UCSB Nanofab Wiki - User contributions [en]

Tom Reynolds

2020-08-07T15:29:29Z

Reynolds t:

{{staff|{{PAGENAME}}
|position = Engineering Expert
|room = 1109E
|phone = 805-893-8158
|cell =
|email = reynolds@ece.ucsb.edu
}}
=About=
Tom has a varied background of job experiences. He began in 1978 working in the construction industry installing asphalt and concrete. He has worked in the oil fields as a wireline operator maintaining gas lift wells. He is also a journeyman plumber.

He graduated from UCSB with a BS in Electrical Engineering in 1990. After graduation, he continued in a staff position at UCSB working in Professor John Bowers’ group. He helped start Terabit Technology with John Bowers and Aaron Hawkins in 1996 which was purchased by Ciena Corporation in 1998. At Ciena he was a Senior Engineer working on optical packaging, III/V semiconductor processing, and facility design and construction. The primary goal at the Goleta Ciena division was to build optical receivers using a novel fused APD developed at UCSB.

In 2002, the Goleta Ciena division was sold to new investors and became VTR Corporation. He became the Operations Manager and continued producing optical receivers and began development on optical transceivers using VCSEL sources.

He returned part time to UCSB in 2005 as a Senior Development Engineer to finish the new facilities and install all the process equipment into the current Engineering Science Building Nanofab.

In 2006 he began working part-time for Transphorm as a Facility Manager. Transphorm is a start-up company that produces GaN devices for high voltage power conversion applications. He was responsible for design/construction of all facility labs, cleanrooms, offices and equipment necessary for operation.

In 2012 he became the full time Lab Manager of the UCSB Nanofab facility. In 2018 he transitioned from Lab Manager to his current position as an Engineering Expert as he phases into retirement.

Co-author on over 30 technical papers, and one patent based on optical packaging.

=Current Work=
Tom is currently transitioning to retirement. He continues to offer assistance in the operations of the lab while working on new process equipment selection and installs. He is working on several lab projects at this time.

Tom Reynolds

2020-05-24T14:44:18Z

Reynolds t:

{{staff|{{PAGENAME}}
|position = Engineering Expert
|room = 1109E
|phone = 805-893-8158
|cell =
|email = reynolds@ece.ucsb.edu
}}
=About=
Tom has a varied background of job experiences. He began in 1978 working in the construction industry installing asphalt and concrete. He has worked in the oil fields as a wireline operator maintaining gas lift wells. He is also a journeyman plumber.

He graduated from UCSB with a BS in Electrical Engineering in 1990. After graduation, he continued in a staff position at UCSB working in Professor John Bowers’ group. He helped start Terabit Technology with John Bowers and Aaron Hawkins in 1996 which was purchased by Ciena Corporation in 1998. At Ciena he was a Senior Engineer working on optical packaging, III/V semiconductor processing, and facility design and construction. The primary goal at the Goleta Ciena division was to build optical receivers using a novel fused APD developed at UCSB.

In 2002, the Goleta Ciena division was sold to new investors and became VTR Corporation. He became the Operations Manager and continued producing optical receivers and began development on optical transceivers using VCSEL sources.

He returned part time to UCSB in 2005 as a Senior Development Engineer to finish the new facilities and install all the process equipment into the current Engineering Science Building Nanofab.

In 2006 he began working part-time for Transphorm as a Facility Manager. Transphorm was a new start-up company that produces GaN devices for high voltage power conversion applications. He was responsible for design/construction of all facility labs, cleanrooms, offices and equipment necessary for operation.

In 2012 he became the full time Lab Manager of the UCSB Nanofab facility. In 2018 he transitioned from Lab Manager to his current position as an Engineering Expert as he phases into retirement.

Co-author on over 30 technical papers, and one patent based on optical packaging.

=Current Work=
Tom is currently transitioning to retirement. He continues to offer assistance in the operations of the lab while working on new process equipment selection and installs. He is working on several lab projects at this time.

Tom Reynolds

2020-05-12T21:23:15Z

Reynolds t:

{{staff|{{PAGENAME}}
|position = Engineering Expert
|room = 1109E
|phone = 805-893-8158
|cell =
|email = reynolds@ece.ucsb.edu
}}
=About=
Tom has a varied background of job experiences. He began in 1978 working in the construction industry installing asphalt and concrete. He has worked in the oil fields as a wireline operator maintaining gas lift wells. He is also a journeyman plumber.

He graduated from UCSB with a BS in Electrical Engineering in 1990. After graduation, he continued in a staff position at UCSB working in Professor John Bowers’ group. He helped start Terabit Technology with John Bowers and Aaron Hawkins in 1996 which was purchased by Ciena Corporation in 1998. At Ciena he was a Senior Engineer working on optical packaging, III/V semiconductor processing, and facility design and construction. The primary goal at the Goleta Ciena division was to build optical receivers using a novel fused APD developed at UCSB.

In 2002, the Goleta Ciena division was sold to new investors and became VTR Corporation. He became the Operations Manager and continued producing optical receivers and began development on optical transceivers using VCSEL sources.

He returned part time to UCSB in 2005 as a Senior Development Engineer to finish the new facilities and install all the process equipment into the current Engineering Science Building Nanofab.

In 2006 he began working part-time for Transphorm as a Facility Manager. Transphorm was a new start-up company that produces GaN devices for high voltage power conversion applications. He was responsible for design/construction of all facility labs, cleanrooms, offices and equipment necessary for operation.

In 2012 he became the full time Lab Manager of the UCSB Nanofab facility. In 2018 he transitioned from Lab Manager to his current position as an Engineering Expert as he phases into retirement.

Co-author on over 30 technical papers, and one patent based on optical packaging.

=Current Work=
Tom is currently transitioning to retirement. He continues to offer assistance in the operations of the lab while working on new process equipment selection and installs. He is working on several labs projects at this time.

Tom Reynolds

2020-05-03T18:56:21Z

Reynolds t:

{{staff|{{PAGENAME}}
|position = Engineering Expert
|room = 1109E
|phone = 805-893-8158
|cell =
|email = reynolds@ece.ucsb.edu
}}
=About=
Tom has a varied background of job experiences. He began in 1978 working in the construction industry installing asphalt and concrete. He has worked in the oil fields as a wireline operator maintaining gas lift wells. He is also a journeyman plumber.

He graduated from UCSB with a BS in Electrical Engineering in 1990. After graduation, he continued in a staff position at UCSB working in Professor John Bowers’ group. He helped start Terabit Technology with John Bowers and Aaron Hawkins in 1996 which was purchased by Ciena Corporation in 1998. At Ciena he was a Senior Engineer working on optical packaging, III/V semiconductor processing, and facility design and construction. The primary goal at the Goleta Ciena division was to build optical receivers using a novel fused APD developed at UCSB.

In 2002, the Goleta Ciena division was sold to new investors and became VTR Corporation. He became the Operations Manager and continued producing optical receivers and began development on optical transceivers using VCSEL sources.

He returned part time to UCSB in 2005 as a Senior Development Engineer to finish the new facilities and install all the process equipment into the current Engineering Science Building Nanofab.

In 2006 he began working part-time for Transphorm as a Facility Manager. Transphorm was a new start-up company that produces GaN devices for high voltage power conversion applications. He was responsible for design/construction of all facility labs, cleanrooms, offices and equipment necessary for operation.

In 2012 he became the full time Lab Manager of the UCSB Nanofab facility. In 2018 he transitioned from Lab Manager to his current position as an Engineering Expert as he phases into retirement.

=Current Work=
Tom is currently transitioning to retirement. He continues to offer assistance in the operations of the lab while working on new process equipment selection and installs. He is working on several labs projects at this time.

Tom Reynolds

2020-05-03T18:54:03Z

Reynolds t:

{{staff|{{PAGENAME}}
|position = Engineering Expert
|room = 1109E
|phone = (805) 839-3918x215
|cell =
|email = reynolds@ece.ucsb.edu
}}
=About=
Tom has a varied background of job experiences. He began in 1978 working in the construction industry installing asphalt and concrete. He has worked in the oil fields as a wireline operator maintaining gas lift wells. He is also a journeyman plumber.

He graduated from UCSB with a BS in Electrical Engineering in 1990. After graduation, he continued in a staff position at UCSB working in Professor John Bowers’ group. He helped start Terabit Technology with John Bowers and Aaron Hawkins in 1996 which was purchased by Ciena Corporation in 1998. At Ciena he was a Senior Engineer working on optical packaging, III/V semiconductor processing, and facility design and construction. The primary goal at the Goleta Ciena division was to build optical receivers using a novel fused APD developed at UCSB.

In 2002, the Goleta Ciena division was sold to new investors and became VTR Corporation. He became the Operations Manager and continued producing optical receivers and began development on optical transceivers using VCSEL sources.

He returned part time to UCSB in 2005 as a Senior Development Engineer to finish the new facilities and install all the process equipment into the current Engineering Science Building Nanofab.

In 2006 he began working part-time for Transphorm as a Facility Manager. Transphorm was a new start-up company that produces GaN devices for high voltage power conversion applications. He was responsible for design/construction of all facility labs, cleanrooms, offices and equipment necessary for operation.

In 2012 he became the full time Lab Manager of the UCSB Nanofab facility. In 2018 he transitioned from Lab Manager to his current position as an Engineering Expert as he phases into retirement.

=Current Work=
Tom is currently transitioning to retirement. He continues to offer assistance in the operations of the lab while working on new process equipment selection and installs. He is working on several labs projects at this time.

Tom Reynolds

2020-05-03T17:52:31Z

Reynolds t:

{{staff|{{PAGENAME}}
|position = Lab Manager
|room = 1109E
|phone = (805) 839-3918x215
|cell =
|email = reynolds@ece.ucsb.edu
}}
=About=
Tom has a varied background of job experiences. He began in 1978 working in the construction industry installing asphalt and concrete. He has worked in the oil fields as a wireline operator maintaining gas lift wells. He is also a journeyman plumber.

He graduated from UCSB with a BS in Electrical Engineering in 1990. After graduation, he continued in a staff position at UCSB working in Professor John Bowers’ group. He helped start Terabit Technology with John Bowers and Aaron Hawkins in 1996 which was purchased by Ciena Corporation in 1998. At Ciena he was a Senior Engineer working on optical packaging, III/V semiconductor processing, and facility design and construction. The primary goal at the Goleta Ciena division was to build optical receivers using a novel fused APD developed at UCSB.

In 2002, the Goleta Ciena division was sold to new investors and became VTR Corporation. He became the Operations Manager and continued producing optical receivers and began development on optical transceivers using VCSEL sources.

He returned part time to UCSB in 2005 as a Senior Development Engineer to finish the new facilities and install all the process equipment into the current Engineering Science Building Nanofab.

In 2006 he began working part-time for Transphorm as a Facility Manager. Transphorm was a new start-up company that produces GaN devices for high voltage power conversion applications. He was responsible for design/construction of all facility labs, cleanrooms, offices and equipment necessary for operation.

In 2012 he became the full time Lab Manager of the UCSB Nanofab facility. In 2018 he transitioned from Lab Manager to his current position as an Engineering Expert as he phases into retirement.

=Current Work=
Tom is currently transitioning to retirement. He continues to offer assistance in the operations of the lab while working on new process equipment selection and installs. He is working on several labs projects at this time.

Tom Reynolds

2020-05-03T17:47:25Z

Reynolds t: /* About */

Template:Announcements

2018-09-21T22:17:30Z

Reynolds t:

<startfeed />


''UCSB NanoFab Announcements''




===== Gasonics Up =====

===== RIE#5: Software Upgrades =====
[[RIE_5_(PlasmaTherm)|RIE#5]] Will be down next week from approximately Monday Sept. 17th to Thursday Sept. 20th, for a software upgrade to the same software running on the other PlasmaTherm tools.
All users will need to be retrained after the upgrade is complete.
// [[User:John d|John d]] 15:16, 11 September 2018 (PDT)

===== PECVD#1: Software Upgrade =====
Plasmatherm will be upgrading the system software on September 17th. The upgrade will take 3-5 days. After the upgrade is complete, everyone must be re-certified to use the tool. Please document any custom recipes that you may have, in case they can't be copied over.
// [[User:John d|John d]] 06:38, 15 August 2018 (PDT)

===== RIE#5: SiCl4 Issue =====
We have a flow rate problem on the SiCl4 gas line. You can only flow the SiCl4 for 5 minutes and then you have to wait 5 minutes before you flow it again. So in order to to do a 10 minute Etch you will have to do it in three steps flow 5 mi, wait 5mi, then flow 5min.
// [[User:John d|John d]] 17:22, 15 June 2018 (PDT)

===== RIE#3: RF Issue =====
RF issues on RIE3 resolved. System is up. See email from tool owner for details.
// [[User:Thibeault|Thibeault]] 09:43, 20 September 2018 (PDT)

===== Sputter#4: TiW gun shorted =====
Gun will be looked at during next opening this Friday 9/21.
// [[User:Thibeault|Thibeault]] 08:31, 18 September 2018 (PDT)



<endfeed />
<noinclude>[[Category:Templates]]</noinclude>

Nano-Imprint (Nanonex NX2000)

2018-05-09T18:35:51Z

Reynolds t:

{{tool|{{PAGENAME}}
|picture=Nanonex.jpg
|type = Lithography
|super= Tony Bosch
|location=Bay 4
|description = Nanonex NX2000 Nanoimprinting System
|manufacturer = Nanonex
|materials =
|toolid=36
}}
= About =
The Nanonex NX2000 is a nanoimprinting system that allows for direct pattern transfer from a pre-fabricated master mold into an underlying polymer material. Lateral feature sizes down to less than 10 nm have been demonstrated on this tool. The system can do thermal imprinting into a polymer at temperatures up to 200°C and chamber pressures up to 600 psi. The system can also imprint into and cure UV-cureable materials on top of underlayer polymers in order to planarize samples and provide for high aspect ratio imprint lithography. Since the system uses no rigid plates, but air pressure only, the pressure uniformity is excellent in the system. The heating and cooling rates are as high as 300°C/min. Several types of resists are supplied, including [[media:NXR-1020-Datasheet.pdf|NXR-1020]], [[media:mr-l-7000-Imprint-Polymer.pdf|mr-l-7020]], and {{fl|Mr-UVCur21.pdf|MR-UVCur21}}. The system is capable of handling piece parts up to 100 mm wafers. An additional alignment system is also available for 100 mm wafers for aligned imprinting. Non-stick coatings for master molds are deposited using FDTS in the [[Molecular Vapor Deposition]] system. For creation of master molds, please call for a discussion of our other capabilities, including electron-beam lithography.

=Detailed Specifications=
*Thermal imprinting up to 200°C and 600 psi chamber pressure (equivalent to 1200 psi on the wafer stack); 300°C/min heat-cool rates
*UV-imprinting
*In-house resist processes and subsequent pattern transfer offered
*Resolution: 10 nm demonstrated
*Minimum substrate size: small pieces
*Largest substrate size: 100 mm wafer
*Several resists, non-stick layers, and master copy formation also available.

Tool List

2018-04-03T16:16:23Z

Reynolds t: /* Vacuum Deposition */

__NOTOC__
=Lithography=
You can see our available photoresists on the [https://www.nanotech.ucsb.edu/wiki/index.php/Lithography_Recipes#Chemical_Datasheets Chemical Datasheets page].
{|
|- valign="top"
| width="300" |
* [[Suss Aligners (SUSS MJB-3)]]
* [[IR Aligner (SUSS MJB-3 IR)]]
* [[DUV Flood Expose]]
* [[Ovens 1, 2 & 3 (Labline)]]
* [[Oven 4 (Fisher)]]
* [[Oven 5 (Labline)]]
* [[High Temp Oven (Blue M)]]
* [[Vacuum Oven (YES)]]
* [[Holographic Lith/PL Setup (Custom)]]
| width="400" |
* [[Stepper 1 (GCA 6300)]]
* [[Stepper 2 (AutoStep 200)]]
* [[Stepper 3 (ASML DUV)]]
* [[E-Beam Lithography System (JEOL JBX-6300FS)]]
* [[Nano-Imprint (Nanonex NX2000)]]
* [[Contact Aligner (SUSS MA-6)]]
|-
|}

= Vacuum Deposition =

{|
|- valign="top"
| width="300" |
*[[E-Beam 1 (Sharon)]]
*[[E-Beam 2 (Custom)]]
*[[E-Beam 3 (Temescal)]]
*[[E-Beam 4 (CHA)]]
*[[Removed]]
*[[Sputter 3 (AJA ATC 2000-F)]]
*[[Sputter 4 (AJA ATC 2200-V)]]
*[[Sputter 5 (Lesker AXXIS)]]

| width="400" |
*[[PECVD 1 (PlasmaTherm 790)]]
*[[PECVD 2 (Advanced Vacuum)]]
*[[Thermal Evap 1]]
*[[Thermal Evap 2 (Solder)]]
*[[ICP-PECVD (Unaxis VLR)]]
*[[Ion Beam Deposition (Veeco NEXUS)]]
*[[Molecular Vapor Deposition]]
*[[Atomic Layer Deposision (Oxford FlexAL)|Atomic Layer Deposition (Oxford FlexAL)]]

|}

= Dry Etch =

{|
|- valign="top"
| width="300" |
*[[RIE 2 (MRC)]]
*[[RIE 3 (MRC)]]
*[[RIE 5 (PlasmaTherm)]]
*[[Si Deep RIE (PlasmaTherm/Bosch Etch)]]
*[[DSEIII (PlasmaTherm/Deep Silicon Etcher)]]
*[[Ashers (Technics PEII)]]
*[[UV Ozone Reactor]]
*[[CAIBE (Oxford Ion Mill)]]
| width="400" |
*[[ICP Etch 1 (Panasonic E626I)]]
*[[ICP Etch 2 (Panasonic E640)]]
*[[ICP-Etch (Unaxis VLR)]]
*[[Plasma Clean (Gasonics 2000)]]
*[[XeF2 Etch (Xetch)|XeF2 Etch (Xetch)]]
*[[Plasma Activation (EVG 810)]]
*[[Vapor HF Etch]]

|}

=Wet Processing=
{|
|- valign="top"
| width="300" |
* [[Wet Benches]]
**[[Solvent Cleaning Benches]]
**[[Spin Coat Benches]]
**[[Develop Benches]]
**[[Toxic Corrosive Benches]]
**[[HF/TMAH Processing Benches]]
**[[Plating Bench]]
| width="400" |
* [[Gold Plating Bench]]
* [[Critical Point Dryer]]
* [[Spin Rinse Dryer (SemiTool)]]
* [[Chemical-Mechanical Polisher (Logitech)]]
|-
|}

=Thermal Processing=
* [[Rapid Thermal Processor (AET RX6)]]
* [[Strip Annealer]]
* [[Tube Furnace (Tystar 8300)]]
* [[Tube Furnace Wafer Bonding (Thermco)]]
* [[Tube Furnace AlGaAs Oxidation (Linberg)]]
* [[Wafer Bonder (SUSS SB6-8E)]]
* [[Ovens 1, 2 & 3 (Labline)]]
* [[Oven 4 (Fisher)]]
* [[Oven 5 (Labline)]]
* [[High Temp Oven (Blue M)]]
* [[Vacuum Oven (YES)]]

=Packaging=
* [[Dicing Saw (ADT)]]
* [[Flip-Chip Bonder (Finetech)]]
* [[Vacuum Sealer]]
* [[Wire Saw (Takatori)]]

=Inspection, Test and Characterization=
{|
|- valign="top"
| width="300" |
* [[Field Emission SEM 1 (FEI Sirion)]]
* [[Field Emission SEM 2 (JEOL 7600F)]]
* [[Step Profile (Dektak IIA)]]
* [[Step Profilometer (Dektak 6M)]]
* [[Ellipsometer (Rudolph)]]
* [[Microscopes]]
* [[Probe Station & Curve Tracer]]
* [[Optical Film Thickness (Filmetrics)|Optical Film Thickness (Filmetrics F20)]]
* Optical Film Thickness (Microscope-Mounted Filmetrics XYZ)
* [[Optical Film Thickness (Nanometric)]]
* [[Goniometer]]
| width="400" |
* [[Film Stress (Tencor Flexus)]]
* [[SEM Sample Coater (Hummer)]]
* [[Surface Analysis (KLA/Tencor Surfscan)]]
* [[Photo-emission & IR Microscope (QFI)]]
* [[Ellipsometer (Woollam)]]
* [[Resistivity Mapper (CDE RESMAP)]]
* [[Laser Scanning Confocal M-scope (Olympus LEXT)]]
* [[Deep UV Optical Microscope (Olympus)]]
* [[Fluorescence Microscope (Olympus MX51)]]
* [[Atomic Force Microsope (Dimension 3100/Nanoscope IVA)]]
|-
|}

Tool List

2018-04-02T23:58:13Z

Reynolds t: /* Vacuum Deposition */

__NOTOC__
=Lithography=
You can see our available photoresists on the [https://www.nanotech.ucsb.edu/wiki/index.php/Lithography_Recipes#Chemical_Datasheets Chemical Datasheets page].
{|
|- valign="top"
| width="300" |
* [[Suss Aligners (SUSS MJB-3)]]
* [[IR Aligner (SUSS MJB-3 IR)]]
* [[DUV Flood Expose]]
* [[Ovens 1, 2 & 3 (Labline)]]
* [[Oven 4 (Fisher)]]
* [[Oven 5 (Labline)]]
* [[High Temp Oven (Blue M)]]
* [[Vacuum Oven (YES)]]
* [[Holographic Lith/PL Setup (Custom)]]
| width="400" |
* [[Stepper 1 (GCA 6300)]]
* [[Stepper 2 (AutoStep 200)]]
* [[Stepper 3 (ASML DUV)]]
* [[E-Beam Lithography System (JEOL JBX-6300FS)]]
* [[Nano-Imprint (Nanonex NX2000)]]
* [[Contact Aligner (SUSS MA-6)]]
|-
|}

= Vacuum Deposition =

{|
|- valign="top"
| width="300" |
*[[E-Beam 1 (Sharon)]]
*[[E-Beam 2 (Custom)]]
*[[E-Beam 3 (Temescal)]]
*[[E-Beam 4 (CHA)]]
*[[Blank]]
*[[Sputter 3 (AJA ATC 2000-F)]]
*[[Sputter 4 (AJA ATC 2200-V)]]
*[[Sputter 5 (Lesker AXXIS)]]

| width="400" |
*[[PECVD 1 (PlasmaTherm 790)]]
*[[PECVD 2 (Advanced Vacuum)]]
*[[Thermal Evap 1]]
*[[Thermal Evap 2 (Solder)]]
*[[ICP-PECVD (Unaxis VLR)]]
*[[Ion Beam Deposition (Veeco NEXUS)]]
*[[Molecular Vapor Deposition]]
*[[Atomic Layer Deposision (Oxford FlexAL)|Atomic Layer Deposition (Oxford FlexAL)]]

|}

= Dry Etch =

{|
|- valign="top"
| width="300" |
*[[RIE 2 (MRC)]]
*[[RIE 3 (MRC)]]
*[[RIE 5 (PlasmaTherm)]]
*[[Si Deep RIE (PlasmaTherm/Bosch Etch)]]
*[[DSEIII (PlasmaTherm/Deep Silicon Etcher)]]
*[[Ashers (Technics PEII)]]
*[[UV Ozone Reactor]]
*[[CAIBE (Oxford Ion Mill)]]
| width="400" |
*[[ICP Etch 1 (Panasonic E626I)]]
*[[ICP Etch 2 (Panasonic E640)]]
*[[ICP-Etch (Unaxis VLR)]]
*[[Plasma Clean (Gasonics 2000)]]
*[[XeF2 Etch (Xetch)|XeF2 Etch (Xetch)]]
*[[Plasma Activation (EVG 810)]]
*[[Vapor HF Etch]]

|}

=Wet Processing=
{|
|- valign="top"
| width="300" |
* [[Wet Benches]]
**[[Solvent Cleaning Benches]]
**[[Spin Coat Benches]]
**[[Develop Benches]]
**[[Toxic Corrosive Benches]]
**[[HF/TMAH Processing Benches]]
**[[Plating Bench]]
| width="400" |
* [[Gold Plating Bench]]
* [[Critical Point Dryer]]
* [[Spin Rinse Dryer (SemiTool)]]
* [[Chemical-Mechanical Polisher (Logitech)]]
|-
|}

=Thermal Processing=
* [[Rapid Thermal Processor (AET RX6)]]
* [[Strip Annealer]]
* [[Tube Furnace (Tystar 8300)]]
* [[Tube Furnace Wafer Bonding (Thermco)]]
* [[Tube Furnace AlGaAs Oxidation (Linberg)]]
* [[Wafer Bonder (SUSS SB6-8E)]]
* [[Ovens 1, 2 & 3 (Labline)]]
* [[Oven 4 (Fisher)]]
* [[Oven 5 (Labline)]]
* [[High Temp Oven (Blue M)]]
* [[Vacuum Oven (YES)]]

=Packaging=
* [[Dicing Saw (ADT)]]
* [[Flip-Chip Bonder (Finetech)]]
* [[Vacuum Sealer]]
* [[Wire Saw (Takatori)]]

=Inspection, Test and Characterization=
{|
|- valign="top"
| width="300" |
* [[Field Emission SEM 1 (FEI Sirion)]]
* [[Field Emission SEM 2 (JEOL 7600F)]]
* [[Step Profile (Dektak IIA)]]
* [[Step Profilometer (Dektak 6M)]]
* [[Ellipsometer (Rudolph)]]
* [[Microscopes]]
* [[Probe Station & Curve Tracer]]
* [[Optical Film Thickness (Filmetrics)|Optical Film Thickness (Filmetrics F20)]]
* Optical Film Thickness (Microscope-Mounted Filmetrics XYZ)
* [[Optical Film Thickness (Nanometric)]]
* [[Goniometer]]
| width="400" |
* [[Film Stress (Tencor Flexus)]]
* [[SEM Sample Coater (Hummer)]]
* [[Surface Analysis (KLA/Tencor Surfscan)]]
* [[Photo-emission & IR Microscope (QFI)]]
* [[Ellipsometer (Woollam)]]
* [[Resistivity Mapper (CDE RESMAP)]]
* [[Laser Scanning Confocal M-scope (Olympus LEXT)]]
* [[Deep UV Optical Microscope (Olympus)]]
* [[Fluorescence Microscope (Olympus MX51)]]
* [[Atomic Force Microsope (Dimension 3100/Nanoscope IVA)]]
|-
|}

Mike Day

2017-12-15T00:22:39Z

Reynolds t:

{{staff|{{PAGENAME}}
|position = Senior Development Engineer
|room = 1109C
|phone = (805)839-3918x223
|cell =
|email = day@ece.ucsb.edu
}}
=About=

Mike Day

2017-12-15T00:22:08Z

Reynolds t: Created page with "{{staff|{{PAGENAME}} |position = Senior Development Engineer |room = 1109C |phone = (805)839-3918x210 |cell = |email = day@ece.ucsb.edu }} =About="

{{staff|{{PAGENAME}}
|position = Senior Development Engineer
|room = 1109C
|phone = (805)839-3918x210
|cell =
|email = day@ece.ucsb.edu
}}
=About=

Tom Reynolds

2017-12-15T00:19:55Z

Reynolds t:

{{staff|{{PAGENAME}}
|position = Lab Manager
|room = 1109E
|phone = (805) 839-3918x215
|cell =
|email = reynolds@ece.ucsb.edu
}}

<big>'''Lab Manager'''</big>
=About=

=Current Work=
Managing the UCSB Nanofab

Tom Reynolds

2017-12-15T00:18:36Z

Reynolds t:

{{staff|{{PAGENAME}}
|position = Lab Manager
|room = 1109E
|phone = (805) 839-3918x215
|cell =
|email = reynolds@ece.ucsb.edu
}}

<big>'''Lab Manager'''</big>
=About=
=Current Work=

Staff List

2017-12-14T23:35:32Z

Reynolds t:

== Equipment Group ==
General Nanofab facility management, operations, and equipment maintenance, are handled by the Equipment Group. Information about specific tools, request for chemicals or trainings and facilities-related requests should be directed to the appropriate person on either list.
{| class="wikitable" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:left; font-size: 95%" border="1"
|- bgcolor="#D0E7FF"
! align="center" bgcolor="#D0E7FF" width="150" |'''Name'''
! align="center" bgcolor="#D0E7FF" width="250" |'''Title'''
! align="center" bgcolor="#D0E7FF" width="150" |'''Phone'''
! align="center" bgcolor="#D0E7FF" width="100" |'''E-mail'''
|-
|-
|[[Tony Bosch]]||Senior Development Engineer||(805) 893-3918X217||bosch@ece.ucsb.edu
|-
|[[Mike Day]]||Senior Development Engineer||(805) 893-3918x223||day@ece.ucsb.edu
|-
|[[Don Freeborn]]||Senior Development Engineer||(805) 893-3918x216||dfreeborn@ece.ucsb.edu
|-
|[[Aidan Hopkins]]||Senior Development Engineer||(805) 893-3918x208||hopkins@ece.ucsb.edu
|-
|[[Brian Lingg]]||Senior Development Engineer||(805) 893-3918x210||lingg@ece.ucsb.edu
|-
|[[Tom Reynolds]]||Lab Manager||(805) 893-3918x215||reynolds@ece.ucsb.edu
|-
|[[Mike Silva]]||Senior Development Engineer||(805) 893-3918x219||silva@ece.ucsb.edu
|-
|[[Tino Sy]]||Development Technician||(805) 893-3918x209||sy@ece.ucsb.edu
|-
|[[Luis Zuzunaga]]||Development Technician||(805) 893-3918x218||luis@ece.ucsb.edu
|}

== Process Group ==
The process group provides expertise on process development, fabrication techniques, recipe development, and some direct tool training and maintenance. The Process Group helps to ensure that equipment is providing the expected processing capabilities. In addition, the group performs fabrication jobs for companies, universities and research groups, for on- and off-campus groups. [https://www.nanotech.ucsb.edu/index.php/submit-a-project Submit a job request here].
{| class="wikitable" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:left; font-size: 95%" border="1"
|- bgcolor="#D0E7FF"
! align="center" bgcolor="#D0E7FF" width="150" |'''Name'''
! align="center" bgcolor="#D0E7FF" width="250" |'''Title'''
! align="center" bgcolor="#D0E7FF" width="150" |'''Phone'''
! align="center" bgcolor="#D0E7FF" width="100" |'''E-mail'''
|-
|-
|[[Ning Cao]]||Principal Development Engineer||(805) 893-4689||ningcao@ece.ucsb.edu
|-
|[[Demis D. John]]||Principal Development Engineer||(805) 893-5934||demis@ucsb.edu
|-
|[[Bill Mitchell]]||Principal Development Engineer||(805) 893-4974||mitchell@ece.ucsb.edu
|-
|[[Biljana Stamenic]]||Senior Development Engineer||(805) 893-4002 ||biljana@ece.ucsb.edu
|-
|[[Brian Thibeault]]||Project Scientist / Lab Manager||(805) 893-2268||thibeault@ece.ucsb.edu
|}

Lab Rules OLD 2018

2017-09-28T22:25:23Z

Reynolds t: Visitor/Beneficial policy

For a printable PDF version of the Lab Rules, please '''[[Media:Nanofab_Policies__Chemical_Hygiene_Plan_9_15_16.pdf|CLICK HERE]]'''

While working in the Nanofab, you are surrounded by dangerous and deadly chemicals, gases, high voltages, radiation, and mechanical systems. The responsibility lies with users and staff to act in a professional, courteous, and safe manner at all times while in the facility. Users violating the operating and safety rules of the facility or endangering the safety of themselves or other users will be denied further access to the facility.

This document attempts to define acceptable actions and behavior for the users of the Nanofabrication facility. However, it is impossible to define a policy for every conceivable situation. Nanofab users are expected to employ common sense and a high degree of prudence while working in this facility.

=General Nanofabrication Facility Safety Policies=
==Visual and Audible Alarms in the Nanofab==
#'''Fire Alarm''': White strobe with high volume audible alarm, located throughout the Nanofab. If this alarm activates, immediately leave the Nanofab through the nearest exit. Do not remove bunnysuit until outside.
#'''Toxic Gas Alarm''': Blue strobe with high volume audible alarm, located at both ends of each bay. If this alarm activates in one bay, do not enter the bay. If this alarm activates throughout the Nanofab, immediately leave the Nanofab through the nearest exit. Do not remove bunnysuit until outside.
#'''Wet Bench Alarms''': Small illuminated visual alarms with buzzers. Each wet bench may have multiple alarms, with a placard beside the alarms indicating meaning of alarm and proper response. You must follow proper response if you see or hear a wet bench alarm.
#'''Equipment Alarms''': Please notify supervisor of tool if equipment alarm is activated.
==Emergencies and First Aid==
If you believe you may have been exposed to a toxic substance or gas, if appropriate rinse in the emergency shower. In all cases, quickly go to the emergency room at Goleta Valley Hospital. Emergency showers and eye wash stations are located at the south end of all bays. An enclosed emergency showers is located in bay 5 beside the wet etch benches. A first aid kit is located in the gowning room, and on the south wall at the end of bays 2, 4, and 6. Chemical spill clean-up kits are located on the wire shelving in each bay containing a wet bench. After using a spill cleanup kit, please inform the Nanofab manager. Fire extinguishers are located on the south end of each clean bay, and the north end of each maintenance chase.
==Hydrofluoric Acid (HF) Exposure==
===HF Exposure to Skin===
#Immediately rinse exposed area for 5 minutes in safety shower, flush affected area thoroughly. Speed and thoroughness in washing off the acid is of primary importance. An enclosed emergency showers is located in bay 5 across from the HF/TMAH wet processing bench. If using the emergency shower at the end of the bay, water will spill onto floor of Nanofab - this is OK.
#Immediately after rinsing, start massaging 2.5% calcium gluconate gel into the affected area. The individual applying the gel should wear gloves. Apply gel frequently and massage continuously. Calcium gluconate gel is located to the left of the HF bench in a pocket mounted to the side of the bench.
#Seek immediate medical attention by calling 9-911.
#Continue rubbing gel on affected area until advised otherwise by physician.
===HF Exposure to Eyes===
#Immediately rinse exposed area for 15 minutes at eye wash station. Hold eyelids open during irrigation to allow thorough flushing of the eyes. Water will spill onto floor of Nanofab - this is OK.
#Seek immediate medical attention by calling 9-911.
==TetraMethylAmmonium Hydroxide (TMAH) Exposure==
TMAH is a component in several photoresist developers and strippers, and is also used in the Nanofab as an ebeam resist developer and silicon etchant. The concentration of TMAH in photoresist developer and stripper solutions is relatively low (2-4%). However, the ebeam developer and silicon etchant utilize a solution of 25% TMAH.
===TMAH Exposure to Skin, 25% Concentration===
#Immediately rinse exposed area for at least 15 minutes in safety shower, flush affected area thoroughly. An enclosed emergency showers is located in bay 5 across from the HF/TMAH wet etch bench. If using the emergency shower at the end of the bay, water will spill onto floor of Nanofab - this is OK.
#Seek immediate medical attention by calling 9-911
===TMAH Exposure to Skin, 2%-4%Concentration===
#If small area skin exposure (<1% body surface area, <approximately 25 inches2) to 2-4% TMAH, immediately rinse exposed area until skin feels normal (not greasy). If irritation occurs, consult a physician.
#If medium to large area skin exposure (>1% body surface area, >approximately 25 inches2) to 2-4% TMAH, immediately rinse exposed area for at least 15 minutes in safety shower, flush affected area thoroughly. An enclosed emergency showers is located in bay 5 across from the HF/TMAH wet etch bench. If using the emergency shower at the end of the bay, water will spill onto floor of Nanofab - this is OK. Seek immediate medical attention by calling 9-911.
===TMAH Exposure to Eyes, Any Concentration===
#Immediately rinse exposed area for at least 15 minutes at eye wash station. Hold eyelids open during irrigation to allow thorough flushing of the eyes. Water will spill onto floor of Nanofab - this is OK.
#Seek immediate medical attention by calling 9-911
==Pregnancy and the Nanofab==
The effects on a fetus of many of the chemicals utilized in the Nanfab is unknown. The Nanofab is designed to prevent exposure to the fumes and vapors from these chemicals, but absolute 100% containment is impossible, and it is possible to be exposed to extremely small concentrations of these materials. Consequently, we strongly recommend that you do not work in the Nanofab if you know or suspect that you are pregnant.
=Chemicals and Hazardous Materials the Nanofab=
==[[MSDS]]==
The MSDS contains safety information regarding exposure, first aid, handling, storage, fire hazard, etc., for all chemicals, gases, and materials present in the facility. Before using an unfamiliar material, consult the MSDS to determine any potential hazards. Consult the MSDS to determine the proper course of action if someone has been exposed to a gas or chemical, or a spill has occurred. A book containing the MSDS for any material used in the Nanofab is located just inside the gowning room. Additionally, an electronic version of the MDSD in .pdf format for all chemicals in our inventory is located on the desktops of all the computers connected to microscopes in the Nanofab.
==Introducing New Materials Into the Nanofab==
All new chemicals, compounds, gases, materials for evaporation, etc., must be approved by the Nanofab manager before introduction into the facility. In order to introduce a new material into the Nanofab, a MSDS (Material Safety Data Sheet) for the material in .pdf format must be submitted to the Nanofab manager, plus a description of the proposed process utilizing the new material. The description of the process should include the goals of the process, and the mechanics of the process in reasonable detail. The Nanofab manager will determine if the material will be allowed in the Nanofab, and if so, where the new material will be stored, where the material is to be used (typically a specific wet bench), and how to dispose of the waste.
==Containers and Labeling==
Chemical containers such as beakers, bottles, etc, must be labeled with contents, date, and ownership (individual or group name). This information can be written on a wipe under the container. The exceptions to this policy are as follows:
#A beaker in use on a solvent bench can contain acetone, propanol, or methanol if the beaker is labeled with the text: “acetone/propanol/methanol”. The generic label “solvent” is insufficient. Beakers containing solvents other that acetone, propanol, or methanol must be labeled with the specific solvent.
#Indication of date is no longer required on beakers in use on solvent benches. All beakers in use on solvent benches must be labeled with contents and ownership.
#Beakers in use at lithography developer benches must be labeled with exact contents and ownership (individual or group name). The generic label “developer” is insufficient.
#Indication of date is no longer required on beakers in use on the developer benches. All beakers in use on developer benches must be labeled with contents and ownership.
==Chemical Storage==
*'''Acid Storage'''
:The primary acid storage area (except HF) is the acid cabinet located next to the acid wet processing benches in bay 5. HF acid is stored in the HF cabinet
*'''Base Storage'''
:The primary base storage area is the base cabinet located next to the acid wet processing bench.
*'''Solvent Storage'''
:The primary solvent storage area is the stainless steel flammables cabinet in bay 6. You may store small amounts of solvents in labeled containers on the shelves in the photolith area.
==Solvent Processing==
Solvents with flashpoints below 55 deg C cannot be heated in the Nanofab. This includes acetone, methanol, isopropanol, ethanol, and toluene. All solvent processing is limited to the stainless steel solvent processing benches. Do not perform standard solvent processing at the photoresist spinner benches.
==Wet Etch and HF/TMAH Processing==
All wet processing involving acids and bases (except HF and TMAH) is limited to the acid/base benches. All HF and Bromine processing is limited to the HF or HF/TMAH benches - NO EXCEPTIONS. All TMAH processing is limited to the HF/TMAH bench. When working at the HF or HF/TMAH benches, always wear a chemical apron, face shield, and “Trionic” gloves. Store all HF and bromine in labeled containers in the HF acid/bromine storage cabinet. Store TMAH is the base storage cabinet. Please keep open containers of these two toxic chemicals away from the edge of the bench. All waste solutions containing any HF is poured down the drain, and treated in the Nanofab acid treatment system. Empty HF bottles should be returned to the HF acid storage cabinet. You may not deviate from this policy unless you have prior approval by the Nanofab manager.
==Photoresist Coating or Spinning==
Standard solvent-based photoresist spinning should be perfomed at the PR spinner benches. Some lithography chemicals utilize non-standard chemicals in place of solvents, which may require spinning at a different bench. If using a non-standard lithography chemicals, please provide the MSDS and process instructions to the laboratory manager for direction in this matter.
==Developer Benches==
Developer benches are used for developing photoresists only. In general, solvents are not allowed at the developer benches because solvent fumes adversely affect the develop process. Solvent based liftoff processes are not allowed at the developer benches E-beam develop processes may utilize solvents, and should be performed at the solvent benches in the photolith area.
==Plating Bench==
The Solvent/Plating bench contains cyanide-based plating and etching solutions. Never use acid solutions at this bench.
==Photoresist Storage, Handling, and Waste==
Photoresists can contain many solvents and aromatics that are potentially toxic. Special care must be exercised when handling these materials. All photoresist fumes must be exhausted or otherwise contained through careful procedures at the photolith wet benches. The primary photoresist storage area is the lab refrigerator located bay 6. Some resists do not need refrigeration and are stored in the flammables cabinet next to the refrigerator (PMGI, PMMA, etc). Before transferring refrigerated PR from the main bottle to your in-use bottle, place main bottle on designated photoresist warming racks for a minimum of 2 hours, or until the bottle is at room temperature, whichever is longer. Large transfer pipettes are provided for transferring PR from the main bottle to your in-use bottle. To prevent PR flakes from contaminating the main bottle, please inspect the main bottle cap and bottle threads for PR, and remove any PR with an acetone wipe before replacing cap. After transfer, place main bottle back in the refrigerator. You may store your in-use, fully labeled PR bottle in the stainless steel PR storage cabinet in a bin labeled with your research group name. Disposable droppers, syringes, and filters are provided for the application of photoresist on your substrate. You may store photoresist in the PR storage cabinet for a maximum of 6 months. Nanofab staff will remove in-use PR bottles older than 6 months, and will also remove any bottle not correctly labeled with contents, date, and ownership. Nanofab wipes and pipettes contaminated with PR must be placed in the beakers at the back of the spinner benches. Do not place PR contaminated materials in the trashcans, as this will allow photoresist fumes to migrate throughout the photolith area. Dispose of waste photoresist bottles by placing your labeled bottle in the yellow solvent waste cabinet in chase 5.
==Photoresist Strippers==
Use of heated strippers is limited to the stainless steel solvent benches. It is recommended you use the heated water bath to heat your stripper to 80 C. If you choose to use a hot plate to heat commercial photoresist strippers, we realize the hot plate surface temperature will need to be set above 80 C. Ideally, you should use a temperature probe inserted in the liquid as the feedback control for the hot plate. If you have the hot plate surface temperature set above 80 C, you must actively monitor the temperature of the stripper using a thermometer (or equivalent) and limit the stripper temperature to a maximum of 80 degrees C. You must be in the vicinity of the hotplate whenever you are heating strippers with the hot plate surface set above 80 degrees C if you are not using a temperature probe for feedback control of the hot plate.
'''The following photoresist strippers are stocked:'''
*Shipley 1165
*AZ 300T
*Shipley SVC-14
*PRX-127
==Chemical Waste Disposal==
===General Guidelines===
#The correct method of disposal for any chemical waste in our inventory is posted throughout the Nanofab, and also indicated in a file titled “Nanofab Chemical Storage/Use/Disposal”, located on the desktops of all optical microscope computers in the Nanofab.
#'''DO NOT DISPOSE OF SOLVENTS IN THE ACID DRAIN, OR ACIDS AND BASES IN THE SOLVENT DRAINS DUE TO POSSIBLE EXPLOSION OR THE CREATION OF OTHER HAZARDOUS SITUATIONS.'''
===All chemical waste is disposed in one of three methods:===
'''Acid Drains'''
:Most (but not all) water-based chemicals use this method. The acid drain empties into a waste chemical pH neutralization system located in the Nanofab mechanical room. This is the primary drain in the Nanofab. All liquids entering the sink drain at any polypropylene wet bench in the Nanofab run through this treatment system.

:To dispose of an acid or base, pour the liquid down the drain using the plenum flush. If you spill an acid or base onto the top surface of a bench, first rinse the surface thoroughly with water, then turn on the plenum flush to rinse the bench drain. Do not pour solvents down the acid drain.
'''Solvent Drains'''
:Most (but not all) solvent waste use this method. The solvent drain waste is pumped to a storage tank located in the Nanofab mechanical room. The waste solvents are transported to the EH&S chemical waste processing facility.
'''Collection of Waste'''
:Always fill out the Environmental Health and Safety waste disposal form when storing waste chemicals in the appropriate cabinet.
==Disposing of Empty Acid, Base, and Solvent Bottles==
Thoroughly rinse empty acid and base bottles three times with DI water, and then place in a trashcan. Place completely empty solvent bottles in the trashcan, making sure caps are in place. The exception to this policy is empty 49% HF bottles, which should be returned to the HF storage cabinet.
=Nanofab Apparel and Gloves=
==Bunnysuits and Booties==
You must wear a full bunnysuit to enter the Nanofab (hood, coverall, shoe covers). Facial covers are optional. Change bunnysuits weekly if used often, or at least once a month if used sporadically. Store coverall and hoods on numbered hangers in the gowning room. Reserve a hanger by placing a stainless steel “hanger reserve clip” on the hanger number. Store booties in the corresponding numbered slot in the bootie storage rack. Sandals or any other open toed shoes are not allowed in the Nanofab at any time.
==Eye Protection==
ANSI-approved eye protection must be worn at all times in the Nanofab, except when using optical microscopes. All eye protection eyewear must be ANSI-approved, as indicated by the “Z87” stamp required on the eyewear. You are welcome to use personal prescription safety eyewear which is ANSI-approved. Three types of safety eyewear are stocked in the Nanofab:
#'''Uvex Astro 3000''', for use by people who do not wear vision correction glasses. These safety glasses have a black frame.
#'''Uvex Astro OTG 3001''', for use by people who do wear vision correction glasses. These safety glasses are intended to be worn over vision correction glasses, and have a blue frame.
#'''U.S. Safety Faceshield'''. This full faceshields must be worn when working with dangerous chemicals or materials. Always use a faceshield when working at the HF bench.
==Aprons and Gloves==
===General Information===
Always wear gloves when in the Nanofab. Acid aprons are required when handling HF and other highly corrosive or toxic chemicals.
===Five types of gloves are available in the Nanofab:===
{| style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center; font-size: 95%" border="1"
|- bgcolor="#D0E7FF"
! align="center" bgcolor="#D0E7FF" width="75" |'''Material'''
! align="center" bgcolor="#D0E7FF" width="150" |'''Manufacturer/Model'''
! align="center" bgcolor="#D0E7FF" width="75" |'''Color'''
! align="center" bgcolor="#D0E7FF" width="100" |'''Thickness'''
! align="center" bgcolor="#D0E7FF" width="150" |'''Stocked Sizes'''
|-
|PVC||Kimtech G5 Co-Polymer||Clear||0.10mm (4 mil)||S, M, L, XL
|-
|Latex||Kimtech G3 Latex||Tan||0.20mm (8 mil)||6, 6.5, 7, 7.5, 8, 8.5, 9, 10
|-
|Nitrile||Best CleaN-Dex Ultimate||White||0.15mm (6 mil)||XS, S, M, L, XL
|-
|Nitrile||MAPA StanSolve A-30||Green||0.28mm (11 mil)||7, 8, 9, 10, 11
|-
|Blend||MAPA TRIonic E-194||Tan||0.50mm (20 mil)||6, 7, 8, 9, 10, 11
|-
|}

*'''Polyvinyl Chloride (PVC)''': Kimtech G5 Co-Polymer
:A relatively inexpensive static free general-purpose glove, poor for most organics. These gloves break down rapidly in acetone.
*'''Latex''': Kimtech G3 Latex
:A general-purpose glove, poor for most organics, okay with aldehydes and keytones.
*'''Nitrile, White''': Best CleaN-Dex Ultimate
:This thin general purpose low cost glove offers marginal protection from many keytones, okay with some acids and bases.
*'''Nitrile, Green''': MAPA StanSolve A-30
:A thicker nitrile glove that affords increased protection over the CleaN-Dex white nitrile glove.
*'''Nitrile/Neoprene/Latex Blend''': MAPA TRIonic E-194
:This glove is the standard wet processing glove. A blend of latex, neoprene, and carboxylated nitrile, which offers excellent protection from corrosives and solvents such as HF and acetone. Highly resistant to cuts, tears, and snags. Always use this glove when processing with HF, TMAH, or Bromine.

=General Nanofab Information=
==Iris Camera Access System==
The iris camera access system provides security to the Nanofab, and allows tracking of the time each user spends in the Nanofab. ALWAYS scan in when entering the lab and scan out when exiting the lab, even when attending training sessions or performing beneficial work. Violating this policy will result in a two-week suspension for the first incidence, and possible permanent suspension for recurring incidences.
==Scheduling Tool/Equipment Use and Tool Supervisors==
Tool use is scheduled in one of two ways:
#either through the web-based system “Signupmonkey” at URL: http://signupmonkey.ece.ucsb.edu
#or first come/first served
*If a tool is listed on Signupmonkey, you must obtain permission from the supervisor of the tool in order to schedule use of the tool. This is typically accomplished by attending a training session.
*Some tools are not scheduled using Signupmonkey because the cycle period is typically short and use of the tool is most efficient without using signupmonkey.
*All tools in the Nanofab have a supervisor, regardless of whether the tool is listed on Signupmonkey.
*If you have problems with any tool, please inform the supervisor either by email, or direct communication (phone, etc).
==Credit for Beneficial Work in the Nanofab==
You will receive 1.5 hours of free processing time for each hour spent performing maintenance on lab equipment, conducting training sessions, or any time spent performing work beneficial to the general operation of the lab. Please indicate time spent performing beneficial work on the sign-up sheet just inside the gowning room.
==Wet Bench Housekeeping==
Always leave wet benches clean, dry, and organized. This includes cleaning up all spills, storing glassware and chemicals, etc. If a bench is not clean when you start a task, you still have the responsibility to leave it clean. If you leave a wet bench in disarray, or leave an unlabeled container on a bench, you can be suspended from the Nanofab. Do not cover the exhaust holes on the bench tops, as this will impede the laminar flow of air through the bench and possibly expose you or other Nanofab users to toxic fumes.
==Hotplates==
Hot plates used for heating chemicals must be attended. This means you must be in the Nanofab and near the hot plat whenever it is in use. (This does not apply to PR baking hotplates on the PR spinner benches.)
==Nanofab Paper==
The only paper allowed in the lab is Nanofab type paper. We stock many different types of Nanofab paper for the lab, including photocopier (or laserwriter) paper, sticky labels, and assorted notebooks. If you require a special type of Nanofab paper, ask and we will try to obtain it. You can laminate regular paper for use in the lab. Use pens, not pencils, for writing in the lab.
==Nanofab Wipes==
We stock four types of wipes in the lab
#'''S/Pec-Wipe 3''' is a cellulose/polyester blend with high absorption but medium particle and fiber generation.
#'''Berkshire Poly1200''' is a 100% knit polyethylene wipe with low particulate generation, but also with relatively low absorption.
#'''PRO-STAT''' is a cellulose blend presaturated with isopropyl alcohol and DI water.
#'''BIOHAZ''' are used to line photoresist spinner catch cups
==Preparing Equipment for Entry into the Nanofab==
All equipment entering the lab must be clean. The procedure for cleaning equipment for entry is:
#Vacuum while equipment is outside the lab
#Wipe down all accessible surfaces with propanol or EKC "Lab Clean" using Nanofab wipes while equipment is outside the lab
#Move equipment into the lab
#Vacuum with HEPA filtered vacuum cleaner when inside the lab
==Maintenance Ways==
You may enter maintenance ways without wearing a bunnysuit from outside the Nanofab, or while wearing a bunnysuit from inside the Nanofab.
==Notes on Particle Counts in the Nanofab==
The Nanofab was surveyed with a particle counter, with generally good results. All wet bench work surfaces have extremely low particle counts, better than class 10. The open areas in the lithography area are all better than class 100, and mostly better than class 10. The remainder of the Nanofab tests better than class 1000, and often better than class 100. The Nanofab design specifications stipulated class 100 for litho, class 1000 for everything else. The Nanofab is easily meeting these specs. 

The effectiveness of facemasks was investigated by placing the particle counter directly under a person’s neck while the person moved his head back and forth. Facemasks reduced particle counts, from the equivalent of class 500 without masks to class 100 with masks. Again, this was sampling just below the neck, not at typical substrate surfaces.

The choice of wipes used in the Nanofab has a more pronounced affect on particle counts. In general, wipes trade absorbency for low particle generation. The Spec-Wipe 3 is the stocked polyester/cellulose blend, high absorbency wipe designed for use in class 100 cleanrooms. Dragging the sampling tube across the surface of a Spec-Wipe 3 resulted in a class 1000 level particle counts. The Berkshire Polx 1200 wipe is the stocked low particle count, 100% knit polyester wipe. This wipe is not as absorbent at the Spec-Wipe 3, but generates fewer particles. Dragging the sampling tube across the surface of a Berkshire Polx 1200 wipe resulted in lower than class 100 level particle counts.

To summarize, the Nanofab is meeting and exceeding design specifications for particle counts. If you would like to further reduce particles on your substrates, you may implement the following practices, in order of effectiveness:
*Use only Berkshire Polx 1200 wipes if your process requires placing your substrate on a wipe
*Use a facemask if your process requires you to work above your substrate on a table. Facemasks do not reduce particle counts on substrates in wet benches.
==Procedure for the Use and Handling of Precious Metals==
Gold, platinum, palladium, and various alloys of these metals are stocked by the UCSB Nanofab. Each research group can be issued a precious metal supply. This supply must be stored in a small lockable container, along with a log sheet for recording the use of these metals. Precious metas, the lockable security container, and log sheets will be issued by the Nanofab manager. All use of precious metals must be accurately recorded on the log sheet, and include user name, date, metal type, metal weight before use, and metal weight after use. Multiple digital scales have been acquired and placed throughout the Nanofab to facilitate weighing of these metals. When requesting additional precious metals, the completed log sheet must be presented to the Nanofab manager. Any discrepancies in recorded precious metal use will result in charges to the principle investigator corresponding to the value of the precious metal discrepancy.
=Communications and Internet Access=
==Wireless Access in the Nanofab and Couryard Café==
Currently, we have two wireless networks available to Nanofab users:
===Nanofab Wireless Access:===
The Nanofab has three access points located in the Nanofab. This network is operated by Nanofab staff, and offers anonymous access. You may connect to this network by selecting the following network and entering the password.
*network: ''nanofab''
*password: ''ece!nanofab''

===UCSB Wireless Network===
The Courtyard Café, as well as other locations on campus, provide access to the UCSB wireless network.
*'''External Users''' (Other universities or industrial users)
:Access accounts to external Nanofab user (other university or industrial users) are provided as requested by the Nanofab manager. Please contact the Nanofab manager if you would like an account.
*'''Local academic users''' (UCSB grad students, staff, etc)
:Local academic users can access the UCSB wireless network by using their UCSBNetID and password. Information regarding setup of a UCSBNetID and password: https://my.sa.ucsb.edu/U-reset/AccountManagement.aspx

= Visitor/Beneficial Lab Work Policy =
Visitors are allowed in the lab for observation only. During normal weekday working hours a user should try and obtain a visitor's badge from one of the Nanofab staff to remove any concerns of shadowing another user into the lab without logging in. If it is off hours we expect all users to follow the rules and the honor code of the Nanofab and not abuse this policy. If these simple rule are broken and a visitor is caught operating or handling anything in the lab then both visitor and user will be suspended from the Nanofab.

'''Determining Nanofab beneficial lab time credit:'''

1. The two common ways for logging beneficial time:

a. If you help staff with Nanofab related work such as maintenance, construction or cleanup of equipment or the lab.

b. If you happen to help/train someone outside of your group unplanned while you are logged in to the Nanofab. Please review the below paragraphs to understand other situations.

2. When you are training a group member or any other user the correct way to enter the Nanofab is to log in and then take the user in as a visitor. We assume that you are training while you are performing your own work and the other user is only observing. Only one user can be using the equipment and that user should be charged for their use.

a. This should not be logged as beneficial time as the visitor is not charged.

3. The other method would be for the new user that is being trained to log in and you will go in as the visitor. This will allow the new user to handle and operate systems while you observe his use as the visitor.

a. This should not be logged as beneficial time as the visitor is not charged.

4. Visitor badges can be obtained from the staff during the normal weekday hours and that will remove any confusion about the shadowing of another user without logging in. But on weekends and at nights we expect everyone to follow the honor system and do the right thing. We encourage new users to shadow current users as a visitor to become familiar with the Nanofab before becoming actual users.

5. The Nanofab relies on the honor system and the visitor “observation only” policy is clear. If users are caught violating the visitor policy and operating/handling anything in the lab while being a visitor both the user and the visitor will be suspended from the lab with no exceptions.

=Ball Bonding, Wire Bonding, and Packaging Services=
We have established an arrangement with PLT Technology to provide various ball bonding and packaging services to UCSB Nanofab users. The service can be provided for you by PLT technology, a local Santa Barbara company, and will be invoiced to your PI through our normal Nanofab recharge system. This service is offered to both academic and industrial Nanofab researchers. A description of the services and associated rates is below. Peter Tihanyi of PLT Technology will provide the service. Peter has a high level of expertise with these processes, especially involving unique or research-type substrates and processes. If you would like to utilize Peter's services, please contact Peter by email to start the process. All equipment noted below is in-house at PLT and in good working condition.

::Peter Tihanyi 
::PLT Technology, Inc 
::420 East Haley Street 
::Santa Barbara, CA 93101 
::Phone: 805-280-1834 
::[http://www.laserdiodeservices.com www.laserdiodeservices.com] 
::pltlaser@silcom.com 

*Au wire bonding service using K&S model 4124 gold ball bonder. The charge is $120 for the setup of the system and a minimum charge of $120, which includes up to 20 Au wires bonded. Each additional set of 20 wires is $120.
*Semiconductor device soldering (laser diodes, other lasers, electronics, etc) using indium deposition on a heat sink in high vacuum (3x10-7 tore). Device placement is accomplished using a Royce model 110 pick and place station with ± 0.5um accuracy on heat sink, with flux/organics free soldering in a vacuum chamber using protective gas during the soldering process. This flux-free soldering process was developed by Peter Tihanyi for spacecraft applications. The charge for this process is $120 per hour. There is a minimum charge of 8 hours for each soldering process which includes deposition of indium, chip placement, and chip soldering. The number of devices that can be soldered at the same time depends primarily on the heat sink size. We can supply C-mounts and 9mm packages for $30 each.
*Vacuum or N2 back-fill of 9mm and TO-3 packages utilizing a POLARIS Accu-Weld 4000 tool. This tool can also be setup for other package configurations. PLT has fixtures for both 9mm and TO-3 packages. However, new fixturing will be required for other package types. The service for 9mm and TO-3 packages up to 10 pieces is $800. We can supply the package for $30 each.
*Laser diode testing for wavelengths from 400nm to 1600nm utilizing a ILX Lightwave model LPA-9084 laser diode parameter analyzer. The charge is $120 per hour for C-mount. The use of other package types is dependent on the heat sink size, but many other package types can be accommodated.
*Semiconductor substrate scribe and break service utilizing a Loomis model 100 LSD tool. The setup charge is$120, with a rate of $120 per hour.
*Lapping and polishing service utilizing a Logitech model PM2 tool. The rate is $120 per hour, with a minimum of 8 hours. Various substrate materials can be processed, including Ga and InP.

=Nanofab Summer Intern Policy =

Whenever the intern is in the Nanofab, the mentor must also be in the Nanofab. Interns may use tools that do not require training sessions, such as microscopes, etc, unless the supervisor of these tools objects. Interns can work at photolith benches, and use components of the photolith benches, unless the supervisor of the bench objects. Interns will need to follow normal Nanofab access procedures, including initiation meeting with the Nanofab manager.

Interns will be allowed to use one or two mainline Nanofab tools after completing training conducted by Nanofab staff. Mainline tools are tools scheduled through our web site signupmonkey. Certain tools will be unavailable to interns due to extremely heavy use or other concerns.

File:Beneficial Nanofab lab time policy.docx

2017-09-28T22:17:49Z

Reynolds t:

Tom

Template:Tool

2017-07-31T16:56:05Z

Reynolds t:

{| border="0" cellpadding="20" align="right" style="float: right;"
|-
|
{| border="0" cellpadding="2" cellspacing="0" style="background: whitesmoke; border: 1px solid #aaaaaa" align="center"
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{| border="0" cellpadding="2" cellspacing="0" style="background: black; border: 1px solid #aaaaaa" align="center"
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![[image:{{{picture|none.jpg}}}|350px|center|]]
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|-
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{| border="0" cellpadding="2" cellspacing="1" style="background: none; border-top:1px solid #aaaaaa"
|-valign="top"
!width=150|Tool Type
!width=200|[[:Category:{{{type|NONE}}}|{{{type|NONE}}}]]
|-valign="top"
!width=150|Location
!width=200|{{{location|}}}
|-valign="top"
{{#ifeq: {{{super}}}|Tony Bosch|{{StaffInfo|Tony Bosch|(805) 893-3918X217||bosch@ece.ucsb.edu}}}}{{#ifeq: {{{super}}}{{#ifeq: {{{super}}}|Ning Cao|{{StaffInfo|Ning Cao|(805) 893-4689| |ningcao@ece.ucsb.edu}}}}{{#ifeq: {{{super}}}|Don Freeborn|{{StaffInfo|Don Freeborn|(805) 893-3918x216| |dfreeborn@ece.ucsb.edu}}}}{{#ifeq: {{{super}}}|Aidan Hopkins|{{StaffInfo|Aidan Hopkins|(805) 893-3918x208||hopkins@ece.ucsb.edu}}}}{{#ifeq: {{{super}}}|Bill Mitchell|{{StaffInfo|Bill Mitchell|(805) 893-4974| |mitchell@ece.ucsb.edu}}}}{{#ifeq: {{{super}}}|Tom Reynolds|{{StaffInfo|Tom Reynolds|(805) 893-3918x215||reynolds@ece.ucsb.edu}}}}{{#ifeq: {{{super}}}|Mike Silva|{{StaffInfo|Mike Silva|(805) 893-3918x219||silva@ece.ucsb.edu}}}}{{#ifeq: {{{super}}}|Biljana Stamenic|{{StaffInfo|Biljana Stamenic|(805) 893-4002 | |biljana@ece.ucsb.edu}}}}{{#ifeq: {{{super}}}|Brian Thibeault|{{StaffInfo|Brian Thibeault|(805) 893-2268||thibeault@ece.ucsb.edu}}}}{{#ifeq: {{{super}}}|Jack Whaley|{{StaffInfo|Jack Whaley|(805) 893-8174||whaley@ece.ucsb.edu}}}}{{#ifeq: {{{super}}}|Luis Zuzunaga|{{StaffInfo|Luis Zuzunaga|(805) 893-3918x218||luis@ece.ucsb.edu}}}}{{#ifeq: {{{super}}}|Zack Warburg|{{StaffInfo|Zack Warburg|(805) 893-3918x200| |zwarburg@ece.ucsb.edu}}}}{{#ifeq: {{{super}}}|Brian Lingg|{{StaffInfo|Brian Lingg|(805) 893-3918X210||lingg@ece.ucsb.edu}}}}{{#ifeq: {{{super}}}|Tino Sy|{{StaffInfo|Tino Sy|(805) 893-3918x209||sy@ece.ucsb.edu}}}}
|-
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{| border="0" cellpadding="2" cellspacing="1" style="background: none; border-top:1px solid #aaaaaa"
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|-
|}
{{#if:{{{toolid|}}}|
{{{!}} border="0" cellpadding="2" cellspacing="1" style="background: none; border-top:1px solid #aaaaaa"
{{!}}-valign="top"
{{!}}width=350 align=center{{!}}[http://signupmonkey.ece.ucsb.edu/cgi-bin/users/{{#ifeq:{{{toolid|}}}|999|tools.cgi|browse.cgi?tool_ID={{{toolid|}}}}} Sign up for this tool]
{{!}}-
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{{tool|{{PAGENAME}}
|picture = toolName.jpg
|type = ToolType
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|recipe = The type of process that it is (Lithography, Vacuum Deposition, Dry Etching, Wet Etching, Thermal Processing)
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</pre></div>

Ovens 1, 2 & 3 (Labline)

2017-07-31T16:54:33Z

Reynolds t:

{{tool|{{PAGENAME}}
|picture=Oven1&2.jpg
|type = Lithography
|super= Aidan Hopkins
|location=Bay 6
|description =?
|manufacturer = Labline
}}

Ovens 1, 2 & 3 (Labline)

2017-07-31T16:49:28Z

Reynolds t: Undo revision 154310 by Reynolds t (talk)

{{tool|{{PAGENAME}}
|picture=Oven1&2.jpg
|type = Lithography
|super= Adam Abrahamsen
|location=Bay 6
|description =?
|manufacturer = Labline
}}

Ovens 1, 2 & 3 (Labline)

2017-07-31T16:47:41Z

Reynolds t:

{{tool|{{PAGENAME}}
|picture=Oven1&2.jpg
|type = Lithography
|super= Adian Hopkins
|location=Bay 6
|description =?
|manufacturer = Labline
}}

Chemical List - OLD 2018-09-05

2017-04-26T17:45:55Z

Reynolds t: /* Other Chemicals */

Below is a list of all chemicals authorized for use in the lab. Please note that only the chemicals that appear in '''bold''' are stocked by the lab. All other chemicals have been authorized for users to bring.
=Acids=
{|
|-valign="top"
|width=300|
*'''[[media:Acetic Acid MSDS.pdf|Acetic Acid MSDS]]'''
*'''[[media:Al Etchant, Type A MSDS.pdf|Al Etchant, Type A MSDS]]'''
*'''[[media:Al Etchant, Type D MSDS.pdf|Al Etchant, Type D MSDS]]'''
*[[media:BoricAcidMSDS.pdf|Boric Acid MSDS]]
*'''[[media:Buffered HF.pdf|Buffered HF MSDS]]
*'''[[media:Chromic Acid.pdf|Chromic Acid MSDS]]'''
*'''[[media:ChromiumMaskEtchantMSDS.pdf|Chromium Mask Etchant MSDS]]
*'''[[media:CitricAcidMSDS.pdf|Citric Acid (granular) MSDS]]
*[[media:FormicAcidMSDS.pdf|Formic Acid 88% MSDS]]
*'''[[media:HydrobromicAcidMSDS.pdf|Hydrobromic Acid MSDS]]
*'''[[media:HydrochloricAcidMSDS.pdf|Hydrochloric Acid MSDS]]'''
*'''[[media:HydrofluoricAcidMSDS.pdf|Hydrofluoric Acid 49% MSDS]]
*[[media:HydroiodicAcidMSDS.pdf|Hydroiodic Acid 47% MSDS]]
*[[media:LacticAcidFractionalMSDS.pdf|Lactic Acid 0.1 Normal Volumetric MSDS]]
|width=300|
*[[media:LacticAcidMSDS.pdf|Lactic Acid MSDS]]
*[[media:MethacrylicAcidMSDS.pdf|Methacrylic Acid MSDS]]
*'''[[media:NickelEtchantTFBMSDS.pdf|Nickel Etchant, Type TFB MSDS]]
*'''[[media:NitricAcidMSDS.pdf|Nitric Acid MSDS]]
*[[media:OxalicAcidDihydrateMSDS.pdf|Oxalic Acid Dihydrate MSDS]]
*'''[[media:PhosphoricAcidMSDS.pdf|Phosphoric Acid MSDS]]
*[[media:SelenousAcidMSDS.pdf|Selenous Acid MSDS]]
*[[media:SuccinicAcid99%MSDS.pdf|Succinic Acid 99% MSDS]]
*[[media:SulfamicAcidMSDS.pdf|Sulfamic Acid MSDS]]
*[[media:SulfuricAcid93%MSDS.pdf|Sulfuric Acid 93% MSDS]]
*[[media:SulfuricAcidFuming.pdf|Sulfuric Acid Fuming MSDS]]
*'''[[media:SulfuricAcidMSDS.pdf|Sulfuric Acid MSDS]]
*[[media:TartaricAcidMSDS.pdf|Tartaric Acid MSDS]]
*'''[[media:TiEtchantMSDS.pdf|Ti Etchant, Type TFTN MSDS]]
|-
|}

=Bases=
{|
|-valign="top"
|width=300|
*'''[[media:AmmoniumHydroxideMSDS.pdf|Ammonium Hydroxide MSDS]]
*'''[[media:AmmoniumSulfideMSDS.pdf|Ammonium Sulfide MSDS]]
*'''[[media:PotassiumHydroxideMSDS.pdf|Potassium Hydroxide MSDS]]
*'''[[media:SodiumHydroxideMSDS.pdf|Sodium Hydroxide MSDS]]
|width=300|
*'''[[media:SodiumSulfideMSDS.pdf|Sodium Sulfide MSDS]]
*'''[[media:THAH25MSDS1.pdf|TMAH 25% MSDS #1]]
*'''[[media:THAH25MSDS2.pdf|TMAH 25% MSDS #2]]
|-
|}

=Lithography Chemicals=
{| class="wikitable" style="font-size: 95%;" border="1" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center; font-size: 95%"
|-bgcolor=#D0E7FF
!align=center bgcolor=#D0E7FF width="250"|'''Chemical'''
!align=center bgcolor=#D0E7FF width="250"|'''MSDS'''
!align=center bgcolor=#D0E7FF width="150"|'''Datasheet'''
|-
|'''1165 Stripper||[[media:1165 Stripper MSDS.pdf|1165 Stripper MSDS]]||[[media:1165 Stripper Datasheet.pdf|1165 Stripper Datasheet]]
|-
|'''Accuglass T-12B||[[media:AccuglassT-12B-MSDS.pdf|Accuglass T-12B MSDS]] ||
|-
|'''AP 3000 Adhesion Promoter||[[media:AP-3000-Adhesion-MSDS.pdf|AP 3000 Adhesion Promoter]] ||
|-
|AZ 300 MIF Developer|| ||
|-
|AZ 300T Stripper|| ||
|-
|AZ 400K Developer|| ||
|-
|AZ726 MIF Developer|| ||
|-
|AZ EBR Edge Bead Remover|| ||
|-
|AZ LOL 2000 Photoresist|| ||
|-
|AZ nLOF 2020 Photoresist|| ||
|-
|AZ nLOF 5510 Photoresist|| ||
|-
|AZ P4110 Photoresist|| ||
|-
|AZ P4210 Photoresist|| ||
|-
|AZ P4330 RS Photoresist|| ||
|-
|AZ P5214 EIR Photoresist|| ||
|-
|CEM 365 IS|| ||
|-
|Cyclotene 4024-40 BCB|| ||
|-
|DS 2100 VCS Developer|| ||
|-
|HMDS|| ||
|-
|ma-N 2403 Photoresist|| ||
|-
|mr-l-7000 Imprint Polymer|| ||[[media:mr-l-7000-Imprint-Polymer.pdf|mr-l-7000 Datasheet]]
|-
|MCC-101 Developer|| ||
|-
|Nano MMA Photoresist|| ||
|-
|NR7-1500PY Photoresist|| ||
|-
|NXR-1010 Imprint Resist|| ||
|-
|NXR-1020 Imprint Resist|| ||[[media:NXR-1020-Datasheet.pdf|NXR-1020 Datasheet]]
|-
|OCG 825 Photoresist|| ||
|-
|PMGI SF-series Photoresist|| ||
|-
|PRX-127 Stripper|| ||
|-
|RD6 Developer|| ||
|-
|S1805 Photoresist|| ||
|-
|SPR 220 Photoresist|| ||
|-
|SPR 510A Photoresist|| ||
|-
|SPR 518A Photoresist|| ||
|-
|SPR 950-0.8 Photoresist|| ||
|-
|SPR 955 CM|| ||
|-
|SVC-14 Stripper|| ||
|-
|Thinner P|| ||
|-
|}

=Solvents=
{|
|-valign="top"
|width=300|
*'''[[media:AcetoneMSDS.pdf|Acetone MSDS]]
*'''[[media:AmylAcetateMSDS.pdf|Amyl Acetate MSDS]]
*'''[[media:EthylAlcoholMSDS.pdf|Ethyl Alcohol (Ethanol) MSDS]]
*'''[[media:EthyleneGlycolMSDS.pdf|Ethylene Glycol MSDS]]
*'''[[media:MethylAlcoholMSDS.pdf|Methyl Alcohol (Methanol) MSDS]]
|width=300|
*'''[[media:MethylEthylKetoneMSDS.pdf|Methyl Ethyl Ketone MSDS]]
*'''[[media:MethylIsobutylKetoneMSDS.pdf|Methyl Isobutyl Ketone (MIBK) MSDS]]
*'''[[media:PropanolMSDS.pdf|Propanol MSDS]]
*'''[[media:TolueneMSDS.pdf|Toluene MSDS]]
*'''[[media:XylenesMSDS.pdf|Xylenes MSDS]]
|-
|}

=Other Chemicals=
{|
|-valign="top"
|width=300|
*'''[[media:AmmoniumSulfideMSDS.pdf|Ammonium Sulfide MSDS]]
*'''[[media:Crystalbond509MSDS.pdf|Crystalbond 509 MSDS]]
*'''[[media:GenSolve500MSDS.pdf|GenSolve 500 MSDS]]
*'''[[media:GenTak230MSDS.pdf|GenTak 230 MSDS]]
*'''[[media:GoldEtchantTypeTFAMSDS.pdf|Gold Etchant, Type TFA MSDS]]
*'''[[media:HydrogenPeroxideMSDS.pdf|Hydrogen Peroxide MSDS]]
|width=300|
*'''[[media:NickelEtchantTFBMSDS.pdf|Nickel Etchant Type TFB MSDS]]
*'''[[media:PC3-1500SpinOnGlassMSDS.pdf|PC3-1500 Spin-On-Glass MSDS]]
*'''[[media:SaturatedBromineWaterMSDS.pdf|Saturated Bromine Water MSDS]]
*'''[[media:SilverEtchantTypeTFS.pdf|Silver Etchant Type TFS MSDS]]
*'''[[media:Technic25ESGoldPlatingSolution.pdf|Technic 25 ES Gold Plating Solution MSDS]]
*'''[[media:KJL 705 pump oil.pdf|Kurt J Lesker 705 pump oil MSDS]]
|-
|}

==UNSORTED==
{|
|-valign="top"
|width=300|
*[[media:DN-201GP-Photoresist-MSDS.pdf|DN-201 GP Photoresist MSDS]]
*[[media:(4-Methylthiophenyl)methyl phenyl sulfonium triflate MSDS.pdf|(4-Methylthiophenyl)methyl phenyl sulfonium triflate MSDS]]
*[[media:(4-Phenylthiophenyl)diphenylsulfonium triflate MSDS.pdf|(4-Phenylthiophenyl)diphenylsulfonium triflate MSDS]]
*[[media:2-Bromo-3-hexylthiophene MSDS.pdf|2-Bromo-3-hexylthiophene MSDS]]
*[[media:2-Hydroxy-2-Methylpropiophenone MSDS.pdf|2-Hydroxy-2-Methylpropiophenone MSDS]]
*[[media:3-Aminopropyl)triethoxysilane MSDS.pdf|3-Aminopropyl)triethoxysilane MSDS]]
*[[media:18-Crown-6 MSDS.pdf|18-Crown-6 MSDS]]
*[[media:1165 Stripper MSDS.pdf|1165 Stripper MSDS]]
*[[media:Accuglass 103 Solvent MSDS.pdf|Accuglass 103 Solvent MSDS]]
*[[media:Accuglass T-12B MSDS.pdf|Accuglass T-12B MSDS]]
*[[media:ACCUGLASS T-12B Spin-On-Glass MSDS.pdf|ACCUGLASS T-12B Spin-On-Glass MSDS]]
*[[media:ACEM 365iS MSDS.pdf|ACEM 365iS MSDS]]
*[[media:Additive S-1 MSDS.pdf|Additive S-1 MSDS]]
*[[media:Adhesion Promoter AP3000 MSDS.pdf|Adhesion Promoter AP3000 MSDS]]
*[[media:Adhesion Promoter VM-651 MSDS.pdf|Adhesion Promoter VM-651 MSDS]]
*[[media:Alkyl Quaternary Ammonium Bentonite MSDS.pdf|Alkyl Quaternary Ammonium Bentonite MSDS]]
*[[media:Alpha Alpha Alpha Trifluorotoluene MSDS.pdf|Alpha Alpha Alpha Trifluorotoluene MSDS]]
*[[media:Aluminum Fluoride MSDS.pdf|Aluminum Fluoride MSDS]]
*[[media:Aluminum Oxide MSDS.pdf|Aluminum Oxide MSDS]]
*[[media:Ammonia MSDS.pdf|Ammonia MSDS]]
*[[media:Ammonium Chloride MSDS.pdf|Ammonium Chloride MSDS]]
*[[media:Ammonium Tartrate MSDS.pdf|Ammonium Tartrate MSDS]]
*[[media:Antimony Powder MSDS.pdf|Antimony Powder MSDS]]
*[[media:AP 3000 Adhesion Promoter MSDS.pdf|AP 3000 Adhesion Promoter MSDS]]
*[[media:AquaBond 55 MSDS.pdf|AquaBond 55 MSDS]]
*[[media:AquaBond 65 MSDS.pdf|AquaBond 65 MSDS]]
*[[media:AquaBond 85 MSDS.pdf|AquaBond 85 MSDS]]
*[[media:AquaClean 900 MSDS.pdf|AquaClean 900 MSDS]]
*[[media:ARC i-CON-7 Anti Reflective MSDS.pdf|ARC i-CON-7 Anti Reflective MSDS]]
*[[media:ARC i-CON-16 MSDS.pdf|ARC i-CON-16 MSDS]]
*[[media:Arcosolv PM Solvent MSDS.pdf|Arcosolv PM Solvent MSDS]]
*[[media:Argon MSDS.pdf|Argon MSDS]]
*[[media:Axarel 2200 Defluxed Degreaser MSDS.pdf|Axarel 2200 Defluxed Degreaser MSDS]]{|
*[[media:AZ 300 MIF Developer MSDS.pdf|AZ 300 MIF Developer MSDS]]
*[[media:AZ 300T Stripper MSDS.pdf|AZ 300T Stripper MSDS]]
*[[media:AZ 400K Developer MSDS.pdf|AZ 400K Developer MSDS]]
*[[media:AZ 726 MIF Developer MSDS.pdf|AZ 726 MIF Developer MSDS]]
*[[media:AZ 726 MIF Developer MSDS2.pdf|AZ 726 MIF Developer (2) MSDS]]
*[[media:AZ 1518 Photoresist MSDS.pdf|AZ 1518 Photoresist MSDS]]
*[[media:AZ Aquatar VIII-A 45 MSDS.pdf|AZ Aquatar VIII-A 45 MSDS]]
*[[media:AZ Aquatar VIII-A 45 MSDS(2).pdf|AZ Aquatar VIII-A 45 MSDS (2)]]
*[[media:AZ Developer MSDS.pdf|AZ Developer MSDS]]
*[[media:AZ EBR Edge Bead Remover MSDS.pdf|AZ EBR Edge Bead Remover MSDS]]
*[[media:AZ LExp.KDB087F 42 MSDS.pdf|AZ LExp.KDB087F 42 MSDS]]
*[[media:AZ LOL 2000 Photoresist MSDS.pdf|AZ LOL 2000 Photoresist MSDS]]
*[[media:AZ nLOF 2020 Photoresist MSDS.pdf|AZ nLOF 2020 Photoresist MSDS]]
*[[media:AZ nLOF 2070 Photoresist MSDS.pdf|AZ nLOF 2070 Photoresist MSDS]]
*[[media:AZ nLOF 5510 Photoresist MSDS.pdf|AZ nLOF 5510 Photoresist MSDS]]
*[[media:AZ P4110 Photoresist MSDS.pdf|AZ P4110 Photoresist MSDS]]
*[[media:AZ P4210 Photoresist MSDS.pdf|AZ P4210 Photoresist MSDS]]
*[[media:AZ P4330 RS Photoresist MSDS.pdf|AZ P4330 RS Photoresist MSDS]]
*[[media:AZ P4620 Photoresist MSDS.pdf|AZ P4620 Photoresist MSDS]]
*[[media:AZ P5214 EIR Photoresist MSDS.pdf|AZ P5214 EIR Photoresist MSDS]]
*[[media:AZ R200 Coating MSDS.pdf|AZ R200 Coating MSDS]]
*[[media:AZ SH-114A MSDS.pdf|AZ SH-114A MSDS]]
*[[media:Benzoyl Peroxide MSDS.pdf|Benzoyl Peroxide MSDS]]
*[[media:Bipyridyl Dichlororuthenium II Hexahydrate MDSD.pdf|Bipyridyl Dichlororuthenium II Hexahydrate MDSD]]
*[[media:BIS Cyclopentadienyl Iron (Ferrocene) MSDS.pdf|BIS Cyclopentadienyl Iron (Ferrocene) MSDS]]
*[[media:BIS Cyclopentadienyl Magnesium MSDS.pdf|BIS Cyclopentadienyl Magnesium MSDS]]
*[[media:Bismuth.pdf|Bismuth]]
*[[media:Brewer Science WaferBOND HT-10 MSDS.pdf|Brewer Science WaferBOND HT-10 MSDS]]
*[[media:Brewer Science WaferBOND Remover MSDS.pdf|Brewer Science WaferBOND Remover MSDS]]
*[[media:Bromine MSDS.pdf|Bromine MSDS]]
*[[media:Buffered Oxide Etch JT Baker MSDS.pdf|Buffered Oxide Etch JT Baker MSDS]]
*[[media:CAaD Poymers MSDS.pdf|CAaD Poymers MSDS]]
*[[media:Calcium Fluoride MSDS.pdf|Calcium Fluoride MSDS]]
*[[media:Carbon Black MSDS.pdf|Carbon Black MSDS]]
*[[media:Carbon Tetrachloride MSDS.pdf|Carbon Tetrachloride MSDS]]
*[[media:CEM 365 IS MSDS.pdf|CEM 365 IS MSDS]]
*[[media:Cesium Fluoride MSDS.pdf|Cesium Fluoride MSDS]]
*[[media:Cesium Hydroxide Monohydrate MSDS.pdf|Cesium Hydroxide Monohydrate MSDS]]
*[[media:CF19-2186 Part A MSDS.PDF|CF19-2186 Part A MSDS]]
*[[media:CF19-2186 Part B MSDS.PDF|CF19-2186 Part B MSDS]]
*[[media:Chlorine MSDS.pdf|Chlorine MSDS]]
*[[media:Chloroform MSDS.pdf|Chloroform MSDS]]
*[[media:Chromium Etchant 1020AC MSDS.pdf|Chromium Etchant 1020AC MSDS]]
*[[media:CLEVIOS P MSDS.pdf|CLEVIOS P MSDS]]
*[[media:Clorobenzene MSDS.pdf|Clorobenzene MSDS]]
*[[media:Collodion MSDS.pdf|Collodion MSDS]]
*[[media:Copolmyer MMA(8.5)MAA(EL9) MSDS.pdf|Copolmyer MMA(8.5)MAA(EL9) MSDS]]
*[[media:Copper (II) Sulfate Pentahydrate MSDS.pdf|Copper (II) Sulfate Pentahydrate MSDS]]
*[[media:Cyclohexane MSDS.pdf|Cyclohexane MSDS]]
*[[media:Cyclopentanone MSDS.pdf|Cyclopentanone MSDS]]
*[[media:Cyclotene 3022 MSDS.pdf|Cyclotene 3022 MSDS]]
*[[media:Cyclotene 4000 Resin MSDS.pdf|Cyclotene 4000 Resin MSDS]]
*[[media:Cyclotene 4022 MSDS.pdf|Cyclotene 4022 MSDS]]
*[[media:Cyclotene 4024-40 BCB MSDS.pdf|Cyclotene 4024-40 BCB MSDS]]
*[[media:Cyclotene 4026 Resin MSDS.pdf|Cyclotene 4026 Resin MSDS]]
|width=300|
*[[media:DE-6018 Polymide Developer MSDS.pdf|DE-6018 Polymide Developer MSDS]]
*[[media:DE9040 Developer MSDS.pdf|DE9040 Developer MSDS]]
*[[media:Developer DS3000 MSDS.pdf|Developer DS3000 MSDS]]
*[[media:Dibenzo-18-crown-6 MSDS.pdf|Dibenzo-18-crown-6 MSDS]]
*[[media:Diethoxyethane MSDS.pdf|Diethoxyethane MSDS]]
*[[media:Diethylzinc MSDS.pdf|Diethylzinc MSDS]]
*[[media:Dimethyldydrazine MSDS.pdf|Dimethyldydrazine MSDS]]
*[[media:Dimethylsila-17-Crown-6 MSDS.pdf|Dimethylsila-17-Crown-6 MSDS]]
*[[media:Dimethylsulfoxide MSDS.pdf|Dimethylsulfoxide MSDS]]
*[[media:Disilane MSDS.pdf|Disilane MSDS]]
*[[media:Dodecanethiol MSDS.pdf|Dodecanethiol MSDS]]
*[[media:Dow Corning WL-5150 MSDS.pdf|Dow Corning WL-5150 MSDS]]
*[[media:DS 2100 BCB Developer MSDS.pdf|DS 2100 BCB Developer MSDS]]
*[[media:Dynasolve 165 MSDS.pdf|Dynasolve 165 MSDS]]
*[[media:Dynasolve 185 MSDS.pdf|Dynasolve 185 MSDS]]
*[[media:EC11 Solvent MSDS.pdf|EC11 Solvent MSDS]]
*[[media:ECF-63 Gold Plating Solution MSDS.pdf|ECF-63 Gold Plating Solution MSDS]]
*[[media:EKC 1020 Photoresist MSDS.pdf|EKC 1020 Photoresist MSDS]]
*[[media:EKC 265 Stripper MSDS.pdf|EKC 265 Stripper MSDS]]
*[[media:Epo Tek H20E, Part A & B.pdf|Epo Tek H20E]]
*[[media:Er(TMOD)3 MSDS.pdf|Er(TMOD)3 MSDS]]
*[[media:Ethylenediamine MSDS.pdf|Ethylenediamine MSDS]]
*[[media:FC-4430 MSDS.pdf|FC-4430 MSDS]]
*[[media:FC-4432 MSDS.pdf|FC-4432 MSDS]]
*[[media:FOX-16 Flowable Oxide MSDS.pdf|FOX-16 Flowable Oxide MSDS]]
*[[media:FTO 100-FBA5 Etchant MSDS.pdf|FTO 100-FBA5 Etchant MSDS]]
*[[media:Fe-Pt Bimetallic Nanoparticles in Hexane MSDS.pdf|Fe-Pt Bimetallic Nanoparticles in Hexane MSDS]]
*[[media:Ferric Chloride Hexahydrate MSDS.pdf|Ferric Chloride Hexahydrate MSDS]]
*[[media:Ferric Nitrate Nonahydrate MSDS.pdf|Ferric Nitrate Nonahydrate MSDS]]
*[[media:Ferrous Sulfate MSDS.pdf|Ferrous Sulfate MSDS]]
*[[media:Filmtronics 700B Spin On Glass MSDS.pdf|Filmtronics 700B Spin On Glass MSDS]]
*[[media:Fomblin Y-LVAC 25-6 MSDS.pdf|Fomblin Y-LVAC 25/6 MSDS]]
*[[media:Freon 13B1 Refrigerant MSDS.pdf|Freon 13B1 Refrigerant MSDS]]
*[[media:Gadolinium Oxide MSDS.pdf|Gadolinium Oxide MSDS]]
*[[media:Gallium Arsenide MSDS.pdf|Gallium Arsenide MSDS]]
*[[media:Germanium MSDS.pdf|Germanium MSDS]]
*[[media:Glycerol MSDS.pdf|Glycerol MSDS]]
*[[media:Gold Chloride Hydrate MSDS.pdf|Gold Chloride Hydrate MSDS]]
*[[media:Gold_Etchant_GE-8148-GE-8110_MSDS.pdf|Gold Etchant GE-8148/GE-8110 MSDS]]
*[[media:HD-8820 MSDS.pdf|HD-8820 MSDS]]
*[[media:HD-8820 Polyimide MSDS.pdf|HD-8820 Polyimide MSDS]]
*[[media:HMDS MSDS.pdf|HMDS MSDS]]
*[[media:Hafnium MSDS.pdf|Hafnium MSDS]]
*[[media:Hafnium Oxide MSDS.pdf|Hafnium Oxide MSDS]]
*[[media:Hexadecane MSDS.pdf|Hexadecane MSDS]]
*[[media:Hexamethyldisilazane MSDS.pdf|Hexamethyldisilazane MSDS]]
*[[media:Hexanediol Diacrylate MSDS.pdf|Hexanediol Diacrylate MSDS]]
*[[media:Hydrogen Iodide MSDS.pdf|Hydrogen Iodide MSDS]]
*[[media:Hydrogen MSDS.pdf|Hydrogen MSDS]]
*[[media:IC1-200 Spin On Glass MSDS.pdf|IC1-200 Spin On Glass MSDS]]
*[[media:Imidazole MSDS.pdf|Imidazole MSDS]]
*[[media:Indium MSDS.pdf|Indium MSDS]]
*[[media:Indium Phosphide MSDS.pdf|Indium Phosphide MSDS]]
*[[media:Iodine MSDS.pdf|Iodine MSDS]]
*[[media:Iodine-Bromide Solution MSDS.pdf|Iodine-Bromide Solution MSDS]]
*[[media:Iridium (IV) Chloride MSDS.pdf|Iridium (IV) Chloride MSDS]]
*[[media:Isopropyl Alcohol MSDS.pdf|Isopropyl Alcohol MSDS]]
*[[media:JSR NFC FZX F112 Photoresist Overcoat MSDS.pdf|JSR NFC FZX F112 Photoresist Overcoat MSDS]]
*[[media:JSR NSD 2533Y Photoresist MSDS.pdf|JSR NSD 2533Y Photoresist MSDS]]
*[[media:LDD 26W Developer MSDS.pdf|LDD 26W Developer MSDS]]
*[[media:LOL 2000 Lift Off Layer MSDS.pdf|LOL 2000 Lift Off Layer MSDS]]
*[[media:LOR A Photoresist MSDS.pdf|LOR A Photoresist MSDS]]
*[[media:LOR B Photoresist MSDS.pdf|LOR B Photoresist MSDS]]
*[[media:Lanthanum Fluoride MSDS.pdf|Lanthanum Fluoride MSDS]]
*[[media:Lead Metal MSDS.pdf|Lead Metal MSDS]]
*[[media:MF 24A Developer MSDS.pdf|MF 24A Developer MSDS]]
*[[media:MF-701 Developer MSDS.pdf|MF-701 Developer MSDS]]
*[[media:MICRAL 9400 MSDS.pdf|MICRAL 9400 MSDS]]
*[[media:MMA(8.5)MAA Copolymer Series Resists MSDS.pdf|MMA(8.5)MAA Copolymer Series Resists MSDS]]
*[[media:MR-i 7000 series MSDS.pdf|MR-i 7000 series MSDS]]
*[[media:Magnesium Fluoride MSDS.pdf|Magnesium Fluoride MSDS]]
*[[media:Manganese Pieces MSDS.pdf|Manganese Pieces MSDS]]
*[[media:Manganese Sulfate MSDS.pdf|Manganese Sulfate MSDS]]
*[[media:Mesitylene MSDS.pdf|Mesitylene MSDS]]
*[[media:Methacryloxypropyltrimethoxysilane-3 MSDS.pdf|Methacryloxypropyltrimethoxysilane-3 MSDS]]
*[[media:Methane MSDS.pdf|Methane MSDS]]
*[[media:Methylstyrene MSDS.pdf|Methylstyrene MSDS]]
*[[media:Methyltrimethoxysilane MSDS.pdf|Methyltrimethoxysilane MSDS]]
*[[media:MicroChem 101 Developer MSDS.pdf|MicroChem 101 Developer MSDS]]
*[[media:Microposit 351 Developer MSDS.pdf|Microposit 351 Developer MSDS]]
*[[media:Microposit S1822 Photoresist MSDS.pdf|Microposit S1822 Photoresist MSDS]]
*[[media:Microprime HP Primer MSDS.pdf|Microprime HP Primer MSDS]]
*[[media:Mung MSDS.pdf|Mung MSDS]]
|width=300|
*[[media:N Methyl 2 Pyrrolidone MSDS.pdf|N Methyl 2 Pyrrolidone MSDS]]
*[[media:NANO 495PMMA MSDS.pdf|NANO 495PMMA MSDS]]
*[[media:NANO LOR B Series Resist MSDS.pdf|NANO LOR B Series Resist MSDS]]
*[[media:NANO MMA(17.5)MAA EL 10 MSDS.pdf|NANO MMA(17.5)MAA EL 10 MSDS]]
*[[media:NEB-31 Photoresist MSDS.pdf|NEB-31 Photoresist MSDS]]
*[[media:NOE Etch I MSDS.pdf|NOE Etch I MSDS]]
*[[media:NR5-8000 Photoresist MSDS.pdf|NR5-8000 Photoresist MSDS]]
*[[media:NR7-1500PY Photoresist MSDS.pdf|NR7-1500PY Photoresist MSDS]]
*[[media:NR71-6000PY Photoresist MSDS.pdf|NR71-6000PY Photoresist MSDS]]
*[[media:NR9-8000 Photoresist MSDS.pdf|NR9-8000 Photoresist MSDS]]
*[[media:NXR-1010 Imprint Resist MSDS.pdf|NXR-1010 Imprint Resist MSDS]]
*[[media:NXR-1020 Imprint Resist MSDS.pdf|NXR-1020 Imprint Resist MSDS]]
*[[media:NXR-2010 Imprint Resist MSDS.pdf|NXR-2010 Imprint Resist MSDS]]
*[[media:NXR-3020 Imprint Resist MSDS.pdf|NXR-3020 Imprint Resist MSDS]]
*[[media:NXR-3022 Imprint Resist MSDS.pdf|NXR-3022 Imprint Resist MSDS]]
*[[media:Nano MMA Photoresist MSDS.pdf|Nano MMA Photoresist MSDS]]
*[[media:Nano PMGI SF-series Photoresist MSDS.pdf|Nano PMGI SF-series Photoresist MSDS]]
*[[media:NanoRemover PG Photoresist Remover MSDS.pdf|NanoRemover PG Photoresist Remover MSDS]]
*[[media:NanoStrip MSDS.pdf|NanoStrip MSDS]]
*[[media:Nanochem OMA MSDS.pdf|Nanochem OMA MSDS]]
*[[media:Negative Resist NR9-8000 MSDS.pdf|Negative Resist NR9-8000 MSDS]]
*[[media:Nickel Ammonium Sulfate MSDS.pdf|Nickel Ammonium Sulfate MSDS]]
*[[media:Nickel Chloride MSDS.pdf|Nickel Chloride MSDS]]
*[[media:Nickel MSDS.pdf|Nickel MSDS]]
*[[media:Nickel Sulfamate MSDS.pdf|Nickel Sulfamate MSDS]]
*[[media:Nickel Sulfamate Plating Solution MSDS.pdf|Nickel Sulfamate Plating Solution MSDS]]
*[[media:Nickel Sulfamate Semi-Bright Nickel "S" MSDS.pdf|Nickel Sulfamate Semi-Bright Nickel "S" MSDS]]
*[[media:Nickel Sulfate Crystal MSDS.pdf|Nickel Sulfate Crystal MSDS]]
*[[media:Nickelous Sulfate MSDS.pdf|Nickelous Sulfate MSDS]]
*[[media:Nickle (II) Carbonate MSDS.pdf|Nickle (II) Carbonate MSDS]]
*[[media:Nitrogen MSDS.pdf|Nitrogen MSDS]]
|-
|}

{{MSDS}}

Chemical List - OLD 2018-09-05

2017-04-26T17:43:42Z

Reynolds t: /* Other Chemicals */

Below is a list of all chemicals authorized for use in the lab. Please note that only the chemicals that appear in '''bold''' are stocked by the lab. All other chemicals have been authorized for users to bring.
=Acids=
{|
|-valign="top"
|width=300|
*'''[[media:Acetic Acid MSDS.pdf|Acetic Acid MSDS]]'''
*'''[[media:Al Etchant, Type A MSDS.pdf|Al Etchant, Type A MSDS]]'''
*'''[[media:Al Etchant, Type D MSDS.pdf|Al Etchant, Type D MSDS]]'''
*[[media:BoricAcidMSDS.pdf|Boric Acid MSDS]]
*'''[[media:Buffered HF.pdf|Buffered HF MSDS]]
*'''[[media:Chromic Acid.pdf|Chromic Acid MSDS]]'''
*'''[[media:ChromiumMaskEtchantMSDS.pdf|Chromium Mask Etchant MSDS]]
*'''[[media:CitricAcidMSDS.pdf|Citric Acid (granular) MSDS]]
*[[media:FormicAcidMSDS.pdf|Formic Acid 88% MSDS]]
*'''[[media:HydrobromicAcidMSDS.pdf|Hydrobromic Acid MSDS]]
*'''[[media:HydrochloricAcidMSDS.pdf|Hydrochloric Acid MSDS]]'''
*'''[[media:HydrofluoricAcidMSDS.pdf|Hydrofluoric Acid 49% MSDS]]
*[[media:HydroiodicAcidMSDS.pdf|Hydroiodic Acid 47% MSDS]]
*[[media:LacticAcidFractionalMSDS.pdf|Lactic Acid 0.1 Normal Volumetric MSDS]]
|width=300|
*[[media:LacticAcidMSDS.pdf|Lactic Acid MSDS]]
*[[media:MethacrylicAcidMSDS.pdf|Methacrylic Acid MSDS]]
*'''[[media:NickelEtchantTFBMSDS.pdf|Nickel Etchant, Type TFB MSDS]]
*'''[[media:NitricAcidMSDS.pdf|Nitric Acid MSDS]]
*[[media:OxalicAcidDihydrateMSDS.pdf|Oxalic Acid Dihydrate MSDS]]
*'''[[media:PhosphoricAcidMSDS.pdf|Phosphoric Acid MSDS]]
*[[media:SelenousAcidMSDS.pdf|Selenous Acid MSDS]]
*[[media:SuccinicAcid99%MSDS.pdf|Succinic Acid 99% MSDS]]
*[[media:SulfamicAcidMSDS.pdf|Sulfamic Acid MSDS]]
*[[media:SulfuricAcid93%MSDS.pdf|Sulfuric Acid 93% MSDS]]
*[[media:SulfuricAcidFuming.pdf|Sulfuric Acid Fuming MSDS]]
*'''[[media:SulfuricAcidMSDS.pdf|Sulfuric Acid MSDS]]
*[[media:TartaricAcidMSDS.pdf|Tartaric Acid MSDS]]
*'''[[media:TiEtchantMSDS.pdf|Ti Etchant, Type TFTN MSDS]]
|-
|}

=Bases=
{|
|-valign="top"
|width=300|
*'''[[media:AmmoniumHydroxideMSDS.pdf|Ammonium Hydroxide MSDS]]
*'''[[media:AmmoniumSulfideMSDS.pdf|Ammonium Sulfide MSDS]]
*'''[[media:PotassiumHydroxideMSDS.pdf|Potassium Hydroxide MSDS]]
*'''[[media:SodiumHydroxideMSDS.pdf|Sodium Hydroxide MSDS]]
|width=300|
*'''[[media:SodiumSulfideMSDS.pdf|Sodium Sulfide MSDS]]
*'''[[media:THAH25MSDS1.pdf|TMAH 25% MSDS #1]]
*'''[[media:THAH25MSDS2.pdf|TMAH 25% MSDS #2]]
|-
|}

=Lithography Chemicals=
{| class="wikitable" style="font-size: 95%;" border="1" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center; font-size: 95%"
|-bgcolor=#D0E7FF
!align=center bgcolor=#D0E7FF width="250"|'''Chemical'''
!align=center bgcolor=#D0E7FF width="250"|'''MSDS'''
!align=center bgcolor=#D0E7FF width="150"|'''Datasheet'''
|-
|'''1165 Stripper||[[media:1165 Stripper MSDS.pdf|1165 Stripper MSDS]]||[[media:1165 Stripper Datasheet.pdf|1165 Stripper Datasheet]]
|-
|'''Accuglass T-12B||[[media:AccuglassT-12B-MSDS.pdf|Accuglass T-12B MSDS]] ||
|-
|'''AP 3000 Adhesion Promoter||[[media:AP-3000-Adhesion-MSDS.pdf|AP 3000 Adhesion Promoter]] ||
|-
|AZ 300 MIF Developer|| ||
|-
|AZ 300T Stripper|| ||
|-
|AZ 400K Developer|| ||
|-
|AZ726 MIF Developer|| ||
|-
|AZ EBR Edge Bead Remover|| ||
|-
|AZ LOL 2000 Photoresist|| ||
|-
|AZ nLOF 2020 Photoresist|| ||
|-
|AZ nLOF 5510 Photoresist|| ||
|-
|AZ P4110 Photoresist|| ||
|-
|AZ P4210 Photoresist|| ||
|-
|AZ P4330 RS Photoresist|| ||
|-
|AZ P5214 EIR Photoresist|| ||
|-
|CEM 365 IS|| ||
|-
|Cyclotene 4024-40 BCB|| ||
|-
|DS 2100 VCS Developer|| ||
|-
|HMDS|| ||
|-
|ma-N 2403 Photoresist|| ||
|-
|mr-l-7000 Imprint Polymer|| ||[[media:mr-l-7000-Imprint-Polymer.pdf|mr-l-7000 Datasheet]]
|-
|MCC-101 Developer|| ||
|-
|Nano MMA Photoresist|| ||
|-
|NR7-1500PY Photoresist|| ||
|-
|NXR-1010 Imprint Resist|| ||
|-
|NXR-1020 Imprint Resist|| ||[[media:NXR-1020-Datasheet.pdf|NXR-1020 Datasheet]]
|-
|OCG 825 Photoresist|| ||
|-
|PMGI SF-series Photoresist|| ||
|-
|PRX-127 Stripper|| ||
|-
|RD6 Developer|| ||
|-
|S1805 Photoresist|| ||
|-
|SPR 220 Photoresist|| ||
|-
|SPR 510A Photoresist|| ||
|-
|SPR 518A Photoresist|| ||
|-
|SPR 950-0.8 Photoresist|| ||
|-
|SPR 955 CM|| ||
|-
|SVC-14 Stripper|| ||
|-
|Thinner P|| ||
|-
|}

=Solvents=
{|
|-valign="top"
|width=300|
*'''[[media:AcetoneMSDS.pdf|Acetone MSDS]]
*'''[[media:AmylAcetateMSDS.pdf|Amyl Acetate MSDS]]
*'''[[media:EthylAlcoholMSDS.pdf|Ethyl Alcohol (Ethanol) MSDS]]
*'''[[media:EthyleneGlycolMSDS.pdf|Ethylene Glycol MSDS]]
*'''[[media:MethylAlcoholMSDS.pdf|Methyl Alcohol (Methanol) MSDS]]
|width=300|
*'''[[media:MethylEthylKetoneMSDS.pdf|Methyl Ethyl Ketone MSDS]]
*'''[[media:MethylIsobutylKetoneMSDS.pdf|Methyl Isobutyl Ketone (MIBK) MSDS]]
*'''[[media:PropanolMSDS.pdf|Propanol MSDS]]
*'''[[media:TolueneMSDS.pdf|Toluene MSDS]]
*'''[[media:XylenesMSDS.pdf|Xylenes MSDS]]
|-
|}

=Other Chemicals=
{|
|-valign="top"
|width=300|
*'''[[media:AmmoniumSulfideMSDS.pdf|Ammonium Sulfide MSDS]]
*'''[[media:Crystalbond509MSDS.pdf|Crystalbond 509 MSDS]]
*'''[[media:GenSolve500MSDS.pdf|GenSolve 500 MSDS]]
*'''[[media:GenTak230MSDS.pdf|GenTak 230 MSDS]]
*'''[[media:GoldEtchantTypeTFAMSDS.pdf|Gold Etchant, Type TFA MSDS]]
*'''[[media:HydrogenPeroxideMSDS.pdf|Hydrogen Peroxide MSDS]]
|width=300|
*'''[[media:NickelEtchantTFBMSDS.pdf|Nickel Etchant Type TFB MSDS]]
*'''[[media:PC3-1500SpinOnGlassMSDS.pdf|PC3-1500 Spin-On-Glass MSDS]]
*'''[[media:SaturatedBromineWaterMSDS.pdf|Saturated Bromine Water MSDS]]
*'''[[media:SilverEtchantTypeTFS.pdf|Silver Etchant Type TFS MSDS]]
*'''[[media:Technic25ESGoldPlatingSolution.pdf|Technic 25 ES Gold Plating Solution MSDS]]
*'''[[media:KJL 705 pump oil.pdf|Kurt J Lesker 705 pump oil MSDS]]
|-
|}
[[File:Example.jpg]]

==UNSORTED==
{|
|-valign="top"
|width=300|
*[[media:DN-201GP-Photoresist-MSDS.pdf|DN-201 GP Photoresist MSDS]]
*[[media:(4-Methylthiophenyl)methyl phenyl sulfonium triflate MSDS.pdf|(4-Methylthiophenyl)methyl phenyl sulfonium triflate MSDS]]
*[[media:(4-Phenylthiophenyl)diphenylsulfonium triflate MSDS.pdf|(4-Phenylthiophenyl)diphenylsulfonium triflate MSDS]]
*[[media:2-Bromo-3-hexylthiophene MSDS.pdf|2-Bromo-3-hexylthiophene MSDS]]
*[[media:2-Hydroxy-2-Methylpropiophenone MSDS.pdf|2-Hydroxy-2-Methylpropiophenone MSDS]]
*[[media:3-Aminopropyl)triethoxysilane MSDS.pdf|3-Aminopropyl)triethoxysilane MSDS]]
*[[media:18-Crown-6 MSDS.pdf|18-Crown-6 MSDS]]
*[[media:1165 Stripper MSDS.pdf|1165 Stripper MSDS]]
*[[media:Accuglass 103 Solvent MSDS.pdf|Accuglass 103 Solvent MSDS]]
*[[media:Accuglass T-12B MSDS.pdf|Accuglass T-12B MSDS]]
*[[media:ACCUGLASS T-12B Spin-On-Glass MSDS.pdf|ACCUGLASS T-12B Spin-On-Glass MSDS]]
*[[media:ACEM 365iS MSDS.pdf|ACEM 365iS MSDS]]
*[[media:Additive S-1 MSDS.pdf|Additive S-1 MSDS]]
*[[media:Adhesion Promoter AP3000 MSDS.pdf|Adhesion Promoter AP3000 MSDS]]
*[[media:Adhesion Promoter VM-651 MSDS.pdf|Adhesion Promoter VM-651 MSDS]]
*[[media:Alkyl Quaternary Ammonium Bentonite MSDS.pdf|Alkyl Quaternary Ammonium Bentonite MSDS]]
*[[media:Alpha Alpha Alpha Trifluorotoluene MSDS.pdf|Alpha Alpha Alpha Trifluorotoluene MSDS]]
*[[media:Aluminum Fluoride MSDS.pdf|Aluminum Fluoride MSDS]]
*[[media:Aluminum Oxide MSDS.pdf|Aluminum Oxide MSDS]]
*[[media:Ammonia MSDS.pdf|Ammonia MSDS]]
*[[media:Ammonium Chloride MSDS.pdf|Ammonium Chloride MSDS]]
*[[media:Ammonium Tartrate MSDS.pdf|Ammonium Tartrate MSDS]]
*[[media:Antimony Powder MSDS.pdf|Antimony Powder MSDS]]
*[[media:AP 3000 Adhesion Promoter MSDS.pdf|AP 3000 Adhesion Promoter MSDS]]
*[[media:AquaBond 55 MSDS.pdf|AquaBond 55 MSDS]]
*[[media:AquaBond 65 MSDS.pdf|AquaBond 65 MSDS]]
*[[media:AquaBond 85 MSDS.pdf|AquaBond 85 MSDS]]
*[[media:AquaClean 900 MSDS.pdf|AquaClean 900 MSDS]]
*[[media:ARC i-CON-7 Anti Reflective MSDS.pdf|ARC i-CON-7 Anti Reflective MSDS]]
*[[media:ARC i-CON-16 MSDS.pdf|ARC i-CON-16 MSDS]]
*[[media:Arcosolv PM Solvent MSDS.pdf|Arcosolv PM Solvent MSDS]]
*[[media:Argon MSDS.pdf|Argon MSDS]]
*[[media:Axarel 2200 Defluxed Degreaser MSDS.pdf|Axarel 2200 Defluxed Degreaser MSDS]]{|
*[[media:AZ 300 MIF Developer MSDS.pdf|AZ 300 MIF Developer MSDS]]
*[[media:AZ 300T Stripper MSDS.pdf|AZ 300T Stripper MSDS]]
*[[media:AZ 400K Developer MSDS.pdf|AZ 400K Developer MSDS]]
*[[media:AZ 726 MIF Developer MSDS.pdf|AZ 726 MIF Developer MSDS]]
*[[media:AZ 726 MIF Developer MSDS2.pdf|AZ 726 MIF Developer (2) MSDS]]
*[[media:AZ 1518 Photoresist MSDS.pdf|AZ 1518 Photoresist MSDS]]
*[[media:AZ Aquatar VIII-A 45 MSDS.pdf|AZ Aquatar VIII-A 45 MSDS]]
*[[media:AZ Aquatar VIII-A 45 MSDS(2).pdf|AZ Aquatar VIII-A 45 MSDS (2)]]
*[[media:AZ Developer MSDS.pdf|AZ Developer MSDS]]
*[[media:AZ EBR Edge Bead Remover MSDS.pdf|AZ EBR Edge Bead Remover MSDS]]
*[[media:AZ LExp.KDB087F 42 MSDS.pdf|AZ LExp.KDB087F 42 MSDS]]
*[[media:AZ LOL 2000 Photoresist MSDS.pdf|AZ LOL 2000 Photoresist MSDS]]
*[[media:AZ nLOF 2020 Photoresist MSDS.pdf|AZ nLOF 2020 Photoresist MSDS]]
*[[media:AZ nLOF 2070 Photoresist MSDS.pdf|AZ nLOF 2070 Photoresist MSDS]]
*[[media:AZ nLOF 5510 Photoresist MSDS.pdf|AZ nLOF 5510 Photoresist MSDS]]
*[[media:AZ P4110 Photoresist MSDS.pdf|AZ P4110 Photoresist MSDS]]
*[[media:AZ P4210 Photoresist MSDS.pdf|AZ P4210 Photoresist MSDS]]
*[[media:AZ P4330 RS Photoresist MSDS.pdf|AZ P4330 RS Photoresist MSDS]]
*[[media:AZ P4620 Photoresist MSDS.pdf|AZ P4620 Photoresist MSDS]]
*[[media:AZ P5214 EIR Photoresist MSDS.pdf|AZ P5214 EIR Photoresist MSDS]]
*[[media:AZ R200 Coating MSDS.pdf|AZ R200 Coating MSDS]]
*[[media:AZ SH-114A MSDS.pdf|AZ SH-114A MSDS]]
*[[media:Benzoyl Peroxide MSDS.pdf|Benzoyl Peroxide MSDS]]
*[[media:Bipyridyl Dichlororuthenium II Hexahydrate MDSD.pdf|Bipyridyl Dichlororuthenium II Hexahydrate MDSD]]
*[[media:BIS Cyclopentadienyl Iron (Ferrocene) MSDS.pdf|BIS Cyclopentadienyl Iron (Ferrocene) MSDS]]
*[[media:BIS Cyclopentadienyl Magnesium MSDS.pdf|BIS Cyclopentadienyl Magnesium MSDS]]
*[[media:Bismuth.pdf|Bismuth]]
*[[media:Brewer Science WaferBOND HT-10 MSDS.pdf|Brewer Science WaferBOND HT-10 MSDS]]
*[[media:Brewer Science WaferBOND Remover MSDS.pdf|Brewer Science WaferBOND Remover MSDS]]
*[[media:Bromine MSDS.pdf|Bromine MSDS]]
*[[media:Buffered Oxide Etch JT Baker MSDS.pdf|Buffered Oxide Etch JT Baker MSDS]]
*[[media:CAaD Poymers MSDS.pdf|CAaD Poymers MSDS]]
*[[media:Calcium Fluoride MSDS.pdf|Calcium Fluoride MSDS]]
*[[media:Carbon Black MSDS.pdf|Carbon Black MSDS]]
*[[media:Carbon Tetrachloride MSDS.pdf|Carbon Tetrachloride MSDS]]
*[[media:CEM 365 IS MSDS.pdf|CEM 365 IS MSDS]]
*[[media:Cesium Fluoride MSDS.pdf|Cesium Fluoride MSDS]]
*[[media:Cesium Hydroxide Monohydrate MSDS.pdf|Cesium Hydroxide Monohydrate MSDS]]
*[[media:CF19-2186 Part A MSDS.PDF|CF19-2186 Part A MSDS]]
*[[media:CF19-2186 Part B MSDS.PDF|CF19-2186 Part B MSDS]]
*[[media:Chlorine MSDS.pdf|Chlorine MSDS]]
*[[media:Chloroform MSDS.pdf|Chloroform MSDS]]
*[[media:Chromium Etchant 1020AC MSDS.pdf|Chromium Etchant 1020AC MSDS]]
*[[media:CLEVIOS P MSDS.pdf|CLEVIOS P MSDS]]
*[[media:Clorobenzene MSDS.pdf|Clorobenzene MSDS]]
*[[media:Collodion MSDS.pdf|Collodion MSDS]]
*[[media:Copolmyer MMA(8.5)MAA(EL9) MSDS.pdf|Copolmyer MMA(8.5)MAA(EL9) MSDS]]
*[[media:Copper (II) Sulfate Pentahydrate MSDS.pdf|Copper (II) Sulfate Pentahydrate MSDS]]
*[[media:Cyclohexane MSDS.pdf|Cyclohexane MSDS]]
*[[media:Cyclopentanone MSDS.pdf|Cyclopentanone MSDS]]
*[[media:Cyclotene 3022 MSDS.pdf|Cyclotene 3022 MSDS]]
*[[media:Cyclotene 4000 Resin MSDS.pdf|Cyclotene 4000 Resin MSDS]]
*[[media:Cyclotene 4022 MSDS.pdf|Cyclotene 4022 MSDS]]
*[[media:Cyclotene 4024-40 BCB MSDS.pdf|Cyclotene 4024-40 BCB MSDS]]
*[[media:Cyclotene 4026 Resin MSDS.pdf|Cyclotene 4026 Resin MSDS]]
|width=300|
*[[media:DE-6018 Polymide Developer MSDS.pdf|DE-6018 Polymide Developer MSDS]]
*[[media:DE9040 Developer MSDS.pdf|DE9040 Developer MSDS]]
*[[media:Developer DS3000 MSDS.pdf|Developer DS3000 MSDS]]
*[[media:Dibenzo-18-crown-6 MSDS.pdf|Dibenzo-18-crown-6 MSDS]]
*[[media:Diethoxyethane MSDS.pdf|Diethoxyethane MSDS]]
*[[media:Diethylzinc MSDS.pdf|Diethylzinc MSDS]]
*[[media:Dimethyldydrazine MSDS.pdf|Dimethyldydrazine MSDS]]
*[[media:Dimethylsila-17-Crown-6 MSDS.pdf|Dimethylsila-17-Crown-6 MSDS]]
*[[media:Dimethylsulfoxide MSDS.pdf|Dimethylsulfoxide MSDS]]
*[[media:Disilane MSDS.pdf|Disilane MSDS]]
*[[media:Dodecanethiol MSDS.pdf|Dodecanethiol MSDS]]
*[[media:Dow Corning WL-5150 MSDS.pdf|Dow Corning WL-5150 MSDS]]
*[[media:DS 2100 BCB Developer MSDS.pdf|DS 2100 BCB Developer MSDS]]
*[[media:Dynasolve 165 MSDS.pdf|Dynasolve 165 MSDS]]
*[[media:Dynasolve 185 MSDS.pdf|Dynasolve 185 MSDS]]
*[[media:EC11 Solvent MSDS.pdf|EC11 Solvent MSDS]]
*[[media:ECF-63 Gold Plating Solution MSDS.pdf|ECF-63 Gold Plating Solution MSDS]]
*[[media:EKC 1020 Photoresist MSDS.pdf|EKC 1020 Photoresist MSDS]]
*[[media:EKC 265 Stripper MSDS.pdf|EKC 265 Stripper MSDS]]
*[[media:Epo Tek H20E, Part A & B.pdf|Epo Tek H20E]]
*[[media:Er(TMOD)3 MSDS.pdf|Er(TMOD)3 MSDS]]
*[[media:Ethylenediamine MSDS.pdf|Ethylenediamine MSDS]]
*[[media:FC-4430 MSDS.pdf|FC-4430 MSDS]]
*[[media:FC-4432 MSDS.pdf|FC-4432 MSDS]]
*[[media:FOX-16 Flowable Oxide MSDS.pdf|FOX-16 Flowable Oxide MSDS]]
*[[media:FTO 100-FBA5 Etchant MSDS.pdf|FTO 100-FBA5 Etchant MSDS]]
*[[media:Fe-Pt Bimetallic Nanoparticles in Hexane MSDS.pdf|Fe-Pt Bimetallic Nanoparticles in Hexane MSDS]]
*[[media:Ferric Chloride Hexahydrate MSDS.pdf|Ferric Chloride Hexahydrate MSDS]]
*[[media:Ferric Nitrate Nonahydrate MSDS.pdf|Ferric Nitrate Nonahydrate MSDS]]
*[[media:Ferrous Sulfate MSDS.pdf|Ferrous Sulfate MSDS]]
*[[media:Filmtronics 700B Spin On Glass MSDS.pdf|Filmtronics 700B Spin On Glass MSDS]]
*[[media:Fomblin Y-LVAC 25-6 MSDS.pdf|Fomblin Y-LVAC 25/6 MSDS]]
*[[media:Freon 13B1 Refrigerant MSDS.pdf|Freon 13B1 Refrigerant MSDS]]
*[[media:Gadolinium Oxide MSDS.pdf|Gadolinium Oxide MSDS]]
*[[media:Gallium Arsenide MSDS.pdf|Gallium Arsenide MSDS]]
*[[media:Germanium MSDS.pdf|Germanium MSDS]]
*[[media:Glycerol MSDS.pdf|Glycerol MSDS]]
*[[media:Gold Chloride Hydrate MSDS.pdf|Gold Chloride Hydrate MSDS]]
*[[media:Gold_Etchant_GE-8148-GE-8110_MSDS.pdf|Gold Etchant GE-8148/GE-8110 MSDS]]
*[[media:HD-8820 MSDS.pdf|HD-8820 MSDS]]
*[[media:HD-8820 Polyimide MSDS.pdf|HD-8820 Polyimide MSDS]]
*[[media:HMDS MSDS.pdf|HMDS MSDS]]
*[[media:Hafnium MSDS.pdf|Hafnium MSDS]]
*[[media:Hafnium Oxide MSDS.pdf|Hafnium Oxide MSDS]]
*[[media:Hexadecane MSDS.pdf|Hexadecane MSDS]]
*[[media:Hexamethyldisilazane MSDS.pdf|Hexamethyldisilazane MSDS]]
*[[media:Hexanediol Diacrylate MSDS.pdf|Hexanediol Diacrylate MSDS]]
*[[media:Hydrogen Iodide MSDS.pdf|Hydrogen Iodide MSDS]]
*[[media:Hydrogen MSDS.pdf|Hydrogen MSDS]]
*[[media:IC1-200 Spin On Glass MSDS.pdf|IC1-200 Spin On Glass MSDS]]
*[[media:Imidazole MSDS.pdf|Imidazole MSDS]]
*[[media:Indium MSDS.pdf|Indium MSDS]]
*[[media:Indium Phosphide MSDS.pdf|Indium Phosphide MSDS]]
*[[media:Iodine MSDS.pdf|Iodine MSDS]]
*[[media:Iodine-Bromide Solution MSDS.pdf|Iodine-Bromide Solution MSDS]]
*[[media:Iridium (IV) Chloride MSDS.pdf|Iridium (IV) Chloride MSDS]]
*[[media:Isopropyl Alcohol MSDS.pdf|Isopropyl Alcohol MSDS]]
*[[media:JSR NFC FZX F112 Photoresist Overcoat MSDS.pdf|JSR NFC FZX F112 Photoresist Overcoat MSDS]]
*[[media:JSR NSD 2533Y Photoresist MSDS.pdf|JSR NSD 2533Y Photoresist MSDS]]
*[[media:LDD 26W Developer MSDS.pdf|LDD 26W Developer MSDS]]
*[[media:LOL 2000 Lift Off Layer MSDS.pdf|LOL 2000 Lift Off Layer MSDS]]
*[[media:LOR A Photoresist MSDS.pdf|LOR A Photoresist MSDS]]
*[[media:LOR B Photoresist MSDS.pdf|LOR B Photoresist MSDS]]
*[[media:Lanthanum Fluoride MSDS.pdf|Lanthanum Fluoride MSDS]]
*[[media:Lead Metal MSDS.pdf|Lead Metal MSDS]]
*[[media:MF 24A Developer MSDS.pdf|MF 24A Developer MSDS]]
*[[media:MF-701 Developer MSDS.pdf|MF-701 Developer MSDS]]
*[[media:MICRAL 9400 MSDS.pdf|MICRAL 9400 MSDS]]
*[[media:MMA(8.5)MAA Copolymer Series Resists MSDS.pdf|MMA(8.5)MAA Copolymer Series Resists MSDS]]
*[[media:MR-i 7000 series MSDS.pdf|MR-i 7000 series MSDS]]
*[[media:Magnesium Fluoride MSDS.pdf|Magnesium Fluoride MSDS]]
*[[media:Manganese Pieces MSDS.pdf|Manganese Pieces MSDS]]
*[[media:Manganese Sulfate MSDS.pdf|Manganese Sulfate MSDS]]
*[[media:Mesitylene MSDS.pdf|Mesitylene MSDS]]
*[[media:Methacryloxypropyltrimethoxysilane-3 MSDS.pdf|Methacryloxypropyltrimethoxysilane-3 MSDS]]
*[[media:Methane MSDS.pdf|Methane MSDS]]
*[[media:Methylstyrene MSDS.pdf|Methylstyrene MSDS]]
*[[media:Methyltrimethoxysilane MSDS.pdf|Methyltrimethoxysilane MSDS]]
*[[media:MicroChem 101 Developer MSDS.pdf|MicroChem 101 Developer MSDS]]
*[[media:Microposit 351 Developer MSDS.pdf|Microposit 351 Developer MSDS]]
*[[media:Microposit S1822 Photoresist MSDS.pdf|Microposit S1822 Photoresist MSDS]]
*[[media:Microprime HP Primer MSDS.pdf|Microprime HP Primer MSDS]]
*[[media:Mung MSDS.pdf|Mung MSDS]]
|width=300|
*[[media:N Methyl 2 Pyrrolidone MSDS.pdf|N Methyl 2 Pyrrolidone MSDS]]
*[[media:NANO 495PMMA MSDS.pdf|NANO 495PMMA MSDS]]
*[[media:NANO LOR B Series Resist MSDS.pdf|NANO LOR B Series Resist MSDS]]
*[[media:NANO MMA(17.5)MAA EL 10 MSDS.pdf|NANO MMA(17.5)MAA EL 10 MSDS]]
*[[media:NEB-31 Photoresist MSDS.pdf|NEB-31 Photoresist MSDS]]
*[[media:NOE Etch I MSDS.pdf|NOE Etch I MSDS]]
*[[media:NR5-8000 Photoresist MSDS.pdf|NR5-8000 Photoresist MSDS]]
*[[media:NR7-1500PY Photoresist MSDS.pdf|NR7-1500PY Photoresist MSDS]]
*[[media:NR71-6000PY Photoresist MSDS.pdf|NR71-6000PY Photoresist MSDS]]
*[[media:NR9-8000 Photoresist MSDS.pdf|NR9-8000 Photoresist MSDS]]
*[[media:NXR-1010 Imprint Resist MSDS.pdf|NXR-1010 Imprint Resist MSDS]]
*[[media:NXR-1020 Imprint Resist MSDS.pdf|NXR-1020 Imprint Resist MSDS]]
*[[media:NXR-2010 Imprint Resist MSDS.pdf|NXR-2010 Imprint Resist MSDS]]
*[[media:NXR-3020 Imprint Resist MSDS.pdf|NXR-3020 Imprint Resist MSDS]]
*[[media:NXR-3022 Imprint Resist MSDS.pdf|NXR-3022 Imprint Resist MSDS]]
*[[media:Nano MMA Photoresist MSDS.pdf|Nano MMA Photoresist MSDS]]
*[[media:Nano PMGI SF-series Photoresist MSDS.pdf|Nano PMGI SF-series Photoresist MSDS]]
*[[media:NanoRemover PG Photoresist Remover MSDS.pdf|NanoRemover PG Photoresist Remover MSDS]]
*[[media:NanoStrip MSDS.pdf|NanoStrip MSDS]]
*[[media:Nanochem OMA MSDS.pdf|Nanochem OMA MSDS]]
*[[media:Negative Resist NR9-8000 MSDS.pdf|Negative Resist NR9-8000 MSDS]]
*[[media:Nickel Ammonium Sulfate MSDS.pdf|Nickel Ammonium Sulfate MSDS]]
*[[media:Nickel Chloride MSDS.pdf|Nickel Chloride MSDS]]
*[[media:Nickel MSDS.pdf|Nickel MSDS]]
*[[media:Nickel Sulfamate MSDS.pdf|Nickel Sulfamate MSDS]]
*[[media:Nickel Sulfamate Plating Solution MSDS.pdf|Nickel Sulfamate Plating Solution MSDS]]
*[[media:Nickel Sulfamate Semi-Bright Nickel "S" MSDS.pdf|Nickel Sulfamate Semi-Bright Nickel "S" MSDS]]
*[[media:Nickel Sulfate Crystal MSDS.pdf|Nickel Sulfate Crystal MSDS]]
*[[media:Nickelous Sulfate MSDS.pdf|Nickelous Sulfate MSDS]]
*[[media:Nickle (II) Carbonate MSDS.pdf|Nickle (II) Carbonate MSDS]]
*[[media:Nitrogen MSDS.pdf|Nitrogen MSDS]]
|-
|}

{{MSDS}}

Chemical List - OLD 2018-09-05

2017-04-26T17:41:42Z

Reynolds t: /* Other Chemicals */

Chemical List - OLD 2018-09-05

2017-04-26T17:38:04Z

Reynolds t: /* Other Chemicals */

Below is a list of all chemicals authorized for use in the lab. Please note that only the chemicals that appear in '''bold''' are stocked by the lab. All other chemicals have been authorized for users to bring.
=Acids=
{|
|-valign="top"
|width=300|
*'''[[media:Acetic Acid MSDS.pdf|Acetic Acid MSDS]]'''
*'''[[media:Al Etchant, Type A MSDS.pdf|Al Etchant, Type A MSDS]]'''
*'''[[media:Al Etchant, Type D MSDS.pdf|Al Etchant, Type D MSDS]]'''
*[[media:BoricAcidMSDS.pdf|Boric Acid MSDS]]
*'''[[media:Buffered HF.pdf|Buffered HF MSDS]]
*'''[[media:Chromic Acid.pdf|Chromic Acid MSDS]]'''
*'''[[media:ChromiumMaskEtchantMSDS.pdf|Chromium Mask Etchant MSDS]]
*'''[[media:CitricAcidMSDS.pdf|Citric Acid (granular) MSDS]]
*[[media:FormicAcidMSDS.pdf|Formic Acid 88% MSDS]]
*'''[[media:HydrobromicAcidMSDS.pdf|Hydrobromic Acid MSDS]]
*'''[[media:HydrochloricAcidMSDS.pdf|Hydrochloric Acid MSDS]]'''
*'''[[media:HydrofluoricAcidMSDS.pdf|Hydrofluoric Acid 49% MSDS]]
*[[media:HydroiodicAcidMSDS.pdf|Hydroiodic Acid 47% MSDS]]
*[[media:LacticAcidFractionalMSDS.pdf|Lactic Acid 0.1 Normal Volumetric MSDS]]
|width=300|
*[[media:LacticAcidMSDS.pdf|Lactic Acid MSDS]]
*[[media:MethacrylicAcidMSDS.pdf|Methacrylic Acid MSDS]]
*'''[[media:NickelEtchantTFBMSDS.pdf|Nickel Etchant, Type TFB MSDS]]
*'''[[media:NitricAcidMSDS.pdf|Nitric Acid MSDS]]
*[[media:OxalicAcidDihydrateMSDS.pdf|Oxalic Acid Dihydrate MSDS]]
*'''[[media:PhosphoricAcidMSDS.pdf|Phosphoric Acid MSDS]]
*[[media:SelenousAcidMSDS.pdf|Selenous Acid MSDS]]
*[[media:SuccinicAcid99%MSDS.pdf|Succinic Acid 99% MSDS]]
*[[media:SulfamicAcidMSDS.pdf|Sulfamic Acid MSDS]]
*[[media:SulfuricAcid93%MSDS.pdf|Sulfuric Acid 93% MSDS]]
*[[media:SulfuricAcidFuming.pdf|Sulfuric Acid Fuming MSDS]]
*'''[[media:SulfuricAcidMSDS.pdf|Sulfuric Acid MSDS]]
*[[media:TartaricAcidMSDS.pdf|Tartaric Acid MSDS]]
*'''[[media:TiEtchantMSDS.pdf|Ti Etchant, Type TFTN MSDS]]
|-
|}

=Bases=
{|
|-valign="top"
|width=300|
*'''[[media:AmmoniumHydroxideMSDS.pdf|Ammonium Hydroxide MSDS]]
*'''[[media:AmmoniumSulfideMSDS.pdf|Ammonium Sulfide MSDS]]
*'''[[media:PotassiumHydroxideMSDS.pdf|Potassium Hydroxide MSDS]]
*'''[[media:SodiumHydroxideMSDS.pdf|Sodium Hydroxide MSDS]]
|width=300|
*'''[[media:SodiumSulfideMSDS.pdf|Sodium Sulfide MSDS]]
*'''[[media:THAH25MSDS1.pdf|TMAH 25% MSDS #1]]
*'''[[media:THAH25MSDS2.pdf|TMAH 25% MSDS #2]]
|-
|}

=Lithography Chemicals=
{| class="wikitable" style="font-size: 95%;" border="1" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center; font-size: 95%"
|-bgcolor=#D0E7FF
!align=center bgcolor=#D0E7FF width="250"|'''Chemical'''
!align=center bgcolor=#D0E7FF width="250"|'''MSDS'''
!align=center bgcolor=#D0E7FF width="150"|'''Datasheet'''
|-
|'''1165 Stripper||[[media:1165 Stripper MSDS.pdf|1165 Stripper MSDS]]||[[media:1165 Stripper Datasheet.pdf|1165 Stripper Datasheet]]
|-
|'''Accuglass T-12B||[[media:AccuglassT-12B-MSDS.pdf|Accuglass T-12B MSDS]] ||
|-
|'''AP 3000 Adhesion Promoter||[[media:AP-3000-Adhesion-MSDS.pdf|AP 3000 Adhesion Promoter]] ||
|-
|AZ 300 MIF Developer|| ||
|-
|AZ 300T Stripper|| ||
|-
|AZ 400K Developer|| ||
|-
|AZ726 MIF Developer|| ||
|-
|AZ EBR Edge Bead Remover|| ||
|-
|AZ LOL 2000 Photoresist|| ||
|-
|AZ nLOF 2020 Photoresist|| ||
|-
|AZ nLOF 5510 Photoresist|| ||
|-
|AZ P4110 Photoresist|| ||
|-
|AZ P4210 Photoresist|| ||
|-
|AZ P4330 RS Photoresist|| ||
|-
|AZ P5214 EIR Photoresist|| ||
|-
|CEM 365 IS|| ||
|-
|Cyclotene 4024-40 BCB|| ||
|-
|DS 2100 VCS Developer|| ||
|-
|HMDS|| ||
|-
|ma-N 2403 Photoresist|| ||
|-
|mr-l-7000 Imprint Polymer|| ||[[media:mr-l-7000-Imprint-Polymer.pdf|mr-l-7000 Datasheet]]
|-
|MCC-101 Developer|| ||
|-
|Nano MMA Photoresist|| ||
|-
|NR7-1500PY Photoresist|| ||
|-
|NXR-1010 Imprint Resist|| ||
|-
|NXR-1020 Imprint Resist|| ||[[media:NXR-1020-Datasheet.pdf|NXR-1020 Datasheet]]
|-
|OCG 825 Photoresist|| ||
|-
|PMGI SF-series Photoresist|| ||
|-
|PRX-127 Stripper|| ||
|-
|RD6 Developer|| ||
|-
|S1805 Photoresist|| ||
|-
|SPR 220 Photoresist|| ||
|-
|SPR 510A Photoresist|| ||
|-
|SPR 518A Photoresist|| ||
|-
|SPR 950-0.8 Photoresist|| ||
|-
|SPR 955 CM|| ||
|-
|SVC-14 Stripper|| ||
|-
|Thinner P|| ||
|-
|}

=Solvents=
{|
|-valign="top"
|width=300|
*'''[[media:AcetoneMSDS.pdf|Acetone MSDS]]
*'''[[media:AmylAcetateMSDS.pdf|Amyl Acetate MSDS]]
*'''[[media:EthylAlcoholMSDS.pdf|Ethyl Alcohol (Ethanol) MSDS]]
*'''[[media:EthyleneGlycolMSDS.pdf|Ethylene Glycol MSDS]]
*'''[[media:MethylAlcoholMSDS.pdf|Methyl Alcohol (Methanol) MSDS]]
|width=300|
*'''[[media:MethylEthylKetoneMSDS.pdf|Methyl Ethyl Ketone MSDS]]
*'''[[media:MethylIsobutylKetoneMSDS.pdf|Methyl Isobutyl Ketone (MIBK) MSDS]]
*'''[[media:PropanolMSDS.pdf|Propanol MSDS]]
*'''[[media:TolueneMSDS.pdf|Toluene MSDS]]
*'''[[media:XylenesMSDS.pdf|Xylenes MSDS]]
|-
|}

=Other Chemicals=
{|
|-valign="top"
|width=300|
*'''[[media:AmmoniumSulfideMSDS.pdf|Ammonium Sulfide MSDS]]
*'''[[media:Crystalbond509MSDS.pdf|Crystalbond 509 MSDS]]
*'''[[media:GenSolve500MSDS.pdf|GenSolve 500 MSDS]]
*'''[[media:GenTak230MSDS.pdf|GenTak 230 MSDS]]
*'''[[media:GoldEtchantTypeTFAMSDS.pdf|Gold Etchant, Type TFA MSDS]]
*'''[[media:HydrogenPeroxideMSDS.pdf|Hydrogen Peroxide MSDS]]
|width=300|
*'''[[media:NickelEtchantTFBMSDS.pdf|Nickel Etchant Type TFB MSDS]]
*'''[[media:PC3-1500SpinOnGlassMSDS.pdf|PC3-1500 Spin-On-Glass MSDS]]
*'''[[media:SaturatedBromineWaterMSDS.pdf|Saturated Bromine Water MSDS]]
*'''[[media:SilverEtchantTypeTFS.pdf|Silver Etchant Type TFS MSDS]]
*'''[[media:Technic25ESGoldPlatingSolution.pdf|Technic 25 ES Gold Plating Solution MSDS]]
|-
|}

==UNSORTED==
{|
|-valign="top"
|width=300|
*[[media:DN-201GP-Photoresist-MSDS.pdf|DN-201 GP Photoresist MSDS]]
*[[media:(4-Methylthiophenyl)methyl phenyl sulfonium triflate MSDS.pdf|(4-Methylthiophenyl)methyl phenyl sulfonium triflate MSDS]]
*[[media:(4-Phenylthiophenyl)diphenylsulfonium triflate MSDS.pdf|(4-Phenylthiophenyl)diphenylsulfonium triflate MSDS]]
*[[media:2-Bromo-3-hexylthiophene MSDS.pdf|2-Bromo-3-hexylthiophene MSDS]]
*[[media:2-Hydroxy-2-Methylpropiophenone MSDS.pdf|2-Hydroxy-2-Methylpropiophenone MSDS]]
*[[media:3-Aminopropyl)triethoxysilane MSDS.pdf|3-Aminopropyl)triethoxysilane MSDS]]
*[[media:18-Crown-6 MSDS.pdf|18-Crown-6 MSDS]]
*[[media:1165 Stripper MSDS.pdf|1165 Stripper MSDS]]
*[[media:Accuglass 103 Solvent MSDS.pdf|Accuglass 103 Solvent MSDS]]
*[[media:Accuglass T-12B MSDS.pdf|Accuglass T-12B MSDS]]
*[[media:ACCUGLASS T-12B Spin-On-Glass MSDS.pdf|ACCUGLASS T-12B Spin-On-Glass MSDS]]
*[[media:ACEM 365iS MSDS.pdf|ACEM 365iS MSDS]]
*[[media:Additive S-1 MSDS.pdf|Additive S-1 MSDS]]
*[[media:Adhesion Promoter AP3000 MSDS.pdf|Adhesion Promoter AP3000 MSDS]]
*[[media:Adhesion Promoter VM-651 MSDS.pdf|Adhesion Promoter VM-651 MSDS]]
*[[media:Alkyl Quaternary Ammonium Bentonite MSDS.pdf|Alkyl Quaternary Ammonium Bentonite MSDS]]
*[[media:Alpha Alpha Alpha Trifluorotoluene MSDS.pdf|Alpha Alpha Alpha Trifluorotoluene MSDS]]
*[[media:Aluminum Fluoride MSDS.pdf|Aluminum Fluoride MSDS]]
*[[media:Aluminum Oxide MSDS.pdf|Aluminum Oxide MSDS]]
*[[media:Ammonia MSDS.pdf|Ammonia MSDS]]
*[[media:Ammonium Chloride MSDS.pdf|Ammonium Chloride MSDS]]
*[[media:Ammonium Tartrate MSDS.pdf|Ammonium Tartrate MSDS]]
*[[media:Antimony Powder MSDS.pdf|Antimony Powder MSDS]]
*[[media:AP 3000 Adhesion Promoter MSDS.pdf|AP 3000 Adhesion Promoter MSDS]]
*[[media:AquaBond 55 MSDS.pdf|AquaBond 55 MSDS]]
*[[media:AquaBond 65 MSDS.pdf|AquaBond 65 MSDS]]
*[[media:AquaBond 85 MSDS.pdf|AquaBond 85 MSDS]]
*[[media:AquaClean 900 MSDS.pdf|AquaClean 900 MSDS]]
*[[media:ARC i-CON-7 Anti Reflective MSDS.pdf|ARC i-CON-7 Anti Reflective MSDS]]
*[[media:ARC i-CON-16 MSDS.pdf|ARC i-CON-16 MSDS]]
*[[media:Arcosolv PM Solvent MSDS.pdf|Arcosolv PM Solvent MSDS]]
*[[media:Argon MSDS.pdf|Argon MSDS]]
*[[media:Axarel 2200 Defluxed Degreaser MSDS.pdf|Axarel 2200 Defluxed Degreaser MSDS]]{|
*[[media:AZ 300 MIF Developer MSDS.pdf|AZ 300 MIF Developer MSDS]]
*[[media:AZ 300T Stripper MSDS.pdf|AZ 300T Stripper MSDS]]
*[[media:AZ 400K Developer MSDS.pdf|AZ 400K Developer MSDS]]
*[[media:AZ 726 MIF Developer MSDS.pdf|AZ 726 MIF Developer MSDS]]
*[[media:AZ 726 MIF Developer MSDS2.pdf|AZ 726 MIF Developer (2) MSDS]]
*[[media:AZ 1518 Photoresist MSDS.pdf|AZ 1518 Photoresist MSDS]]
*[[media:AZ Aquatar VIII-A 45 MSDS.pdf|AZ Aquatar VIII-A 45 MSDS]]
*[[media:AZ Aquatar VIII-A 45 MSDS(2).pdf|AZ Aquatar VIII-A 45 MSDS (2)]]
*[[media:AZ Developer MSDS.pdf|AZ Developer MSDS]]
*[[media:AZ EBR Edge Bead Remover MSDS.pdf|AZ EBR Edge Bead Remover MSDS]]
*[[media:AZ LExp.KDB087F 42 MSDS.pdf|AZ LExp.KDB087F 42 MSDS]]
*[[media:AZ LOL 2000 Photoresist MSDS.pdf|AZ LOL 2000 Photoresist MSDS]]
*[[media:AZ nLOF 2020 Photoresist MSDS.pdf|AZ nLOF 2020 Photoresist MSDS]]
*[[media:AZ nLOF 2070 Photoresist MSDS.pdf|AZ nLOF 2070 Photoresist MSDS]]
*[[media:AZ nLOF 5510 Photoresist MSDS.pdf|AZ nLOF 5510 Photoresist MSDS]]
*[[media:AZ P4110 Photoresist MSDS.pdf|AZ P4110 Photoresist MSDS]]
*[[media:AZ P4210 Photoresist MSDS.pdf|AZ P4210 Photoresist MSDS]]
*[[media:AZ P4330 RS Photoresist MSDS.pdf|AZ P4330 RS Photoresist MSDS]]
*[[media:AZ P4620 Photoresist MSDS.pdf|AZ P4620 Photoresist MSDS]]
*[[media:AZ P5214 EIR Photoresist MSDS.pdf|AZ P5214 EIR Photoresist MSDS]]
*[[media:AZ R200 Coating MSDS.pdf|AZ R200 Coating MSDS]]
*[[media:AZ SH-114A MSDS.pdf|AZ SH-114A MSDS]]
*[[media:Benzoyl Peroxide MSDS.pdf|Benzoyl Peroxide MSDS]]
*[[media:Bipyridyl Dichlororuthenium II Hexahydrate MDSD.pdf|Bipyridyl Dichlororuthenium II Hexahydrate MDSD]]
*[[media:BIS Cyclopentadienyl Iron (Ferrocene) MSDS.pdf|BIS Cyclopentadienyl Iron (Ferrocene) MSDS]]
*[[media:BIS Cyclopentadienyl Magnesium MSDS.pdf|BIS Cyclopentadienyl Magnesium MSDS]]
*[[media:Bismuth.pdf|Bismuth]]
*[[media:Brewer Science WaferBOND HT-10 MSDS.pdf|Brewer Science WaferBOND HT-10 MSDS]]
*[[media:Brewer Science WaferBOND Remover MSDS.pdf|Brewer Science WaferBOND Remover MSDS]]
*[[media:Bromine MSDS.pdf|Bromine MSDS]]
*[[media:Buffered Oxide Etch JT Baker MSDS.pdf|Buffered Oxide Etch JT Baker MSDS]]
*[[media:CAaD Poymers MSDS.pdf|CAaD Poymers MSDS]]
*[[media:Calcium Fluoride MSDS.pdf|Calcium Fluoride MSDS]]
*[[media:Carbon Black MSDS.pdf|Carbon Black MSDS]]
*[[media:Carbon Tetrachloride MSDS.pdf|Carbon Tetrachloride MSDS]]
*[[media:CEM 365 IS MSDS.pdf|CEM 365 IS MSDS]]
*[[media:Cesium Fluoride MSDS.pdf|Cesium Fluoride MSDS]]
*[[media:Cesium Hydroxide Monohydrate MSDS.pdf|Cesium Hydroxide Monohydrate MSDS]]
*[[media:CF19-2186 Part A MSDS.PDF|CF19-2186 Part A MSDS]]
*[[media:CF19-2186 Part B MSDS.PDF|CF19-2186 Part B MSDS]]
*[[media:Chlorine MSDS.pdf|Chlorine MSDS]]
*[[media:Chloroform MSDS.pdf|Chloroform MSDS]]
*[[media:Chromium Etchant 1020AC MSDS.pdf|Chromium Etchant 1020AC MSDS]]
*[[media:CLEVIOS P MSDS.pdf|CLEVIOS P MSDS]]
*[[media:Clorobenzene MSDS.pdf|Clorobenzene MSDS]]
*[[media:Collodion MSDS.pdf|Collodion MSDS]]
*[[media:Copolmyer MMA(8.5)MAA(EL9) MSDS.pdf|Copolmyer MMA(8.5)MAA(EL9) MSDS]]
*[[media:Copper (II) Sulfate Pentahydrate MSDS.pdf|Copper (II) Sulfate Pentahydrate MSDS]]
*[[media:Cyclohexane MSDS.pdf|Cyclohexane MSDS]]
*[[media:Cyclopentanone MSDS.pdf|Cyclopentanone MSDS]]
*[[media:Cyclotene 3022 MSDS.pdf|Cyclotene 3022 MSDS]]
*[[media:Cyclotene 4000 Resin MSDS.pdf|Cyclotene 4000 Resin MSDS]]
*[[media:Cyclotene 4022 MSDS.pdf|Cyclotene 4022 MSDS]]
*[[media:Cyclotene 4024-40 BCB MSDS.pdf|Cyclotene 4024-40 BCB MSDS]]
*[[media:Cyclotene 4026 Resin MSDS.pdf|Cyclotene 4026 Resin MSDS]]
|width=300|
*[[media:DE-6018 Polymide Developer MSDS.pdf|DE-6018 Polymide Developer MSDS]]
*[[media:DE9040 Developer MSDS.pdf|DE9040 Developer MSDS]]
*[[media:Developer DS3000 MSDS.pdf|Developer DS3000 MSDS]]
*[[media:Dibenzo-18-crown-6 MSDS.pdf|Dibenzo-18-crown-6 MSDS]]
*[[media:Diethoxyethane MSDS.pdf|Diethoxyethane MSDS]]
*[[media:Diethylzinc MSDS.pdf|Diethylzinc MSDS]]
*[[media:Dimethyldydrazine MSDS.pdf|Dimethyldydrazine MSDS]]
*[[media:Dimethylsila-17-Crown-6 MSDS.pdf|Dimethylsila-17-Crown-6 MSDS]]
*[[media:Dimethylsulfoxide MSDS.pdf|Dimethylsulfoxide MSDS]]
*[[media:Disilane MSDS.pdf|Disilane MSDS]]
*[[media:Dodecanethiol MSDS.pdf|Dodecanethiol MSDS]]
*[[media:Dow Corning WL-5150 MSDS.pdf|Dow Corning WL-5150 MSDS]]
*[[media:DS 2100 BCB Developer MSDS.pdf|DS 2100 BCB Developer MSDS]]
*[[media:Dynasolve 165 MSDS.pdf|Dynasolve 165 MSDS]]
*[[media:Dynasolve 185 MSDS.pdf|Dynasolve 185 MSDS]]
*[[media:EC11 Solvent MSDS.pdf|EC11 Solvent MSDS]]
*[[media:ECF-63 Gold Plating Solution MSDS.pdf|ECF-63 Gold Plating Solution MSDS]]
*[[media:EKC 1020 Photoresist MSDS.pdf|EKC 1020 Photoresist MSDS]]
*[[media:EKC 265 Stripper MSDS.pdf|EKC 265 Stripper MSDS]]
*[[media:Epo Tek H20E, Part A & B.pdf|Epo Tek H20E]]
*[[media:Er(TMOD)3 MSDS.pdf|Er(TMOD)3 MSDS]]
*[[media:Ethylenediamine MSDS.pdf|Ethylenediamine MSDS]]
*[[media:FC-4430 MSDS.pdf|FC-4430 MSDS]]
*[[media:FC-4432 MSDS.pdf|FC-4432 MSDS]]
*[[media:FOX-16 Flowable Oxide MSDS.pdf|FOX-16 Flowable Oxide MSDS]]
*[[media:FTO 100-FBA5 Etchant MSDS.pdf|FTO 100-FBA5 Etchant MSDS]]
*[[media:Fe-Pt Bimetallic Nanoparticles in Hexane MSDS.pdf|Fe-Pt Bimetallic Nanoparticles in Hexane MSDS]]
*[[media:Ferric Chloride Hexahydrate MSDS.pdf|Ferric Chloride Hexahydrate MSDS]]
*[[media:Ferric Nitrate Nonahydrate MSDS.pdf|Ferric Nitrate Nonahydrate MSDS]]
*[[media:Ferrous Sulfate MSDS.pdf|Ferrous Sulfate MSDS]]
*[[media:Filmtronics 700B Spin On Glass MSDS.pdf|Filmtronics 700B Spin On Glass MSDS]]
*[[media:Fomblin Y-LVAC 25-6 MSDS.pdf|Fomblin Y-LVAC 25/6 MSDS]]
*[[media:Freon 13B1 Refrigerant MSDS.pdf|Freon 13B1 Refrigerant MSDS]]
*[[media:Gadolinium Oxide MSDS.pdf|Gadolinium Oxide MSDS]]
*[[media:Gallium Arsenide MSDS.pdf|Gallium Arsenide MSDS]]
*[[media:Germanium MSDS.pdf|Germanium MSDS]]
*[[media:Glycerol MSDS.pdf|Glycerol MSDS]]
*[[media:Gold Chloride Hydrate MSDS.pdf|Gold Chloride Hydrate MSDS]]
*[[media:Gold_Etchant_GE-8148-GE-8110_MSDS.pdf|Gold Etchant GE-8148/GE-8110 MSDS]]
*[[media:HD-8820 MSDS.pdf|HD-8820 MSDS]]
*[[media:HD-8820 Polyimide MSDS.pdf|HD-8820 Polyimide MSDS]]
*[[media:HMDS MSDS.pdf|HMDS MSDS]]
*[[media:Hafnium MSDS.pdf|Hafnium MSDS]]
*[[media:Hafnium Oxide MSDS.pdf|Hafnium Oxide MSDS]]
*[[media:Hexadecane MSDS.pdf|Hexadecane MSDS]]
*[[media:Hexamethyldisilazane MSDS.pdf|Hexamethyldisilazane MSDS]]
*[[media:Hexanediol Diacrylate MSDS.pdf|Hexanediol Diacrylate MSDS]]
*[[media:Hydrogen Iodide MSDS.pdf|Hydrogen Iodide MSDS]]
*[[media:Hydrogen MSDS.pdf|Hydrogen MSDS]]
*[[media:IC1-200 Spin On Glass MSDS.pdf|IC1-200 Spin On Glass MSDS]]
*[[media:Imidazole MSDS.pdf|Imidazole MSDS]]
*[[media:Indium MSDS.pdf|Indium MSDS]]
*[[media:Indium Phosphide MSDS.pdf|Indium Phosphide MSDS]]
*[[media:Iodine MSDS.pdf|Iodine MSDS]]
*[[media:Iodine-Bromide Solution MSDS.pdf|Iodine-Bromide Solution MSDS]]
*[[media:Iridium (IV) Chloride MSDS.pdf|Iridium (IV) Chloride MSDS]]
*[[media:Isopropyl Alcohol MSDS.pdf|Isopropyl Alcohol MSDS]]
*[[media:JSR NFC FZX F112 Photoresist Overcoat MSDS.pdf|JSR NFC FZX F112 Photoresist Overcoat MSDS]]
*[[media:JSR NSD 2533Y Photoresist MSDS.pdf|JSR NSD 2533Y Photoresist MSDS]]
*[[media:LDD 26W Developer MSDS.pdf|LDD 26W Developer MSDS]]
*[[media:LOL 2000 Lift Off Layer MSDS.pdf|LOL 2000 Lift Off Layer MSDS]]
*[[media:LOR A Photoresist MSDS.pdf|LOR A Photoresist MSDS]]
*[[media:LOR B Photoresist MSDS.pdf|LOR B Photoresist MSDS]]
*[[media:Lanthanum Fluoride MSDS.pdf|Lanthanum Fluoride MSDS]]
*[[media:Lead Metal MSDS.pdf|Lead Metal MSDS]]
*[[media:MF 24A Developer MSDS.pdf|MF 24A Developer MSDS]]
*[[media:MF-701 Developer MSDS.pdf|MF-701 Developer MSDS]]
*[[media:MICRAL 9400 MSDS.pdf|MICRAL 9400 MSDS]]
*[[media:MMA(8.5)MAA Copolymer Series Resists MSDS.pdf|MMA(8.5)MAA Copolymer Series Resists MSDS]]
*[[media:MR-i 7000 series MSDS.pdf|MR-i 7000 series MSDS]]
*[[media:Magnesium Fluoride MSDS.pdf|Magnesium Fluoride MSDS]]
*[[media:Manganese Pieces MSDS.pdf|Manganese Pieces MSDS]]
*[[media:Manganese Sulfate MSDS.pdf|Manganese Sulfate MSDS]]
*[[media:Mesitylene MSDS.pdf|Mesitylene MSDS]]
*[[media:Methacryloxypropyltrimethoxysilane-3 MSDS.pdf|Methacryloxypropyltrimethoxysilane-3 MSDS]]
*[[media:Methane MSDS.pdf|Methane MSDS]]
*[[media:Methylstyrene MSDS.pdf|Methylstyrene MSDS]]
*[[media:Methyltrimethoxysilane MSDS.pdf|Methyltrimethoxysilane MSDS]]
*[[media:MicroChem 101 Developer MSDS.pdf|MicroChem 101 Developer MSDS]]
*[[media:Microposit 351 Developer MSDS.pdf|Microposit 351 Developer MSDS]]
*[[media:Microposit S1822 Photoresist MSDS.pdf|Microposit S1822 Photoresist MSDS]]
*[[media:Microprime HP Primer MSDS.pdf|Microprime HP Primer MSDS]]
*[[media:Mung MSDS.pdf|Mung MSDS]]
|width=300|
*[[media:N Methyl 2 Pyrrolidone MSDS.pdf|N Methyl 2 Pyrrolidone MSDS]]
*[[media:NANO 495PMMA MSDS.pdf|NANO 495PMMA MSDS]]
*[[media:NANO LOR B Series Resist MSDS.pdf|NANO LOR B Series Resist MSDS]]
*[[media:NANO MMA(17.5)MAA EL 10 MSDS.pdf|NANO MMA(17.5)MAA EL 10 MSDS]]
*[[media:NEB-31 Photoresist MSDS.pdf|NEB-31 Photoresist MSDS]]
*[[media:NOE Etch I MSDS.pdf|NOE Etch I MSDS]]
*[[media:NR5-8000 Photoresist MSDS.pdf|NR5-8000 Photoresist MSDS]]
*[[media:NR7-1500PY Photoresist MSDS.pdf|NR7-1500PY Photoresist MSDS]]
*[[media:NR71-6000PY Photoresist MSDS.pdf|NR71-6000PY Photoresist MSDS]]
*[[media:NR9-8000 Photoresist MSDS.pdf|NR9-8000 Photoresist MSDS]]
*[[media:NXR-1010 Imprint Resist MSDS.pdf|NXR-1010 Imprint Resist MSDS]]
*[[media:NXR-1020 Imprint Resist MSDS.pdf|NXR-1020 Imprint Resist MSDS]]
*[[media:NXR-2010 Imprint Resist MSDS.pdf|NXR-2010 Imprint Resist MSDS]]
*[[media:NXR-3020 Imprint Resist MSDS.pdf|NXR-3020 Imprint Resist MSDS]]
*[[media:NXR-3022 Imprint Resist MSDS.pdf|NXR-3022 Imprint Resist MSDS]]
*[[media:Nano MMA Photoresist MSDS.pdf|Nano MMA Photoresist MSDS]]
*[[media:Nano PMGI SF-series Photoresist MSDS.pdf|Nano PMGI SF-series Photoresist MSDS]]
*[[media:NanoRemover PG Photoresist Remover MSDS.pdf|NanoRemover PG Photoresist Remover MSDS]]
*[[media:NanoStrip MSDS.pdf|NanoStrip MSDS]]
*[[media:Nanochem OMA MSDS.pdf|Nanochem OMA MSDS]]
*[[media:Negative Resist NR9-8000 MSDS.pdf|Negative Resist NR9-8000 MSDS]]
*[[media:Nickel Ammonium Sulfate MSDS.pdf|Nickel Ammonium Sulfate MSDS]]
*[[media:Nickel Chloride MSDS.pdf|Nickel Chloride MSDS]]
*[[media:Nickel MSDS.pdf|Nickel MSDS]]
*[[media:Nickel Sulfamate MSDS.pdf|Nickel Sulfamate MSDS]]
*[[media:Nickel Sulfamate Plating Solution MSDS.pdf|Nickel Sulfamate Plating Solution MSDS]]
*[[media:Nickel Sulfamate Semi-Bright Nickel "S" MSDS.pdf|Nickel Sulfamate Semi-Bright Nickel "S" MSDS]]
*[[media:Nickel Sulfate Crystal MSDS.pdf|Nickel Sulfate Crystal MSDS]]
*[[media:Nickelous Sulfate MSDS.pdf|Nickelous Sulfate MSDS]]
*[[media:Nickle (II) Carbonate MSDS.pdf|Nickle (II) Carbonate MSDS]]
*[[media:Nitrogen MSDS.pdf|Nitrogen MSDS]]
|-
|}

{{MSDS}}

Chemical List - OLD 2018-09-05

2017-04-26T17:35:00Z

Reynolds t: /* Other Chemicals */

Below is a list of all chemicals authorized for use in the lab. Please note that only the chemicals that appear in '''bold''' are stocked by the lab. All other chemicals have been authorized for users to bring.
=Acids=
{|
|-valign="top"
|width=300|
*'''[[media:Acetic Acid MSDS.pdf|Acetic Acid MSDS]]'''
*'''[[media:Al Etchant, Type A MSDS.pdf|Al Etchant, Type A MSDS]]'''
*'''[[media:Al Etchant, Type D MSDS.pdf|Al Etchant, Type D MSDS]]'''
*[[media:BoricAcidMSDS.pdf|Boric Acid MSDS]]
*'''[[media:Buffered HF.pdf|Buffered HF MSDS]]
*'''[[media:Chromic Acid.pdf|Chromic Acid MSDS]]'''
*'''[[media:ChromiumMaskEtchantMSDS.pdf|Chromium Mask Etchant MSDS]]
*'''[[media:CitricAcidMSDS.pdf|Citric Acid (granular) MSDS]]
*[[media:FormicAcidMSDS.pdf|Formic Acid 88% MSDS]]
*'''[[media:HydrobromicAcidMSDS.pdf|Hydrobromic Acid MSDS]]
*'''[[media:HydrochloricAcidMSDS.pdf|Hydrochloric Acid MSDS]]'''
*'''[[media:HydrofluoricAcidMSDS.pdf|Hydrofluoric Acid 49% MSDS]]
*[[media:HydroiodicAcidMSDS.pdf|Hydroiodic Acid 47% MSDS]]
*[[media:LacticAcidFractionalMSDS.pdf|Lactic Acid 0.1 Normal Volumetric MSDS]]
|width=300|
*[[media:LacticAcidMSDS.pdf|Lactic Acid MSDS]]
*[[media:MethacrylicAcidMSDS.pdf|Methacrylic Acid MSDS]]
*'''[[media:NickelEtchantTFBMSDS.pdf|Nickel Etchant, Type TFB MSDS]]
*'''[[media:NitricAcidMSDS.pdf|Nitric Acid MSDS]]
*[[media:OxalicAcidDihydrateMSDS.pdf|Oxalic Acid Dihydrate MSDS]]
*'''[[media:PhosphoricAcidMSDS.pdf|Phosphoric Acid MSDS]]
*[[media:SelenousAcidMSDS.pdf|Selenous Acid MSDS]]
*[[media:SuccinicAcid99%MSDS.pdf|Succinic Acid 99% MSDS]]
*[[media:SulfamicAcidMSDS.pdf|Sulfamic Acid MSDS]]
*[[media:SulfuricAcid93%MSDS.pdf|Sulfuric Acid 93% MSDS]]
*[[media:SulfuricAcidFuming.pdf|Sulfuric Acid Fuming MSDS]]
*'''[[media:SulfuricAcidMSDS.pdf|Sulfuric Acid MSDS]]
*[[media:TartaricAcidMSDS.pdf|Tartaric Acid MSDS]]
*'''[[media:TiEtchantMSDS.pdf|Ti Etchant, Type TFTN MSDS]]
|-
|}

=Bases=
{|
|-valign="top"
|width=300|
*'''[[media:AmmoniumHydroxideMSDS.pdf|Ammonium Hydroxide MSDS]]
*'''[[media:AmmoniumSulfideMSDS.pdf|Ammonium Sulfide MSDS]]
*'''[[media:PotassiumHydroxideMSDS.pdf|Potassium Hydroxide MSDS]]
*'''[[media:SodiumHydroxideMSDS.pdf|Sodium Hydroxide MSDS]]
|width=300|
*'''[[media:SodiumSulfideMSDS.pdf|Sodium Sulfide MSDS]]
*'''[[media:THAH25MSDS1.pdf|TMAH 25% MSDS #1]]
*'''[[media:THAH25MSDS2.pdf|TMAH 25% MSDS #2]]
|-
|}

=Lithography Chemicals=
{| class="wikitable" style="font-size: 95%;" border="1" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center; font-size: 95%"
|-bgcolor=#D0E7FF
!align=center bgcolor=#D0E7FF width="250"|'''Chemical'''
!align=center bgcolor=#D0E7FF width="250"|'''MSDS'''
!align=center bgcolor=#D0E7FF width="150"|'''Datasheet'''
|-
|'''1165 Stripper||[[media:1165 Stripper MSDS.pdf|1165 Stripper MSDS]]||[[media:1165 Stripper Datasheet.pdf|1165 Stripper Datasheet]]
|-
|'''Accuglass T-12B||[[media:AccuglassT-12B-MSDS.pdf|Accuglass T-12B MSDS]] ||
|-
|'''AP 3000 Adhesion Promoter||[[media:AP-3000-Adhesion-MSDS.pdf|AP 3000 Adhesion Promoter]] ||
|-
|AZ 300 MIF Developer|| ||
|-
|AZ 300T Stripper|| ||
|-
|AZ 400K Developer|| ||
|-
|AZ726 MIF Developer|| ||
|-
|AZ EBR Edge Bead Remover|| ||
|-
|AZ LOL 2000 Photoresist|| ||
|-
|AZ nLOF 2020 Photoresist|| ||
|-
|AZ nLOF 5510 Photoresist|| ||
|-
|AZ P4110 Photoresist|| ||
|-
|AZ P4210 Photoresist|| ||
|-
|AZ P4330 RS Photoresist|| ||
|-
|AZ P5214 EIR Photoresist|| ||
|-
|CEM 365 IS|| ||
|-
|Cyclotene 4024-40 BCB|| ||
|-
|DS 2100 VCS Developer|| ||
|-
|HMDS|| ||
|-
|ma-N 2403 Photoresist|| ||
|-
|mr-l-7000 Imprint Polymer|| ||[[media:mr-l-7000-Imprint-Polymer.pdf|mr-l-7000 Datasheet]]
|-
|MCC-101 Developer|| ||
|-
|Nano MMA Photoresist|| ||
|-
|NR7-1500PY Photoresist|| ||
|-
|NXR-1010 Imprint Resist|| ||
|-
|NXR-1020 Imprint Resist|| ||[[media:NXR-1020-Datasheet.pdf|NXR-1020 Datasheet]]
|-
|OCG 825 Photoresist|| ||
|-
|PMGI SF-series Photoresist|| ||
|-
|PRX-127 Stripper|| ||
|-
|RD6 Developer|| ||
|-
|S1805 Photoresist|| ||
|-
|SPR 220 Photoresist|| ||
|-
|SPR 510A Photoresist|| ||
|-
|SPR 518A Photoresist|| ||
|-
|SPR 950-0.8 Photoresist|| ||
|-
|SPR 955 CM|| ||
|-
|SVC-14 Stripper|| ||
|-
|Thinner P|| ||
|-
|}

=Solvents=
{|
|-valign="top"
|width=300|
*'''[[media:AcetoneMSDS.pdf|Acetone MSDS]]
*'''[[media:AmylAcetateMSDS.pdf|Amyl Acetate MSDS]]
*'''[[media:EthylAlcoholMSDS.pdf|Ethyl Alcohol (Ethanol) MSDS]]
*'''[[media:EthyleneGlycolMSDS.pdf|Ethylene Glycol MSDS]]
*'''[[media:MethylAlcoholMSDS.pdf|Methyl Alcohol (Methanol) MSDS]]
|width=300|
*'''[[media:MethylEthylKetoneMSDS.pdf|Methyl Ethyl Ketone MSDS]]
*'''[[media:MethylIsobutylKetoneMSDS.pdf|Methyl Isobutyl Ketone (MIBK) MSDS]]
*'''[[media:PropanolMSDS.pdf|Propanol MSDS]]
*'''[[media:TolueneMSDS.pdf|Toluene MSDS]]
*'''[[media:XylenesMSDS.pdf|Xylenes MSDS]]
|-
|}

=Other Chemicals=
{|
|-valign="top"
|width=300|
*'''[[media:AmmoniumSulfideMSDS.pdf|Ammonium Sulfide MSDS]]
*'''[[media:Crystalbond509MSDS.pdf|Crystalbond 509 MSDS]]
*'''[[media:GenSolve500MSDS.pdf|GenSolve 500 MSDS]]
*'''[[media:GenTak230MSDS.pdf|GenTak 230 MSDS]]
*'''[[media:GoldEtchantTypeTFAMSDS.pdf|Gold Etchant, Type TFA MSDS]]
*'''[[media:HydrogenPeroxideMSDS.pdf|Hydrogen Peroxide MSDS]]
|width=300|
*'''[[media:NickelEtchantTFBMSDS.pdf|Nickel Etchant Type TFB MSDS]]
*'''[[media:PC3-1500SpinOnGlassMSDS.pdf|PC3-1500 Spin-On-Glass MSDS]]
*'''[[media:SaturatedBromineWaterMSDS.pdf|Saturated Bromine Water MSDS]]
*'''[[media:SilverEtchantTypeTFS.pdf|Silver Etchant Type TFS MSDS]]
*'''[[media:Technic25ESGoldPlatingSolution.pdf|Technic 25 ES Gold Plating Solution MSDS]]
[[https://signupmonkey.ece.ucsb.edu/wiki/images/9/93/KJL_705_pump_oil.pdf]]
|-
|}

==UNSORTED==
{|
|-valign="top"
|width=300|
*[[media:DN-201GP-Photoresist-MSDS.pdf|DN-201 GP Photoresist MSDS]]
*[[media:(4-Methylthiophenyl)methyl phenyl sulfonium triflate MSDS.pdf|(4-Methylthiophenyl)methyl phenyl sulfonium triflate MSDS]]
*[[media:(4-Phenylthiophenyl)diphenylsulfonium triflate MSDS.pdf|(4-Phenylthiophenyl)diphenylsulfonium triflate MSDS]]
*[[media:2-Bromo-3-hexylthiophene MSDS.pdf|2-Bromo-3-hexylthiophene MSDS]]
*[[media:2-Hydroxy-2-Methylpropiophenone MSDS.pdf|2-Hydroxy-2-Methylpropiophenone MSDS]]
*[[media:3-Aminopropyl)triethoxysilane MSDS.pdf|3-Aminopropyl)triethoxysilane MSDS]]
*[[media:18-Crown-6 MSDS.pdf|18-Crown-6 MSDS]]
*[[media:1165 Stripper MSDS.pdf|1165 Stripper MSDS]]
*[[media:Accuglass 103 Solvent MSDS.pdf|Accuglass 103 Solvent MSDS]]
*[[media:Accuglass T-12B MSDS.pdf|Accuglass T-12B MSDS]]
*[[media:ACCUGLASS T-12B Spin-On-Glass MSDS.pdf|ACCUGLASS T-12B Spin-On-Glass MSDS]]
*[[media:ACEM 365iS MSDS.pdf|ACEM 365iS MSDS]]
*[[media:Additive S-1 MSDS.pdf|Additive S-1 MSDS]]
*[[media:Adhesion Promoter AP3000 MSDS.pdf|Adhesion Promoter AP3000 MSDS]]
*[[media:Adhesion Promoter VM-651 MSDS.pdf|Adhesion Promoter VM-651 MSDS]]
*[[media:Alkyl Quaternary Ammonium Bentonite MSDS.pdf|Alkyl Quaternary Ammonium Bentonite MSDS]]
*[[media:Alpha Alpha Alpha Trifluorotoluene MSDS.pdf|Alpha Alpha Alpha Trifluorotoluene MSDS]]
*[[media:Aluminum Fluoride MSDS.pdf|Aluminum Fluoride MSDS]]
*[[media:Aluminum Oxide MSDS.pdf|Aluminum Oxide MSDS]]
*[[media:Ammonia MSDS.pdf|Ammonia MSDS]]
*[[media:Ammonium Chloride MSDS.pdf|Ammonium Chloride MSDS]]
*[[media:Ammonium Tartrate MSDS.pdf|Ammonium Tartrate MSDS]]
*[[media:Antimony Powder MSDS.pdf|Antimony Powder MSDS]]
*[[media:AP 3000 Adhesion Promoter MSDS.pdf|AP 3000 Adhesion Promoter MSDS]]
*[[media:AquaBond 55 MSDS.pdf|AquaBond 55 MSDS]]
*[[media:AquaBond 65 MSDS.pdf|AquaBond 65 MSDS]]
*[[media:AquaBond 85 MSDS.pdf|AquaBond 85 MSDS]]
*[[media:AquaClean 900 MSDS.pdf|AquaClean 900 MSDS]]
*[[media:ARC i-CON-7 Anti Reflective MSDS.pdf|ARC i-CON-7 Anti Reflective MSDS]]
*[[media:ARC i-CON-16 MSDS.pdf|ARC i-CON-16 MSDS]]
*[[media:Arcosolv PM Solvent MSDS.pdf|Arcosolv PM Solvent MSDS]]
*[[media:Argon MSDS.pdf|Argon MSDS]]
*[[media:Axarel 2200 Defluxed Degreaser MSDS.pdf|Axarel 2200 Defluxed Degreaser MSDS]]{|
*[[media:AZ 300 MIF Developer MSDS.pdf|AZ 300 MIF Developer MSDS]]
*[[media:AZ 300T Stripper MSDS.pdf|AZ 300T Stripper MSDS]]
*[[media:AZ 400K Developer MSDS.pdf|AZ 400K Developer MSDS]]
*[[media:AZ 726 MIF Developer MSDS.pdf|AZ 726 MIF Developer MSDS]]
*[[media:AZ 726 MIF Developer MSDS2.pdf|AZ 726 MIF Developer (2) MSDS]]
*[[media:AZ 1518 Photoresist MSDS.pdf|AZ 1518 Photoresist MSDS]]
*[[media:AZ Aquatar VIII-A 45 MSDS.pdf|AZ Aquatar VIII-A 45 MSDS]]
*[[media:AZ Aquatar VIII-A 45 MSDS(2).pdf|AZ Aquatar VIII-A 45 MSDS (2)]]
*[[media:AZ Developer MSDS.pdf|AZ Developer MSDS]]
*[[media:AZ EBR Edge Bead Remover MSDS.pdf|AZ EBR Edge Bead Remover MSDS]]
*[[media:AZ LExp.KDB087F 42 MSDS.pdf|AZ LExp.KDB087F 42 MSDS]]
*[[media:AZ LOL 2000 Photoresist MSDS.pdf|AZ LOL 2000 Photoresist MSDS]]
*[[media:AZ nLOF 2020 Photoresist MSDS.pdf|AZ nLOF 2020 Photoresist MSDS]]
*[[media:AZ nLOF 2070 Photoresist MSDS.pdf|AZ nLOF 2070 Photoresist MSDS]]
*[[media:AZ nLOF 5510 Photoresist MSDS.pdf|AZ nLOF 5510 Photoresist MSDS]]
*[[media:AZ P4110 Photoresist MSDS.pdf|AZ P4110 Photoresist MSDS]]
*[[media:AZ P4210 Photoresist MSDS.pdf|AZ P4210 Photoresist MSDS]]
*[[media:AZ P4330 RS Photoresist MSDS.pdf|AZ P4330 RS Photoresist MSDS]]
*[[media:AZ P4620 Photoresist MSDS.pdf|AZ P4620 Photoresist MSDS]]
*[[media:AZ P5214 EIR Photoresist MSDS.pdf|AZ P5214 EIR Photoresist MSDS]]
*[[media:AZ R200 Coating MSDS.pdf|AZ R200 Coating MSDS]]
*[[media:AZ SH-114A MSDS.pdf|AZ SH-114A MSDS]]
*[[media:Benzoyl Peroxide MSDS.pdf|Benzoyl Peroxide MSDS]]
*[[media:Bipyridyl Dichlororuthenium II Hexahydrate MDSD.pdf|Bipyridyl Dichlororuthenium II Hexahydrate MDSD]]
*[[media:BIS Cyclopentadienyl Iron (Ferrocene) MSDS.pdf|BIS Cyclopentadienyl Iron (Ferrocene) MSDS]]
*[[media:BIS Cyclopentadienyl Magnesium MSDS.pdf|BIS Cyclopentadienyl Magnesium MSDS]]
*[[media:Bismuth.pdf|Bismuth]]
*[[media:Brewer Science WaferBOND HT-10 MSDS.pdf|Brewer Science WaferBOND HT-10 MSDS]]
*[[media:Brewer Science WaferBOND Remover MSDS.pdf|Brewer Science WaferBOND Remover MSDS]]
*[[media:Bromine MSDS.pdf|Bromine MSDS]]
*[[media:Buffered Oxide Etch JT Baker MSDS.pdf|Buffered Oxide Etch JT Baker MSDS]]
*[[media:CAaD Poymers MSDS.pdf|CAaD Poymers MSDS]]
*[[media:Calcium Fluoride MSDS.pdf|Calcium Fluoride MSDS]]
*[[media:Carbon Black MSDS.pdf|Carbon Black MSDS]]
*[[media:Carbon Tetrachloride MSDS.pdf|Carbon Tetrachloride MSDS]]
*[[media:CEM 365 IS MSDS.pdf|CEM 365 IS MSDS]]
*[[media:Cesium Fluoride MSDS.pdf|Cesium Fluoride MSDS]]
*[[media:Cesium Hydroxide Monohydrate MSDS.pdf|Cesium Hydroxide Monohydrate MSDS]]
*[[media:CF19-2186 Part A MSDS.PDF|CF19-2186 Part A MSDS]]
*[[media:CF19-2186 Part B MSDS.PDF|CF19-2186 Part B MSDS]]
*[[media:Chlorine MSDS.pdf|Chlorine MSDS]]
*[[media:Chloroform MSDS.pdf|Chloroform MSDS]]
*[[media:Chromium Etchant 1020AC MSDS.pdf|Chromium Etchant 1020AC MSDS]]
*[[media:CLEVIOS P MSDS.pdf|CLEVIOS P MSDS]]
*[[media:Clorobenzene MSDS.pdf|Clorobenzene MSDS]]
*[[media:Collodion MSDS.pdf|Collodion MSDS]]
*[[media:Copolmyer MMA(8.5)MAA(EL9) MSDS.pdf|Copolmyer MMA(8.5)MAA(EL9) MSDS]]
*[[media:Copper (II) Sulfate Pentahydrate MSDS.pdf|Copper (II) Sulfate Pentahydrate MSDS]]
*[[media:Cyclohexane MSDS.pdf|Cyclohexane MSDS]]
*[[media:Cyclopentanone MSDS.pdf|Cyclopentanone MSDS]]
*[[media:Cyclotene 3022 MSDS.pdf|Cyclotene 3022 MSDS]]
*[[media:Cyclotene 4000 Resin MSDS.pdf|Cyclotene 4000 Resin MSDS]]
*[[media:Cyclotene 4022 MSDS.pdf|Cyclotene 4022 MSDS]]
*[[media:Cyclotene 4024-40 BCB MSDS.pdf|Cyclotene 4024-40 BCB MSDS]]
*[[media:Cyclotene 4026 Resin MSDS.pdf|Cyclotene 4026 Resin MSDS]]
|width=300|
*[[media:DE-6018 Polymide Developer MSDS.pdf|DE-6018 Polymide Developer MSDS]]
*[[media:DE9040 Developer MSDS.pdf|DE9040 Developer MSDS]]
*[[media:Developer DS3000 MSDS.pdf|Developer DS3000 MSDS]]
*[[media:Dibenzo-18-crown-6 MSDS.pdf|Dibenzo-18-crown-6 MSDS]]
*[[media:Diethoxyethane MSDS.pdf|Diethoxyethane MSDS]]
*[[media:Diethylzinc MSDS.pdf|Diethylzinc MSDS]]
*[[media:Dimethyldydrazine MSDS.pdf|Dimethyldydrazine MSDS]]
*[[media:Dimethylsila-17-Crown-6 MSDS.pdf|Dimethylsila-17-Crown-6 MSDS]]
*[[media:Dimethylsulfoxide MSDS.pdf|Dimethylsulfoxide MSDS]]
*[[media:Disilane MSDS.pdf|Disilane MSDS]]
*[[media:Dodecanethiol MSDS.pdf|Dodecanethiol MSDS]]
*[[media:Dow Corning WL-5150 MSDS.pdf|Dow Corning WL-5150 MSDS]]
*[[media:DS 2100 BCB Developer MSDS.pdf|DS 2100 BCB Developer MSDS]]
*[[media:Dynasolve 165 MSDS.pdf|Dynasolve 165 MSDS]]
*[[media:Dynasolve 185 MSDS.pdf|Dynasolve 185 MSDS]]
*[[media:EC11 Solvent MSDS.pdf|EC11 Solvent MSDS]]
*[[media:ECF-63 Gold Plating Solution MSDS.pdf|ECF-63 Gold Plating Solution MSDS]]
*[[media:EKC 1020 Photoresist MSDS.pdf|EKC 1020 Photoresist MSDS]]
*[[media:EKC 265 Stripper MSDS.pdf|EKC 265 Stripper MSDS]]
*[[media:Epo Tek H20E, Part A & B.pdf|Epo Tek H20E]]
*[[media:Er(TMOD)3 MSDS.pdf|Er(TMOD)3 MSDS]]
*[[media:Ethylenediamine MSDS.pdf|Ethylenediamine MSDS]]
*[[media:FC-4430 MSDS.pdf|FC-4430 MSDS]]
*[[media:FC-4432 MSDS.pdf|FC-4432 MSDS]]
*[[media:FOX-16 Flowable Oxide MSDS.pdf|FOX-16 Flowable Oxide MSDS]]
*[[media:FTO 100-FBA5 Etchant MSDS.pdf|FTO 100-FBA5 Etchant MSDS]]
*[[media:Fe-Pt Bimetallic Nanoparticles in Hexane MSDS.pdf|Fe-Pt Bimetallic Nanoparticles in Hexane MSDS]]
*[[media:Ferric Chloride Hexahydrate MSDS.pdf|Ferric Chloride Hexahydrate MSDS]]
*[[media:Ferric Nitrate Nonahydrate MSDS.pdf|Ferric Nitrate Nonahydrate MSDS]]
*[[media:Ferrous Sulfate MSDS.pdf|Ferrous Sulfate MSDS]]
*[[media:Filmtronics 700B Spin On Glass MSDS.pdf|Filmtronics 700B Spin On Glass MSDS]]
*[[media:Fomblin Y-LVAC 25-6 MSDS.pdf|Fomblin Y-LVAC 25/6 MSDS]]
*[[media:Freon 13B1 Refrigerant MSDS.pdf|Freon 13B1 Refrigerant MSDS]]
*[[media:Gadolinium Oxide MSDS.pdf|Gadolinium Oxide MSDS]]
*[[media:Gallium Arsenide MSDS.pdf|Gallium Arsenide MSDS]]
*[[media:Germanium MSDS.pdf|Germanium MSDS]]
*[[media:Glycerol MSDS.pdf|Glycerol MSDS]]
*[[media:Gold Chloride Hydrate MSDS.pdf|Gold Chloride Hydrate MSDS]]
*[[media:Gold_Etchant_GE-8148-GE-8110_MSDS.pdf|Gold Etchant GE-8148/GE-8110 MSDS]]
*[[media:HD-8820 MSDS.pdf|HD-8820 MSDS]]
*[[media:HD-8820 Polyimide MSDS.pdf|HD-8820 Polyimide MSDS]]
*[[media:HMDS MSDS.pdf|HMDS MSDS]]
*[[media:Hafnium MSDS.pdf|Hafnium MSDS]]
*[[media:Hafnium Oxide MSDS.pdf|Hafnium Oxide MSDS]]
*[[media:Hexadecane MSDS.pdf|Hexadecane MSDS]]
*[[media:Hexamethyldisilazane MSDS.pdf|Hexamethyldisilazane MSDS]]
*[[media:Hexanediol Diacrylate MSDS.pdf|Hexanediol Diacrylate MSDS]]
*[[media:Hydrogen Iodide MSDS.pdf|Hydrogen Iodide MSDS]]
*[[media:Hydrogen MSDS.pdf|Hydrogen MSDS]]
*[[media:IC1-200 Spin On Glass MSDS.pdf|IC1-200 Spin On Glass MSDS]]
*[[media:Imidazole MSDS.pdf|Imidazole MSDS]]
*[[media:Indium MSDS.pdf|Indium MSDS]]
*[[media:Indium Phosphide MSDS.pdf|Indium Phosphide MSDS]]
*[[media:Iodine MSDS.pdf|Iodine MSDS]]
*[[media:Iodine-Bromide Solution MSDS.pdf|Iodine-Bromide Solution MSDS]]
*[[media:Iridium (IV) Chloride MSDS.pdf|Iridium (IV) Chloride MSDS]]
*[[media:Isopropyl Alcohol MSDS.pdf|Isopropyl Alcohol MSDS]]
*[[media:JSR NFC FZX F112 Photoresist Overcoat MSDS.pdf|JSR NFC FZX F112 Photoresist Overcoat MSDS]]
*[[media:JSR NSD 2533Y Photoresist MSDS.pdf|JSR NSD 2533Y Photoresist MSDS]]
*[[media:LDD 26W Developer MSDS.pdf|LDD 26W Developer MSDS]]
*[[media:LOL 2000 Lift Off Layer MSDS.pdf|LOL 2000 Lift Off Layer MSDS]]
*[[media:LOR A Photoresist MSDS.pdf|LOR A Photoresist MSDS]]
*[[media:LOR B Photoresist MSDS.pdf|LOR B Photoresist MSDS]]
*[[media:Lanthanum Fluoride MSDS.pdf|Lanthanum Fluoride MSDS]]
*[[media:Lead Metal MSDS.pdf|Lead Metal MSDS]]
*[[media:MF 24A Developer MSDS.pdf|MF 24A Developer MSDS]]
*[[media:MF-701 Developer MSDS.pdf|MF-701 Developer MSDS]]
*[[media:MICRAL 9400 MSDS.pdf|MICRAL 9400 MSDS]]
*[[media:MMA(8.5)MAA Copolymer Series Resists MSDS.pdf|MMA(8.5)MAA Copolymer Series Resists MSDS]]
*[[media:MR-i 7000 series MSDS.pdf|MR-i 7000 series MSDS]]
*[[media:Magnesium Fluoride MSDS.pdf|Magnesium Fluoride MSDS]]
*[[media:Manganese Pieces MSDS.pdf|Manganese Pieces MSDS]]
*[[media:Manganese Sulfate MSDS.pdf|Manganese Sulfate MSDS]]
*[[media:Mesitylene MSDS.pdf|Mesitylene MSDS]]
*[[media:Methacryloxypropyltrimethoxysilane-3 MSDS.pdf|Methacryloxypropyltrimethoxysilane-3 MSDS]]
*[[media:Methane MSDS.pdf|Methane MSDS]]
*[[media:Methylstyrene MSDS.pdf|Methylstyrene MSDS]]
*[[media:Methyltrimethoxysilane MSDS.pdf|Methyltrimethoxysilane MSDS]]
*[[media:MicroChem 101 Developer MSDS.pdf|MicroChem 101 Developer MSDS]]
*[[media:Microposit 351 Developer MSDS.pdf|Microposit 351 Developer MSDS]]
*[[media:Microposit S1822 Photoresist MSDS.pdf|Microposit S1822 Photoresist MSDS]]
*[[media:Microprime HP Primer MSDS.pdf|Microprime HP Primer MSDS]]
*[[media:Mung MSDS.pdf|Mung MSDS]]
|width=300|
*[[media:N Methyl 2 Pyrrolidone MSDS.pdf|N Methyl 2 Pyrrolidone MSDS]]
*[[media:NANO 495PMMA MSDS.pdf|NANO 495PMMA MSDS]]
*[[media:NANO LOR B Series Resist MSDS.pdf|NANO LOR B Series Resist MSDS]]
*[[media:NANO MMA(17.5)MAA EL 10 MSDS.pdf|NANO MMA(17.5)MAA EL 10 MSDS]]
*[[media:NEB-31 Photoresist MSDS.pdf|NEB-31 Photoresist MSDS]]
*[[media:NOE Etch I MSDS.pdf|NOE Etch I MSDS]]
*[[media:NR5-8000 Photoresist MSDS.pdf|NR5-8000 Photoresist MSDS]]
*[[media:NR7-1500PY Photoresist MSDS.pdf|NR7-1500PY Photoresist MSDS]]
*[[media:NR71-6000PY Photoresist MSDS.pdf|NR71-6000PY Photoresist MSDS]]
*[[media:NR9-8000 Photoresist MSDS.pdf|NR9-8000 Photoresist MSDS]]
*[[media:NXR-1010 Imprint Resist MSDS.pdf|NXR-1010 Imprint Resist MSDS]]
*[[media:NXR-1020 Imprint Resist MSDS.pdf|NXR-1020 Imprint Resist MSDS]]
*[[media:NXR-2010 Imprint Resist MSDS.pdf|NXR-2010 Imprint Resist MSDS]]
*[[media:NXR-3020 Imprint Resist MSDS.pdf|NXR-3020 Imprint Resist MSDS]]
*[[media:NXR-3022 Imprint Resist MSDS.pdf|NXR-3022 Imprint Resist MSDS]]
*[[media:Nano MMA Photoresist MSDS.pdf|Nano MMA Photoresist MSDS]]
*[[media:Nano PMGI SF-series Photoresist MSDS.pdf|Nano PMGI SF-series Photoresist MSDS]]
*[[media:NanoRemover PG Photoresist Remover MSDS.pdf|NanoRemover PG Photoresist Remover MSDS]]
*[[media:NanoStrip MSDS.pdf|NanoStrip MSDS]]
*[[media:Nanochem OMA MSDS.pdf|Nanochem OMA MSDS]]
*[[media:Negative Resist NR9-8000 MSDS.pdf|Negative Resist NR9-8000 MSDS]]
*[[media:Nickel Ammonium Sulfate MSDS.pdf|Nickel Ammonium Sulfate MSDS]]
*[[media:Nickel Chloride MSDS.pdf|Nickel Chloride MSDS]]
*[[media:Nickel MSDS.pdf|Nickel MSDS]]
*[[media:Nickel Sulfamate MSDS.pdf|Nickel Sulfamate MSDS]]
*[[media:Nickel Sulfamate Plating Solution MSDS.pdf|Nickel Sulfamate Plating Solution MSDS]]
*[[media:Nickel Sulfamate Semi-Bright Nickel "S" MSDS.pdf|Nickel Sulfamate Semi-Bright Nickel "S" MSDS]]
*[[media:Nickel Sulfate Crystal MSDS.pdf|Nickel Sulfate Crystal MSDS]]
*[[media:Nickelous Sulfate MSDS.pdf|Nickelous Sulfate MSDS]]
*[[media:Nickle (II) Carbonate MSDS.pdf|Nickle (II) Carbonate MSDS]]
*[[media:Nitrogen MSDS.pdf|Nitrogen MSDS]]
|-
|}

{{MSDS}}

File:KJL 705 pump oil.pdf

2017-04-26T17:02:28Z

Reynolds t:

Tool List

2016-10-18T17:35:01Z

Reynolds t: /* Inspection, Test and Characterization */

__NOTOC__
=Lithography=
{|
|-valign="top"
|width=300|
* [[Suss Aligners (SUSS MJB-3)]]
* [[IR Aligner (SUSS MJB-3 IR)]]
* [[DUV Flood Expose]]
* [[Ovens 1, 2 & 3 (Labline)]]
* [[Oven 4 (Fisher)]]
* [[High Temp Oven (Blue M)]]
* [[Vacuum Oven (YES)]]
* [[Holographic Lith/PL Setup (Custom)]]
|width=400|
* [[Stepper 1 (GCA 6300)]]
* [[Stepper 2 (AutoStep 200)]]
* [[Stepper 3 (ASML DUV)]]
* [[E-Beam Lithography System (JEOL JBX-6300FS)]]
* [[Nano-Imprint (Nanonex NX2000)]]
* [[Contact Aligner (SUSS MA-6)]]
|-
|}

= Vacuum Deposition =

{|
|- valign="top"
| width="300" |
*[[E-Beam 1 (Sharon)]]
*[[E-Beam 2 (Custom)]]
*[[E-Beam 3 (Temescal)]]
*[[E-Beam 4 (CHA)]]
*[[Sputter 2 (SFI Endeavor)]]
*[[Sputter 3 (AJA ATC 2000-F)]]
*[[Sputter 4 (AJA ATC 2200-V)]]
*[[Sputter 5 (Lesker AXXIS)]]

| width="400" |
*[[PECVD 1 (PlasmaTherm 790)]]
*[[PECVD 2 (Advanced Vacuum)]]
*[[Thermal Evap 1]]
*[[Thermal Evap 2 (Solder)]]
*[[ICP-PECVD (Unaxis VLR)]]
*[[Ion Beam Deposition (Veeco NEXUS)]]
*[[Molecular Vapor Deposition]]
*[[Atomic Layer Deposision (Oxford FlexAL)]]

|}

= Dry Etch =

{|
|- valign="top"
| width="300" |
*[[RIE 2 (MRC)]]
*[[RIE 3 (MRC)]]
*[[RIE 5 (PlasmaTherm)]]
*[[Si Deep RIE (PlasmaTherm/Bosch Etch)]]
*[[Ashers (Technics PEII)]]
*[[UV Ozone Reactor]]
*[[CAIBE (Oxford Ion Mill)]]
| width="400" |
*[[ICP Etch 1 (Panasonic E626I)]]
*[[ICP Etch 2 (Panasonic E640)]]
*[[ICP-Etch (Unaxis VLR)]]
*[[Plasma Clean (Gasonics 2000)]]
*[[XeF2 Etch (Xetch)|XeF2 Etch (Xetch)]]
*[[Plasma Activation (EVG 810)]]
*[[Vapor HF Etch]]

|}

=Wet Processing=
{|
|-valign="top"
|width=300|
* [[Wet Benches]]
**[[Solvent Cleaning Benches]]
**[[Spin Coat Benches]]
**[[Develop Benches]]
**[[Toxic Corrosive Benches]]
**[[HF/TMAH Processing Benches]]
**[[Plating Bench]]
|width=400|
* [[Gold Plating Bench]]
* [[Critical Point Dryer]]
* [[Spin Rinse Dryer (SemiTool)]]
* [[Chemical-Mechanical Polisher (Logitech)]]
|-
|}

=Thermal Processing=
* [[Rapid Thermal Processor (AET RX6)]]
* [[Strip Annealer]]
* [[Tube Furnace (Tystar 8300)]]
* [[Tube Furnace Wafer Bonding (Thermco)]]
* [[Tube Furnace AlGaAs Oxidation (Linberg)]]
* [[Wafer Bonder (SUSS SB6-8E)]]

=Packaging=
* [[Dicing Saw (ADT)]]
* [[Flip-Chip Bonder (Finetech)]]
* [[Vacuum Sealer]]
* [[Wire Saw (Takatori)]]

=Inspection, Test and Characterization=
{|
|-valign="top"
|width=300|
* [[Field Emission SEM 1 (FEI Sirion)]]
* [[Field Emission SEM 2 (JEOL 7600F)]]
* [[Step Profile (Dektak IIA)]]
* [[Step Profilometer (Dektak 6M)]]
* [[Ellipsometer (Rudolph)]]
* [[Microscopes]]
* [[Probe Station & Curve Tracer]]
* [[Optical Film Thickness (Filmetrics)]]
* [[Optical Film Thickness (Nanometric)]]
* [[Goniometer]]
|width=400|
* [[Film Stress (Tencor Flexus)]]
* [[SEM Sample Coater (Hummer)]]
* [[Surface Analysis (KLA/Tencor Surfscan)]]
* [[Photo-emission & IR Microscope (QFI)]]
* [[Ellipsometer (Woollam)]]
* [[Resistivity Mapper (CDE RESMAP)]]
* [[Laser Scanning Confocal M-scope (Olympus LEXT)]]
* [[Deep UV Optical Microscope (Olympus)]]
* [[Fluorescence Microscope (Olympus MX51)]]
* [[Atomic Force Microsope (Dimension 3100/Nanoscope IVA)]]
|-
|}

Tool List

2016-10-18T17:27:59Z

Reynolds t: /* Inspection, Test and Characterization */

Tool List

2016-10-18T17:26:57Z

Reynolds t: /* Inspection, Test and Characterization */

__NOTOC__
=Lithography=
{|
|-valign="top"
|width=300|
* [[Suss Aligners (SUSS MJB-3)]]
* [[IR Aligner (SUSS MJB-3 IR)]]
* [[DUV Flood Expose]]
* [[Ovens 1, 2 & 3 (Labline)]]
* [[Oven 4 (Fisher)]]
* [[High Temp Oven (Blue M)]]
* [[Vacuum Oven (YES)]]
* [[Holographic Lith/PL Setup (Custom)]]
|width=400|
* [[Stepper 1 (GCA 6300)]]
* [[Stepper 2 (AutoStep 200)]]
* [[Stepper 3 (ASML DUV)]]
* [[E-Beam Lithography System (JEOL JBX-6300FS)]]
* [[Nano-Imprint (Nanonex NX2000)]]
* [[Contact Aligner (SUSS MA-6)]]
|-
|}

= Vacuum Deposition =

{|
|- valign="top"
| width="300" |
*[[E-Beam 1 (Sharon)]]
*[[E-Beam 2 (Custom)]]
*[[E-Beam 3 (Temescal)]]
*[[E-Beam 4 (CHA)]]
*[[Sputter 2 (SFI Endeavor)]]
*[[Sputter 3 (AJA ATC 2000-F)]]
*[[Sputter 4 (AJA ATC 2200-V)]]
*[[Sputter 5 (Lesker AXXIS)]]

| width="400" |
*[[PECVD 1 (PlasmaTherm 790)]]
*[[PECVD 2 (Advanced Vacuum)]]
*[[Thermal Evap 1]]
*[[Thermal Evap 2 (Solder)]]
*[[ICP-PECVD (Unaxis VLR)]]
*[[Ion Beam Deposition (Veeco NEXUS)]]
*[[Molecular Vapor Deposition]]
*[[Atomic Layer Deposision (Oxford FlexAL)]]

|}

= Dry Etch =

{|
|- valign="top"
| width="300" |
*[[RIE 2 (MRC)]]
*[[RIE 3 (MRC)]]
*[[RIE 5 (PlasmaTherm)]]
*[[Si Deep RIE (PlasmaTherm/Bosch Etch)]]
*[[Ashers (Technics PEII)]]
*[[UV Ozone Reactor]]
*[[CAIBE (Oxford Ion Mill)]]
| width="400" |
*[[ICP Etch 1 (Panasonic E626I)]]
*[[ICP Etch 2 (Panasonic E640)]]
*[[ICP-Etch (Unaxis VLR)]]
*[[Plasma Clean (Gasonics 2000)]]
*[[XeF2 Etch (Xetch)|XeF2 Etch (Xetch)]]
*[[Plasma Activation (EVG 810)]]
*[[Vapor HF Etch]]

|}

=Wet Processing=
{|
|-valign="top"
|width=300|
* [[Wet Benches]]
**[[Solvent Cleaning Benches]]
**[[Spin Coat Benches]]
**[[Develop Benches]]
**[[Toxic Corrosive Benches]]
**[[HF/TMAH Processing Benches]]
**[[Plating Bench]]
|width=400|
* [[Gold Plating Bench]]
* [[Critical Point Dryer]]
* [[Spin Rinse Dryer (SemiTool)]]
* [[Chemical-Mechanical Polisher (Logitech)]]
|-
|}

=Thermal Processing=
* [[Rapid Thermal Processor (AET RX6)]]
* [[Strip Annealer]]
* [[Tube Furnace (Tystar 8300)]]
* [[Tube Furnace Wafer Bonding (Thermco)]]
* [[Tube Furnace AlGaAs Oxidation (Linberg)]]
* [[Wafer Bonder (SUSS SB6-8E)]]

=Packaging=
* [[Dicing Saw (ADT)]]
* [[Flip-Chip Bonder (Finetech)]]
* [[Vacuum Sealer]]
* [[Wire Saw (Takatori)]]

=Inspection, Test and Characterization=
{|
|-valign="top"
|width=300|
* [[Field Emission SEM 1 (FEI Sirion)]]
* [[Field Emission SEM 2 (JEOL 7600F)]]
* [[Step Profile (Dektak IIA)]]
* [[Step Profilometer (Dektak 6M)]]
* [[Ellipsometer (Rudolph)]]
* [[Microscopes]]
* [[Probe Station & Curve Tracer]]
* [[Optical Film Thickness (Filmetrics)]]
* [[Optical Film Thickness (Nanometric)]]
* [[Goniometer]]
|width=400|
* [[Film Stress (Tencor Flexus)]]
* [[SEM Sample Coater (Hummer)]]
* [[Surface Analysis (KLA/Tencor Surfscan)]]
* [[Photo-emission & IR Microscope (QFI)]]
* [[Ellipsometer (Woollam)]]
* [[Resistivity Mapper (CDE RESMAP)]]
* [[Laser Scanning Confocal M-scope (Olympus LEXT)]]
* [[Deep UV Optical Microscope (Olympus)]]
* [[Fluorescence Microscope (Olympus MX51)]]

* [[Atomic Force Microsope (Dimension 3100/Nanoscope IVA)]]
|-
|}

File:Nanofab Policies Chemical Hygiene Plan 9 15 16.pdf

2016-09-15T23:24:21Z

Reynolds t:

Lab Rules OLD 2018

2016-09-15T23:23:31Z

Reynolds t:

For a printable PDF version of the Lab Rules, please '''[[Media:Nanofab_Policies__Chemical_Hygiene_Plan_9_15_16.pdf|CLICK HERE]]'''

While working in the Nanofab, you are surrounded by dangerous and deadly chemicals, gases, high voltages, radiation, and mechanical systems. The responsibility lies with users and staff to act in a professional, courteous, and safe manner at all times while in the facility. Users violating the operating and safety rules of the facility or endangering the safety of themselves or other users will be denied further access to the facility.

This document attempts to define acceptable actions and behavior for the users of the Nanofabrication facility. However, it is impossible to define a policy for every conceivable situation. Nanofab users are expected to employ common sense and a high degree of prudence while working in this facility.

=General Nanofabrication Facility Safety Policies=
==Visual and Audible Alarms in the Nanofab==
#'''Fire Alarm''': White strobe with high volume audible alarm, located throughout the Nanofab. If this alarm activates, immediately leave the Nanofab through the nearest exit. Do not remove bunnysuit until outside.
#'''Toxic Gas Alarm''': Blue strobe with high volume audible alarm, located at both ends of each bay. If this alarm activates in one bay, do not enter the bay. If this alarm activates throughout the Nanofab, immediately leave the Nanofab through the nearest exit. Do not remove bunnysuit until outside.
#'''Wet Bench Alarms''': Small illuminated visual alarms with buzzers. Each wet bench may have multiple alarms, with a placard beside the alarms indicating meaning of alarm and proper response. You must follow proper response if you see or hear a wet bench alarm.
#'''Equipment Alarms''': Please notify supervisor of tool if equipment alarm is activated.
==Emergencies and First Aid==
If you believe you may have been exposed to a toxic substance or gas, if appropriate rinse in the emergency shower. In all cases, quickly go to the emergency room at Goleta Valley Hospital. Emergency showers and eye wash stations are located at the south end of all bays. An enclosed emergency showers is located in bay 5 beside the wet etch benches. A first aid kit is located in the gowning room, and on the south wall at the end of bays 2, 4, and 6. Chemical spill clean-up kits are located on the wire shelving in each bay containing a wet bench. After using a spill cleanup kit, please inform the Nanofab manager. Fire extinguishers are located on the south end of each clean bay, and the north end of each maintenance chase.
==Hydrofluoric Acid (HF) Exposure==
===HF Exposure to Skin===
#Immediately rinse exposed area for 5 minutes in safety shower, flush affected area thoroughly. Speed and thoroughness in washing off the acid is of primary importance. An enclosed emergency showers is located in bay 5 across from the HF/TMAH wet processing bench. If using the emergency shower at the end of the bay, water will spill onto floor of Nanofab - this is OK.
#Immediately after rinsing, start massaging 2.5% calcium gluconate gel into the affected area. The individual applying the gel should wear gloves. Apply gel frequently and massage continuously. Calcium gluconate gel is located to the left of the HF bench in a pocket mounted to the side of the bench.
#Seek immediate medical attention by calling 9-911.
#Continue rubbing gel on affected area until advised otherwise by physician.
===HF Exposure to Eyes===
#Immediately rinse exposed area for 15 minutes at eye wash station. Hold eyelids open during irrigation to allow thorough flushing of the eyes. Water will spill onto floor of Nanofab - this is OK.
#Seek immediate medical attention by calling 9-911.
==TetraMethylAmmonium Hydroxide (TMAH) Exposure==
TMAH is a component in several photoresist developers and strippers, and is also used in the Nanofab as an ebeam resist developer and silicon etchant. The concentration of TMAH in photoresist developer and stripper solutions is relatively low (2-4%). However, the ebeam developer and silicon etchant utilize a solution of 25% TMAH.
===TMAH Exposure to Skin, 25% Concentration===
#Immediately rinse exposed area for at least 15 minutes in safety shower, flush affected area thoroughly. An enclosed emergency showers is located in bay 5 across from the HF/TMAH wet etch bench. If using the emergency shower at the end of the bay, water will spill onto floor of Nanofab - this is OK.
#Seek immediate medical attention by calling 9-911
===TMAH Exposure to Skin, 2%-4%Concentration===
#If small area skin exposure (<1% body surface area, <approximately 25 inches2) to 2-4% TMAH, immediately rinse exposed area until skin feels normal (not greasy). If irritation occurs, consult a physician.
#If medium to large area skin exposure (>1% body surface area, >approximately 25 inches2) to 2-4% TMAH, immediately rinse exposed area for at least 15 minutes in safety shower, flush affected area thoroughly. An enclosed emergency showers is located in bay 5 across from the HF/TMAH wet etch bench. If using the emergency shower at the end of the bay, water will spill onto floor of Nanofab - this is OK. Seek immediate medical attention by calling 9-911.
===TMAH Exposure to Eyes, Any Concentration===
#Immediately rinse exposed area for at least 15 minutes at eye wash station. Hold eyelids open during irrigation to allow thorough flushing of the eyes. Water will spill onto floor of Nanofab - this is OK.
#Seek immediate medical attention by calling 9-911
==Pregnancy and the Nanofab==
The effects on a fetus of many of the chemicals utilized in the Nanfab is unknown. The Nanofab is designed to prevent exposure to the fumes and vapors from these chemicals, but absolute 100% containment is impossible, and it is possible to be exposed to extremely small concentrations of these materials. Consequently, we strongly recommend that you do not work in the Nanofab if you know or suspect that you are pregnant.
=Chemicals and Hazardous Materials the Nanofab=
==[[MSDS]]==
The MSDS contains safety information regarding exposure, first aid, handling, storage, fire hazard, etc., for all chemicals, gases, and materials present in the facility. Before using an unfamiliar material, consult the MSDS to determine any potential hazards. Consult the MSDS to determine the proper course of action if someone has been exposed to a gas or chemical, or a spill has occurred. A book containing the MSDS for any material used in the Nanofab is located just inside the gowning room. Additionally, an electronic version of the MDSD in .pdf format for all chemicals in our inventory is located on the desktops of all the computers connected to microscopes in the Nanofab.
==Introducing New Materials Into the Nanofab==
All new chemicals, compounds, gases, materials for evaporation, etc., must be approved by the Nanofab manager before introduction into the facility. In order to introduce a new material into the Nanofab, a MSDS (Material Safety Data Sheet) for the material in .pdf format must be submitted to the Nanofab manager, plus a description of the proposed process utilizing the new material. The description of the process should include the goals of the process, and the mechanics of the process in reasonable detail. The Nanofab manager will determine if the material will be allowed in the Nanofab, and if so, where the new material will be stored, where the material is to be used (typically a specific wet bench), and how to dispose of the waste.
==Containers and Labeling==
Chemical containers such as beakers, bottles, etc, must be labeled with contents, date, and ownership (individual or group name). This information can be written on a wipe under the container. The exceptions to this policy are as follows:
#A beaker in use on a solvent bench can contain acetone, propanol, or methanol if the beaker is labeled with the text: “acetone/propanol/methanol”. The generic label “solvent” is insufficient. Beakers containing solvents other that acetone, propanol, or methanol must be labeled with the specific solvent.
#Indication of date is no longer required on beakers in use on solvent benches. All beakers in use on solvent benches must be labeled with contents and ownership.
#Beakers in use at lithography developer benches must be labeled with exact contents and ownership (individual or group name). The generic label “developer” is insufficient.
#Indication of date is no longer required on beakers in use on the developer benches. All beakers in use on developer benches must be labeled with contents and ownership.
==Chemical Storage==
*'''Acid Storage'''
:The primary acid storage area (except HF) is the acid cabinet located next to the acid wet processing benches in bay 5. HF acid is stored in the HF cabinet
*'''Base Storage'''
:The primary base storage area is the base cabinet located next to the acid wet processing bench.
*'''Solvent Storage'''
:The primary solvent storage area is the stainless steel flammables cabinet in bay 6. You may store small amounts of solvents in labeled containers on the shelves in the photolith area.
==Solvent Processing==
Solvents with flashpoints below 55 deg C cannot be heated in the Nanofab. This includes acetone, methanol, isopropanol, ethanol, and toluene. All solvent processing is limited to the stainless steel solvent processing benches. Do not perform standard solvent processing at the photoresist spinner benches.
==Wet Etch and HF/TMAH Processing==
All wet processing involving acids and bases (except HF and TMAH) is limited to the acid/base benches. All HF and Bromine processing is limited to the HF or HF/TMAH benches - NO EXCEPTIONS. All TMAH processing is limited to the HF/TMAH bench. When working at the HF or HF/TMAH benches, always wear a chemical apron, face shield, and “Trionic” gloves. Store all HF and bromine in labeled containers in the HF acid/bromine storage cabinet. Store TMAH is the base storage cabinet. Please keep open containers of these two toxic chemicals away from the edge of the bench. All waste solutions containing any HF is poured down the drain, and treated in the Nanofab acid treatment system. Empty HF bottles should be returned to the HF acid storage cabinet. You may not deviate from this policy unless you have prior approval by the Nanofab manager.
==Photoresist Coating or Spinning==
Standard solvent-based photoresist spinning should be perfomed at the PR spinner benches. Some lithography chemicals utilize non-standard chemicals in place of solvents, which may require spinning at a different bench. If using a non-standard lithography chemicals, please provide the MSDS and process instructions to the laboratory manager for direction in this matter.
==Developer Benches==
Developer benches are used for developing photoresists only. In general, solvents are not allowed at the developer benches because solvent fumes adversely affect the develop process. Solvent based liftoff processes are not allowed at the developer benches E-beam develop processes may utilize solvents, and should be performed at the solvent benches in the photolith area.
==Plating Bench==
The Solvent/Plating bench contains cyanide-based plating and etching solutions. Never use acid solutions at this bench.
==Photoresist Storage, Handling, and Waste==
Photoresists can contain many solvents and aromatics that are potentially toxic. Special care must be exercised when handling these materials. All photoresist fumes must be exhausted or otherwise contained through careful procedures at the photolith wet benches. The primary photoresist storage area is the lab refrigerator located bay 6. Some resists do not need refrigeration and are stored in the flammables cabinet next to the refrigerator (PMGI, PMMA, etc). Before transferring refrigerated PR from the main bottle to your in-use bottle, place main bottle on designated photoresist warming racks for a minimum of 2 hours, or until the bottle is at room temperature, whichever is longer. Large transfer pipettes are provided for transferring PR from the main bottle to your in-use bottle. To prevent PR flakes from contaminating the main bottle, please inspect the main bottle cap and bottle threads for PR, and remove any PR with an acetone wipe before replacing cap. After transfer, place main bottle back in the refrigerator. You may store your in-use, fully labeled PR bottle in the stainless steel PR storage cabinet in a bin labeled with your research group name. Disposable droppers, syringes, and filters are provided for the application of photoresist on your substrate. You may store photoresist in the PR storage cabinet for a maximum of 6 months. Nanofab staff will remove in-use PR bottles older than 6 months, and will also remove any bottle not correctly labeled with contents, date, and ownership. Nanofab wipes and pipettes contaminated with PR must be placed in the beakers at the back of the spinner benches. Do not place PR contaminated materials in the trashcans, as this will allow photoresist fumes to migrate throughout the photolith area. Dispose of waste photoresist bottles by placing your labeled bottle in the yellow solvent waste cabinet in chase 5.
==Photoresist Strippers==
Use of heated strippers is limited to the stainless steel solvent benches. It is recommended you use the heated water bath to heat your stripper to 80 C. If you choose to use a hot plate to heat commercial photoresist strippers, we realize the hot plate surface temperature will need to be set above 80 C. Ideally, you should use a temperature probe inserted in the liquid as the feedback control for the hot plate. If you have the hot plate surface temperature set above 80 C, you must actively monitor the temperature of the stripper using a thermometer (or equivalent) and limit the stripper temperature to a maximum of 80 degrees C. You must be in the vicinity of the hotplate whenever you are heating strippers with the hot plate surface set above 80 degrees C if you are not using a temperature probe for feedback control of the hot plate.
'''The following photoresist strippers are stocked:'''
*Shipley 1165
*AZ 300T
*Shipley SVC-14
*PRX-127
==Chemical Waste Disposal==
===General Guidelines===
#The correct method of disposal for any chemical waste in our inventory is posted throughout the Nanofab, and also indicated in a file titled “Nanofab Chemical Storage/Use/Disposal”, located on the desktops of all optical microscope computers in the Nanofab.
#'''DO NOT DISPOSE OF SOLVENTS IN THE ACID DRAIN, OR ACIDS AND BASES IN THE SOLVENT DRAINS DUE TO POSSIBLE EXPLOSION OR THE CREATION OF OTHER HAZARDOUS SITUATIONS.'''
===All chemical waste is disposed in one of three methods:===
'''Acid Drains'''
:Most (but not all) water-based chemicals use this method. The acid drain empties into a waste chemical pH neutralization system located in the Nanofab mechanical room. This is the primary drain in the Nanofab. All liquids entering the sink drain at any polypropylene wet bench in the Nanofab run through this treatment system.

:To dispose of an acid or base, pour the liquid down the drain using the plenum flush. If you spill an acid or base onto the top surface of a bench, first rinse the surface thoroughly with water, then turn on the plenum flush to rinse the bench drain. Do not pour solvents down the acid drain.
'''Solvent Drains'''
:Most (but not all) solvent waste use this method. The solvent drain waste is pumped to a storage tank located in the Nanofab mechanical room. The waste solvents are transported to the EH&S chemical waste processing facility.
'''Collection of Waste'''
:Always fill out the Environmental Health and Safety waste disposal form when storing waste chemicals in the appropriate cabinet.
==Disposing of Empty Acid, Base, and Solvent Bottles==
Thoroughly rinse empty acid and base bottles three times with DI water, and then place in a trashcan. Place completely empty solvent bottles in the trashcan, making sure caps are in place. The exception to this policy is empty 49% HF bottles, which should be returned to the HF storage cabinet.
=Nanofab Apparel and Gloves=
==Bunnysuits and Booties==
You must wear a full bunnysuit to enter the Nanofab (hood, coverall, shoe covers). Facial covers are optional. Change bunnysuits weekly if used often, or at least once a month if used sporadically. Store coverall and hoods on numbered hangers in the gowning room. Reserve a hanger by placing a stainless steel “hanger reserve clip” on the hanger number. Store booties in the corresponding numbered slot in the bootie storage rack. Sandals or any other open toed shoes are not allowed in the Nanofab at any time.
==Eye Protection==
ANSI-approved eye protection must be worn at all times in the Nanofab, except when using optical microscopes. All eye protection eyewear must be ANSI-approved, as indicated by the “Z87” stamp required on the eyewear. You are welcome to use personal prescription safety eyewear which is ANSI-approved. Three types of safety eyewear are stocked in the Nanofab:
#'''Uvex Astro 3000''', for use by people who do not wear vision correction glasses. These safety glasses have a black frame.
#'''Uvex Astro OTG 3001''', for use by people who do wear vision correction glasses. These safety glasses are intended to be worn over vision correction glasses, and have a blue frame.
#'''U.S. Safety Faceshield'''. This full faceshields must be worn when working with dangerous chemicals or materials. Always use a faceshield when working at the HF bench.
==Aprons and Gloves==
===General Information===
Always wear gloves when in the Nanofab. Acid aprons are required when handling HF and other highly corrosive or toxic chemicals.
===Five types of gloves are available in the Nanofab:===
{| style="font-size: 95%;" border="1" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center; font-size: 95%"
|-bgcolor=#D0E7FF
!align=center bgcolor=#D0E7FF width="75"|'''Material'''
!align=center bgcolor=#D0E7FF width="150"|'''Manufacturer/Model'''
!align=center bgcolor=#D0E7FF width="75"|'''Color'''
!align=center bgcolor=#D0E7FF width="100"|'''Thickness'''
!align=center bgcolor=#D0E7FF width="150"|'''Stocked Sizes'''
|-
|PVC||Kimtech G5 Co-Polymer||Clear||0.10mm (4 mil)||S, M, L, XL
|-
|Latex||Kimtech G3 Latex||Tan||0.20mm (8 mil)||6, 6.5, 7, 7.5, 8, 8.5, 9, 10
|-
|Nitrile||Best CleaN-Dex Ultimate||White||0.15mm (6 mil)||XS, S, M, L, XL
|-
|Nitrile||MAPA StanSolve A-30||Green||0.28mm (11 mil)||7, 8, 9, 10, 11
|-
|Blend||MAPA TRIonic E-194||Tan||0.50mm (20 mil)||6, 7, 8, 9, 10, 11
|-
|}

*'''Polyvinyl Chloride (PVC)''': Kimtech G5 Co-Polymer
:A relatively inexpensive static free general-purpose glove, poor for most organics. These gloves break down rapidly in acetone.
*'''Latex''': Kimtech G3 Latex
:A general-purpose glove, poor for most organics, okay with aldehydes and keytones.
*'''Nitrile, White''': Best CleaN-Dex Ultimate
:This thin general purpose low cost glove offers marginal protection from many keytones, okay with some acids and bases.
*'''Nitrile, Green''': MAPA StanSolve A-30
:A thicker nitrile glove that affords increased protection over the CleaN-Dex white nitrile glove.
*'''Nitrile/Neoprene/Latex Blend''': MAPA TRIonic E-194
:This glove is the standard wet processing glove. A blend of latex, neoprene, and carboxylated nitrile, which offers excellent protection from corrosives and solvents such as HF and acetone. Highly resistant to cuts, tears, and snags. Always use this glove when processing with HF, TMAH, or Bromine.

=General Nanofab Information=
==Iris Camera Access System==
The iris camera access system provides security to the Nanofab, and allows tracking of the time each user spends in the Nanofab. ALWAYS scan in when entering the lab and scan out when exiting the lab, even when attending training sessions or performing beneficial work. Violating this policy will result in a two-week suspension for the first incidence, and possible permanent suspension for recurring incidences.
==Scheduling Tool/Equipment Use and Tool Supervisors==
Tool use is scheduled in one of two ways:
#either through the web-based system “Signupmonkey” at URL: http://signupmonkey.ece.ucsb.edu
#or first come/first served
*If a tool is listed on Signupmonkey, you must obtain permission from the supervisor of the tool in order to schedule use of the tool. This is typically accomplished by attending a training session.
*Some tools are not scheduled using Signupmonkey because the cycle period is typically short and use of the tool is most efficient without using signupmonkey.
*All tools in the Nanofab have a supervisor, regardless of whether the tool is listed on Signupmonkey.
*If you have problems with any tool, please inform the supervisor either by email, or direct communication (phone, etc).
==Credit for Beneficial Work in the Nanofab==
You will receive 1.5 hours of free processing time for each hour spent performing maintenance on lab equipment, conducting training sessions, or any time spent performing work beneficial to the general operation of the lab. Please indicate time spent performing beneficial work on the sign-up sheet just inside the gowning room.
==Wet Bench Housekeeping==
Always leave wet benches clean, dry, and organized. This includes cleaning up all spills, storing glassware and chemicals, etc. If a bench is not clean when you start a task, you still have the responsibility to leave it clean. If you leave a wet bench in disarray, or leave an unlabeled container on a bench, you can be suspended from the Nanofab. Do not cover the exhaust holes on the bench tops, as this will impede the laminar flow of air through the bench and possibly expose you or other Nanofab users to toxic fumes.
==Hotplates==
Hot plates used for heating chemicals must be attended. This means you must be in the Nanofab and near the hot plat whenever it is in use. (This does not apply to PR baking hotplates on the PR spinner benches.)
==Nanofab Paper==
The only paper allowed in the lab is Nanofab type paper. We stock many different types of Nanofab paper for the lab, including photocopier (or laserwriter) paper, sticky labels, and assorted notebooks. If you require a special type of Nanofab paper, ask and we will try to obtain it. You can laminate regular paper for use in the lab. Use pens, not pencils, for writing in the lab.
==Nanofab Wipes==
We stock four types of wipes in the lab
#'''S/Pec-Wipe 3''' is a cellulose/polyester blend with high absorption but medium particle and fiber generation.
#'''Berkshire Poly1200''' is a 100% knit polyethylene wipe with low particulate generation, but also with relatively low absorption.
#'''PRO-STAT''' is a cellulose blend presaturated with isopropyl alcohol and DI water.
#'''BIOHAZ''' are used to line photoresist spinner catch cups
==Preparing Equipment for Entry into the Nanofab==
All equipment entering the lab must be clean. The procedure for cleaning equipment for entry is:
#Vacuum while equipment is outside the lab
#Wipe down all accessible surfaces with propanol or EKC "Lab Clean" using Nanofab wipes while equipment is outside the lab
#Move equipment into the lab
#Vacuum with HEPA filtered vacuum cleaner when inside the lab
==Maintenance Ways==
You may enter maintenance ways without wearing a bunnysuit from outside the Nanofab, or while wearing a bunnysuit from inside the Nanofab.
==Notes on Particle Counts in the Nanofab==
The Nanofab was surveyed with a particle counter, with generally good results. All wet bench work surfaces have extremely low particle counts, better than class 10. The open areas in the lithography area are all better than class 100, and mostly better than class 10. The remainder of the Nanofab tests better than class 1000, and often better than class 100. The Nanofab design specifications stipulated class 100 for litho, class 1000 for everything else. The Nanofab is easily meeting these specs. 

The effectiveness of facemasks was investigated by placing the particle counter directly under a person’s neck while the person moved his head back and forth. Facemasks reduced particle counts, from the equivalent of class 500 without masks to class 100 with masks. Again, this was sampling just below the neck, not at typical substrate surfaces.

The choice of wipes used in the Nanofab has a more pronounced affect on particle counts. In general, wipes trade absorbency for low particle generation. The Spec-Wipe 3 is the stocked polyester/cellulose blend, high absorbency wipe designed for use in class 100 cleanrooms. Dragging the sampling tube across the surface of a Spec-Wipe 3 resulted in a class 1000 level particle counts. The Berkshire Polx 1200 wipe is the stocked low particle count, 100% knit polyester wipe. This wipe is not as absorbent at the Spec-Wipe 3, but generates fewer particles. Dragging the sampling tube across the surface of a Berkshire Polx 1200 wipe resulted in lower than class 100 level particle counts.

To summarize, the Nanofab is meeting and exceeding design specifications for particle counts. If you would like to further reduce particles on your substrates, you may implement the following practices, in order of effectiveness:
*Use only Berkshire Polx 1200 wipes if your process requires placing your substrate on a wipe
*Use a facemask if your process requires you to work above your substrate on a table. Facemasks do not reduce particle counts on substrates in wet benches.
==Procedure for the Use and Handling of Precious Metals==
Gold, platinum, palladium, and various alloys of these metals are stocked by the UCSB Nanofab. Each research group can be issued a precious metal supply. This supply must be stored in a small lockable container, along with a log sheet for recording the use of these metals. Precious metas, the lockable security container, and log sheets will be issued by the Nanofab manager. All use of precious metals must be accurately recorded on the log sheet, and include user name, date, metal type, metal weight before use, and metal weight after use. Multiple digital scales have been acquired and placed throughout the Nanofab to facilitate weighing of these metals. When requesting additional precious metals, the completed log sheet must be presented to the Nanofab manager. Any discrepancies in recorded precious metal use will result in charges to the principle investigator corresponding to the value of the precious metal discrepancy.
=Communications and Internet Access=
==Wireless Access in the Nanofab and Couryard Café==
Currently, we have two wireless networks available to Nanofab users:
===Nanofab Wireless Access:===
The Nanofab has three access points located in the Nanofab. This network is operated by Nanofab staff, and offers anonymous access. You may connect to this network by selecting the following network and entering the password.
*network: ''nanofab''
*password: ''ece!nanofab''

===UCSB Wireless Network===
The Courtyard Café, as well as other locations on campus, provide access to the UCSB wireless network.
*'''External Users''' (Other universities or industrial users)
:Access accounts to external Nanofab user (other university or industrial users) are provided as requested by the Nanofab manager. Please contact the Nanofab manager if you would like an account.
*'''Local academic users''' (UCSB grad students, staff, etc)
:Local academic users can access the UCSB wireless network by using their UCSBNetID and password. Information regarding setup of a UCSBNetID and password: https://my.sa.ucsb.edu/U-reset/AccountManagement.aspx

=Ball Bonding, Wire Bonding, and Packaging Services=
We have established an arrangement with PLT Technology to provide various ball bonding and packaging services to UCSB Nanofab users. The service can be provided for you by PLT technology, a local Santa Barbara company, and will be invoiced to your PI through our normal Nanofab recharge system. This service is offered to both academic and industrial Nanofab researchers. A description of the services and associated rates is below. Peter Tihanyi of PLT Technology will provide the service. Peter has a high level of expertise with these processes, especially involving unique or research-type substrates and processes. If you would like to utilize Peter's services, please contact Peter by email to start the process. All equipment noted below is in-house at PLT and in good working condition.

::Peter Tihanyi 
::PLT Technology, Inc 
::420 East Haley Street 
::Santa Barbara, CA 93101 
::Phone: 805-280-1834 
::[http://www.laserdiodeservices.com www.laserdiodeservices.com] 
::pltlaser@silcom.com 

*Au wire bonding service using K&S model 4124 gold ball bonder. The charge is $120 for the setup of the system and a minimum charge of $120, which includes up to 20 Au wires bonded. Each additional set of 20 wires is $120.
*Semiconductor device soldering (laser diodes, other lasers, electronics, etc) using indium deposition on a heat sink in high vacuum (3x10-7 tore). Device placement is accomplished using a Royce model 110 pick and place station with ± 0.5um accuracy on heat sink, with flux/organics free soldering in a vacuum chamber using protective gas during the soldering process. This flux-free soldering process was developed by Peter Tihanyi for spacecraft applications. The charge for this process is $120 per hour. There is a minimum charge of 8 hours for each soldering process which includes deposition of indium, chip placement, and chip soldering. The number of devices that can be soldered at the same time depends primarily on the heat sink size. We can supply C-mounts and 9mm packages for $30 each.
*Vacuum or N2 back-fill of 9mm and TO-3 packages utilizing a POLARIS Accu-Weld 4000 tool. This tool can also be setup for other package configurations. PLT has fixtures for both 9mm and TO-3 packages. However, new fixturing will be required for other package types. The service for 9mm and TO-3 packages up to 10 pieces is $800. We can supply the package for $30 each.
*Laser diode testing for wavelengths from 400nm to 1600nm utilizing a ILX Lightwave model LPA-9084 laser diode parameter analyzer. The charge is $120 per hour for C-mount. The use of other package types is dependent on the heat sink size, but many other package types can be accommodated.
*Semiconductor substrate scribe and break service utilizing a Loomis model 100 LSD tool. The setup charge is$120, with a rate of $120 per hour.
*Lapping and polishing service utilizing a Logitech model PM2 tool. The rate is $120 per hour, with a minimum of 8 hours. Various substrate materials can be processed, including Ga and InP.

=Nanofab Summer Intern Policy =

Whenever the intern is in the Nanofab, the mentor must also be in the Nanofab. Interns may use tools that do not require training sessions, such as microscopes, etc, unless the supervisor of these tools objects. Interns can work at photolith benches, and use components of the photolith benches, unless the supervisor of the bench objects. Interns will need to follow normal Nanofab access procedures, including initiation meeting with the Nanofab manager.

Interns will be allowed to use one or two mainline Nanofab tools after completing training conducted by Nanofab staff. Mainline tools are tools scheduled through our web site signupmonkey. Certain tools will be unavailable to interns due to extremely heavy use or other concerns.

Lab Rules OLD 2018

2016-09-15T23:20:21Z

Reynolds t:

For a printable PDF version of the Lab Rules, please '''[[Media:LabRules.pdf|CLICK HERE]]'''

While working in the Nanofab, you are surrounded by dangerous and deadly chemicals, gases, high voltages, radiation, and mechanical systems. The responsibility lies with users and staff to act in a professional, courteous, and safe manner at all times while in the facility. Users violating the operating and safety rules of the facility or endangering the safety of themselves or other users will be denied further access to the facility.

This document attempts to define acceptable actions and behavior for the users of the Nanofabrication facility. However, it is impossible to define a policy for every conceivable situation. Nanofab users are expected to employ common sense and a high degree of prudence while working in this facility.

=General Nanofabrication Facility Safety Policies=
==Visual and Audible Alarms in the Nanofab==
#'''Fire Alarm''': White strobe with high volume audible alarm, located throughout the Nanofab. If this alarm activates, immediately leave the Nanofab through the nearest exit. Do not remove bunnysuit until outside.
#'''Toxic Gas Alarm''': Blue strobe with high volume audible alarm, located at both ends of each bay. If this alarm activates in one bay, do not enter the bay. If this alarm activates throughout the Nanofab, immediately leave the Nanofab through the nearest exit. Do not remove bunnysuit until outside.
#'''Wet Bench Alarms''': Small illuminated visual alarms with buzzers. Each wet bench may have multiple alarms, with a placard beside the alarms indicating meaning of alarm and proper response. You must follow proper response if you see or hear a wet bench alarm.
#'''Equipment Alarms''': Please notify supervisor of tool if equipment alarm is activated.
==Emergencies and First Aid==
If you believe you may have been exposed to a toxic substance or gas, if appropriate rinse in the emergency shower. In all cases, quickly go to the emergency room at Goleta Valley Hospital. Emergency showers and eye wash stations are located at the south end of all bays. An enclosed emergency showers is located in bay 5 beside the wet etch benches. A first aid kit is located in the gowning room, and on the south wall at the end of bays 2, 4, and 6. Chemical spill clean-up kits are located on the wire shelving in each bay containing a wet bench. After using a spill cleanup kit, please inform the Nanofab manager. Fire extinguishers are located on the south end of each clean bay, and the north end of each maintenance chase.
==Hydrofluoric Acid (HF) Exposure==
===HF Exposure to Skin===
#Immediately rinse exposed area for 5 minutes in safety shower, flush affected area thoroughly. Speed and thoroughness in washing off the acid is of primary importance. An enclosed emergency showers is located in bay 5 across from the HF/TMAH wet processing bench. If using the emergency shower at the end of the bay, water will spill onto floor of Nanofab - this is OK.
#Immediately after rinsing, start massaging 2.5% calcium gluconate gel into the affected area. The individual applying the gel should wear gloves. Apply gel frequently and massage continuously. Calcium gluconate gel is located to the left of the HF bench in a pocket mounted to the side of the bench.
#Seek immediate medical attention by calling 9-911.
#Continue rubbing gel on affected area until advised otherwise by physician.
===HF Exposure to Eyes===
#Immediately rinse exposed area for 15 minutes at eye wash station. Hold eyelids open during irrigation to allow thorough flushing of the eyes. Water will spill onto floor of Nanofab - this is OK.
#Seek immediate medical attention by calling 9-911.
==TetraMethylAmmonium Hydroxide (TMAH) Exposure==
TMAH is a component in several photoresist developers and strippers, and is also used in the Nanofab as an ebeam resist developer and silicon etchant. The concentration of TMAH in photoresist developer and stripper solutions is relatively low (2-4%). However, the ebeam developer and silicon etchant utilize a solution of 25% TMAH.
===TMAH Exposure to Skin, 25% Concentration===
#Immediately rinse exposed area for at least 15 minutes in safety shower, flush affected area thoroughly. An enclosed emergency showers is located in bay 5 across from the HF/TMAH wet etch bench. If using the emergency shower at the end of the bay, water will spill onto floor of Nanofab - this is OK.
#Seek immediate medical attention by calling 9-911
===TMAH Exposure to Skin, 2%-4%Concentration===
#If small area skin exposure (<1% body surface area, <approximately 25 inches2) to 2-4% TMAH, immediately rinse exposed area until skin feels normal (not greasy). If irritation occurs, consult a physician.
#If medium to large area skin exposure (>1% body surface area, >approximately 25 inches2) to 2-4% TMAH, immediately rinse exposed area for at least 15 minutes in safety shower, flush affected area thoroughly. An enclosed emergency showers is located in bay 5 across from the HF/TMAH wet etch bench. If using the emergency shower at the end of the bay, water will spill onto floor of Nanofab - this is OK. Seek immediate medical attention by calling 9-911.
===TMAH Exposure to Eyes, Any Concentration===
#Immediately rinse exposed area for at least 15 minutes at eye wash station. Hold eyelids open during irrigation to allow thorough flushing of the eyes. Water will spill onto floor of Nanofab - this is OK.
#Seek immediate medical attention by calling 9-911
==Pregnancy and the Nanofab==
The effects on a fetus of many of the chemicals utilized in the Nanfab is unknown. The Nanofab is designed to prevent exposure to the fumes and vapors from these chemicals, but absolute 100% containment is impossible, and it is possible to be exposed to extremely small concentrations of these materials. Consequently, we strongly recommend that you do not work in the Nanofab if you know or suspect that you are pregnant.
=Chemicals and Hazardous Materials the Nanofab=
==[[MSDS]]==
The MSDS contains safety information regarding exposure, first aid, handling, storage, fire hazard, etc., for all chemicals, gases, and materials present in the facility. Before using an unfamiliar material, consult the MSDS to determine any potential hazards. Consult the MSDS to determine the proper course of action if someone has been exposed to a gas or chemical, or a spill has occurred. A book containing the MSDS for any material used in the Nanofab is located just inside the gowning room. Additionally, an electronic version of the MDSD in .pdf format for all chemicals in our inventory is located on the desktops of all the computers connected to microscopes in the Nanofab.
==Introducing New Materials Into the Nanofab==
All new chemicals, compounds, gases, materials for evaporation, etc., must be approved by the Nanofab manager before introduction into the facility. In order to introduce a new material into the Nanofab, a MSDS (Material Safety Data Sheet) for the material in .pdf format must be submitted to the Nanofab manager, plus a description of the proposed process utilizing the new material. The description of the process should include the goals of the process, and the mechanics of the process in reasonable detail. The Nanofab manager will determine if the material will be allowed in the Nanofab, and if so, where the new material will be stored, where the material is to be used (typically a specific wet bench), and how to dispose of the waste.
==Containers and Labeling==
Chemical containers such as beakers, bottles, etc, must be labeled with contents, date, and ownership (individual or group name). This information can be written on a wipe under the container. The exceptions to this policy are as follows:
#A beaker in use on a solvent bench can contain acetone, propanol, or methanol if the beaker is labeled with the text: “acetone/propanol/methanol”. The generic label “solvent” is insufficient. Beakers containing solvents other that acetone, propanol, or methanol must be labeled with the specific solvent.
#Indication of date is no longer required on beakers in use on solvent benches. All beakers in use on solvent benches must be labeled with contents and ownership.
#Beakers in use at lithography developer benches must be labeled with exact contents and ownership (individual or group name). The generic label “developer” is insufficient.
#Indication of date is no longer required on beakers in use on the developer benches. All beakers in use on developer benches must be labeled with contents and ownership.
==Chemical Storage==
*'''Acid Storage'''
:The primary acid storage area (except HF) is the acid cabinet located next to the acid wet processing benches in bay 5. HF acid is stored in the HF cabinet
*'''Base Storage'''
:The primary base storage area is the base cabinet located next to the acid wet processing bench.
*'''Solvent Storage'''
:The primary solvent storage area is the stainless steel flammables cabinet in bay 6. You may store small amounts of solvents in labeled containers on the shelves in the photolith area.
==Solvent Processing==
Solvents with flashpoints below 55 deg C cannot be heated in the Nanofab. This includes acetone, methanol, isopropanol, ethanol, and toluene. All solvent processing is limited to the stainless steel solvent processing benches. Do not perform standard solvent processing at the photoresist spinner benches.
==Wet Etch and HF/TMAH Processing==
All wet processing involving acids and bases (except HF and TMAH) is limited to the acid/base benches. All HF and Bromine processing is limited to the HF or HF/TMAH benches - NO EXCEPTIONS. All TMAH processing is limited to the HF/TMAH bench. When working at the HF or HF/TMAH benches, always wear a chemical apron, face shield, and “Trionic” gloves. Store all HF and bromine in labeled containers in the HF acid/bromine storage cabinet. Store TMAH is the base storage cabinet. Please keep open containers of these two toxic chemicals away from the edge of the bench. All waste solutions containing any HF is poured down the drain, and treated in the Nanofab acid treatment system. Empty HF bottles should be returned to the HF acid storage cabinet. You may not deviate from this policy unless you have prior approval by the Nanofab manager.
==Photoresist Coating or Spinning==
Standard solvent-based photoresist spinning should be perfomed at the PR spinner benches. Some lithography chemicals utilize non-standard chemicals in place of solvents, which may require spinning at a different bench. If using a non-standard lithography chemicals, please provide the MSDS and process instructions to the laboratory manager for direction in this matter.
==Developer Benches==
Developer benches are used for developing photoresists only. In general, solvents are not allowed at the developer benches because solvent fumes adversely affect the develop process. Solvent based liftoff processes are not allowed at the developer benches E-beam develop processes may utilize solvents, and should be performed at the solvent benches in the photolith area.
==Plating Bench==
The Solvent/Plating bench contains cyanide-based plating and etching solutions. Never use acid solutions at this bench.
==Photoresist Storage, Handling, and Waste==
Photoresists can contain many solvents and aromatics that are potentially toxic. Special care must be exercised when handling these materials. All photoresist fumes must be exhausted or otherwise contained through careful procedures at the photolith wet benches. The primary photoresist storage area is the lab refrigerator located bay 6. Some resists do not need refrigeration and are stored in the flammables cabinet next to the refrigerator (PMGI, PMMA, etc). Before transferring refrigerated PR from the main bottle to your in-use bottle, place main bottle on designated photoresist warming racks for a minimum of 2 hours, or until the bottle is at room temperature, whichever is longer. Large transfer pipettes are provided for transferring PR from the main bottle to your in-use bottle. To prevent PR flakes from contaminating the main bottle, please inspect the main bottle cap and bottle threads for PR, and remove any PR with an acetone wipe before replacing cap. After transfer, place main bottle back in the refrigerator. You may store your in-use, fully labeled PR bottle in the stainless steel PR storage cabinet in a bin labeled with your research group name. Disposable droppers, syringes, and filters are provided for the application of photoresist on your substrate. You may store photoresist in the PR storage cabinet for a maximum of 6 months. Nanofab staff will remove in-use PR bottles older than 6 months, and will also remove any bottle not correctly labeled with contents, date, and ownership. Nanofab wipes and pipettes contaminated with PR must be placed in the beakers at the back of the spinner benches. Do not place PR contaminated materials in the trashcans, as this will allow photoresist fumes to migrate throughout the photolith area. Dispose of waste photoresist bottles by placing your labeled bottle in the yellow solvent waste cabinet in chase 5.
==Photoresist Strippers==
Use of heated strippers is limited to the stainless steel solvent benches. It is recommended you use the heated water bath to heat your stripper to 80 C. If you choose to use a hot plate to heat commercial photoresist strippers, we realize the hot plate surface temperature will need to be set above 80 C. Ideally, you should use a temperature probe inserted in the liquid as the feedback control for the hot plate. If you have the hot plate surface temperature set above 80 C, you must actively monitor the temperature of the stripper using a thermometer (or equivalent) and limit the stripper temperature to a maximum of 80 degrees C. You must be in the vicinity of the hotplate whenever you are heating strippers with the hot plate surface set above 80 degrees C if you are not using a temperature probe for feedback control of the hot plate.
'''The following photoresist strippers are stocked:'''
*Shipley 1165
*AZ 300T
*Shipley SVC-14
*PRX-127
==Chemical Waste Disposal==
===General Guidelines===
#The correct method of disposal for any chemical waste in our inventory is posted throughout the Nanofab, and also indicated in a file titled “Nanofab Chemical Storage/Use/Disposal”, located on the desktops of all optical microscope computers in the Nanofab.
#'''DO NOT DISPOSE OF SOLVENTS IN THE ACID DRAIN, OR ACIDS AND BASES IN THE SOLVENT DRAINS DUE TO POSSIBLE EXPLOSION OR THE CREATION OF OTHER HAZARDOUS SITUATIONS.'''
===All chemical waste is disposed in one of three methods:===
'''Acid Drains'''
:Most (but not all) water-based chemicals use this method. The acid drain empties into a waste chemical pH neutralization system located in the Nanofab mechanical room. This is the primary drain in the Nanofab. All liquids entering the sink drain at any polypropylene wet bench in the Nanofab run through this treatment system.

:To dispose of an acid or base, pour the liquid down the drain using the plenum flush. If you spill an acid or base onto the top surface of a bench, first rinse the surface thoroughly with water, then turn on the plenum flush to rinse the bench drain. Do not pour solvents down the acid drain.
'''Solvent Drains'''
:Most (but not all) solvent waste use this method. The solvent drain waste is pumped to a storage tank located in the Nanofab mechanical room. The waste solvents are transported to the EH&S chemical waste processing facility.
'''Collection of Waste'''
:Always fill out the Environmental Health and Safety waste disposal form when storing waste chemicals in the appropriate cabinet.
==Disposing of Empty Acid, Base, and Solvent Bottles==
Thoroughly rinse empty acid and base bottles three times with DI water, and then place in a trashcan. Place completely empty solvent bottles in the trashcan, making sure caps are in place. The exception to this policy is empty 49% HF bottles, which should be returned to the HF storage cabinet.
=Nanofab Apparel and Gloves=
==Bunnysuits and Booties==
You must wear a full bunnysuit to enter the Nanofab (hood, coverall, shoe covers). Facial covers are optional. Change bunnysuits weekly if used often, or at least once a month if used sporadically. Store coverall and hoods on numbered hangers in the gowning room. Reserve a hanger by placing a stainless steel “hanger reserve clip” on the hanger number. Store booties in the corresponding numbered slot in the bootie storage rack. Sandals or any other open toed shoes are not allowed in the Nanofab at any time.
==Eye Protection==
ANSI-approved eye protection must be worn at all times in the Nanofab, except when using optical microscopes. All eye protection eyewear must be ANSI-approved, as indicated by the “Z87” stamp required on the eyewear. You are welcome to use personal prescription safety eyewear which is ANSI-approved. Three types of safety eyewear are stocked in the Nanofab:
#'''Uvex Astro 3000''', for use by people who do not wear vision correction glasses. These safety glasses have a black frame.
#'''Uvex Astro OTG 3001''', for use by people who do wear vision correction glasses. These safety glasses are intended to be worn over vision correction glasses, and have a blue frame.
#'''U.S. Safety Faceshield'''. This full faceshields must be worn when working with dangerous chemicals or materials. Always use a faceshield when working at the HF bench.
==Aprons and Gloves==
===General Information===
Always wear gloves when in the Nanofab. Acid aprons are required when handling HF and other highly corrosive or toxic chemicals.
===Five types of gloves are available in the Nanofab:===
{| style="font-size: 95%;" border="1" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center; font-size: 95%"
|-bgcolor=#D0E7FF
!align=center bgcolor=#D0E7FF width="75"|'''Material'''
!align=center bgcolor=#D0E7FF width="150"|'''Manufacturer/Model'''
!align=center bgcolor=#D0E7FF width="75"|'''Color'''
!align=center bgcolor=#D0E7FF width="100"|'''Thickness'''
!align=center bgcolor=#D0E7FF width="150"|'''Stocked Sizes'''
|-
|PVC||Kimtech G5 Co-Polymer||Clear||0.10mm (4 mil)||S, M, L, XL
|-
|Latex||Kimtech G3 Latex||Tan||0.20mm (8 mil)||6, 6.5, 7, 7.5, 8, 8.5, 9, 10
|-
|Nitrile||Best CleaN-Dex Ultimate||White||0.15mm (6 mil)||XS, S, M, L, XL
|-
|Nitrile||MAPA StanSolve A-30||Green||0.28mm (11 mil)||7, 8, 9, 10, 11
|-
|Blend||MAPA TRIonic E-194||Tan||0.50mm (20 mil)||6, 7, 8, 9, 10, 11
|-
|}

*'''Polyvinyl Chloride (PVC)''': Kimtech G5 Co-Polymer
:A relatively inexpensive static free general-purpose glove, poor for most organics. These gloves break down rapidly in acetone.
*'''Latex''': Kimtech G3 Latex
:A general-purpose glove, poor for most organics, okay with aldehydes and keytones.
*'''Nitrile, White''': Best CleaN-Dex Ultimate
:This thin general purpose low cost glove offers marginal protection from many keytones, okay with some acids and bases.
*'''Nitrile, Green''': MAPA StanSolve A-30
:A thicker nitrile glove that affords increased protection over the CleaN-Dex white nitrile glove.
*'''Nitrile/Neoprene/Latex Blend''': MAPA TRIonic E-194
:This glove is the standard wet processing glove. A blend of latex, neoprene, and carboxylated nitrile, which offers excellent protection from corrosives and solvents such as HF and acetone. Highly resistant to cuts, tears, and snags. Always use this glove when processing with HF, TMAH, or Bromine.

=General Nanofab Information=
==Iris Camera Access System==
The iris camera access system provides security to the Nanofab, and allows tracking of the time each user spends in the Nanofab. ALWAYS scan in when entering the lab and scan out when exiting the lab, even when attending training sessions or performing beneficial work. Violating this policy will result in a two-week suspension for the first incidence, and possible permanent suspension for recurring incidences.
==Scheduling Tool/Equipment Use and Tool Supervisors==
Tool use is scheduled in one of two ways:
#either through the web-based system “Signupmonkey” at URL: http://signupmonkey.ece.ucsb.edu
#or first come/first served
*If a tool is listed on Signupmonkey, you must obtain permission from the supervisor of the tool in order to schedule use of the tool. This is typically accomplished by attending a training session.
*Some tools are not scheduled using Signupmonkey because the cycle period is typically short and use of the tool is most efficient without using signupmonkey.
*All tools in the Nanofab have a supervisor, regardless of whether the tool is listed on Signupmonkey.
*If you have problems with any tool, please inform the supervisor either by email, or direct communication (phone, etc).
==Credit for Beneficial Work in the Nanofab==
You will receive 1.5 hours of free processing time for each hour spent performing maintenance on lab equipment, conducting training sessions, or any time spent performing work beneficial to the general operation of the lab. Please indicate time spent performing beneficial work on the sign-up sheet just inside the gowning room.
==Wet Bench Housekeeping==
Always leave wet benches clean, dry, and organized. This includes cleaning up all spills, storing glassware and chemicals, etc. If a bench is not clean when you start a task, you still have the responsibility to leave it clean. If you leave a wet bench in disarray, or leave an unlabeled container on a bench, you can be suspended from the Nanofab. Do not cover the exhaust holes on the bench tops, as this will impede the laminar flow of air through the bench and possibly expose you or other Nanofab users to toxic fumes.
==Hotplates==
Hot plates used for heating chemicals must be attended. This means you must be in the Nanofab and near the hot plat whenever it is in use. (This does not apply to PR baking hotplates on the PR spinner benches.)
==Nanofab Paper==
The only paper allowed in the lab is Nanofab type paper. We stock many different types of Nanofab paper for the lab, including photocopier (or laserwriter) paper, sticky labels, and assorted notebooks. If you require a special type of Nanofab paper, ask and we will try to obtain it. You can laminate regular paper for use in the lab. Use pens, not pencils, for writing in the lab.
==Nanofab Wipes==
We stock four types of wipes in the lab
#'''S/Pec-Wipe 3''' is a cellulose/polyester blend with high absorption but medium particle and fiber generation.
#'''Berkshire Poly1200''' is a 100% knit polyethylene wipe with low particulate generation, but also with relatively low absorption.
#'''PRO-STAT''' is a cellulose blend presaturated with isopropyl alcohol and DI water.
#'''BIOHAZ''' are used to line photoresist spinner catch cups
==Preparing Equipment for Entry into the Nanofab==
All equipment entering the lab must be clean. The procedure for cleaning equipment for entry is:
#Vacuum while equipment is outside the lab
#Wipe down all accessible surfaces with propanol or EKC "Lab Clean" using Nanofab wipes while equipment is outside the lab
#Move equipment into the lab
#Vacuum with HEPA filtered vacuum cleaner when inside the lab
==Maintenance Ways==
You may enter maintenance ways without wearing a bunnysuit from outside the Nanofab, or while wearing a bunnysuit from inside the Nanofab.
==Notes on Particle Counts in the Nanofab==
The Nanofab was surveyed with a particle counter, with generally good results. All wet bench work surfaces have extremely low particle counts, better than class 10. The open areas in the lithography area are all better than class 100, and mostly better than class 10. The remainder of the Nanofab tests better than class 1000, and often better than class 100. The Nanofab design specifications stipulated class 100 for litho, class 1000 for everything else. The Nanofab is easily meeting these specs. 

The effectiveness of facemasks was investigated by placing the particle counter directly under a person’s neck while the person moved his head back and forth. Facemasks reduced particle counts, from the equivalent of class 500 without masks to class 100 with masks. Again, this was sampling just below the neck, not at typical substrate surfaces.

The choice of wipes used in the Nanofab has a more pronounced affect on particle counts. In general, wipes trade absorbency for low particle generation. The Spec-Wipe 3 is the stocked polyester/cellulose blend, high absorbency wipe designed for use in class 100 cleanrooms. Dragging the sampling tube across the surface of a Spec-Wipe 3 resulted in a class 1000 level particle counts. The Berkshire Polx 1200 wipe is the stocked low particle count, 100% knit polyester wipe. This wipe is not as absorbent at the Spec-Wipe 3, but generates fewer particles. Dragging the sampling tube across the surface of a Berkshire Polx 1200 wipe resulted in lower than class 100 level particle counts.

To summarize, the Nanofab is meeting and exceeding design specifications for particle counts. If you would like to further reduce particles on your substrates, you may implement the following practices, in order of effectiveness:
*Use only Berkshire Polx 1200 wipes if your process requires placing your substrate on a wipe
*Use a facemask if your process requires you to work above your substrate on a table. Facemasks do not reduce particle counts on substrates in wet benches.
==Procedure for the Use and Handling of Precious Metals==
Gold, platinum, palladium, and various alloys of these metals are stocked by the UCSB Nanofab. Each research group can be issued a precious metal supply. This supply must be stored in a small lockable container, along with a log sheet for recording the use of these metals. Precious metas, the lockable security container, and log sheets will be issued by the Nanofab manager. All use of precious metals must be accurately recorded on the log sheet, and include user name, date, metal type, metal weight before use, and metal weight after use. Multiple digital scales have been acquired and placed throughout the Nanofab to facilitate weighing of these metals. When requesting additional precious metals, the completed log sheet must be presented to the Nanofab manager. Any discrepancies in recorded precious metal use will result in charges to the principle investigator corresponding to the value of the precious metal discrepancy.
=Communications and Internet Access=
==Wireless Access in the Nanofab and Couryard Café==
Currently, we have two wireless networks available to Nanofab users:
===Nanofab Wireless Access:===
The Nanofab has three access points located in the Nanofab. This network is operated by Nanofab staff, and offers anonymous access. You may connect to this network by selecting the following network and entering the password.
*network: ''nanofab''
*password: ''ece!nanofab''

===UCSB Wireless Network===
The Courtyard Café, as well as other locations on campus, provide access to the UCSB wireless network.
*'''External Users''' (Other universities or industrial users)
:Access accounts to external Nanofab user (other university or industrial users) are provided as requested by the Nanofab manager. Please contact the Nanofab manager if you would like an account.
*'''Local academic users''' (UCSB grad students, staff, etc)
:Local academic users can access the UCSB wireless network by using their UCSBNetID and password. Information regarding setup of a UCSBNetID and password: https://my.sa.ucsb.edu/U-reset/AccountManagement.aspx

=Ball Bonding, Wire Bonding, and Packaging Services=
We have established an arrangement with PLT Technology to provide various ball bonding and packaging services to UCSB Nanofab users. The service can be provided for you by PLT technology, a local Santa Barbara company, and will be invoiced to your PI through our normal Nanofab recharge system. This service is offered to both academic and industrial Nanofab researchers. A description of the services and associated rates is below. Peter Tihanyi of PLT Technology will provide the service. Peter has a high level of expertise with these processes, especially involving unique or research-type substrates and processes. If you would like to utilize Peter's services, please contact Peter by email to start the process. All equipment noted below is in-house at PLT and in good working condition.

::Peter Tihanyi 
::PLT Technology, Inc 
::420 East Haley Street 
::Santa Barbara, CA 93101 
::Phone: 805-280-1834 
::[http://www.laserdiodeservices.com www.laserdiodeservices.com] 
::pltlaser@silcom.com 

*Au wire bonding service using K&S model 4124 gold ball bonder. The charge is $120 for the setup of the system and a minimum charge of $120, which includes up to 20 Au wires bonded. Each additional set of 20 wires is $120.
*Semiconductor device soldering (laser diodes, other lasers, electronics, etc) using indium deposition on a heat sink in high vacuum (3x10-7 tore). Device placement is accomplished using a Royce model 110 pick and place station with ± 0.5um accuracy on heat sink, with flux/organics free soldering in a vacuum chamber using protective gas during the soldering process. This flux-free soldering process was developed by Peter Tihanyi for spacecraft applications. The charge for this process is $120 per hour. There is a minimum charge of 8 hours for each soldering process which includes deposition of indium, chip placement, and chip soldering. The number of devices that can be soldered at the same time depends primarily on the heat sink size. We can supply C-mounts and 9mm packages for $30 each.
*Vacuum or N2 back-fill of 9mm and TO-3 packages utilizing a POLARIS Accu-Weld 4000 tool. This tool can also be setup for other package configurations. PLT has fixtures for both 9mm and TO-3 packages. However, new fixturing will be required for other package types. The service for 9mm and TO-3 packages up to 10 pieces is $800. We can supply the package for $30 each.
*Laser diode testing for wavelengths from 400nm to 1600nm utilizing a ILX Lightwave model LPA-9084 laser diode parameter analyzer. The charge is $120 per hour for C-mount. The use of other package types is dependent on the heat sink size, but many other package types can be accommodated.
*Semiconductor substrate scribe and break service utilizing a Loomis model 100 LSD tool. The setup charge is$120, with a rate of $120 per hour.
*Lapping and polishing service utilizing a Logitech model PM2 tool. The rate is $120 per hour, with a minimum of 8 hours. Various substrate materials can be processed, including Ga and InP.

=Nanofab Summer Intern Policy =

Whenever the intern is in the Nanofab, the mentor must also be in the Nanofab. Interns may use tools that do not require training sessions, such as microscopes, etc, unless the supervisor of these tools objects. Interns can work at photolith benches, and use components of the photolith benches, unless the supervisor of the bench objects. Interns will need to follow normal Nanofab access procedures, including initiation meeting with the Nanofab manager.

Interns will be allowed to use one or two mainline Nanofab tools after completing training conducted by Nanofab staff. Mainline tools are tools scheduled through our web site signupmonkey. Certain tools will be unavailable to interns due to extremely heavy use or other concerns.

Lab Rules OLD 2018

2016-09-15T23:19:55Z

Reynolds t:

[[File:Example.jpg]]For a printable PDF version of the Lab Rules, please '''[[Media:LabRules.pdf|CLICK HERE]]'''

While working in the Nanofab, you are surrounded by dangerous and deadly chemicals, gases, high voltages, radiation, and mechanical systems. The responsibility lies with users and staff to act in a professional, courteous, and safe manner at all times while in the facility. Users violating the operating and safety rules of the facility or endangering the safety of themselves or other users will be denied further access to the facility.

This document attempts to define acceptable actions and behavior for the users of the Nanofabrication facility. However, it is impossible to define a policy for every conceivable situation. Nanofab users are expected to employ common sense and a high degree of prudence while working in this facility.

=General Nanofabrication Facility Safety Policies=
==Visual and Audible Alarms in the Nanofab==
#'''Fire Alarm''': White strobe with high volume audible alarm, located throughout the Nanofab. If this alarm activates, immediately leave the Nanofab through the nearest exit. Do not remove bunnysuit until outside.
#'''Toxic Gas Alarm''': Blue strobe with high volume audible alarm, located at both ends of each bay. If this alarm activates in one bay, do not enter the bay. If this alarm activates throughout the Nanofab, immediately leave the Nanofab through the nearest exit. Do not remove bunnysuit until outside.
#'''Wet Bench Alarms''': Small illuminated visual alarms with buzzers. Each wet bench may have multiple alarms, with a placard beside the alarms indicating meaning of alarm and proper response. You must follow proper response if you see or hear a wet bench alarm.
#'''Equipment Alarms''': Please notify supervisor of tool if equipment alarm is activated.
==Emergencies and First Aid==
If you believe you may have been exposed to a toxic substance or gas, if appropriate rinse in the emergency shower. In all cases, quickly go to the emergency room at Goleta Valley Hospital. Emergency showers and eye wash stations are located at the south end of all bays. An enclosed emergency showers is located in bay 5 beside the wet etch benches. A first aid kit is located in the gowning room, and on the south wall at the end of bays 2, 4, and 6. Chemical spill clean-up kits are located on the wire shelving in each bay containing a wet bench. After using a spill cleanup kit, please inform the Nanofab manager. Fire extinguishers are located on the south end of each clean bay, and the north end of each maintenance chase.
==Hydrofluoric Acid (HF) Exposure==
===HF Exposure to Skin===
#Immediately rinse exposed area for 5 minutes in safety shower, flush affected area thoroughly. Speed and thoroughness in washing off the acid is of primary importance. An enclosed emergency showers is located in bay 5 across from the HF/TMAH wet processing bench. If using the emergency shower at the end of the bay, water will spill onto floor of Nanofab - this is OK.
#Immediately after rinsing, start massaging 2.5% calcium gluconate gel into the affected area. The individual applying the gel should wear gloves. Apply gel frequently and massage continuously. Calcium gluconate gel is located to the left of the HF bench in a pocket mounted to the side of the bench.
#Seek immediate medical attention by calling 9-911.
#Continue rubbing gel on affected area until advised otherwise by physician.
===HF Exposure to Eyes===
#Immediately rinse exposed area for 15 minutes at eye wash station. Hold eyelids open during irrigation to allow thorough flushing of the eyes. Water will spill onto floor of Nanofab - this is OK.
#Seek immediate medical attention by calling 9-911.
==TetraMethylAmmonium Hydroxide (TMAH) Exposure==
TMAH is a component in several photoresist developers and strippers, and is also used in the Nanofab as an ebeam resist developer and silicon etchant. The concentration of TMAH in photoresist developer and stripper solutions is relatively low (2-4%). However, the ebeam developer and silicon etchant utilize a solution of 25% TMAH.
===TMAH Exposure to Skin, 25% Concentration===
#Immediately rinse exposed area for at least 15 minutes in safety shower, flush affected area thoroughly. An enclosed emergency showers is located in bay 5 across from the HF/TMAH wet etch bench. If using the emergency shower at the end of the bay, water will spill onto floor of Nanofab - this is OK.
#Seek immediate medical attention by calling 9-911
===TMAH Exposure to Skin, 2%-4%Concentration===
#If small area skin exposure (<1% body surface area, <approximately 25 inches2) to 2-4% TMAH, immediately rinse exposed area until skin feels normal (not greasy). If irritation occurs, consult a physician.
#If medium to large area skin exposure (>1% body surface area, >approximately 25 inches2) to 2-4% TMAH, immediately rinse exposed area for at least 15 minutes in safety shower, flush affected area thoroughly. An enclosed emergency showers is located in bay 5 across from the HF/TMAH wet etch bench. If using the emergency shower at the end of the bay, water will spill onto floor of Nanofab - this is OK. Seek immediate medical attention by calling 9-911.
===TMAH Exposure to Eyes, Any Concentration===
#Immediately rinse exposed area for at least 15 minutes at eye wash station. Hold eyelids open during irrigation to allow thorough flushing of the eyes. Water will spill onto floor of Nanofab - this is OK.
#Seek immediate medical attention by calling 9-911
==Pregnancy and the Nanofab==
The effects on a fetus of many of the chemicals utilized in the Nanfab is unknown. The Nanofab is designed to prevent exposure to the fumes and vapors from these chemicals, but absolute 100% containment is impossible, and it is possible to be exposed to extremely small concentrations of these materials. Consequently, we strongly recommend that you do not work in the Nanofab if you know or suspect that you are pregnant.
=Chemicals and Hazardous Materials the Nanofab=
==[[MSDS]]==
The MSDS contains safety information regarding exposure, first aid, handling, storage, fire hazard, etc., for all chemicals, gases, and materials present in the facility. Before using an unfamiliar material, consult the MSDS to determine any potential hazards. Consult the MSDS to determine the proper course of action if someone has been exposed to a gas or chemical, or a spill has occurred. A book containing the MSDS for any material used in the Nanofab is located just inside the gowning room. Additionally, an electronic version of the MDSD in .pdf format for all chemicals in our inventory is located on the desktops of all the computers connected to microscopes in the Nanofab.
==Introducing New Materials Into the Nanofab==
All new chemicals, compounds, gases, materials for evaporation, etc., must be approved by the Nanofab manager before introduction into the facility. In order to introduce a new material into the Nanofab, a MSDS (Material Safety Data Sheet) for the material in .pdf format must be submitted to the Nanofab manager, plus a description of the proposed process utilizing the new material. The description of the process should include the goals of the process, and the mechanics of the process in reasonable detail. The Nanofab manager will determine if the material will be allowed in the Nanofab, and if so, where the new material will be stored, where the material is to be used (typically a specific wet bench), and how to dispose of the waste.
==Containers and Labeling==
Chemical containers such as beakers, bottles, etc, must be labeled with contents, date, and ownership (individual or group name). This information can be written on a wipe under the container. The exceptions to this policy are as follows:
#A beaker in use on a solvent bench can contain acetone, propanol, or methanol if the beaker is labeled with the text: “acetone/propanol/methanol”. The generic label “solvent” is insufficient. Beakers containing solvents other that acetone, propanol, or methanol must be labeled with the specific solvent.
#Indication of date is no longer required on beakers in use on solvent benches. All beakers in use on solvent benches must be labeled with contents and ownership.
#Beakers in use at lithography developer benches must be labeled with exact contents and ownership (individual or group name). The generic label “developer” is insufficient.
#Indication of date is no longer required on beakers in use on the developer benches. All beakers in use on developer benches must be labeled with contents and ownership.
==Chemical Storage==
*'''Acid Storage'''
:The primary acid storage area (except HF) is the acid cabinet located next to the acid wet processing benches in bay 5. HF acid is stored in the HF cabinet
*'''Base Storage'''
:The primary base storage area is the base cabinet located next to the acid wet processing bench.
*'''Solvent Storage'''
:The primary solvent storage area is the stainless steel flammables cabinet in bay 6. You may store small amounts of solvents in labeled containers on the shelves in the photolith area.
==Solvent Processing==
Solvents with flashpoints below 55 deg C cannot be heated in the Nanofab. This includes acetone, methanol, isopropanol, ethanol, and toluene. All solvent processing is limited to the stainless steel solvent processing benches. Do not perform standard solvent processing at the photoresist spinner benches.
==Wet Etch and HF/TMAH Processing==
All wet processing involving acids and bases (except HF and TMAH) is limited to the acid/base benches. All HF and Bromine processing is limited to the HF or HF/TMAH benches - NO EXCEPTIONS. All TMAH processing is limited to the HF/TMAH bench. When working at the HF or HF/TMAH benches, always wear a chemical apron, face shield, and “Trionic” gloves. Store all HF and bromine in labeled containers in the HF acid/bromine storage cabinet. Store TMAH is the base storage cabinet. Please keep open containers of these two toxic chemicals away from the edge of the bench. All waste solutions containing any HF is poured down the drain, and treated in the Nanofab acid treatment system. Empty HF bottles should be returned to the HF acid storage cabinet. You may not deviate from this policy unless you have prior approval by the Nanofab manager.
==Photoresist Coating or Spinning==
Standard solvent-based photoresist spinning should be perfomed at the PR spinner benches. Some lithography chemicals utilize non-standard chemicals in place of solvents, which may require spinning at a different bench. If using a non-standard lithography chemicals, please provide the MSDS and process instructions to the laboratory manager for direction in this matter.
==Developer Benches==
Developer benches are used for developing photoresists only. In general, solvents are not allowed at the developer benches because solvent fumes adversely affect the develop process. Solvent based liftoff processes are not allowed at the developer benches E-beam develop processes may utilize solvents, and should be performed at the solvent benches in the photolith area.
==Plating Bench==
The Solvent/Plating bench contains cyanide-based plating and etching solutions. Never use acid solutions at this bench.
==Photoresist Storage, Handling, and Waste==
Photoresists can contain many solvents and aromatics that are potentially toxic. Special care must be exercised when handling these materials. All photoresist fumes must be exhausted or otherwise contained through careful procedures at the photolith wet benches. The primary photoresist storage area is the lab refrigerator located bay 6. Some resists do not need refrigeration and are stored in the flammables cabinet next to the refrigerator (PMGI, PMMA, etc). Before transferring refrigerated PR from the main bottle to your in-use bottle, place main bottle on designated photoresist warming racks for a minimum of 2 hours, or until the bottle is at room temperature, whichever is longer. Large transfer pipettes are provided for transferring PR from the main bottle to your in-use bottle. To prevent PR flakes from contaminating the main bottle, please inspect the main bottle cap and bottle threads for PR, and remove any PR with an acetone wipe before replacing cap. After transfer, place main bottle back in the refrigerator. You may store your in-use, fully labeled PR bottle in the stainless steel PR storage cabinet in a bin labeled with your research group name. Disposable droppers, syringes, and filters are provided for the application of photoresist on your substrate. You may store photoresist in the PR storage cabinet for a maximum of 6 months. Nanofab staff will remove in-use PR bottles older than 6 months, and will also remove any bottle not correctly labeled with contents, date, and ownership. Nanofab wipes and pipettes contaminated with PR must be placed in the beakers at the back of the spinner benches. Do not place PR contaminated materials in the trashcans, as this will allow photoresist fumes to migrate throughout the photolith area. Dispose of waste photoresist bottles by placing your labeled bottle in the yellow solvent waste cabinet in chase 5.
==Photoresist Strippers==
Use of heated strippers is limited to the stainless steel solvent benches. It is recommended you use the heated water bath to heat your stripper to 80 C. If you choose to use a hot plate to heat commercial photoresist strippers, we realize the hot plate surface temperature will need to be set above 80 C. Ideally, you should use a temperature probe inserted in the liquid as the feedback control for the hot plate. If you have the hot plate surface temperature set above 80 C, you must actively monitor the temperature of the stripper using a thermometer (or equivalent) and limit the stripper temperature to a maximum of 80 degrees C. You must be in the vicinity of the hotplate whenever you are heating strippers with the hot plate surface set above 80 degrees C if you are not using a temperature probe for feedback control of the hot plate.
'''The following photoresist strippers are stocked:'''
*Shipley 1165
*AZ 300T
*Shipley SVC-14
*PRX-127
==Chemical Waste Disposal==
===General Guidelines===
#The correct method of disposal for any chemical waste in our inventory is posted throughout the Nanofab, and also indicated in a file titled “Nanofab Chemical Storage/Use/Disposal”, located on the desktops of all optical microscope computers in the Nanofab.
#'''DO NOT DISPOSE OF SOLVENTS IN THE ACID DRAIN, OR ACIDS AND BASES IN THE SOLVENT DRAINS DUE TO POSSIBLE EXPLOSION OR THE CREATION OF OTHER HAZARDOUS SITUATIONS.'''
===All chemical waste is disposed in one of three methods:===
'''Acid Drains'''
:Most (but not all) water-based chemicals use this method. The acid drain empties into a waste chemical pH neutralization system located in the Nanofab mechanical room. This is the primary drain in the Nanofab. All liquids entering the sink drain at any polypropylene wet bench in the Nanofab run through this treatment system.

:To dispose of an acid or base, pour the liquid down the drain using the plenum flush. If you spill an acid or base onto the top surface of a bench, first rinse the surface thoroughly with water, then turn on the plenum flush to rinse the bench drain. Do not pour solvents down the acid drain.
'''Solvent Drains'''
:Most (but not all) solvent waste use this method. The solvent drain waste is pumped to a storage tank located in the Nanofab mechanical room. The waste solvents are transported to the EH&S chemical waste processing facility.
'''Collection of Waste'''
:Always fill out the Environmental Health and Safety waste disposal form when storing waste chemicals in the appropriate cabinet.
==Disposing of Empty Acid, Base, and Solvent Bottles==
Thoroughly rinse empty acid and base bottles three times with DI water, and then place in a trashcan. Place completely empty solvent bottles in the trashcan, making sure caps are in place. The exception to this policy is empty 49% HF bottles, which should be returned to the HF storage cabinet.
=Nanofab Apparel and Gloves=
==Bunnysuits and Booties==
You must wear a full bunnysuit to enter the Nanofab (hood, coverall, shoe covers). Facial covers are optional. Change bunnysuits weekly if used often, or at least once a month if used sporadically. Store coverall and hoods on numbered hangers in the gowning room. Reserve a hanger by placing a stainless steel “hanger reserve clip” on the hanger number. Store booties in the corresponding numbered slot in the bootie storage rack. Sandals or any other open toed shoes are not allowed in the Nanofab at any time.
==Eye Protection==
ANSI-approved eye protection must be worn at all times in the Nanofab, except when using optical microscopes. All eye protection eyewear must be ANSI-approved, as indicated by the “Z87” stamp required on the eyewear. You are welcome to use personal prescription safety eyewear which is ANSI-approved. Three types of safety eyewear are stocked in the Nanofab:
#'''Uvex Astro 3000''', for use by people who do not wear vision correction glasses. These safety glasses have a black frame.
#'''Uvex Astro OTG 3001''', for use by people who do wear vision correction glasses. These safety glasses are intended to be worn over vision correction glasses, and have a blue frame.
#'''U.S. Safety Faceshield'''. This full faceshields must be worn when working with dangerous chemicals or materials. Always use a faceshield when working at the HF bench.
==Aprons and Gloves==
===General Information===
Always wear gloves when in the Nanofab. Acid aprons are required when handling HF and other highly corrosive or toxic chemicals.
===Five types of gloves are available in the Nanofab:===
{| style="font-size: 95%;" border="1" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center; font-size: 95%"
|-bgcolor=#D0E7FF
!align=center bgcolor=#D0E7FF width="75"|'''Material'''
!align=center bgcolor=#D0E7FF width="150"|'''Manufacturer/Model'''
!align=center bgcolor=#D0E7FF width="75"|'''Color'''
!align=center bgcolor=#D0E7FF width="100"|'''Thickness'''
!align=center bgcolor=#D0E7FF width="150"|'''Stocked Sizes'''
|-
|PVC||Kimtech G5 Co-Polymer||Clear||0.10mm (4 mil)||S, M, L, XL
|-
|Latex||Kimtech G3 Latex||Tan||0.20mm (8 mil)||6, 6.5, 7, 7.5, 8, 8.5, 9, 10
|-
|Nitrile||Best CleaN-Dex Ultimate||White||0.15mm (6 mil)||XS, S, M, L, XL
|-
|Nitrile||MAPA StanSolve A-30||Green||0.28mm (11 mil)||7, 8, 9, 10, 11
|-
|Blend||MAPA TRIonic E-194||Tan||0.50mm (20 mil)||6, 7, 8, 9, 10, 11
|-
|}

*'''Polyvinyl Chloride (PVC)''': Kimtech G5 Co-Polymer
:A relatively inexpensive static free general-purpose glove, poor for most organics. These gloves break down rapidly in acetone.
*'''Latex''': Kimtech G3 Latex
:A general-purpose glove, poor for most organics, okay with aldehydes and keytones.
*'''Nitrile, White''': Best CleaN-Dex Ultimate
:This thin general purpose low cost glove offers marginal protection from many keytones, okay with some acids and bases.
*'''Nitrile, Green''': MAPA StanSolve A-30
:A thicker nitrile glove that affords increased protection over the CleaN-Dex white nitrile glove.
*'''Nitrile/Neoprene/Latex Blend''': MAPA TRIonic E-194
:This glove is the standard wet processing glove. A blend of latex, neoprene, and carboxylated nitrile, which offers excellent protection from corrosives and solvents such as HF and acetone. Highly resistant to cuts, tears, and snags. Always use this glove when processing with HF, TMAH, or Bromine.

=General Nanofab Information=
==Iris Camera Access System==
The iris camera access system provides security to the Nanofab, and allows tracking of the time each user spends in the Nanofab. ALWAYS scan in when entering the lab and scan out when exiting the lab, even when attending training sessions or performing beneficial work. Violating this policy will result in a two-week suspension for the first incidence, and possible permanent suspension for recurring incidences.
==Scheduling Tool/Equipment Use and Tool Supervisors==
Tool use is scheduled in one of two ways:
#either through the web-based system “Signupmonkey” at URL: http://signupmonkey.ece.ucsb.edu
#or first come/first served
*If a tool is listed on Signupmonkey, you must obtain permission from the supervisor of the tool in order to schedule use of the tool. This is typically accomplished by attending a training session.
*Some tools are not scheduled using Signupmonkey because the cycle period is typically short and use of the tool is most efficient without using signupmonkey.
*All tools in the Nanofab have a supervisor, regardless of whether the tool is listed on Signupmonkey.
*If you have problems with any tool, please inform the supervisor either by email, or direct communication (phone, etc).
==Credit for Beneficial Work in the Nanofab==
You will receive 1.5 hours of free processing time for each hour spent performing maintenance on lab equipment, conducting training sessions, or any time spent performing work beneficial to the general operation of the lab. Please indicate time spent performing beneficial work on the sign-up sheet just inside the gowning room.
==Wet Bench Housekeeping==
Always leave wet benches clean, dry, and organized. This includes cleaning up all spills, storing glassware and chemicals, etc. If a bench is not clean when you start a task, you still have the responsibility to leave it clean. If you leave a wet bench in disarray, or leave an unlabeled container on a bench, you can be suspended from the Nanofab. Do not cover the exhaust holes on the bench tops, as this will impede the laminar flow of air through the bench and possibly expose you or other Nanofab users to toxic fumes.
==Hotplates==
Hot plates used for heating chemicals must be attended. This means you must be in the Nanofab and near the hot plat whenever it is in use. (This does not apply to PR baking hotplates on the PR spinner benches.)
==Nanofab Paper==
The only paper allowed in the lab is Nanofab type paper. We stock many different types of Nanofab paper for the lab, including photocopier (or laserwriter) paper, sticky labels, and assorted notebooks. If you require a special type of Nanofab paper, ask and we will try to obtain it. You can laminate regular paper for use in the lab. Use pens, not pencils, for writing in the lab.
==Nanofab Wipes==
We stock four types of wipes in the lab
#'''S/Pec-Wipe 3''' is a cellulose/polyester blend with high absorption but medium particle and fiber generation.
#'''Berkshire Poly1200''' is a 100% knit polyethylene wipe with low particulate generation, but also with relatively low absorption.
#'''PRO-STAT''' is a cellulose blend presaturated with isopropyl alcohol and DI water.
#'''BIOHAZ''' are used to line photoresist spinner catch cups
==Preparing Equipment for Entry into the Nanofab==
All equipment entering the lab must be clean. The procedure for cleaning equipment for entry is:
#Vacuum while equipment is outside the lab
#Wipe down all accessible surfaces with propanol or EKC "Lab Clean" using Nanofab wipes while equipment is outside the lab
#Move equipment into the lab
#Vacuum with HEPA filtered vacuum cleaner when inside the lab
==Maintenance Ways==
You may enter maintenance ways without wearing a bunnysuit from outside the Nanofab, or while wearing a bunnysuit from inside the Nanofab.
==Notes on Particle Counts in the Nanofab==
The Nanofab was surveyed with a particle counter, with generally good results. All wet bench work surfaces have extremely low particle counts, better than class 10. The open areas in the lithography area are all better than class 100, and mostly better than class 10. The remainder of the Nanofab tests better than class 1000, and often better than class 100. The Nanofab design specifications stipulated class 100 for litho, class 1000 for everything else. The Nanofab is easily meeting these specs. 

The effectiveness of facemasks was investigated by placing the particle counter directly under a person’s neck while the person moved his head back and forth. Facemasks reduced particle counts, from the equivalent of class 500 without masks to class 100 with masks. Again, this was sampling just below the neck, not at typical substrate surfaces.

The choice of wipes used in the Nanofab has a more pronounced affect on particle counts. In general, wipes trade absorbency for low particle generation. The Spec-Wipe 3 is the stocked polyester/cellulose blend, high absorbency wipe designed for use in class 100 cleanrooms. Dragging the sampling tube across the surface of a Spec-Wipe 3 resulted in a class 1000 level particle counts. The Berkshire Polx 1200 wipe is the stocked low particle count, 100% knit polyester wipe. This wipe is not as absorbent at the Spec-Wipe 3, but generates fewer particles. Dragging the sampling tube across the surface of a Berkshire Polx 1200 wipe resulted in lower than class 100 level particle counts.

To summarize, the Nanofab is meeting and exceeding design specifications for particle counts. If you would like to further reduce particles on your substrates, you may implement the following practices, in order of effectiveness:
*Use only Berkshire Polx 1200 wipes if your process requires placing your substrate on a wipe
*Use a facemask if your process requires you to work above your substrate on a table. Facemasks do not reduce particle counts on substrates in wet benches.
==Procedure for the Use and Handling of Precious Metals==
Gold, platinum, palladium, and various alloys of these metals are stocked by the UCSB Nanofab. Each research group can be issued a precious metal supply. This supply must be stored in a small lockable container, along with a log sheet for recording the use of these metals. Precious metas, the lockable security container, and log sheets will be issued by the Nanofab manager. All use of precious metals must be accurately recorded on the log sheet, and include user name, date, metal type, metal weight before use, and metal weight after use. Multiple digital scales have been acquired and placed throughout the Nanofab to facilitate weighing of these metals. When requesting additional precious metals, the completed log sheet must be presented to the Nanofab manager. Any discrepancies in recorded precious metal use will result in charges to the principle investigator corresponding to the value of the precious metal discrepancy.
=Communications and Internet Access=
==Wireless Access in the Nanofab and Couryard Café==
Currently, we have two wireless networks available to Nanofab users:
===Nanofab Wireless Access:===
The Nanofab has three access points located in the Nanofab. This network is operated by Nanofab staff, and offers anonymous access. You may connect to this network by selecting the following network and entering the password.
*network: ''nanofab''
*password: ''ece!nanofab''

===UCSB Wireless Network===
The Courtyard Café, as well as other locations on campus, provide access to the UCSB wireless network.
*'''External Users''' (Other universities or industrial users)
:Access accounts to external Nanofab user (other university or industrial users) are provided as requested by the Nanofab manager. Please contact the Nanofab manager if you would like an account.
*'''Local academic users''' (UCSB grad students, staff, etc)
:Local academic users can access the UCSB wireless network by using their UCSBNetID and password. Information regarding setup of a UCSBNetID and password: https://my.sa.ucsb.edu/U-reset/AccountManagement.aspx

=Ball Bonding, Wire Bonding, and Packaging Services=
We have established an arrangement with PLT Technology to provide various ball bonding and packaging services to UCSB Nanofab users. The service can be provided for you by PLT technology, a local Santa Barbara company, and will be invoiced to your PI through our normal Nanofab recharge system. This service is offered to both academic and industrial Nanofab researchers. A description of the services and associated rates is below. Peter Tihanyi of PLT Technology will provide the service. Peter has a high level of expertise with these processes, especially involving unique or research-type substrates and processes. If you would like to utilize Peter's services, please contact Peter by email to start the process. All equipment noted below is in-house at PLT and in good working condition.

::Peter Tihanyi 
::PLT Technology, Inc 
::420 East Haley Street 
::Santa Barbara, CA 93101 
::Phone: 805-280-1834 
::[http://www.laserdiodeservices.com www.laserdiodeservices.com] 
::pltlaser@silcom.com 

*Au wire bonding service using K&S model 4124 gold ball bonder. The charge is $120 for the setup of the system and a minimum charge of $120, which includes up to 20 Au wires bonded. Each additional set of 20 wires is $120.
*Semiconductor device soldering (laser diodes, other lasers, electronics, etc) using indium deposition on a heat sink in high vacuum (3x10-7 tore). Device placement is accomplished using a Royce model 110 pick and place station with ± 0.5um accuracy on heat sink, with flux/organics free soldering in a vacuum chamber using protective gas during the soldering process. This flux-free soldering process was developed by Peter Tihanyi for spacecraft applications. The charge for this process is $120 per hour. There is a minimum charge of 8 hours for each soldering process which includes deposition of indium, chip placement, and chip soldering. The number of devices that can be soldered at the same time depends primarily on the heat sink size. We can supply C-mounts and 9mm packages for $30 each.
*Vacuum or N2 back-fill of 9mm and TO-3 packages utilizing a POLARIS Accu-Weld 4000 tool. This tool can also be setup for other package configurations. PLT has fixtures for both 9mm and TO-3 packages. However, new fixturing will be required for other package types. The service for 9mm and TO-3 packages up to 10 pieces is $800. We can supply the package for $30 each.
*Laser diode testing for wavelengths from 400nm to 1600nm utilizing a ILX Lightwave model LPA-9084 laser diode parameter analyzer. The charge is $120 per hour for C-mount. The use of other package types is dependent on the heat sink size, but many other package types can be accommodated.
*Semiconductor substrate scribe and break service utilizing a Loomis model 100 LSD tool. The setup charge is$120, with a rate of $120 per hour.
*Lapping and polishing service utilizing a Logitech model PM2 tool. The rate is $120 per hour, with a minimum of 8 hours. Various substrate materials can be processed, including Ga and InP.

=Nanofab Summer Intern Policy =

Whenever the intern is in the Nanofab, the mentor must also be in the Nanofab. Interns may use tools that do not require training sessions, such as microscopes, etc, unless the supervisor of these tools objects. Interns can work at photolith benches, and use components of the photolith benches, unless the supervisor of the bench objects. Interns will need to follow normal Nanofab access procedures, including initiation meeting with the Nanofab manager.

Interns will be allowed to use one or two mainline Nanofab tools after completing training conducted by Nanofab staff. Mainline tools are tools scheduled through our web site signupmonkey. Certain tools will be unavailable to interns due to extremely heavy use or other concerns.

Lab Rules OLD 2018

2016-09-15T23:00:39Z

Reynolds t:

Lab Rules OLD 2018

2016-09-15T23:00:09Z

Reynolds t:

For a printable PDF version of the Lab Rules, please '''[[Media:LabRules.pdf[[File:Example.jpg]]|CLICK HERE]]'''

While working in the Nanofab, you are surrounded by dangerous and deadly chemicals, gases, high voltages, radiation, and mechanical systems. The responsibility lies with users and staff to act in a professional, courteous, and safe manner at all times while in the facility. Users violating the operating and safety rules of the facility or endangering the safety of themselves or other users will be denied further access to the facility.

This document attempts to define acceptable actions and behavior for the users of the Nanofabrication facility. However, it is impossible to define a policy for every conceivable situation. Nanofab users are expected to employ common sense and a high degree of prudence while working in this facility.

=General Nanofabrication Facility Safety Policies=
==Visual and Audible Alarms in the Nanofab==
#'''Fire Alarm''': White strobe with high volume audible alarm, located throughout the Nanofab. If this alarm activates, immediately leave the Nanofab through the nearest exit. Do not remove bunnysuit until outside.
#'''Toxic Gas Alarm''': Blue strobe with high volume audible alarm, located at both ends of each bay. If this alarm activates in one bay, do not enter the bay. If this alarm activates throughout the Nanofab, immediately leave the Nanofab through the nearest exit. Do not remove bunnysuit until outside.
#'''Wet Bench Alarms''': Small illuminated visual alarms with buzzers. Each wet bench may have multiple alarms, with a placard beside the alarms indicating meaning of alarm and proper response. You must follow proper response if you see or hear a wet bench alarm.
#'''Equipment Alarms''': Please notify supervisor of tool if equipment alarm is activated.
==Emergencies and First Aid==
If you believe you may have been exposed to a toxic substance or gas, if appropriate rinse in the emergency shower. In all cases, quickly go to the emergency room at Goleta Valley Hospital. Emergency showers and eye wash stations are located at the south end of all bays. An enclosed emergency showers is located in bay 5 beside the wet etch benches. A first aid kit is located in the gowning room, and on the south wall at the end of bays 2, 4, and 6. Chemical spill clean-up kits are located on the wire shelving in each bay containing a wet bench. After using a spill cleanup kit, please inform the Nanofab manager. Fire extinguishers are located on the south end of each clean bay, and the north end of each maintenance chase.
==Hydrofluoric Acid (HF) Exposure==
===HF Exposure to Skin===
#Immediately rinse exposed area for 5 minutes in safety shower, flush affected area thoroughly. Speed and thoroughness in washing off the acid is of primary importance. An enclosed emergency showers is located in bay 5 across from the HF/TMAH wet processing bench. If using the emergency shower at the end of the bay, water will spill onto floor of Nanofab - this is OK.
#Immediately after rinsing, start massaging 2.5% calcium gluconate gel into the affected area. The individual applying the gel should wear gloves. Apply gel frequently and massage continuously. Calcium gluconate gel is located to the left of the HF bench in a pocket mounted to the side of the bench.
#Seek immediate medical attention by calling 9-911.
#Continue rubbing gel on affected area until advised otherwise by physician.
===HF Exposure to Eyes===
#Immediately rinse exposed area for 15 minutes at eye wash station. Hold eyelids open during irrigation to allow thorough flushing of the eyes. Water will spill onto floor of Nanofab - this is OK.
#Seek immediate medical attention by calling 9-911.
==TetraMethylAmmonium Hydroxide (TMAH) Exposure==
TMAH is a component in several photoresist developers and strippers, and is also used in the Nanofab as an ebeam resist developer and silicon etchant. The concentration of TMAH in photoresist developer and stripper solutions is relatively low (2-4%). However, the ebeam developer and silicon etchant utilize a solution of 25% TMAH.
===TMAH Exposure to Skin, 25% Concentration===
#Immediately rinse exposed area for at least 15 minutes in safety shower, flush affected area thoroughly. An enclosed emergency showers is located in bay 5 across from the HF/TMAH wet etch bench. If using the emergency shower at the end of the bay, water will spill onto floor of Nanofab - this is OK.
#Seek immediate medical attention by calling 9-911
===TMAH Exposure to Skin, 2%-4%Concentration===
#If small area skin exposure (<1% body surface area, <approximately 25 inches2) to 2-4% TMAH, immediately rinse exposed area until skin feels normal (not greasy). If irritation occurs, consult a physician.
#If medium to large area skin exposure (>1% body surface area, >approximately 25 inches2) to 2-4% TMAH, immediately rinse exposed area for at least 15 minutes in safety shower, flush affected area thoroughly. An enclosed emergency showers is located in bay 5 across from the HF/TMAH wet etch bench. If using the emergency shower at the end of the bay, water will spill onto floor of Nanofab - this is OK. Seek immediate medical attention by calling 9-911.
===TMAH Exposure to Eyes, Any Concentration===
#Immediately rinse exposed area for at least 15 minutes at eye wash station. Hold eyelids open during irrigation to allow thorough flushing of the eyes. Water will spill onto floor of Nanofab - this is OK.
#Seek immediate medical attention by calling 9-911
==Pregnancy and the Nanofab==
The effects on a fetus of many of the chemicals utilized in the Nanfab is unknown. The Nanofab is designed to prevent exposure to the fumes and vapors from these chemicals, but absolute 100% containment is impossible, and it is possible to be exposed to extremely small concentrations of these materials. Consequently, we strongly recommend that you do not work in the Nanofab if you know or suspect that you are pregnant.
=Chemicals and Hazardous Materials the Nanofab=
==[[MSDS]]==
The MSDS contains safety information regarding exposure, first aid, handling, storage, fire hazard, etc., for all chemicals, gases, and materials present in the facility. Before using an unfamiliar material, consult the MSDS to determine any potential hazards. Consult the MSDS to determine the proper course of action if someone has been exposed to a gas or chemical, or a spill has occurred. A book containing the MSDS for any material used in the Nanofab is located just inside the gowning room. Additionally, an electronic version of the MDSD in .pdf format for all chemicals in our inventory is located on the desktops of all the computers connected to microscopes in the Nanofab.
==Introducing New Materials Into the Nanofab==
All new chemicals, compounds, gases, materials for evaporation, etc., must be approved by the Nanofab manager before introduction into the facility. In order to introduce a new material into the Nanofab, a MSDS (Material Safety Data Sheet) for the material in .pdf format must be submitted to the Nanofab manager, plus a description of the proposed process utilizing the new material. The description of the process should include the goals of the process, and the mechanics of the process in reasonable detail. The Nanofab manager will determine if the material will be allowed in the Nanofab, and if so, where the new material will be stored, where the material is to be used (typically a specific wet bench), and how to dispose of the waste.
==Containers and Labeling==
Chemical containers such as beakers, bottles, etc, must be labeled with contents, date, and ownership (individual or group name). This information can be written on a wipe under the container. The exceptions to this policy are as follows:
#A beaker in use on a solvent bench can contain acetone, propanol, or methanol if the beaker is labeled with the text: “acetone/propanol/methanol”. The generic label “solvent” is insufficient. Beakers containing solvents other that acetone, propanol, or methanol must be labeled with the specific solvent.
#Indication of date is no longer required on beakers in use on solvent benches. All beakers in use on solvent benches must be labeled with contents and ownership.
#Beakers in use at lithography developer benches must be labeled with exact contents and ownership (individual or group name). The generic label “developer” is insufficient.
#Indication of date is no longer required on beakers in use on the developer benches. All beakers in use on developer benches must be labeled with contents and ownership.
==Chemical Storage==
*'''Acid Storage'''
:The primary acid storage area (except HF) is the acid cabinet located next to the acid wet processing benches in bay 5. HF acid is stored in the HF cabinet
*'''Base Storage'''
:The primary base storage area is the base cabinet located next to the acid wet processing bench.
*'''Solvent Storage'''
:The primary solvent storage area is the stainless steel flammables cabinet in bay 6. You may store small amounts of solvents in labeled containers on the shelves in the photolith area.
==Solvent Processing==
Solvents with flashpoints below 55 deg C cannot be heated in the Nanofab. This includes acetone, methanol, isopropanol, ethanol, and toluene. All solvent processing is limited to the stainless steel solvent processing benches. Do not perform standard solvent processing at the photoresist spinner benches.
==Wet Etch and HF/TMAH Processing==
All wet processing involving acids and bases (except HF and TMAH) is limited to the acid/base benches. All HF and Bromine processing is limited to the HF or HF/TMAH benches - NO EXCEPTIONS. All TMAH processing is limited to the HF/TMAH bench. When working at the HF or HF/TMAH benches, always wear a chemical apron, face shield, and “Trionic” gloves. Store all HF and bromine in labeled containers in the HF acid/bromine storage cabinet. Store TMAH is the base storage cabinet. Please keep open containers of these two toxic chemicals away from the edge of the bench. All waste solutions containing any HF is poured down the drain, and treated in the Nanofab acid treatment system. Empty HF bottles should be returned to the HF acid storage cabinet. You may not deviate from this policy unless you have prior approval by the Nanofab manager.
==Photoresist Coating or Spinning==
Standard solvent-based photoresist spinning should be perfomed at the PR spinner benches. Some lithography chemicals utilize non-standard chemicals in place of solvents, which may require spinning at a different bench. If using a non-standard lithography chemicals, please provide the MSDS and process instructions to the laboratory manager for direction in this matter.
==Developer Benches==
Developer benches are used for developing photoresists only. In general, solvents are not allowed at the developer benches because solvent fumes adversely affect the develop process. Solvent based liftoff processes are not allowed at the developer benches E-beam develop processes may utilize solvents, and should be performed at the solvent benches in the photolith area.
==Plating Bench==
The Solvent/Plating bench contains cyanide-based plating and etching solutions. Never use acid solutions at this bench.
==Photoresist Storage, Handling, and Waste==
Photoresists can contain many solvents and aromatics that are potentially toxic. Special care must be exercised when handling these materials. All photoresist fumes must be exhausted or otherwise contained through careful procedures at the photolith wet benches. The primary photoresist storage area is the lab refrigerator located bay 6. Some resists do not need refrigeration and are stored in the flammables cabinet next to the refrigerator (PMGI, PMMA, etc). Before transferring refrigerated PR from the main bottle to your in-use bottle, place main bottle on designated photoresist warming racks for a minimum of 2 hours, or until the bottle is at room temperature, whichever is longer. Large transfer pipettes are provided for transferring PR from the main bottle to your in-use bottle. To prevent PR flakes from contaminating the main bottle, please inspect the main bottle cap and bottle threads for PR, and remove any PR with an acetone wipe before replacing cap. After transfer, place main bottle back in the refrigerator. You may store your in-use, fully labeled PR bottle in the stainless steel PR storage cabinet in a bin labeled with your research group name. Disposable droppers, syringes, and filters are provided for the application of photoresist on your substrate. You may store photoresist in the PR storage cabinet for a maximum of 6 months. Nanofab staff will remove in-use PR bottles older than 6 months, and will also remove any bottle not correctly labeled with contents, date, and ownership. Nanofab wipes and pipettes contaminated with PR must be placed in the beakers at the back of the spinner benches. Do not place PR contaminated materials in the trashcans, as this will allow photoresist fumes to migrate throughout the photolith area. Dispose of waste photoresist bottles by placing your labeled bottle in the yellow solvent waste cabinet in chase 5.
==Photoresist Strippers==
Use of heated strippers is limited to the stainless steel solvent benches. It is recommended you use the heated water bath to heat your stripper to 80 C. If you choose to use a hot plate to heat commercial photoresist strippers, we realize the hot plate surface temperature will need to be set above 80 C. Ideally, you should use a temperature probe inserted in the liquid as the feedback control for the hot plate. If you have the hot plate surface temperature set above 80 C, you must actively monitor the temperature of the stripper using a thermometer (or equivalent) and limit the stripper temperature to a maximum of 80 degrees C. You must be in the vicinity of the hotplate whenever you are heating strippers with the hot plate surface set above 80 degrees C if you are not using a temperature probe for feedback control of the hot plate.
'''The following photoresist strippers are stocked:'''
*Shipley 1165
*AZ 300T
*Shipley SVC-14
*PRX-127
==Chemical Waste Disposal==
===General Guidelines===
#The correct method of disposal for any chemical waste in our inventory is posted throughout the Nanofab, and also indicated in a file titled “Nanofab Chemical Storage/Use/Disposal”, located on the desktops of all optical microscope computers in the Nanofab.
#'''DO NOT DISPOSE OF SOLVENTS IN THE ACID DRAIN, OR ACIDS AND BASES IN THE SOLVENT DRAINS DUE TO POSSIBLE EXPLOSION OR THE CREATION OF OTHER HAZARDOUS SITUATIONS.'''
===All chemical waste is disposed in one of three methods:===
'''Acid Drains'''
:Most (but not all) water-based chemicals use this method. The acid drain empties into a waste chemical pH neutralization system located in the Nanofab mechanical room. This is the primary drain in the Nanofab. All liquids entering the sink drain at any polypropylene wet bench in the Nanofab run through this treatment system.

:To dispose of an acid or base, pour the liquid down the drain using the plenum flush. If you spill an acid or base onto the top surface of a bench, first rinse the surface thoroughly with water, then turn on the plenum flush to rinse the bench drain. Do not pour solvents down the acid drain.
'''Solvent Drains'''
:Most (but not all) solvent waste use this method. The solvent drain waste is pumped to a storage tank located in the Nanofab mechanical room. The waste solvents are transported to the EH&S chemical waste processing facility.
'''Collection of Waste'''
:Always fill out the Environmental Health and Safety waste disposal form when storing waste chemicals in the appropriate cabinet.
==Disposing of Empty Acid, Base, and Solvent Bottles==
Thoroughly rinse empty acid and base bottles three times with DI water, and then place in a trashcan. Place completely empty solvent bottles in the trashcan, making sure caps are in place. The exception to this policy is empty 49% HF bottles, which should be returned to the HF storage cabinet.
=Nanofab Apparel and Gloves=
==Bunnysuits and Booties==
You must wear a full bunnysuit to enter the Nanofab (hood, coverall, shoe covers). Facial covers are optional. Change bunnysuits weekly if used often, or at least once a month if used sporadically. Store coverall and hoods on numbered hangers in the gowning room. Reserve a hanger by placing a stainless steel “hanger reserve clip” on the hanger number. Store booties in the corresponding numbered slot in the bootie storage rack. Sandals or any other open toed shoes are not allowed in the Nanofab at any time.
==Eye Protection==
ANSI-approved eye protection must be worn at all times in the Nanofab, except when using optical microscopes. All eye protection eyewear must be ANSI-approved, as indicated by the “Z87” stamp required on the eyewear. You are welcome to use personal prescription safety eyewear which is ANSI-approved. Three types of safety eyewear are stocked in the Nanofab:
#'''Uvex Astro 3000''', for use by people who do not wear vision correction glasses. These safety glasses have a black frame.
#'''Uvex Astro OTG 3001''', for use by people who do wear vision correction glasses. These safety glasses are intended to be worn over vision correction glasses, and have a blue frame.
#'''U.S. Safety Faceshield'''. This full faceshields must be worn when working with dangerous chemicals or materials. Always use a faceshield when working at the HF bench.
==Aprons and Gloves==
===General Information===
Always wear gloves when in the Nanofab. Acid aprons are required when handling HF and other highly corrosive or toxic chemicals.
===Five types of gloves are available in the Nanofab:===
{| style="font-size: 95%;" border="1" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center; font-size: 95%"
|-bgcolor=#D0E7FF
!align=center bgcolor=#D0E7FF width="75"|'''Material'''
!align=center bgcolor=#D0E7FF width="150"|'''Manufacturer/Model'''
!align=center bgcolor=#D0E7FF width="75"|'''Color'''
!align=center bgcolor=#D0E7FF width="100"|'''Thickness'''
!align=center bgcolor=#D0E7FF width="150"|'''Stocked Sizes'''
|-
|PVC||Kimtech G5 Co-Polymer||Clear||0.10mm (4 mil)||S, M, L, XL
|-
|Latex||Kimtech G3 Latex||Tan||0.20mm (8 mil)||6, 6.5, 7, 7.5, 8, 8.5, 9, 10
|-
|Nitrile||Best CleaN-Dex Ultimate||White||0.15mm (6 mil)||XS, S, M, L, XL
|-
|Nitrile||MAPA StanSolve A-30||Green||0.28mm (11 mil)||7, 8, 9, 10, 11
|-
|Blend||MAPA TRIonic E-194||Tan||0.50mm (20 mil)||6, 7, 8, 9, 10, 11
|-
|}

*'''Polyvinyl Chloride (PVC)''': Kimtech G5 Co-Polymer
:A relatively inexpensive static free general-purpose glove, poor for most organics. These gloves break down rapidly in acetone.
*'''Latex''': Kimtech G3 Latex
:A general-purpose glove, poor for most organics, okay with aldehydes and keytones.
*'''Nitrile, White''': Best CleaN-Dex Ultimate
:This thin general purpose low cost glove offers marginal protection from many keytones, okay with some acids and bases.
*'''Nitrile, Green''': MAPA StanSolve A-30
:A thicker nitrile glove that affords increased protection over the CleaN-Dex white nitrile glove.
*'''Nitrile/Neoprene/Latex Blend''': MAPA TRIonic E-194
:This glove is the standard wet processing glove. A blend of latex, neoprene, and carboxylated nitrile, which offers excellent protection from corrosives and solvents such as HF and acetone. Highly resistant to cuts, tears, and snags. Always use this glove when processing with HF, TMAH, or Bromine.

=General Nanofab Information=
==Iris Camera Access System==
The iris camera access system provides security to the Nanofab, and allows tracking of the time each user spends in the Nanofab. ALWAYS scan in when entering the lab and scan out when exiting the lab, even when attending training sessions or performing beneficial work. Violating this policy will result in a two-week suspension for the first incidence, and possible permanent suspension for recurring incidences.
==Scheduling Tool/Equipment Use and Tool Supervisors==
Tool use is scheduled in one of two ways:
#either through the web-based system “Signupmonkey” at URL: http://signupmonkey.ece.ucsb.edu
#or first come/first served
*If a tool is listed on Signupmonkey, you must obtain permission from the supervisor of the tool in order to schedule use of the tool. This is typically accomplished by attending a training session.
*Some tools are not scheduled using Signupmonkey because the cycle period is typically short and use of the tool is most efficient without using signupmonkey.
*All tools in the Nanofab have a supervisor, regardless of whether the tool is listed on Signupmonkey.
*If you have problems with any tool, please inform the supervisor either by email, or direct communication (phone, etc).
==Credit for Beneficial Work in the Nanofab==
You will receive 1.5 hours of free processing time for each hour spent performing maintenance on lab equipment, conducting training sessions, or any time spent performing work beneficial to the general operation of the lab. Please indicate time spent performing beneficial work on the sign-up sheet just inside the gowning room.
==Wet Bench Housekeeping==
Always leave wet benches clean, dry, and organized. This includes cleaning up all spills, storing glassware and chemicals, etc. If a bench is not clean when you start a task, you still have the responsibility to leave it clean. If you leave a wet bench in disarray, or leave an unlabeled container on a bench, you can be suspended from the Nanofab. Do not cover the exhaust holes on the bench tops, as this will impede the laminar flow of air through the bench and possibly expose you or other Nanofab users to toxic fumes.
==Hotplates==
Hot plates used for heating chemicals must be attended. This means you must be in the Nanofab and near the hot plat whenever it is in use. (This does not apply to PR baking hotplates on the PR spinner benches.)
==Nanofab Paper==
The only paper allowed in the lab is Nanofab type paper. We stock many different types of Nanofab paper for the lab, including photocopier (or laserwriter) paper, sticky labels, and assorted notebooks. If you require a special type of Nanofab paper, ask and we will try to obtain it. You can laminate regular paper for use in the lab. Use pens, not pencils, for writing in the lab.
==Nanofab Wipes==
We stock four types of wipes in the lab
#'''S/Pec-Wipe 3''' is a cellulose/polyester blend with high absorption but medium particle and fiber generation.
#'''Berkshire Poly1200''' is a 100% knit polyethylene wipe with low particulate generation, but also with relatively low absorption.
#'''PRO-STAT''' is a cellulose blend presaturated with isopropyl alcohol and DI water.
#'''BIOHAZ''' are used to line photoresist spinner catch cups
==Preparing Equipment for Entry into the Nanofab==
All equipment entering the lab must be clean. The procedure for cleaning equipment for entry is:
#Vacuum while equipment is outside the lab
#Wipe down all accessible surfaces with propanol or EKC "Lab Clean" using Nanofab wipes while equipment is outside the lab
#Move equipment into the lab
#Vacuum with HEPA filtered vacuum cleaner when inside the lab
==Maintenance Ways==
You may enter maintenance ways without wearing a bunnysuit from outside the Nanofab, or while wearing a bunnysuit from inside the Nanofab.
==Notes on Particle Counts in the Nanofab==
The Nanofab was surveyed with a particle counter, with generally good results. All wet bench work surfaces have extremely low particle counts, better than class 10. The open areas in the lithography area are all better than class 100, and mostly better than class 10. The remainder of the Nanofab tests better than class 1000, and often better than class 100. The Nanofab design specifications stipulated class 100 for litho, class 1000 for everything else. The Nanofab is easily meeting these specs. 

The effectiveness of facemasks was investigated by placing the particle counter directly under a person’s neck while the person moved his head back and forth. Facemasks reduced particle counts, from the equivalent of class 500 without masks to class 100 with masks. Again, this was sampling just below the neck, not at typical substrate surfaces.

The choice of wipes used in the Nanofab has a more pronounced affect on particle counts. In general, wipes trade absorbency for low particle generation. The Spec-Wipe 3 is the stocked polyester/cellulose blend, high absorbency wipe designed for use in class 100 cleanrooms. Dragging the sampling tube across the surface of a Spec-Wipe 3 resulted in a class 1000 level particle counts. The Berkshire Polx 1200 wipe is the stocked low particle count, 100% knit polyester wipe. This wipe is not as absorbent at the Spec-Wipe 3, but generates fewer particles. Dragging the sampling tube across the surface of a Berkshire Polx 1200 wipe resulted in lower than class 100 level particle counts.

To summarize, the Nanofab is meeting and exceeding design specifications for particle counts. If you would like to further reduce particles on your substrates, you may implement the following practices, in order of effectiveness:
*Use only Berkshire Polx 1200 wipes if your process requires placing your substrate on a wipe
*Use a facemask if your process requires you to work above your substrate on a table. Facemasks do not reduce particle counts on substrates in wet benches.
==Procedure for the Use and Handling of Precious Metals==
Gold, platinum, palladium, and various alloys of these metals are stocked by the UCSB Nanofab. Each research group can be issued a precious metal supply. This supply must be stored in a small lockable container, along with a log sheet for recording the use of these metals. Precious metas, the lockable security container, and log sheets will be issued by the Nanofab manager. All use of precious metals must be accurately recorded on the log sheet, and include user name, date, metal type, metal weight before use, and metal weight after use. Multiple digital scales have been acquired and placed throughout the Nanofab to facilitate weighing of these metals. When requesting additional precious metals, the completed log sheet must be presented to the Nanofab manager. Any discrepancies in recorded precious metal use will result in charges to the principle investigator corresponding to the value of the precious metal discrepancy.
=Communications and Internet Access=
==Wireless Access in the Nanofab and Couryard Café==
Currently, we have two wireless networks available to Nanofab users:
===Nanofab Wireless Access:===
The Nanofab has three access points located in the Nanofab. This network is operated by Nanofab staff, and offers anonymous access. You may connect to this network by selecting the following network and entering the password.
*network: ''nanofab''
*password: ''ece!nanofab''

===UCSB Wireless Network===
The Courtyard Café, as well as other locations on campus, provide access to the UCSB wireless network.
*'''External Users''' (Other universities or industrial users)
:Access accounts to external Nanofab user (other university or industrial users) are provided as requested by the Nanofab manager. Please contact the Nanofab manager if you would like an account.
*'''Local academic users''' (UCSB grad students, staff, etc)
:Local academic users can access the UCSB wireless network by using their UCSBNetID and password. Information regarding setup of a UCSBNetID and password: https://my.sa.ucsb.edu/U-reset/AccountManagement.aspx

=Ball Bonding, Wire Bonding, and Packaging Services=
We have established an arrangement with PLT Technology to provide various ball bonding and packaging services to UCSB Nanofab users. The service can be provided for you by PLT technology, a local Santa Barbara company, and will be invoiced to your PI through our normal Nanofab recharge system. This service is offered to both academic and industrial Nanofab researchers. A description of the services and associated rates is below. Peter Tihanyi of PLT Technology will provide the service. Peter has a high level of expertise with these processes, especially involving unique or research-type substrates and processes. If you would like to utilize Peter's services, please contact Peter by email to start the process. All equipment noted below is in-house at PLT and in good working condition.

::Peter Tihanyi 
::PLT Technology, Inc 
::420 East Haley Street 
::Santa Barbara, CA 93101 
::Phone: 805-280-1834 
::[http://www.laserdiodeservices.com www.laserdiodeservices.com] 
::pltlaser@silcom.com 

*Au wire bonding service using K&S model 4124 gold ball bonder. The charge is $120 for the setup of the system and a minimum charge of $120, which includes up to 20 Au wires bonded. Each additional set of 20 wires is $120.
*Semiconductor device soldering (laser diodes, other lasers, electronics, etc) using indium deposition on a heat sink in high vacuum (3x10-7 tore). Device placement is accomplished using a Royce model 110 pick and place station with ± 0.5um accuracy on heat sink, with flux/organics free soldering in a vacuum chamber using protective gas during the soldering process. This flux-free soldering process was developed by Peter Tihanyi for spacecraft applications. The charge for this process is $120 per hour. There is a minimum charge of 8 hours for each soldering process which includes deposition of indium, chip placement, and chip soldering. The number of devices that can be soldered at the same time depends primarily on the heat sink size. We can supply C-mounts and 9mm packages for $30 each.
*Vacuum or N2 back-fill of 9mm and TO-3 packages utilizing a POLARIS Accu-Weld 4000 tool. This tool can also be setup for other package configurations. PLT has fixtures for both 9mm and TO-3 packages. However, new fixturing will be required for other package types. The service for 9mm and TO-3 packages up to 10 pieces is $800. We can supply the package for $30 each.
*Laser diode testing for wavelengths from 400nm to 1600nm utilizing a ILX Lightwave model LPA-9084 laser diode parameter analyzer. The charge is $120 per hour for C-mount. The use of other package types is dependent on the heat sink size, but many other package types can be accommodated.
*Semiconductor substrate scribe and break service utilizing a Loomis model 100 LSD tool. The setup charge is$120, with a rate of $120 per hour.
*Lapping and polishing service utilizing a Logitech model PM2 tool. The rate is $120 per hour, with a minimum of 8 hours. Various substrate materials can be processed, including Ga and InP.

=Nanofab Summer Intern Policy =

Whenever the intern is in the Nanofab, the mentor must also be in the Nanofab. Interns may use tools that do not require training sessions, such as microscopes, etc, unless the supervisor of these tools objects. Interns can work at photolith benches, and use components of the photolith benches, unless the supervisor of the bench objects. Interns will need to follow normal Nanofab access procedures, including initiation meeting with the Nanofab manager.

Interns will be allowed to use one or two mainline Nanofab tools after completing training conducted by Nanofab staff. Mainline tools are tools scheduled through our web site signupmonkey. Certain tools will be unavailable to interns due to extremely heavy use or other concerns.

Lab Rules OLD 2018

2016-09-15T22:27:22Z

Reynolds t:

Lab Rules OLD 2018

2016-09-15T22:22:43Z

Reynolds t: /* Fostering SEI Research at NNIN  */

For a printable PDF version of the Lab Rules, please '''[[Media:LabRules.pdf|CLICK HERE]]'''

While working in the Nanofab, you are surrounded by dangerous and deadly chemicals, gases, high voltages, radiation, and mechanical systems. The responsibility lies with users and staff to act in a professional, courteous, and safe manner at all times while in the facility. Users violating the operating and safety rules of the facility or endangering the safety of themselves or other users will be denied further access to the facility.

This document attempts to define acceptable actions and behavior for the users of the Nanofabrication facility. However, it is impossible to define a policy for every conceivable situation. Nanofab users are expected to employ common sense and a high degree of prudence while working in this facility.

=General Nanofabrication Facility Safety Policies=
==Visual and Audible Alarms in the Nanofab==
#'''Fire Alarm''': White strobe with high volume audible alarm, located throughout the Nanofab. If this alarm activates, immediately leave the Nanofab through the nearest exit. Do not remove bunnysuit until outside.
#'''Toxic Gas Alarm''': Blue strobe with high volume audible alarm, located at both ends of each bay. If this alarm activates in one bay, do not enter the bay. If this alarm activates throughout the Nanofab, immediately leave the Nanofab through the nearest exit. Do not remove bunnysuit until outside.
#'''Wet Bench Alarms''': Small illuminated visual alarms with buzzers. Each wet bench may have multiple alarms, with a placard beside the alarms indicating meaning of alarm and proper response. You must follow proper response if you see or hear a wet bench alarm.
#'''Equipment Alarms''': Please notify supervisor of tool if equipment alarm is activated.
==Emergencies and First Aid==
If you believe you may have been exposed to a toxic substance or gas, if appropriate rinse in the emergency shower. In all cases, quickly go to the emergency room at Goleta Valley Hospital. Emergency showers and eye wash stations are located at the south end of all bays. An enclosed emergency showers is located in bay 5 beside the wet etch benches. A first aid kit is located in the gowning room, and on the south wall at the end of bays 2, 4, and 6. Chemical spill clean-up kits are located on the wire shelving in each bay containing a wet bench. After using a spill cleanup kit, please inform the Nanofab manager. Fire extinguishers are located on the south end of each clean bay, and the north end of each maintenance chase.
==Hydrofluoric Acid (HF) Exposure==
===HF Exposure to Skin===
#Immediately rinse exposed area for 5 minutes in safety shower, flush affected area thoroughly. Speed and thoroughness in washing off the acid is of primary importance. An enclosed emergency showers is located in bay 5 across from the HF/TMAH wet processing bench. If using the emergency shower at the end of the bay, water will spill onto floor of Nanofab - this is OK.
#Immediately after rinsing, start massaging 2.5% calcium gluconate gel into the affected area. The individual applying the gel should wear gloves. Apply gel frequently and massage continuously. Calcium gluconate gel is located to the left of the HF bench in a pocket mounted to the side of the bench.
#Seek immediate medical attention by calling 9-911.
#Continue rubbing gel on affected area until advised otherwise by physician.
===HF Exposure to Eyes===
#Immediately rinse exposed area for 15 minutes at eye wash station. Hold eyelids open during irrigation to allow thorough flushing of the eyes. Water will spill onto floor of Nanofab - this is OK.
#Seek immediate medical attention by calling 9-911.
==TetraMethylAmmonium Hydroxide (TMAH) Exposure==
TMAH is a component in several photoresist developers and strippers, and is also used in the Nanofab as an ebeam resist developer and silicon etchant. The concentration of TMAH in photoresist developer and stripper solutions is relatively low (2-4%). However, the ebeam developer and silicon etchant utilize a solution of 25% TMAH.
===TMAH Exposure to Skin, 25% Concentration===
#Immediately rinse exposed area for at least 15 minutes in safety shower, flush affected area thoroughly. An enclosed emergency showers is located in bay 5 across from the HF/TMAH wet etch bench. If using the emergency shower at the end of the bay, water will spill onto floor of Nanofab - this is OK.
#Seek immediate medical attention by calling 9-911
===TMAH Exposure to Skin, 2%-4%Concentration===
#If small area skin exposure (<1% body surface area, <approximately 25 inches2) to 2-4% TMAH, immediately rinse exposed area until skin feels normal (not greasy). If irritation occurs, consult a physician.
#If medium to large area skin exposure (>1% body surface area, >approximately 25 inches2) to 2-4% TMAH, immediately rinse exposed area for at least 15 minutes in safety shower, flush affected area thoroughly. An enclosed emergency showers is located in bay 5 across from the HF/TMAH wet etch bench. If using the emergency shower at the end of the bay, water will spill onto floor of Nanofab - this is OK. Seek immediate medical attention by calling 9-911.
===TMAH Exposure to Eyes, Any Concentration===
#Immediately rinse exposed area for at least 15 minutes at eye wash station. Hold eyelids open during irrigation to allow thorough flushing of the eyes. Water will spill onto floor of Nanofab - this is OK.
#Seek immediate medical attention by calling 9-911
==Pregnancy and the Nanofab==
The effects on a fetus of many of the chemicals utilized in the Nanfab is unknown. The Nanofab is designed to prevent exposure to the fumes and vapors from these chemicals, but absolute 100% containment is impossible, and it is possible to be exposed to extremely small concentrations of these materials. Consequently, we strongly recommend that you do not work in the Nanofab if you know or suspect that you are pregnant.
=Chemicals and Hazardous Materials the Nanofab=
==[[MSDS]]==
The MSDS contains safety information regarding exposure, first aid, handling, storage, fire hazard, etc., for all chemicals, gases, and materials present in the facility. Before using an unfamiliar material, consult the MSDS to determine any potential hazards. Consult the MSDS to determine the proper course of action if someone has been exposed to a gas or chemical, or a spill has occurred. A book containing the MSDS for any material used in the Nanofab is located just inside the gowning room. Additionally, an electronic version of the MDSD in .pdf format for all chemicals in our inventory is located on the desktops of all the computers connected to microscopes in the Nanofab.
==Introducing New Materials Into the Nanofab==
All new chemicals, compounds, gases, materials for evaporation, etc., must be approved by the Nanofab manager before introduction into the facility. In order to introduce a new material into the Nanofab, a MSDS (Material Safety Data Sheet) for the material in .pdf format must be submitted to the Nanofab manager, plus a description of the proposed process utilizing the new material. The description of the process should include the goals of the process, and the mechanics of the process in reasonable detail. The Nanofab manager will determine if the material will be allowed in the Nanofab, and if so, where the new material will be stored, where the material is to be used (typically a specific wet bench), and how to dispose of the waste.
==Containers and Labeling==
Chemical containers such as beakers, bottles, etc, must be labeled with contents, date, and ownership (individual or group name). This information can be written on a wipe under the container. The exceptions to this policy are as follows:
#A beaker in use on a solvent bench can contain acetone, propanol, or methanol if the beaker is labeled with the text: “acetone/propanol/methanol”. The generic label “solvent” is insufficient. Beakers containing solvents other that acetone, propanol, or methanol must be labeled with the specific solvent.
#Indication of date is no longer required on beakers in use on solvent benches. All beakers in use on solvent benches must be labeled with contents and ownership.
#Beakers in use at lithography developer benches must be labeled with exact contents and ownership (individual or group name). The generic label “developer” is insufficient.
#Indication of date is no longer required on beakers in use on the developer benches. All beakers in use on developer benches must be labeled with contents and ownership.
==Chemical Storage==
*'''Acid Storage'''
:The primary acid storage area (except HF) is the acid cabinet located next to the acid wet processing benches in bay 5. HF acid is stored in the HF cabinet
*'''Base Storage'''
:The primary base storage area is the base cabinet located next to the acid wet processing bench.
*'''Solvent Storage'''
:The primary solvent storage area is the stainless steel flammables cabinet in bay 6. You may store small amounts of solvents in labeled containers on the shelves in the photolith area.
==Solvent Processing==
Solvents with flashpoints below 55 deg C cannot be heated in the Nanofab. This includes acetone, methanol, isopropanol, ethanol, and toluene. All solvent processing is limited to the stainless steel solvent processing benches. Do not perform standard solvent processing at the photoresist spinner benches.
==Wet Etch and HF/TMAH Processing==
All wet processing involving acids and bases (except HF and TMAH) is limited to the acid/base benches. All HF and Bromine processing is limited to the HF or HF/TMAH benches - NO EXCEPTIONS. All TMAH processing is limited to the HF/TMAH bench. When working at the HF or HF/TMAH benches, always wear a chemical apron, face shield, and “Trionic” gloves. Store all HF and bromine in labeled containers in the HF acid/bromine storage cabinet. Store TMAH is the base storage cabinet. Please keep open containers of these two toxic chemicals away from the edge of the bench. All waste solutions containing any HF is poured down the drain, and treated in the Nanofab acid treatment system. Empty HF bottles should be returned to the HF acid storage cabinet. You may not deviate from this policy unless you have prior approval by the Nanofab manager.
==Photoresist Coating or Spinning==
Standard solvent-based photoresist spinning should be perfomed at the PR spinner benches. Some lithography chemicals utilize non-standard chemicals in place of solvents, which may require spinning at a different bench. If using a non-standard lithography chemicals, please provide the MSDS and process instructions to the laboratory manager for direction in this matter.
==Developer Benches==
Developer benches are used for developing photoresists only. In general, solvents are not allowed at the developer benches because solvent fumes adversely affect the develop process. Solvent based liftoff processes are not allowed at the developer benches E-beam develop processes may utilize solvents, and should be performed at the solvent benches in the photolith area.
==Plating Bench==
The Solvent/Plating bench contains cyanide-based plating and etching solutions. Never use acid solutions at this bench.
==Photoresist Storage, Handling, and Waste==
Photoresists can contain many solvents and aromatics that are potentially toxic. Special care must be exercised when handling these materials. All photoresist fumes must be exhausted or otherwise contained through careful procedures at the photolith wet benches. The primary photoresist storage area is the lab refrigerator located bay 6. Some resists do not need refrigeration and are stored in the flammables cabinet next to the refrigerator (PMGI, PMMA, etc). Before transferring refrigerated PR from the main bottle to your in-use bottle, place main bottle on designated photoresist warming racks for a minimum of 2 hours, or until the bottle is at room temperature, whichever is longer. Large transfer pipettes are provided for transferring PR from the main bottle to your in-use bottle. To prevent PR flakes from contaminating the main bottle, please inspect the main bottle cap and bottle threads for PR, and remove any PR with an acetone wipe before replacing cap. After transfer, place main bottle back in the refrigerator. You may store your in-use, fully labeled PR bottle in the stainless steel PR storage cabinet in a bin labeled with your research group name. Disposable droppers, syringes, and filters are provided for the application of photoresist on your substrate. You may store photoresist in the PR storage cabinet for a maximum of 6 months. Nanofab staff will remove in-use PR bottles older than 6 months, and will also remove any bottle not correctly labeled with contents, date, and ownership. Nanofab wipes and pipettes contaminated with PR must be placed in the beakers at the back of the spinner benches. Do not place PR contaminated materials in the trashcans, as this will allow photoresist fumes to migrate throughout the photolith area. Dispose of waste photoresist bottles by placing your labeled bottle in the yellow solvent waste cabinet in chase 5.
==Photoresist Strippers==
Use of heated strippers is limited to the stainless steel solvent benches. It is recommended you use the heated water bath to heat your stripper to 80 C. If you choose to use a hot plate to heat commercial photoresist strippers, we realize the hot plate surface temperature will need to be set above 80 C. Ideally, you should use a temperature probe inserted in the liquid as the feedback control for the hot plate. If you have the hot plate surface temperature set above 80 C, you must actively monitor the temperature of the stripper using a thermometer (or equivalent) and limit the stripper temperature to a maximum of 80 degrees C. You must be in the vicinity of the hotplate whenever you are heating strippers with the hot plate surface set above 80 degrees C if you are not using a temperature probe for feedback control of the hot plate.
'''The following photoresist strippers are stocked:'''
*Shipley 1165
*AZ 300T
*Shipley SVC-14
*PRX-127
==Chemical Waste Disposal==
===General Guidelines===
#The correct method of disposal for any chemical waste in our inventory is posted throughout the Nanofab, and also indicated in a file titled “Nanofab Chemical Storage/Use/Disposal”, located on the desktops of all optical microscope computers in the Nanofab.
#'''DO NOT DISPOSE OF SOLVENTS IN THE ACID DRAIN, OR ACIDS AND BASES IN THE SOLVENT DRAINS DUE TO POSSIBLE EXPLOSION OR THE CREATION OF OTHER HAZARDOUS SITUATIONS.'''
===All chemical waste is disposed in one of three methods:===
'''Acid Drains'''
:Most (but not all) water-based chemicals use this method. The acid drain empties into a waste chemical pH neutralization system located in the Nanofab mechanical room. This is the primary drain in the Nanofab. All liquids entering the sink drain at any polypropylene wet bench in the Nanofab run through this treatment system.

:To dispose of an acid or base, pour the liquid down the drain using the plenum flush. If you spill an acid or base onto the top surface of a bench, first rinse the surface thoroughly with water, then turn on the plenum flush to rinse the bench drain. Do not pour solvents down the acid drain.
'''Solvent Drains'''
:Most (but not all) solvent waste use this method. The solvent drain waste is pumped to a storage tank located in the Nanofab mechanical room. The waste solvents are transported to the EH&S chemical waste processing facility.
'''Collection of Waste'''
:Always fill out the Environmental Health and Safety waste disposal form when storing waste chemicals in the appropriate cabinet.
==Disposing of Empty Acid, Base, and Solvent Bottles==
Thoroughly rinse empty acid and base bottles three times with DI water, and then place in a trashcan. Place completely empty solvent bottles in the trashcan, making sure caps are in place. The exception to this policy is empty 49% HF bottles, which should be returned to the HF storage cabinet.
=Nanofab Apparel and Gloves=
==Bunnysuits and Booties==
You must wear a full bunnysuit to enter the Nanofab (hood, coverall, shoe covers). Facial covers are optional. Change bunnysuits weekly if used often, or at least once a month if used sporadically. Store coverall and hoods on numbered hangers in the gowning room. Reserve a hanger by placing a stainless steel “hanger reserve clip” on the hanger number. Store booties in the corresponding numbered slot in the bootie storage rack. Sandals or any other open toed shoes are not allowed in the Nanofab at any time.
==Eye Protection==
ANSI-approved eye protection must be worn at all times in the Nanofab, except when using optical microscopes. All eye protection eyewear must be ANSI-approved, as indicated by the “Z87” stamp required on the eyewear. You are welcome to use personal prescription safety eyewear which is ANSI-approved. Three types of safety eyewear are stocked in the Nanofab:
#'''Uvex Astro 3000''', for use by people who do not wear vision correction glasses. These safety glasses have a black frame.
#'''Uvex Astro OTG 3001''', for use by people who do wear vision correction glasses. These safety glasses are intended to be worn over vision correction glasses, and have a blue frame.
#'''U.S. Safety Faceshield'''. This full faceshields must be worn when working with dangerous chemicals or materials. Always use a faceshield when working at the HF bench.
==Aprons and Gloves==
===General Information===
Always wear gloves when in the Nanofab. Acid aprons are required when handling HF and other highly corrosive or toxic chemicals.
===Five types of gloves are available in the Nanofab:===
{| style="font-size: 95%;" border="1" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center; font-size: 95%"
|-bgcolor=#D0E7FF
!align=center bgcolor=#D0E7FF width="75"|'''Material'''
!align=center bgcolor=#D0E7FF width="150"|'''Manufacturer/Model'''
!align=center bgcolor=#D0E7FF width="75"|'''Color'''
!align=center bgcolor=#D0E7FF width="100"|'''Thickness'''
!align=center bgcolor=#D0E7FF width="150"|'''Stocked Sizes'''
|-
|PVC||Kimtech G5 Co-Polymer||Clear||0.10mm (4 mil)||S, M, L, XL
|-
|Latex||Kimtech G3 Latex||Tan||0.20mm (8 mil)||6, 6.5, 7, 7.5, 8, 8.5, 9, 10
|-
|Nitrile||Best CleaN-Dex Ultimate||White||0.15mm (6 mil)||XS, S, M, L, XL
|-
|Nitrile||MAPA StanSolve A-30||Green||0.28mm (11 mil)||7, 8, 9, 10, 11
|-
|Blend||MAPA TRIonic E-194||Tan||0.50mm (20 mil)||6, 7, 8, 9, 10, 11
|-
|}

*'''Polyvinyl Chloride (PVC)''': Kimtech G5 Co-Polymer
:A relatively inexpensive static free general-purpose glove, poor for most organics. These gloves break down rapidly in acetone.
*'''Latex''': Kimtech G3 Latex
:A general-purpose glove, poor for most organics, okay with aldehydes and keytones.
*'''Nitrile, White''': Best CleaN-Dex Ultimate
:This thin general purpose low cost glove offers marginal protection from many keytones, okay with some acids and bases.
*'''Nitrile, Green''': MAPA StanSolve A-30
:A thicker nitrile glove that affords increased protection over the CleaN-Dex white nitrile glove.
*'''Nitrile/Neoprene/Latex Blend''': MAPA TRIonic E-194
:This glove is the standard wet processing glove. A blend of latex, neoprene, and carboxylated nitrile, which offers excellent protection from corrosives and solvents such as HF and acetone. Highly resistant to cuts, tears, and snags. Always use this glove when processing with HF, TMAH, or Bromine.

=General Nanofab Information=
==Iris Camera Access System==
The iris camera access system provides security to the Nanofab, and allows tracking of the time each user spends in the Nanofab. ALWAYS scan in when entering the lab and scan out when exiting the lab, even when attending training sessions or performing beneficial work. Violating this policy will result in a two-week suspension for the first incidence, and possible permanent suspension for recurring incidences.
==Scheduling Tool/Equipment Use and Tool Supervisors==
Tool use is scheduled in one of two ways:
#either through the web-based system “Signupmonkey” at URL: http://signupmonkey.ece.ucsb.edu
#or first come/first served
*If a tool is listed on Signupmonkey, you must obtain permission from the supervisor of the tool in order to schedule use of the tool. This is typically accomplished by attending a training session.
*Some tools are not scheduled using Signupmonkey because the cycle period is typically short and use of the tool is most efficient without using signupmonkey.
*All tools in the Nanofab have a supervisor, regardless of whether the tool is listed on Signupmonkey.
*If you have problems with any tool, please inform the supervisor either by email, or direct communication (phone, etc).
==Credit for Beneficial Work in the Nanofab==
You will receive 1.5 hours of free processing time for each hour spent performing maintenance on lab equipment, conducting training sessions, or any time spent performing work beneficial to the general operation of the lab. Please indicate time spent performing beneficial work on the sign-up sheet just inside the gowning room.
==Wet Bench Housekeeping==
Always leave wet benches clean, dry, and organized. This includes cleaning up all spills, storing glassware and chemicals, etc. If a bench is not clean when you start a task, you still have the responsibility to leave it clean. If you leave a wet bench in disarray, or leave an unlabeled container on a bench, you can be suspended from the Nanofab. Do not cover the exhaust holes on the bench tops, as this will impede the laminar flow of air through the bench and possibly expose you or other Nanofab users to toxic fumes.
==Hotplates==
Hot plates used for heating chemicals must be attended. This means you must be in the Nanofab and near the hot plat whenever it is in use. (This does not apply to PR baking hotplates on the PR spinner benches.)
==Nanofab Paper==
The only paper allowed in the lab is Nanofab type paper. We stock many different types of Nanofab paper for the lab, including photocopier (or laserwriter) paper, sticky labels, and assorted notebooks. If you require a special type of Nanofab paper, ask and we will try to obtain it. You can laminate regular paper for use in the lab. Use pens, not pencils, for writing in the lab.
==Nanofab Wipes==
We stock four types of wipes in the lab
#'''S/Pec-Wipe 3''' is a cellulose/polyester blend with high absorption but medium particle and fiber generation.
#'''Berkshire Poly1200''' is a 100% knit polyethylene wipe with low particulate generation, but also with relatively low absorption.
#'''PRO-STAT''' is a cellulose blend presaturated with isopropyl alcohol and DI water.
#'''BIOHAZ''' are used to line photoresist spinner catch cups
==Preparing Equipment for Entry into the Nanofab==
All equipment entering the lab must be clean. The procedure for cleaning equipment for entry is:
#Vacuum while equipment is outside the lab
#Wipe down all accessible surfaces with propanol or EKC "Lab Clean" using Nanofab wipes while equipment is outside the lab
#Move equipment into the lab
#Vacuum with HEPA filtered vacuum cleaner when inside the lab
==Maintenance Ways==
You may enter maintenance ways without wearing a bunnysuit from outside the Nanofab, or while wearing a bunnysuit from inside the Nanofab.
==Notes on Particle Counts in the Nanofab==
The Nanofab was surveyed with a particle counter, with generally good results. All wet bench work surfaces have extremely low particle counts, better than class 10. The open areas in the lithography area are all better than class 100, and mostly better than class 10. The remainder of the Nanofab tests better than class 1000, and often better than class 100. The Nanofab design specifications stipulated class 100 for litho, class 1000 for everything else. The Nanofab is easily meeting these specs. 

The effectiveness of facemasks was investigated by placing the particle counter directly under a person’s neck while the person moved his head back and forth. Facemasks reduced particle counts, from the equivalent of class 500 without masks to class 100 with masks. Again, this was sampling just below the neck, not at typical substrate surfaces.

The choice of wipes used in the Nanofab has a more pronounced affect on particle counts. In general, wipes trade absorbency for low particle generation. The Spec-Wipe 3 is the stocked polyester/cellulose blend, high absorbency wipe designed for use in class 100 cleanrooms. Dragging the sampling tube across the surface of a Spec-Wipe 3 resulted in a class 1000 level particle counts. The Berkshire Polx 1200 wipe is the stocked low particle count, 100% knit polyester wipe. This wipe is not as absorbent at the Spec-Wipe 3, but generates fewer particles. Dragging the sampling tube across the surface of a Berkshire Polx 1200 wipe resulted in lower than class 100 level particle counts.

To summarize, the Nanofab is meeting and exceeding design specifications for particle counts. If you would like to further reduce particles on your substrates, you may implement the following practices, in order of effectiveness:
*Use only Berkshire Polx 1200 wipes if your process requires placing your substrate on a wipe
*Use a facemask if your process requires you to work above your substrate on a table. Facemasks do not reduce particle counts on substrates in wet benches.
==Procedure for the Use and Handling of Precious Metals==
Gold, platinum, palladium, and various alloys of these metals are stocked by the UCSB Nanofab. Each research group can be issued a precious metal supply. This supply must be stored in a small lockable container, along with a log sheet for recording the use of these metals. Precious metas, the lockable security container, and log sheets will be issued by the Nanofab manager. All use of precious metals must be accurately recorded on the log sheet, and include user name, date, metal type, metal weight before use, and metal weight after use. Multiple digital scales have been acquired and placed throughout the Nanofab to facilitate weighing of these metals. When requesting additional precious metals, the completed log sheet must be presented to the Nanofab manager. Any discrepancies in recorded precious metal use will result in charges to the principle investigator corresponding to the value of the precious metal discrepancy.
=Communications and Internet Access=
==Wireless Access in the Nanofab and Couryard Café==
Currently, we have two wireless networks available to Nanofab users:
===Nanofab Wireless Access:===
The Nanofab has three access points located in the Nanofab. This network is operated by Nanofab staff, and offers anonymous access. You may connect to this network by selecting the following network and entering the password.
*network: ''nanofab''
*password: ''ece!nanofab''

===UCSB Wireless Network===
The Courtyard Café, as well as other locations on campus, provide access to the UCSB wireless network.
*'''External Users''' (Other universities or industrial users)
:Access accounts to external Nanofab user (other university or industrial users) are provided as requested by the Nanofab manager. Please contact the Nanofab manager if you would like an account.
*'''Local academic users''' (UCSB grad students, staff, etc)
:Local academic users can access the UCSB wireless network by using their UCSBNetID and password. Information regarding setup of a UCSBNetID and password: https://my.sa.ucsb.edu/U-reset/AccountManagement.aspx

=Ball Bonding, Wire Bonding, and Packaging Services=
We have established an arrangement with PLT Technology to provide various ball bonding and packaging services to UCSB Nanofab users. The service can be provided for you by PLT technology, a local Santa Barbara company, and will be invoiced to your PI through our normal Nanofab recharge system. This service is offered to both academic and industrial Nanofab researchers. A description of the services and associated rates is below. Peter Tihanyi of PLT Technology will provide the service. Peter has a high level of expertise with these processes, especially involving unique or research-type substrates and processes. If you would like to utilize Peter's services, please contact Peter by email to start the process. All equipment noted below is in-house at PLT and in good working condition.

::Peter Tihanyi 
::PLT Technology, Inc 
::420 East Haley Street 
::Santa Barbara, CA 93101 
::Phone: 805-280-1834 
::[http://www.laserdiodeservices.com www.laserdiodeservices.com] 
::pltlaser@silcom.com 

*Au wire bonding service using K&S model 4124 gold ball bonder. The charge is $120 for the setup of the system and a minimum charge of $120, which includes up to 20 Au wires bonded. Each additional set of 20 wires is $120.
*Semiconductor device soldering (laser diodes, other lasers, electronics, etc) using indium deposition on a heat sink in high vacuum (3x10-7 tore). Device placement is accomplished using a Royce model 110 pick and place station with ± 0.5um accuracy on heat sink, with flux/organics free soldering in a vacuum chamber using protective gas during the soldering process. This flux-free soldering process was developed by Peter Tihanyi for spacecraft applications. The charge for this process is $120 per hour. There is a minimum charge of 8 hours for each soldering process which includes deposition of indium, chip placement, and chip soldering. The number of devices that can be soldered at the same time depends primarily on the heat sink size. We can supply C-mounts and 9mm packages for $30 each.
*Vacuum or N2 back-fill of 9mm and TO-3 packages utilizing a POLARIS Accu-Weld 4000 tool. This tool can also be setup for other package configurations. PLT has fixtures for both 9mm and TO-3 packages. However, new fixturing will be required for other package types. The service for 9mm and TO-3 packages up to 10 pieces is $800. We can supply the package for $30 each.
*Laser diode testing for wavelengths from 400nm to 1600nm utilizing a ILX Lightwave model LPA-9084 laser diode parameter analyzer. The charge is $120 per hour for C-mount. The use of other package types is dependent on the heat sink size, but many other package types can be accommodated.
*Semiconductor substrate scribe and break service utilizing a Loomis model 100 LSD tool. The setup charge is$120, with a rate of $120 per hour.
*Lapping and polishing service utilizing a Logitech model PM2 tool. The rate is $120 per hour, with a minimum of 8 hours. Various substrate materials can be processed, including Ga and InP.

=Fostering SEI Research at NNIN =
Through our participation in the National Nanotechnology Infrastructure Network (NNIN), we are committed to fostering research on the social and ethical implications of nanotechnology. Nanofab users are at the forefront of nanotechnology and can offer unique insight into this research. To this end, from time to time, users may be invited to participate in a research project, such as by answering a survey or participating in an interview. Although users are free to decline, and their decision to participate or not to participate will have no bearing on their ability to use the Nanofab, we sincerely hope that users will consider each request and accept as many invitations as they can in the spirit of advancing knowledge on social and ethical issues and helping to ensure that NNIN remains a leader in nanotechnology innovation.   We are also committed to ensuring that these projects are relevant to NNIN, unburdensome to its users, and have met appropriate ethical standards. Thus, we will only release users' contact information to projects that have received prior approval from NNIN.  

If you have any questions, please contact NNIN's Director, Dr. Sandip Tiwari st222@cornell.edu or NNIN's SEI Coodinator, Dr. Katherine McComas kam19@cornell.edu.

=Nanofab Summer Intern Policy =

Whenever the intern is in the Nanofab, the mentor must also be in the Nanofab. Interns may use tools that do not require training sessions, such as microscopes, etc, unless the supervisor of these tools objects. Interns can work at photolith benches, and use components of the photolith benches, unless the supervisor of the bench objects. Interns will need to follow normal Nanofab access procedures, including initiation meeting with the Nanofab manager.

Interns will be allowed to use one or two mainline Nanofab tools after completing training conducted by Nanofab staff. Mainline tools are tools scheduled through our web site signupmonkey. Certain tools will be unavailable to interns due to extremely heavy use or other concerns.

==Tools unavailable for intern use during Summer 2012:==
{|
|-valign="top"
|
*[[Stepper 1 (GCA 6300)]]
*[[Stepper 2 (AutoStep 200)]]
*[[Stepper 3 (ASML DUV)]]
*[[E-Beam Lithography System (JEOL JBX-6300FS)]]
*[[AFM-based Nanolithography Tool (NanoMan)]]
*[[Wafer Bonder (SUSS SB6-8E)]]
*[[Holographic Lith/PL Setup (Custom)]]
*[[E-Beam 3 (Temescal)]]
*[[E-Beam 4 (CHA)]]
*[[Sputter 1 (Custom)]]
*[[Sputter 2 (SFI Endeavor)]]
*[[Sputter 5 (Lesker AXXIS)]]
*[[ICP-PECVD (Unaxis VLR)]]
*[[Ion Beam Deposition (Veeco NEXUS)]]
*[[RIE 1 (Custom)]]
*[[RIE 5 (PlasmaTherm)]]
*[[Si Deep RIE (PlasmaTherm/Bosch Etch)]]
||
*[[ICP-Etch (Unaxis VLR)]]
*[[ICP Etch 1 (Panasonic E626I)]]
*[[ICP Etch 2 (Panasonic E640)]]
*[[XeF2 Etch (Xetch)|XeF2 Etch (Xetch)]]
*[[Plasma Activation (EVG 810)]]
*[[HF Vapor Etch]]
*Wet Etch Benches (Acid etch and HF etch)
*Wet Etch Wafer Scale Bench (Acid etch and HF etch)
*[[Chemical-Mechanical Polisher (Logitech)]]
*[[Rapid Thermal Processor (AET RX6)]]
* [[Flip-Chip Bonder (Finetech)]]
* [[Dicing Saw (ADT)]]
* [[Field Emission SEM 1 (FEI Sirion)]]
* [[Field Emission SEM 2 (JEOL 7600F)]]
* [[Surface Analysis (KLA/Tencor Surfscan)]]
* [[Deep UV Optical Microscope (Olympus)]]
|}

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2016-09-14T22:59:56Z

Reynolds t:

{| style="background:#f5fffa;" border="0" width="100%"
|-
|-
!width=5%|
!width=25%|[[Image:GowningRoom.jpg|link=Main Page|center|350px|]]
!width=5%|
!width=65%|
*This wiki site has extensive safety related information on common hazards and work practices and procedures within the facility. All facility users should be familiar with the information as relates to their work.

*Since there are multiple users of the facility, with their own unique projects, the management of the facility cannot be responsible for overseeing all aspects of their work. Therefore, the supervisors of individuals using the facility, e.g., UCSB Principal Investigators and external user managers are ultimately responsible for ensuring that their supervisees have the appropriate knowledge and training to work safely in the facility. They are also responsible for ensuring that all applicable regulatory requirements are met. This includes having a compliant "Chemical Hygiene Plan" per OSHA regulations. The information on this site should be considered as providing "general supporting information" to the Chemical Hygiene Plan of a particular supervisor. Supervisors can reference all or some of this site information within their Plans. UCSB EH&S can provide assistance to supervisors in preparing their Plans."

*The Nanofab Wiki consists of resources to help our users work better. Here you can find MSDS sheets, information on all the tools in the lab and contact information for all our staff.

*Users are encouraged to add well qualified process data to the Wiki Processes pages. The Wiki becomes more useful as more in house processes are developed and included in this database.

*We also welcome device process flow sheets from dissertations for any device types made in the facility.
|-
|-
|}<noinclude>[[Category:Templates]]</noinclude>

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2016-09-14T22:57:47Z

Reynolds t:

Lab Rules OLD 2018

2016-07-25T18:29:33Z

Reynolds t: /* Ball Bonding, Wire Bonding, and Packaging Services */

For a printable PDF version of the Lab Rules, please '''[[Media:LabRules.pdf|CLICK HERE]]'''

While working in the Nanofab, you are surrounded by dangerous and deadly chemicals, gases, high voltages, radiation, and mechanical systems. The responsibility lies with users and staff to act in a professional, courteous, and safe manner at all times while in the facility. Users violating the operating and safety rules of the facility or endangering the safety of themselves or other users will be denied further access to the facility.

This document attempts to define acceptable actions and behavior for the users of the Nanofabrication facility. However, it is impossible to define a policy for every conceivable situation. Nanofab users are expected to employ common sense and a high degree of prudence while working in this facility.

=General Nanofabrication Facility Safety Policies=
==Visual and Audible Alarms in the Nanofab==
#'''Fire Alarm''': White strobe with high volume audible alarm, located throughout the Nanofab. If this alarm activates, immediately leave the Nanofab through the nearest exit. Do not remove bunnysuit until outside.
#'''Toxic Gas Alarm''': Blue strobe with high volume audible alarm, located at both ends of each bay. If this alarm activates in one bay, do not enter the bay. If this alarm activates throughout the Nanofab, immediately leave the Nanofab through the nearest exit. Do not remove bunnysuit until outside.
#'''Wet Bench Alarms''': Small illuminated visual alarms with buzzers. Each wet bench may have multiple alarms, with a placard beside the alarms indicating meaning of alarm and proper response. You must follow proper response if you see or hear a wet bench alarm.
#'''Equipment Alarms''': Please notify supervisor of tool if equipment alarm is activated.
==Emergencies and First Aid==
If you believe you may have been exposed to a toxic substance or gas, if appropriate rinse in the emergency shower. In all cases, quickly go to the emergency room at Goleta Valley Hospital. Emergency showers and eye wash stations are located at the south end of all bays. An enclosed emergency showers is located in bay 5 beside the wet etch benches. A first aid kit is located in the gowning room, and on the south wall at the end of bays 2, 4, and 6. Chemical spill clean-up kits are located on the wire shelving in each bay containing a wet bench. After using a spill cleanup kit, please inform the Nanofab manager. Fire extinguishers are located on the south end of each clean bay, and the north end of each maintenance chase.
==Hydrofluoric Acid (HF) Exposure==
===HF Exposure to Skin===
#Immediately rinse exposed area for 5 minutes in safety shower, flush affected area thoroughly. Speed and thoroughness in washing off the acid is of primary importance. An enclosed emergency showers is located in bay 5 across from the HF/TMAH wet processing bench. If using the emergency shower at the end of the bay, water will spill onto floor of Nanofab - this is OK.
#Immediately after rinsing, start massaging 2.5% calcium gluconate gel into the affected area. The individual applying the gel should wear gloves. Apply gel frequently and massage continuously. Calcium gluconate gel is located to the left of the HF bench in a pocket mounted to the side of the bench.
#Seek immediate medical attention by calling 9-911.
#Continue rubbing gel on affected area until advised otherwise by physician.
===HF Exposure to Eyes===
#Immediately rinse exposed area for 15 minutes at eye wash station. Hold eyelids open during irrigation to allow thorough flushing of the eyes. Water will spill onto floor of Nanofab - this is OK.
#Seek immediate medical attention by calling 9-911.
==TetraMethylAmmonium Hydroxide (TMAH) Exposure==
TMAH is a component in several photoresist developers and strippers, and is also used in the Nanofab as an ebeam resist developer and silicon etchant. The concentration of TMAH in photoresist developer and stripper solutions is relatively low (2-4%). However, the ebeam developer and silicon etchant utilize a solution of 25% TMAH.
===TMAH Exposure to Skin, 25% Concentration===
#Immediately rinse exposed area for at least 15 minutes in safety shower, flush affected area thoroughly. An enclosed emergency showers is located in bay 5 across from the HF/TMAH wet etch bench. If using the emergency shower at the end of the bay, water will spill onto floor of Nanofab - this is OK.
#Seek immediate medical attention by calling 9-911
===TMAH Exposure to Skin, 2%-4%Concentration===
#If small area skin exposure (<1% body surface area, <approximately 25 inches2) to 2-4% TMAH, immediately rinse exposed area until skin feels normal (not greasy). If irritation occurs, consult a physician.
#If medium to large area skin exposure (>1% body surface area, >approximately 25 inches2) to 2-4% TMAH, immediately rinse exposed area for at least 15 minutes in safety shower, flush affected area thoroughly. An enclosed emergency showers is located in bay 5 across from the HF/TMAH wet etch bench. If using the emergency shower at the end of the bay, water will spill onto floor of Nanofab - this is OK. Seek immediate medical attention by calling 9-911.
===TMAH Exposure to Eyes, Any Concentration===
#Immediately rinse exposed area for at least 15 minutes at eye wash station. Hold eyelids open during irrigation to allow thorough flushing of the eyes. Water will spill onto floor of Nanofab - this is OK.
#Seek immediate medical attention by calling 9-911
==Pregnancy and the Nanofab==
The effects on a fetus of many of the chemicals utilized in the Nanfab is unknown. The Nanofab is designed to prevent exposure to the fumes and vapors from these chemicals, but absolute 100% containment is impossible, and it is possible to be exposed to extremely small concentrations of these materials. Consequently, we strongly recommend that you do not work in the Nanofab if you know or suspect that you are pregnant.
=Chemicals and Hazardous Materials the Nanofab=
==[[MSDS]]==
The MSDS contains safety information regarding exposure, first aid, handling, storage, fire hazard, etc., for all chemicals, gases, and materials present in the facility. Before using an unfamiliar material, consult the MSDS to determine any potential hazards. Consult the MSDS to determine the proper course of action if someone has been exposed to a gas or chemical, or a spill has occurred. A book containing the MSDS for any material used in the Nanofab is located just inside the gowning room. Additionally, an electronic version of the MDSD in .pdf format for all chemicals in our inventory is located on the desktops of all the computers connected to microscopes in the Nanofab.
==Introducing New Materials Into the Nanofab==
All new chemicals, compounds, gases, materials for evaporation, etc., must be approved by the Nanofab manager before introduction into the facility. In order to introduce a new material into the Nanofab, a MSDS (Material Safety Data Sheet) for the material in .pdf format must be submitted to the Nanofab manager, plus a description of the proposed process utilizing the new material. The description of the process should include the goals of the process, and the mechanics of the process in reasonable detail. The Nanofab manager will determine if the material will be allowed in the Nanofab, and if so, where the new material will be stored, where the material is to be used (typically a specific wet bench), and how to dispose of the waste.
==Containers and Labeling==
Chemical containers such as beakers, bottles, etc, must be labeled with contents, date, and ownership (individual or group name). This information can be written on a wipe under the container. The exceptions to this policy are as follows:
#A beaker in use on a solvent bench can contain acetone, propanol, or methanol if the beaker is labeled with the text: “acetone/propanol/methanol”. The generic label “solvent” is insufficient. Beakers containing solvents other that acetone, propanol, or methanol must be labeled with the specific solvent.
#Indication of date is no longer required on beakers in use on solvent benches. All beakers in use on solvent benches must be labeled with contents and ownership.
#Beakers in use at lithography developer benches must be labeled with exact contents and ownership (individual or group name). The generic label “developer” is insufficient.
#Indication of date is no longer required on beakers in use on the developer benches. All beakers in use on developer benches must be labeled with contents and ownership.
==Chemical Storage==
*'''Acid Storage'''
:The primary acid storage area (except HF) is the acid cabinet located next to the acid wet processing benches in bay 5. HF acid is stored in the HF cabinet
*'''Base Storage'''
:The primary base storage area is the base cabinet located next to the acid wet processing bench.
*'''Solvent Storage'''
:The primary solvent storage area is the stainless steel flammables cabinet in bay 6. You may store small amounts of solvents in labeled containers on the shelves in the photolith area.
==Solvent Processing==
Solvents with flashpoints below 55 deg C cannot be heated in the Nanofab. This includes acetone, methanol, isopropanol, ethanol, and toluene. All solvent processing is limited to the stainless steel solvent processing benches. Do not perform standard solvent processing at the photoresist spinner benches.
==Wet Etch and HF/TMAH Processing==
All wet processing involving acids and bases (except HF and TMAH) is limited to the acid/base benches. All HF and Bromine processing is limited to the HF or HF/TMAH benches - NO EXCEPTIONS. All TMAH processing is limited to the HF/TMAH bench. When working at the HF or HF/TMAH benches, always wear a chemical apron, face shield, and “Trionic” gloves. Store all HF and bromine in labeled containers in the HF acid/bromine storage cabinet. Store TMAH is the base storage cabinet. Please keep open containers of these two toxic chemicals away from the edge of the bench. All waste solutions containing any HF is poured down the drain, and treated in the Nanofab acid treatment system. Empty HF bottles should be returned to the HF acid storage cabinet. You may not deviate from this policy unless you have prior approval by the Nanofab manager.
==Photoresist Coating or Spinning==
Standard solvent-based photoresist spinning should be perfomed at the PR spinner benches. Some lithography chemicals utilize non-standard chemicals in place of solvents, which may require spinning at a different bench. If using a non-standard lithography chemicals, please provide the MSDS and process instructions to the laboratory manager for direction in this matter.
==Developer Benches==
Developer benches are used for developing photoresists only. In general, solvents are not allowed at the developer benches because solvent fumes adversely affect the develop process. Solvent based liftoff processes are not allowed at the developer benches E-beam develop processes may utilize solvents, and should be performed at the solvent benches in the photolith area.
==Plating Bench==
The Solvent/Plating bench contains cyanide-based plating and etching solutions. Never use acid solutions at this bench.
==Photoresist Storage, Handling, and Waste==
Photoresists can contain many solvents and aromatics that are potentially toxic. Special care must be exercised when handling these materials. All photoresist fumes must be exhausted or otherwise contained through careful procedures at the photolith wet benches. The primary photoresist storage area is the lab refrigerator located bay 6. Some resists do not need refrigeration and are stored in the flammables cabinet next to the refrigerator (PMGI, PMMA, etc). Before transferring refrigerated PR from the main bottle to your in-use bottle, place main bottle on designated photoresist warming racks for a minimum of 2 hours, or until the bottle is at room temperature, whichever is longer. Large transfer pipettes are provided for transferring PR from the main bottle to your in-use bottle. To prevent PR flakes from contaminating the main bottle, please inspect the main bottle cap and bottle threads for PR, and remove any PR with an acetone wipe before replacing cap. After transfer, place main bottle back in the refrigerator. You may store your in-use, fully labeled PR bottle in the stainless steel PR storage cabinet in a bin labeled with your research group name. Disposable droppers, syringes, and filters are provided for the application of photoresist on your substrate. You may store photoresist in the PR storage cabinet for a maximum of 6 months. Nanofab staff will remove in-use PR bottles older than 6 months, and will also remove any bottle not correctly labeled with contents, date, and ownership. Nanofab wipes and pipettes contaminated with PR must be placed in the beakers at the back of the spinner benches. Do not place PR contaminated materials in the trashcans, as this will allow photoresist fumes to migrate throughout the photolith area. Dispose of waste photoresist bottles by placing your labeled bottle in the yellow solvent waste cabinet in chase 5.
==Photoresist Strippers==
Use of heated strippers is limited to the stainless steel solvent benches. It is recommended you use the heated water bath to heat your stripper to 80 C. If you choose to use a hot plate to heat commercial photoresist strippers, we realize the hot plate surface temperature will need to be set above 80 C. Ideally, you should use a temperature probe inserted in the liquid as the feedback control for the hot plate. If you have the hot plate surface temperature set above 80 C, you must actively monitor the temperature of the stripper using a thermometer (or equivalent) and limit the stripper temperature to a maximum of 80 degrees C. You must be in the vicinity of the hotplate whenever you are heating strippers with the hot plate surface set above 80 degrees C if you are not using a temperature probe for feedback control of the hot plate.
'''The following photoresist strippers are stocked:'''
*Shipley 1165
*AZ 300T
*Shipley SVC-14
*PRX-127
==Chemical Waste Disposal==
===General Guidelines===
#The correct method of disposal for any chemical waste in our inventory is posted throughout the Nanofab, and also indicated in a file titled “Nanofab Chemical Storage/Use/Disposal”, located on the desktops of all optical microscope computers in the Nanofab.
#'''DO NOT DISPOSE OF SOLVENTS IN THE ACID DRAIN, OR ACIDS AND BASES IN THE SOLVENT DRAINS DUE TO POSSIBLE EXPLOSION OR THE CREATION OF OTHER HAZARDOUS SITUATIONS.'''
===All chemical waste is disposed in one of three methods:===
'''Acid Drains'''
:Most (but not all) water-based chemicals use this method. The acid drain empties into a waste chemical pH neutralization system located in the Nanofab mechanical room. This is the primary drain in the Nanofab. All liquids entering the sink drain at any polypropylene wet bench in the Nanofab run through this treatment system.

:To dispose of an acid or base, pour the liquid down the drain using the plenum flush. If you spill an acid or base onto the top surface of a bench, first rinse the surface thoroughly with water, then turn on the plenum flush to rinse the bench drain. Do not pour solvents down the acid drain.
'''Solvent Drains'''
:Most (but not all) solvent waste use this method. The solvent drain waste is pumped to a storage tank located in the Nanofab mechanical room. The waste solvents are transported to the EH&S chemical waste processing facility.
'''Collection of Waste'''
:Always fill out the Environmental Health and Safety waste disposal form when storing waste chemicals in the appropriate cabinet.
==Disposing of Empty Acid, Base, and Solvent Bottles==
Thoroughly rinse empty acid and base bottles three times with DI water, and then place in a trashcan. Place completely empty solvent bottles in the trashcan, making sure caps are in place. The exception to this policy is empty 49% HF bottles, which should be returned to the HF storage cabinet.
=Nanofab Apparel and Gloves=
==Bunnysuits and Booties==
You must wear a full bunnysuit to enter the Nanofab (hood, coverall, shoe covers). Facial covers are optional. Change bunnysuits weekly if used often, or at least once a month if used sporadically. Store coverall and hoods on numbered hangers in the gowning room. Reserve a hanger by placing a stainless steel “hanger reserve clip” on the hanger number. Store booties in the corresponding numbered slot in the bootie storage rack. Sandals or any other open toed shoes are not allowed in the Nanofab at any time.
==Eye Protection==
ANSI-approved eye protection must be worn at all times in the Nanofab, except when using optical microscopes. All eye protection eyewear must be ANSI-approved, as indicated by the “Z87” stamp required on the eyewear. You are welcome to use personal prescription safety eyewear which is ANSI-approved. Three types of safety eyewear are stocked in the Nanofab:
#'''Uvex Astro 3000''', for use by people who do not wear vision correction glasses. These safety glasses have a black frame.
#'''Uvex Astro OTG 3001''', for use by people who do wear vision correction glasses. These safety glasses are intended to be worn over vision correction glasses, and have a blue frame.
#'''U.S. Safety Faceshield'''. This full faceshields must be worn when working with dangerous chemicals or materials. Always use a faceshield when working at the HF bench.
==Aprons and Gloves==
===General Information===
Always wear gloves when in the Nanofab. Acid aprons are required when handling HF and other highly corrosive or toxic chemicals.
===Five types of gloves are available in the Nanofab:===
{| style="font-size: 95%;" border="1" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center; font-size: 95%"
|-bgcolor=#D0E7FF
!align=center bgcolor=#D0E7FF width="75"|'''Material'''
!align=center bgcolor=#D0E7FF width="150"|'''Manufacturer/Model'''
!align=center bgcolor=#D0E7FF width="75"|'''Color'''
!align=center bgcolor=#D0E7FF width="100"|'''Thickness'''
!align=center bgcolor=#D0E7FF width="150"|'''Stocked Sizes'''
|-
|PVC||Kimtech G5 Co-Polymer||Clear||0.10mm (4 mil)||S, M, L, XL
|-
|Latex||Kimtech G3 Latex||Tan||0.20mm (8 mil)||6, 6.5, 7, 7.5, 8, 8.5, 9, 10
|-
|Nitrile||Best CleaN-Dex Ultimate||White||0.15mm (6 mil)||XS, S, M, L, XL
|-
|Nitrile||MAPA StanSolve A-30||Green||0.28mm (11 mil)||7, 8, 9, 10, 11
|-
|Blend||MAPA TRIonic E-194||Tan||0.50mm (20 mil)||6, 7, 8, 9, 10, 11
|-
|}

*'''Polyvinyl Chloride (PVC)''': Kimtech G5 Co-Polymer
:A relatively inexpensive static free general-purpose glove, poor for most organics. These gloves break down rapidly in acetone.
*'''Latex''': Kimtech G3 Latex
:A general-purpose glove, poor for most organics, okay with aldehydes and keytones.
*'''Nitrile, White''': Best CleaN-Dex Ultimate
:This thin general purpose low cost glove offers marginal protection from many keytones, okay with some acids and bases.
*'''Nitrile, Green''': MAPA StanSolve A-30
:A thicker nitrile glove that affords increased protection over the CleaN-Dex white nitrile glove.
*'''Nitrile/Neoprene/Latex Blend''': MAPA TRIonic E-194
:This glove is the standard wet processing glove. A blend of latex, neoprene, and carboxylated nitrile, which offers excellent protection from corrosives and solvents such as HF and acetone. Highly resistant to cuts, tears, and snags. Always use this glove when processing with HF, TMAH, or Bromine.

=General Nanofab Information=
==Iris Camera Access System==
The iris camera access system provides security to the Nanofab, and allows tracking of the time each user spends in the Nanofab. ALWAYS scan in when entering the lab and scan out when exiting the lab, even when attending training sessions or performing beneficial work. Violating this policy will result in a two-week suspension for the first incidence, and possible permanent suspension for recurring incidences.
==Scheduling Tool/Equipment Use and Tool Supervisors==
Tool use is scheduled in one of two ways:
#either through the web-based system “Signupmonkey” at URL: http://signupmonkey.ece.ucsb.edu
#or first come/first served
*If a tool is listed on Signupmonkey, you must obtain permission from the supervisor of the tool in order to schedule use of the tool. This is typically accomplished by attending a training session.
*Some tools are not scheduled using Signupmonkey because the cycle period is typically short and use of the tool is most efficient without using signupmonkey.
*All tools in the Nanofab have a supervisor, regardless of whether the tool is listed on Signupmonkey.
*If you have problems with any tool, please inform the supervisor either by email, or direct communication (phone, etc).
==Credit for Beneficial Work in the Nanofab==
You will receive 1.5 hours of free processing time for each hour spent performing maintenance on lab equipment, conducting training sessions, or any time spent performing work beneficial to the general operation of the lab. Please indicate time spent performing beneficial work on the sign-up sheet just inside the gowning room.
==Wet Bench Housekeeping==
Always leave wet benches clean, dry, and organized. This includes cleaning up all spills, storing glassware and chemicals, etc. If a bench is not clean when you start a task, you still have the responsibility to leave it clean. If you leave a wet bench in disarray, or leave an unlabeled container on a bench, you can be suspended from the Nanofab. Do not cover the exhaust holes on the bench tops, as this will impede the laminar flow of air through the bench and possibly expose you or other Nanofab users to toxic fumes.
==Hotplates==
Hot plates used for heating chemicals must be attended. This means you must be in the Nanofab and near the hot plat whenever it is in use. (This does not apply to PR baking hotplates on the PR spinner benches.)
==Nanofab Paper==
The only paper allowed in the lab is Nanofab type paper. We stock many different types of Nanofab paper for the lab, including photocopier (or laserwriter) paper, sticky labels, and assorted notebooks. If you require a special type of Nanofab paper, ask and we will try to obtain it. You can laminate regular paper for use in the lab. Use pens, not pencils, for writing in the lab.
==Nanofab Wipes==
We stock four types of wipes in the lab
#'''S/Pec-Wipe 3''' is a cellulose/polyester blend with high absorption but medium particle and fiber generation.
#'''Berkshire Poly1200''' is a 100% knit polyethylene wipe with low particulate generation, but also with relatively low absorption.
#'''PRO-STAT''' is a cellulose blend presaturated with isopropyl alcohol and DI water.
#'''BIOHAZ''' are used to line photoresist spinner catch cups
==Preparing Equipment for Entry into the Nanofab==
All equipment entering the lab must be clean. The procedure for cleaning equipment for entry is:
#Vacuum while equipment is outside the lab
#Wipe down all accessible surfaces with propanol or EKC "Lab Clean" using Nanofab wipes while equipment is outside the lab
#Move equipment into the lab
#Vacuum with HEPA filtered vacuum cleaner when inside the lab
==Maintenance Ways==
You may enter maintenance ways without wearing a bunnysuit from outside the Nanofab, or while wearing a bunnysuit from inside the Nanofab.
==Notes on Particle Counts in the Nanofab==
The Nanofab was surveyed with a particle counter, with generally good results. All wet bench work surfaces have extremely low particle counts, better than class 10. The open areas in the lithography area are all better than class 100, and mostly better than class 10. The remainder of the Nanofab tests better than class 1000, and often better than class 100. The Nanofab design specifications stipulated class 100 for litho, class 1000 for everything else. The Nanofab is easily meeting these specs. 

The effectiveness of facemasks was investigated by placing the particle counter directly under a person’s neck while the person moved his head back and forth. Facemasks reduced particle counts, from the equivalent of class 500 without masks to class 100 with masks. Again, this was sampling just below the neck, not at typical substrate surfaces.

The choice of wipes used in the Nanofab has a more pronounced affect on particle counts. In general, wipes trade absorbency for low particle generation. The Spec-Wipe 3 is the stocked polyester/cellulose blend, high absorbency wipe designed for use in class 100 cleanrooms. Dragging the sampling tube across the surface of a Spec-Wipe 3 resulted in a class 1000 level particle counts. The Berkshire Polx 1200 wipe is the stocked low particle count, 100% knit polyester wipe. This wipe is not as absorbent at the Spec-Wipe 3, but generates fewer particles. Dragging the sampling tube across the surface of a Berkshire Polx 1200 wipe resulted in lower than class 100 level particle counts.

To summarize, the Nanofab is meeting and exceeding design specifications for particle counts. If you would like to further reduce particles on your substrates, you may implement the following practices, in order of effectiveness:
*Use only Berkshire Polx 1200 wipes if your process requires placing your substrate on a wipe
*Use a facemask if your process requires you to work above your substrate on a table. Facemasks do not reduce particle counts on substrates in wet benches.
==Procedure for the Use and Handling of Precious Metals==
Gold, platinum, palladium, and various alloys of these metals are stocked by the UCSB Nanofab. Each research group can be issued a precious metal supply. This supply must be stored in a small lockable container, along with a log sheet for recording the use of these metals. Precious metas, the lockable security container, and log sheets will be issued by the Nanofab manager. All use of precious metals must be accurately recorded on the log sheet, and include user name, date, metal type, metal weight before use, and metal weight after use. Multiple digital scales have been acquired and placed throughout the Nanofab to facilitate weighing of these metals. When requesting additional precious metals, the completed log sheet must be presented to the Nanofab manager. Any discrepancies in recorded precious metal use will result in charges to the principle investigator corresponding to the value of the precious metal discrepancy.
=Communications and Internet Access=
==Wireless Access in the Nanofab and Couryard Café==
Currently, we have two wireless networks available to Nanofab users:
===Nanofab Wireless Access:===
The Nanofab has three access points located in the Nanofab. This network is operated by Nanofab staff, and offers anonymous access. You may connect to this network by selecting the following network and entering the password.
*network: ''nanofab''
*password: ''ece!nanofab''

===UCSB Wireless Network===
The Courtyard Café, as well as other locations on campus, provide access to the UCSB wireless network.
*'''External Users''' (Other universities or industrial users)
:Access accounts to external Nanofab user (other university or industrial users) are provided as requested by the Nanofab manager. Please contact the Nanofab manager if you would like an account.
*'''Local academic users''' (UCSB grad students, staff, etc)
:Local academic users can access the UCSB wireless network by using their UCSBNetID and password. Information regarding setup of a UCSBNetID and password: https://my.sa.ucsb.edu/U-reset/AccountManagement.aspx

=Ball Bonding, Wire Bonding, and Packaging Services=
We have established an arrangement with PLT Technology to provide various ball bonding and packaging services to UCSB Nanofab users. The service can be provided for you by PLT technology, a local Santa Barbara company, and will be invoiced to your PI through our normal Nanofab recharge system. This service is offered to both academic and industrial Nanofab researchers. A description of the services and associated rates is below. Peter Tihanyi of PLT Technology will provide the service. Peter has a high level of expertise with these processes, especially involving unique or research-type substrates and processes. If you would like to utilize Peter's services, please contact Peter by email to start the process. All equipment noted below is in-house at PLT and in good working condition.

::Peter Tihanyi 
::PLT Technology, Inc 
::420 East Haley Street 
::Santa Barbara, CA 93101 
::Phone: 805-280-1834 
::[http://www.laserdiodeservices.com www.laserdiodeservices.com] 
::pltlaser@silcom.com 

*Au wire bonding service using K&S model 4124 gold ball bonder. The charge is $120 for the setup of the system and a minimum charge of $120, which includes up to 20 Au wires bonded. Each additional set of 20 wires is $120.
*Semiconductor device soldering (laser diodes, other lasers, electronics, etc) using indium deposition on a heat sink in high vacuum (3x10-7 tore). Device placement is accomplished using a Royce model 110 pick and place station with ± 0.5um accuracy on heat sink, with flux/organics free soldering in a vacuum chamber using protective gas during the soldering process. This flux-free soldering process was developed by Peter Tihanyi for spacecraft applications. The charge for this process is $120 per hour. There is a minimum charge of 8 hours for each soldering process which includes deposition of indium, chip placement, and chip soldering. The number of devices that can be soldered at the same time depends primarily on the heat sink size. We can supply C-mounts and 9mm packages for $30 each.
*Vacuum or N2 back-fill of 9mm and TO-3 packages utilizing a POLARIS Accu-Weld 4000 tool. This tool can also be setup for other package configurations. PLT has fixtures for both 9mm and TO-3 packages. However, new fixturing will be required for other package types. The service for 9mm and TO-3 packages up to 10 pieces is $800. We can supply the package for $30 each.
*Laser diode testing for wavelengths from 400nm to 1600nm utilizing a ILX Lightwave model LPA-9084 laser diode parameter analyzer. The charge is $120 per hour for C-mount. The use of other package types is dependent on the heat sink size, but many other package types can be accommodated.
*Semiconductor substrate scribe and break service utilizing a Loomis model 100 LSD tool. The setup charge is$120, with a rate of $120 per hour.
*Lapping and polishing service utilizing a Logitech model PM2 tool. The rate is $120 per hour, with a minimum of 8 hours. Various substrate materials can be processed, including Ga and InP.

=Fostering SEI Research at NNIN =
Through our participation in the National Nanotechnology Infrastructure Network (NNIN), we are committed to fostering research on the social and ethical implications of nanotechnology. Nanofab users are at the forefront of nanotechnology and can offer unique insight into this research. To this end, from time to time, users may be invited to participate in a research project, such as by answering a survey or participating in an interview. Although users are free to decline, and their decision to participate or not to participate will have no bearing on their ability to use the Nanofab, we sincerely hope that users will consider each request and accept as many invitations as they can in the spirit of advancing knowledge on social and ethical issues and helping to ensure that NNIN remains a leader in nanotechnology innovation.   We are also committed to ensuring that these projects are relevant to NNIN, unburdensome to its users, and have met appropriate ethical standards. Thus, we will only release users' contact information to projects that have received prior approval from NNIN.  

If you have any questions, please contact NNIN's Director, Dr. Sandip Tiwari st222@cornell.edu or NNIN's SEI Coodinator, Dr. Katherine McComas kam19@cornell.edu.
=Nanofab Summer Intern Policy =

Whenever the intern is in the Nanofab, the mentor must also be in the Nanofab. Interns may use tools that do not require training sessions, such as microscopes, etc, unless the supervisor of these tools objects. Interns can work at photolith benches, and use components of the photolith benches, unless the supervisor of the bench objects. Interns will need to follow normal Nanofab access procedures, including initiation meeting with the Nanofab manager.

Interns will be allowed to use one or two mainline Nanofab tools after completing training conducted by Nanofab staff. Mainline tools are tools scheduled through our web site signupmonkey. Certain tools will be unavailable to interns due to extremely heavy use or other concerns.

==Tools unavailable for intern use during Summer 2012:==
{|
|-valign="top"
|
*[[Stepper 1 (GCA 6300)]]
*[[Stepper 2 (AutoStep 200)]]
*[[Stepper 3 (ASML DUV)]]
*[[E-Beam Lithography System (JEOL JBX-6300FS)]]
*[[AFM-based Nanolithography Tool (NanoMan)]]
*[[Wafer Bonder (SUSS SB6-8E)]]
*[[Holographic Lith/PL Setup (Custom)]]
*[[E-Beam 3 (Temescal)]]
*[[E-Beam 4 (CHA)]]
*[[Sputter 1 (Custom)]]
*[[Sputter 2 (SFI Endeavor)]]
*[[Sputter 5 (Lesker AXXIS)]]
*[[ICP-PECVD (Unaxis VLR)]]
*[[Ion Beam Deposition (Veeco NEXUS)]]
*[[RIE 1 (Custom)]]
*[[RIE 5 (PlasmaTherm)]]
*[[Si Deep RIE (PlasmaTherm/Bosch Etch)]]
||
*[[ICP-Etch (Unaxis VLR)]]
*[[ICP Etch 1 (Panasonic E626I)]]
*[[ICP Etch 2 (Panasonic E640)]]
*[[XeF2 Etch (Xetch)|XeF2 Etch (Xetch)]]
*[[Plasma Activation (EVG 810)]]
*[[HF Vapor Etch]]
*Wet Etch Benches (Acid etch and HF etch)
*Wet Etch Wafer Scale Bench (Acid etch and HF etch)
*[[Chemical-Mechanical Polisher (Logitech)]]
*[[Rapid Thermal Processor (AET RX6)]]
* [[Flip-Chip Bonder (Finetech)]]
* [[Dicing Saw (ADT)]]
* [[Field Emission SEM 1 (FEI Sirion)]]
* [[Field Emission SEM 2 (JEOL 7600F)]]
* [[Surface Analysis (KLA/Tencor Surfscan)]]
* [[Deep UV Optical Microscope (Olympus)]]
|}

Lab Rules OLD 2018

2016-07-25T18:23:42Z

Reynolds t: Undo revision 153880 by Reynolds t (talk)

For a printable PDF version of the Lab Rules, please '''[[Media:LabRules.pdf|CLICK HERE]]'''

While working in the Nanofab, you are surrounded by dangerous and deadly chemicals, gases, high voltages, radiation, and mechanical systems. The responsibility lies with users and staff to act in a professional, courteous, and safe manner at all times while in the facility. Users violating the operating and safety rules of the facility or endangering the safety of themselves or other users will be denied further access to the facility.

This document attempts to define acceptable actions and behavior for the users of the Nanofabrication facility. However, it is impossible to define a policy for every conceivable situation. Nanofab users are expected to employ common sense and a high degree of prudence while working in this facility.

=General Nanofabrication Facility Safety Policies=
==Visual and Audible Alarms in the Nanofab==
#'''Fire Alarm''': White strobe with high volume audible alarm, located throughout the Nanofab. If this alarm activates, immediately leave the Nanofab through the nearest exit. Do not remove bunnysuit until outside.
#'''Toxic Gas Alarm''': Blue strobe with high volume audible alarm, located at both ends of each bay. If this alarm activates in one bay, do not enter the bay. If this alarm activates throughout the Nanofab, immediately leave the Nanofab through the nearest exit. Do not remove bunnysuit until outside.
#'''Wet Bench Alarms''': Small illuminated visual alarms with buzzers. Each wet bench may have multiple alarms, with a placard beside the alarms indicating meaning of alarm and proper response. You must follow proper response if you see or hear a wet bench alarm.
#'''Equipment Alarms''': Please notify supervisor of tool if equipment alarm is activated.
==Emergencies and First Aid==
If you believe you may have been exposed to a toxic substance or gas, if appropriate rinse in the emergency shower. In all cases, quickly go to the emergency room at Goleta Valley Hospital. Emergency showers and eye wash stations are located at the south end of all bays. An enclosed emergency showers is located in bay 5 beside the wet etch benches. A first aid kit is located in the gowning room, and on the south wall at the end of bays 2, 4, and 6. Chemical spill clean-up kits are located on the wire shelving in each bay containing a wet bench. After using a spill cleanup kit, please inform the Nanofab manager. Fire extinguishers are located on the south end of each clean bay, and the north end of each maintenance chase.
==Hydrofluoric Acid (HF) Exposure==
===HF Exposure to Skin===
#Immediately rinse exposed area for 5 minutes in safety shower, flush affected area thoroughly. Speed and thoroughness in washing off the acid is of primary importance. An enclosed emergency showers is located in bay 5 across from the HF/TMAH wet processing bench. If using the emergency shower at the end of the bay, water will spill onto floor of Nanofab - this is OK.
#Immediately after rinsing, start massaging 2.5% calcium gluconate gel into the affected area. The individual applying the gel should wear gloves. Apply gel frequently and massage continuously. Calcium gluconate gel is located to the left of the HF bench in a pocket mounted to the side of the bench.
#Seek immediate medical attention by calling 9-911.
#Continue rubbing gel on affected area until advised otherwise by physician.
===HF Exposure to Eyes===
#Immediately rinse exposed area for 15 minutes at eye wash station. Hold eyelids open during irrigation to allow thorough flushing of the eyes. Water will spill onto floor of Nanofab - this is OK.
#Seek immediate medical attention by calling 9-911.
==TetraMethylAmmonium Hydroxide (TMAH) Exposure==
TMAH is a component in several photoresist developers and strippers, and is also used in the Nanofab as an ebeam resist developer and silicon etchant. The concentration of TMAH in photoresist developer and stripper solutions is relatively low (2-4%). However, the ebeam developer and silicon etchant utilize a solution of 25% TMAH.
===TMAH Exposure to Skin, 25% Concentration===
#Immediately rinse exposed area for at least 15 minutes in safety shower, flush affected area thoroughly. An enclosed emergency showers is located in bay 5 across from the HF/TMAH wet etch bench. If using the emergency shower at the end of the bay, water will spill onto floor of Nanofab - this is OK.
#Seek immediate medical attention by calling 9-911
===TMAH Exposure to Skin, 2%-4%Concentration===
#If small area skin exposure (<1% body surface area, <approximately 25 inches2) to 2-4% TMAH, immediately rinse exposed area until skin feels normal (not greasy). If irritation occurs, consult a physician.
#If medium to large area skin exposure (>1% body surface area, >approximately 25 inches2) to 2-4% TMAH, immediately rinse exposed area for at least 15 minutes in safety shower, flush affected area thoroughly. An enclosed emergency showers is located in bay 5 across from the HF/TMAH wet etch bench. If using the emergency shower at the end of the bay, water will spill onto floor of Nanofab - this is OK. Seek immediate medical attention by calling 9-911.
===TMAH Exposure to Eyes, Any Concentration===
#Immediately rinse exposed area for at least 15 minutes at eye wash station. Hold eyelids open during irrigation to allow thorough flushing of the eyes. Water will spill onto floor of Nanofab - this is OK.
#Seek immediate medical attention by calling 9-911
==Pregnancy and the Nanofab==
The effects on a fetus of many of the chemicals utilized in the Nanfab is unknown. The Nanofab is designed to prevent exposure to the fumes and vapors from these chemicals, but absolute 100% containment is impossible, and it is possible to be exposed to extremely small concentrations of these materials. Consequently, we strongly recommend that you do not work in the Nanofab if you know or suspect that you are pregnant.
=Chemicals and Hazardous Materials the Nanofab=
==[[MSDS]]==
The MSDS contains safety information regarding exposure, first aid, handling, storage, fire hazard, etc., for all chemicals, gases, and materials present in the facility. Before using an unfamiliar material, consult the MSDS to determine any potential hazards. Consult the MSDS to determine the proper course of action if someone has been exposed to a gas or chemical, or a spill has occurred. A book containing the MSDS for any material used in the Nanofab is located just inside the gowning room. Additionally, an electronic version of the MDSD in .pdf format for all chemicals in our inventory is located on the desktops of all the computers connected to microscopes in the Nanofab.
==Introducing New Materials Into the Nanofab==
All new chemicals, compounds, gases, materials for evaporation, etc., must be approved by the Nanofab manager before introduction into the facility. In order to introduce a new material into the Nanofab, a MSDS (Material Safety Data Sheet) for the material in .pdf format must be submitted to the Nanofab manager, plus a description of the proposed process utilizing the new material. The description of the process should include the goals of the process, and the mechanics of the process in reasonable detail. The Nanofab manager will determine if the material will be allowed in the Nanofab, and if so, where the new material will be stored, where the material is to be used (typically a specific wet bench), and how to dispose of the waste.
==Containers and Labeling==
Chemical containers such as beakers, bottles, etc, must be labeled with contents, date, and ownership (individual or group name). This information can be written on a wipe under the container. The exceptions to this policy are as follows:
#A beaker in use on a solvent bench can contain acetone, propanol, or methanol if the beaker is labeled with the text: “acetone/propanol/methanol”. The generic label “solvent” is insufficient. Beakers containing solvents other that acetone, propanol, or methanol must be labeled with the specific solvent.
#Indication of date is no longer required on beakers in use on solvent benches. All beakers in use on solvent benches must be labeled with contents and ownership.
#Beakers in use at lithography developer benches must be labeled with exact contents and ownership (individual or group name). The generic label “developer” is insufficient.
#Indication of date is no longer required on beakers in use on the developer benches. All beakers in use on developer benches must be labeled with contents and ownership.
==Chemical Storage==
*'''Acid Storage'''
:The primary acid storage area (except HF) is the acid cabinet located next to the acid wet processing benches in bay 5. HF acid is stored in the HF cabinet
*'''Base Storage'''
:The primary base storage area is the base cabinet located next to the acid wet processing bench.
*'''Solvent Storage'''
:The primary solvent storage area is the stainless steel flammables cabinet in bay 6. You may store small amounts of solvents in labeled containers on the shelves in the photolith area.
==Solvent Processing==
Solvents with flashpoints below 55 deg C cannot be heated in the Nanofab. This includes acetone, methanol, isopropanol, ethanol, and toluene. All solvent processing is limited to the stainless steel solvent processing benches. Do not perform standard solvent processing at the photoresist spinner benches.
==Wet Etch and HF/TMAH Processing==
All wet processing involving acids and bases (except HF and TMAH) is limited to the acid/base benches. All HF and Bromine processing is limited to the HF or HF/TMAH benches - NO EXCEPTIONS. All TMAH processing is limited to the HF/TMAH bench. When working at the HF or HF/TMAH benches, always wear a chemical apron, face shield, and “Trionic” gloves. Store all HF and bromine in labeled containers in the HF acid/bromine storage cabinet. Store TMAH is the base storage cabinet. Please keep open containers of these two toxic chemicals away from the edge of the bench. All waste solutions containing any HF is poured down the drain, and treated in the Nanofab acid treatment system. Empty HF bottles should be returned to the HF acid storage cabinet. You may not deviate from this policy unless you have prior approval by the Nanofab manager.
==Photoresist Coating or Spinning==
Standard solvent-based photoresist spinning should be perfomed at the PR spinner benches. Some lithography chemicals utilize non-standard chemicals in place of solvents, which may require spinning at a different bench. If using a non-standard lithography chemicals, please provide the MSDS and process instructions to the laboratory manager for direction in this matter.
==Developer Benches==
Developer benches are used for developing photoresists only. In general, solvents are not allowed at the developer benches because solvent fumes adversely affect the develop process. Solvent based liftoff processes are not allowed at the developer benches E-beam develop processes may utilize solvents, and should be performed at the solvent benches in the photolith area.
==Plating Bench==
The Solvent/Plating bench contains cyanide-based plating and etching solutions. Never use acid solutions at this bench.
==Photoresist Storage, Handling, and Waste==
Photoresists can contain many solvents and aromatics that are potentially toxic. Special care must be exercised when handling these materials. All photoresist fumes must be exhausted or otherwise contained through careful procedures at the photolith wet benches. The primary photoresist storage area is the lab refrigerator located bay 6. Some resists do not need refrigeration and are stored in the flammables cabinet next to the refrigerator (PMGI, PMMA, etc). Before transferring refrigerated PR from the main bottle to your in-use bottle, place main bottle on designated photoresist warming racks for a minimum of 2 hours, or until the bottle is at room temperature, whichever is longer. Large transfer pipettes are provided for transferring PR from the main bottle to your in-use bottle. To prevent PR flakes from contaminating the main bottle, please inspect the main bottle cap and bottle threads for PR, and remove any PR with an acetone wipe before replacing cap. After transfer, place main bottle back in the refrigerator. You may store your in-use, fully labeled PR bottle in the stainless steel PR storage cabinet in a bin labeled with your research group name. Disposable droppers, syringes, and filters are provided for the application of photoresist on your substrate. You may store photoresist in the PR storage cabinet for a maximum of 6 months. Nanofab staff will remove in-use PR bottles older than 6 months, and will also remove any bottle not correctly labeled with contents, date, and ownership. Nanofab wipes and pipettes contaminated with PR must be placed in the beakers at the back of the spinner benches. Do not place PR contaminated materials in the trashcans, as this will allow photoresist fumes to migrate throughout the photolith area. Dispose of waste photoresist bottles by placing your labeled bottle in the yellow solvent waste cabinet in chase 5.
==Photoresist Strippers==
Use of heated strippers is limited to the stainless steel solvent benches. It is recommended you use the heated water bath to heat your stripper to 80 C. If you choose to use a hot plate to heat commercial photoresist strippers, we realize the hot plate surface temperature will need to be set above 80 C. Ideally, you should use a temperature probe inserted in the liquid as the feedback control for the hot plate. If you have the hot plate surface temperature set above 80 C, you must actively monitor the temperature of the stripper using a thermometer (or equivalent) and limit the stripper temperature to a maximum of 80 degrees C. You must be in the vicinity of the hotplate whenever you are heating strippers with the hot plate surface set above 80 degrees C if you are not using a temperature probe for feedback control of the hot plate.
'''The following photoresist strippers are stocked:'''
*Shipley 1165
*AZ 300T
*Shipley SVC-14
*PRX-127
==Chemical Waste Disposal==
===General Guidelines===
#The correct method of disposal for any chemical waste in our inventory is posted throughout the Nanofab, and also indicated in a file titled “Nanofab Chemical Storage/Use/Disposal”, located on the desktops of all optical microscope computers in the Nanofab.
#'''DO NOT DISPOSE OF SOLVENTS IN THE ACID DRAIN, OR ACIDS AND BASES IN THE SOLVENT DRAINS DUE TO POSSIBLE EXPLOSION OR THE CREATION OF OTHER HAZARDOUS SITUATIONS.'''
===All chemical waste is disposed in one of three methods:===
'''Acid Drains'''
:Most (but not all) water-based chemicals use this method. The acid drain empties into a waste chemical pH neutralization system located in the Nanofab mechanical room. This is the primary drain in the Nanofab. All liquids entering the sink drain at any polypropylene wet bench in the Nanofab run through this treatment system.

:To dispose of an acid or base, pour the liquid down the drain using the plenum flush. If you spill an acid or base onto the top surface of a bench, first rinse the surface thoroughly with water, then turn on the plenum flush to rinse the bench drain. Do not pour solvents down the acid drain.
'''Solvent Drains'''
:Most (but not all) solvent waste use this method. The solvent drain waste is pumped to a storage tank located in the Nanofab mechanical room. The waste solvents are transported to the EH&S chemical waste processing facility.
'''Collection of Waste'''
:Always fill out the Environmental Health and Safety waste disposal form when storing waste chemicals in the appropriate cabinet.
==Disposing of Empty Acid, Base, and Solvent Bottles==
Thoroughly rinse empty acid and base bottles three times with DI water, and then place in a trashcan. Place completely empty solvent bottles in the trashcan, making sure caps are in place. The exception to this policy is empty 49% HF bottles, which should be returned to the HF storage cabinet.
=Nanofab Apparel and Gloves=
==Bunnysuits and Booties==
You must wear a full bunnysuit to enter the Nanofab (hood, coverall, shoe covers). Facial covers are optional. Change bunnysuits weekly if used often, or at least once a month if used sporadically. Store coverall and hoods on numbered hangers in the gowning room. Reserve a hanger by placing a stainless steel “hanger reserve clip” on the hanger number. Store booties in the corresponding numbered slot in the bootie storage rack. Sandals or any other open toed shoes are not allowed in the Nanofab at any time.
==Eye Protection==
ANSI-approved eye protection must be worn at all times in the Nanofab, except when using optical microscopes. All eye protection eyewear must be ANSI-approved, as indicated by the “Z87” stamp required on the eyewear. You are welcome to use personal prescription safety eyewear which is ANSI-approved. Three types of safety eyewear are stocked in the Nanofab:
#'''Uvex Astro 3000''', for use by people who do not wear vision correction glasses. These safety glasses have a black frame.
#'''Uvex Astro OTG 3001''', for use by people who do wear vision correction glasses. These safety glasses are intended to be worn over vision correction glasses, and have a blue frame.
#'''U.S. Safety Faceshield'''. This full faceshields must be worn when working with dangerous chemicals or materials. Always use a faceshield when working at the HF bench.
==Aprons and Gloves==
===General Information===
Always wear gloves when in the Nanofab. Acid aprons are required when handling HF and other highly corrosive or toxic chemicals.
===Five types of gloves are available in the Nanofab:===
{| style="font-size: 95%;" border="1" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center; font-size: 95%"
|-bgcolor=#D0E7FF
!align=center bgcolor=#D0E7FF width="75"|'''Material'''
!align=center bgcolor=#D0E7FF width="150"|'''Manufacturer/Model'''
!align=center bgcolor=#D0E7FF width="75"|'''Color'''
!align=center bgcolor=#D0E7FF width="100"|'''Thickness'''
!align=center bgcolor=#D0E7FF width="150"|'''Stocked Sizes'''
|-
|PVC||Kimtech G5 Co-Polymer||Clear||0.10mm (4 mil)||S, M, L, XL
|-
|Latex||Kimtech G3 Latex||Tan||0.20mm (8 mil)||6, 6.5, 7, 7.5, 8, 8.5, 9, 10
|-
|Nitrile||Best CleaN-Dex Ultimate||White||0.15mm (6 mil)||XS, S, M, L, XL
|-
|Nitrile||MAPA StanSolve A-30||Green||0.28mm (11 mil)||7, 8, 9, 10, 11
|-
|Blend||MAPA TRIonic E-194||Tan||0.50mm (20 mil)||6, 7, 8, 9, 10, 11
|-
|}

*'''Polyvinyl Chloride (PVC)''': Kimtech G5 Co-Polymer
:A relatively inexpensive static free general-purpose glove, poor for most organics. These gloves break down rapidly in acetone.
*'''Latex''': Kimtech G3 Latex
:A general-purpose glove, poor for most organics, okay with aldehydes and keytones.
*'''Nitrile, White''': Best CleaN-Dex Ultimate
:This thin general purpose low cost glove offers marginal protection from many keytones, okay with some acids and bases.
*'''Nitrile, Green''': MAPA StanSolve A-30
:A thicker nitrile glove that affords increased protection over the CleaN-Dex white nitrile glove.
*'''Nitrile/Neoprene/Latex Blend''': MAPA TRIonic E-194
:This glove is the standard wet processing glove. A blend of latex, neoprene, and carboxylated nitrile, which offers excellent protection from corrosives and solvents such as HF and acetone. Highly resistant to cuts, tears, and snags. Always use this glove when processing with HF, TMAH, or Bromine.

=General Nanofab Information=
==Iris Camera Access System==
The iris camera access system provides security to the Nanofab, and allows tracking of the time each user spends in the Nanofab. ALWAYS scan in when entering the lab and scan out when exiting the lab, even when attending training sessions or performing beneficial work. Violating this policy will result in a two-week suspension for the first incidence, and possible permanent suspension for recurring incidences.
==Scheduling Tool/Equipment Use and Tool Supervisors==
Tool use is scheduled in one of two ways:
#either through the web-based system “Signupmonkey” at URL: http://signupmonkey.ece.ucsb.edu
#or first come/first served
*If a tool is listed on Signupmonkey, you must obtain permission from the supervisor of the tool in order to schedule use of the tool. This is typically accomplished by attending a training session.
*Some tools are not scheduled using Signupmonkey because the cycle period is typically short and use of the tool is most efficient without using signupmonkey.
*All tools in the Nanofab have a supervisor, regardless of whether the tool is listed on Signupmonkey.
*If you have problems with any tool, please inform the supervisor either by email, or direct communication (phone, etc).
==Credit for Beneficial Work in the Nanofab==
You will receive 1.5 hours of free processing time for each hour spent performing maintenance on lab equipment, conducting training sessions, or any time spent performing work beneficial to the general operation of the lab. Please indicate time spent performing beneficial work on the sign-up sheet just inside the gowning room.
==Wet Bench Housekeeping==
Always leave wet benches clean, dry, and organized. This includes cleaning up all spills, storing glassware and chemicals, etc. If a bench is not clean when you start a task, you still have the responsibility to leave it clean. If you leave a wet bench in disarray, or leave an unlabeled container on a bench, you can be suspended from the Nanofab. Do not cover the exhaust holes on the bench tops, as this will impede the laminar flow of air through the bench and possibly expose you or other Nanofab users to toxic fumes.
==Hotplates==
Hot plates used for heating chemicals must be attended. This means you must be in the Nanofab and near the hot plat whenever it is in use. (This does not apply to PR baking hotplates on the PR spinner benches.)
==Nanofab Paper==
The only paper allowed in the lab is Nanofab type paper. We stock many different types of Nanofab paper for the lab, including photocopier (or laserwriter) paper, sticky labels, and assorted notebooks. If you require a special type of Nanofab paper, ask and we will try to obtain it. You can laminate regular paper for use in the lab. Use pens, not pencils, for writing in the lab.
==Nanofab Wipes==
We stock four types of wipes in the lab
#'''S/Pec-Wipe 3''' is a cellulose/polyester blend with high absorption but medium particle and fiber generation.
#'''Berkshire Poly1200''' is a 100% knit polyethylene wipe with low particulate generation, but also with relatively low absorption.
#'''PRO-STAT''' is a cellulose blend presaturated with isopropyl alcohol and DI water.
#'''BIOHAZ''' are used to line photoresist spinner catch cups
==Preparing Equipment for Entry into the Nanofab==
All equipment entering the lab must be clean. The procedure for cleaning equipment for entry is:
#Vacuum while equipment is outside the lab
#Wipe down all accessible surfaces with propanol or EKC "Lab Clean" using Nanofab wipes while equipment is outside the lab
#Move equipment into the lab
#Vacuum with HEPA filtered vacuum cleaner when inside the lab
==Maintenance Ways==
You may enter maintenance ways without wearing a bunnysuit from outside the Nanofab, or while wearing a bunnysuit from inside the Nanofab.
==Notes on Particle Counts in the Nanofab==
The Nanofab was surveyed with a particle counter, with generally good results. All wet bench work surfaces have extremely low particle counts, better than class 10. The open areas in the lithography area are all better than class 100, and mostly better than class 10. The remainder of the Nanofab tests better than class 1000, and often better than class 100. The Nanofab design specifications stipulated class 100 for litho, class 1000 for everything else. The Nanofab is easily meeting these specs. 

The effectiveness of facemasks was investigated by placing the particle counter directly under a person’s neck while the person moved his head back and forth. Facemasks reduced particle counts, from the equivalent of class 500 without masks to class 100 with masks. Again, this was sampling just below the neck, not at typical substrate surfaces.

The choice of wipes used in the Nanofab has a more pronounced affect on particle counts. In general, wipes trade absorbency for low particle generation. The Spec-Wipe 3 is the stocked polyester/cellulose blend, high absorbency wipe designed for use in class 100 cleanrooms. Dragging the sampling tube across the surface of a Spec-Wipe 3 resulted in a class 1000 level particle counts. The Berkshire Polx 1200 wipe is the stocked low particle count, 100% knit polyester wipe. This wipe is not as absorbent at the Spec-Wipe 3, but generates fewer particles. Dragging the sampling tube across the surface of a Berkshire Polx 1200 wipe resulted in lower than class 100 level particle counts.

To summarize, the Nanofab is meeting and exceeding design specifications for particle counts. If you would like to further reduce particles on your substrates, you may implement the following practices, in order of effectiveness:
*Use only Berkshire Polx 1200 wipes if your process requires placing your substrate on a wipe
*Use a facemask if your process requires you to work above your substrate on a table. Facemasks do not reduce particle counts on substrates in wet benches.
==Procedure for the Use and Handling of Precious Metals==
Gold, platinum, palladium, and various alloys of these metals are stocked by the UCSB Nanofab. Each research group can be issued a precious metal supply. This supply must be stored in a small lockable container, along with a log sheet for recording the use of these metals. Precious metas, the lockable security container, and log sheets will be issued by the Nanofab manager. All use of precious metals must be accurately recorded on the log sheet, and include user name, date, metal type, metal weight before use, and metal weight after use. Multiple digital scales have been acquired and placed throughout the Nanofab to facilitate weighing of these metals. When requesting additional precious metals, the completed log sheet must be presented to the Nanofab manager. Any discrepancies in recorded precious metal use will result in charges to the principle investigator corresponding to the value of the precious metal discrepancy.
=Communications and Internet Access=
==Wireless Access in the Nanofab and Couryard Café==
Currently, we have two wireless networks available to Nanofab users:
===Nanofab Wireless Access:===
The Nanofab has three access points located in the Nanofab. This network is operated by Nanofab staff, and offers anonymous access. You may connect to this network by selecting the following network and entering the password.
*network: ''nanofab''
*password: ''ece!nanofab''

===UCSB Wireless Network===
The Courtyard Café, as well as other locations on campus, provide access to the UCSB wireless network.
*'''External Users''' (Other universities or industrial users)
:Access accounts to external Nanofab user (other university or industrial users) are provided as requested by the Nanofab manager. Please contact the Nanofab manager if you would like an account.
*'''Local academic users''' (UCSB grad students, staff, etc)
:Local academic users can access the UCSB wireless network by using their UCSBNetID and password. Information regarding setup of a UCSBNetID and password: https://my.sa.ucsb.edu/U-reset/AccountManagement.aspx

=Ball Bonding, Wire Bonding, and Packaging Services=
We have established an arrangement with PLT Technology to provide various ball bonding and packaging services to UCSB Nanofab users. The service can be provided for you by PLT technology, a local Santa Barbara company, and will be invoiced to your PI through our normal Nanofab recharge system. This service is offered to both academic and industrial Nanofab researchers. A description of the services and associated rates is below. Peter Tihanyi of PLT Technology will provide the service. Peter has a high level of expertise with these processes, especially involving unique or research-type substrates and processes. If you would like to utilize Peter's services, please contact Peter by email to start the process. All equipment noted below is in-house at PLT and in good working condition.

::Peter Tihanyi 
::PLT Technology, Inc 
::420 East Haley Street 
::Santa Barbara, CA 93101 
::Phone: 805-280-1834 
::[http://www.laserdiodeservices.com] 
::pltlaser@silcom.com 

*Au wire bonding service using K&S model 4124 gold ball bonder. The charge is $120 for the setup of the system and a minimum charge of $120, which includes up to 20 Au wires bonded. Each additional set of 20 wires is $120.
*Semiconductor device soldering (laser diodes, other lasers, electronics, etc) using indium deposition on a heat sink in high vacuum (3x10-7 tore). Device placement is accomplished using a Royce model 110 pick and place station with ± 0.5um accuracy on heat sink, with flux/organics free soldering in a vacuum chamber using protective gas during the soldering process. This flux-free soldering process was developed by Peter Tihanyi for spacecraft applications. The charge for this process is $120 per hour. There is a minimum charge of 8 hours for each soldering process which includes deposition of indium, chip placement, and chip soldering. The number of devices that can be soldered at the same time depends primarily on the heat sink size. We can supply C-mounts and 9mm packages for $30 each.
*Vacuum or N2 back-fill of 9mm and TO-3 packages utilizing a POLARIS Accu-Weld 4000 tool. This tool can also be setup for other package configurations. PLT has fixtures for both 9mm and TO-3 packages. However, new fixturing will be required for other package types. The service for 9mm and TO-3 packages up to 10 pieces is $800. We can supply the package for $30 each.
*Laser diode testing for wavelengths from 400nm to 1600nm utilizing a ILX Lightwave model LPA-9084 laser diode parameter analyzer. The charge is $120 per hour for C-mount. The use of other package types is dependent on the heat sink size, but many other package types can be accommodated.
*Semiconductor substrate scribe and break service utilizing a Loomis model 100 LSD tool. The setup charge is$120, with a rate of $120 per hour.
*Lapping and polishing service utilizing a Logitech model PM2 tool. The rate is $120 per hour, with a minimum of 8 hours. Various substrate materials can be processed, including Ga and InP.

=Fostering SEI Research at NNIN =
Through our participation in the National Nanotechnology Infrastructure Network (NNIN), we are committed to fostering research on the social and ethical implications of nanotechnology. Nanofab users are at the forefront of nanotechnology and can offer unique insight into this research. To this end, from time to time, users may be invited to participate in a research project, such as by answering a survey or participating in an interview. Although users are free to decline, and their decision to participate or not to participate will have no bearing on their ability to use the Nanofab, we sincerely hope that users will consider each request and accept as many invitations as they can in the spirit of advancing knowledge on social and ethical issues and helping to ensure that NNIN remains a leader in nanotechnology innovation.   We are also committed to ensuring that these projects are relevant to NNIN, unburdensome to its users, and have met appropriate ethical standards. Thus, we will only release users' contact information to projects that have received prior approval from NNIN.  

If you have any questions, please contact NNIN's Director, Dr. Sandip Tiwari st222@cornell.edu or NNIN's SEI Coodinator, Dr. Katherine McComas kam19@cornell.edu.
=Nanofab Summer Intern Policy =

Whenever the intern is in the Nanofab, the mentor must also be in the Nanofab. Interns may use tools that do not require training sessions, such as microscopes, etc, unless the supervisor of these tools objects. Interns can work at photolith benches, and use components of the photolith benches, unless the supervisor of the bench objects. Interns will need to follow normal Nanofab access procedures, including initiation meeting with the Nanofab manager.

Interns will be allowed to use one or two mainline Nanofab tools after completing training conducted by Nanofab staff. Mainline tools are tools scheduled through our web site signupmonkey. Certain tools will be unavailable to interns due to extremely heavy use or other concerns.

==Tools unavailable for intern use during Summer 2012:==
{|
|-valign="top"
|
*[[Stepper 1 (GCA 6300)]]
*[[Stepper 2 (AutoStep 200)]]
*[[Stepper 3 (ASML DUV)]]
*[[E-Beam Lithography System (JEOL JBX-6300FS)]]
*[[AFM-based Nanolithography Tool (NanoMan)]]
*[[Wafer Bonder (SUSS SB6-8E)]]
*[[Holographic Lith/PL Setup (Custom)]]
*[[E-Beam 3 (Temescal)]]
*[[E-Beam 4 (CHA)]]
*[[Sputter 1 (Custom)]]
*[[Sputter 2 (SFI Endeavor)]]
*[[Sputter 5 (Lesker AXXIS)]]
*[[ICP-PECVD (Unaxis VLR)]]
*[[Ion Beam Deposition (Veeco NEXUS)]]
*[[RIE 1 (Custom)]]
*[[RIE 5 (PlasmaTherm)]]
*[[Si Deep RIE (PlasmaTherm/Bosch Etch)]]
||
*[[ICP-Etch (Unaxis VLR)]]
*[[ICP Etch 1 (Panasonic E626I)]]
*[[ICP Etch 2 (Panasonic E640)]]
*[[XeF2 Etch (Xetch)|XeF2 Etch (Xetch)]]
*[[Plasma Activation (EVG 810)]]
*[[HF Vapor Etch]]
*Wet Etch Benches (Acid etch and HF etch)
*Wet Etch Wafer Scale Bench (Acid etch and HF etch)
*[[Chemical-Mechanical Polisher (Logitech)]]
*[[Rapid Thermal Processor (AET RX6)]]
* [[Flip-Chip Bonder (Finetech)]]
* [[Dicing Saw (ADT)]]
* [[Field Emission SEM 1 (FEI Sirion)]]
* [[Field Emission SEM 2 (JEOL 7600F)]]
* [[Surface Analysis (KLA/Tencor Surfscan)]]
* [[Deep UV Optical Microscope (Olympus)]]
|}

Lab Rules OLD 2018

2016-07-25T18:22:21Z

Reynolds t: /* Ball Bonding, Wire Bonding, and Packaging Services */

For a printable PDF version of the Lab Rules, please '''[[Media:LabRules2015.pdf|CLICK HERE]]'''

While working in the Nanofab, you are surrounded by dangerous and deadly chemicals, gases, high voltages, radiation, and mechanical systems. The responsibility lies with users and staff to act in a professional, courteous, and safe manner at all times while in the facility. Users violating the operating and safety rules of the facility or endangering the safety of themselves or other users will be denied further access to the facility.

This document attempts to define acceptable actions and behavior for the users of the Nanofabrication facility. However, it is impossible to define a policy for every conceivable situation. Nanofab users are expected to employ common sense and a high degree of prudence while working in this facility.

=General Nanofabrication Facility Safety Policies=
==Visual and Audible Alarms in the Nanofab==
#'''Fire Alarm''': White strobe with high volume audible alarm, located throughout the Nanofab. If this alarm activates, immediately leave the Nanofab through the nearest exit. Do not remove bunnysuit until outside.
#'''Toxic Gas Alarm''': Blue strobe with high volume audible alarm, located at both ends of each bay. If this alarm activates in one bay, do not enter the bay. If this alarm activates throughout the Nanofab, immediately leave the Nanofab through the nearest exit. Do not remove bunnysuit until outside.
#'''Wet Bench Alarms''': Small illuminated visual alarms with buzzers. Each wet bench may have multiple alarms, with a placard beside the alarms indicating meaning of alarm and proper response. You must follow proper response if you see or hear a wet bench alarm.
#'''Equipment Alarms''': Please notify supervisor of tool if equipment alarm is activated.
==Emergencies and First Aid==
If you believe you may have been exposed to a toxic substance or gas, if appropriate rinse in the emergency shower. In all cases, quickly go to the emergency room at Goleta Valley Hospital. Emergency showers and eye wash stations are located at the south end of all bays. An enclosed emergency showers is located in bay 5 beside the wet etch benches. A first aid kit is located in the gowning room, and on the south wall at the end of bays 2, 4, and 6. Chemical spill clean-up kits are located on the wire shelving in each bay containing a wet bench. After using a spill cleanup kit, please inform the Nanofab manager. Fire extinguishers are located on the south end of each clean bay, and the north end of each maintenance chase.
==Hydrofluoric Acid (HF) Exposure==
===HF Exposure to Skin===
#Immediately rinse exposed area for 5 minutes in safety shower, flush affected area thoroughly. Speed and thoroughness in washing off the acid is of primary importance. An enclosed emergency showers is located in bay 5 across from the HF/TMAH wet processing bench. If using the emergency shower at the end of the bay, water will spill onto floor of Nanofab - this is OK.
#Immediately after rinsing, start massaging 2.5% calcium gluconate gel into the affected area. The individual applying the gel should wear gloves. Apply gel frequently and massage continuously. Calcium gluconate gel is located to the left of the HF bench in a pocket mounted to the side of the bench.
#Seek immediate medical attention by calling 9-911.
#Continue rubbing gel on affected area until advised otherwise by physician.
===HF Exposure to Eyes===
#Immediately rinse exposed area for 15 minutes at eye wash station. Hold eyelids open during irrigation to allow thorough flushing of the eyes. Water will spill onto floor of Nanofab - this is OK.
#Seek immediate medical attention by calling 9-911.
==TetraMethylAmmonium Hydroxide (TMAH) Exposure==
TMAH is a component in several photoresist developers and strippers, and is also used in the Nanofab as an ebeam resist developer and silicon etchant. The concentration of TMAH in photoresist developer and stripper solutions is relatively low (2-4%). However, the ebeam developer and silicon etchant utilize a solution of 25% TMAH.
===TMAH Exposure to Skin, 25% Concentration===
#Immediately rinse exposed area for at least 15 minutes in safety shower, flush affected area thoroughly. An enclosed emergency showers is located in bay 5 across from the HF/TMAH wet etch bench. If using the emergency shower at the end of the bay, water will spill onto floor of Nanofab - this is OK.
#Seek immediate medical attention by calling 9-911
===TMAH Exposure to Skin, 2%-4%Concentration===
#If small area skin exposure (<1% body surface area, <approximately 25 inches2) to 2-4% TMAH, immediately rinse exposed area until skin feels normal (not greasy). If irritation occurs, consult a physician.
#If medium to large area skin exposure (>1% body surface area, >approximately 25 inches2) to 2-4% TMAH, immediately rinse exposed area for at least 15 minutes in safety shower, flush affected area thoroughly. An enclosed emergency showers is located in bay 5 across from the HF/TMAH wet etch bench. If using the emergency shower at the end of the bay, water will spill onto floor of Nanofab - this is OK. Seek immediate medical attention by calling 9-911.
===TMAH Exposure to Eyes, Any Concentration===
#Immediately rinse exposed area for at least 15 minutes at eye wash station. Hold eyelids open during irrigation to allow thorough flushing of the eyes. Water will spill onto floor of Nanofab - this is OK.
#Seek immediate medical attention by calling 9-911
==Pregnancy and the Nanofab==
The effects on a fetus of many of the chemicals utilized in the Nanfab is unknown. The Nanofab is designed to prevent exposure to the fumes and vapors from these chemicals, but absolute 100% containment is impossible, and it is possible to be exposed to extremely small concentrations of these materials. Consequently, we strongly recommend that you do not work in the Nanofab if you know or suspect that you are pregnant.
=Chemicals and Hazardous Materials the Nanofab=
==[[MSDS]]==
The MSDS contains safety information regarding exposure, first aid, handling, storage, fire hazard, etc., for all chemicals, gases, and materials present in the facility. Before using an unfamiliar material, consult the MSDS to determine any potential hazards. Consult the MSDS to determine the proper course of action if someone has been exposed to a gas or chemical, or a spill has occurred. A book containing the MSDS for any material used in the Nanofab is located just inside the gowning room. Additionally, an electronic version of the MDSD in .pdf format for all chemicals in our inventory is located on the desktops of all the computers connected to microscopes in the Nanofab.
==Introducing New Materials Into the Nanofab==
All new chemicals, compounds, gases, materials for evaporation, etc., must be approved by the Nanofab manager before introduction into the facility. In order to introduce a new material into the Nanofab, a MSDS (Material Safety Data Sheet) for the material in .pdf format must be submitted to the Nanofab manager, plus a description of the proposed process utilizing the new material. The description of the process should include the goals of the process, and the mechanics of the process in reasonable detail. The Nanofab manager will determine if the material will be allowed in the Nanofab, and if so, where the new material will be stored, where the material is to be used (typically a specific wet bench), and how to dispose of the waste.
==Containers and Labeling==
Chemical containers such as beakers, bottles, etc, must be labeled with contents, date, and ownership (individual or group name). This information can be written on a wipe under the container. The exceptions to this policy are as follows:
#A beaker in use on a solvent bench can contain acetone, propanol, or methanol if the beaker is labeled with the text: “acetone/propanol/methanol”. The generic label “solvent” is insufficient. Beakers containing solvents other that acetone, propanol, or methanol must be labeled with the specific solvent.
#Indication of date is no longer required on beakers in use on solvent benches. All beakers in use on solvent benches must be labeled with contents and ownership.
#Beakers in use at lithography developer benches must be labeled with exact contents and ownership (individual or group name). The generic label “developer” is insufficient.
#Indication of date is no longer required on beakers in use on the developer benches. All beakers in use on developer benches must be labeled with contents and ownership.
==Chemical Storage==
*'''Acid Storage'''
:The primary acid storage area (except HF) is the acid cabinet located next to the acid wet processing benches in bay 5. HF acid is stored in the HF cabinet
*'''Base Storage'''
:The primary base storage area is the base cabinet located next to the acid wet processing bench.
*'''Solvent Storage'''
:The primary solvent storage area is the stainless steel flammables cabinet in bay 6. You may store small amounts of solvents in labeled containers on the shelves in the photolith area.
==Solvent Processing==
Solvents with flashpoints below 55 deg C cannot be heated in the Nanofab. This includes acetone, methanol, isopropanol, ethanol, and toluene. All solvent processing is limited to the stainless steel solvent processing benches. Do not perform standard solvent processing at the photoresist spinner benches.
==Wet Etch and HF/TMAH Processing==
All wet processing involving acids and bases (except HF and TMAH) is limited to the acid/base benches. All HF and Bromine processing is limited to the HF or HF/TMAH benches - NO EXCEPTIONS. All TMAH processing is limited to the HF/TMAH bench. When working at the HF or HF/TMAH benches, always wear a chemical apron, face shield, and “Trionic” gloves. Store all HF and bromine in labeled containers in the HF acid/bromine storage cabinet. Store TMAH is the base storage cabinet. Please keep open containers of these two toxic chemicals away from the edge of the bench. All waste solutions containing any HF is poured down the drain, and treated in the Nanofab acid treatment system. Empty HF bottles should be returned to the HF acid storage cabinet. You may not deviate from this policy unless you have prior approval by the Nanofab manager.
==Photoresist Coating or Spinning==
Standard solvent-based photoresist spinning should be perfomed at the PR spinner benches. Some lithography chemicals utilize non-standard chemicals in place of solvents, which may require spinning at a different bench. If using a non-standard lithography chemicals, please provide the MSDS and process instructions to the laboratory manager for direction in this matter.
==Developer Benches==
Developer benches are used for developing photoresists only. In general, solvents are not allowed at the developer benches because solvent fumes adversely affect the develop process. Solvent based liftoff processes are not allowed at the developer benches E-beam develop processes may utilize solvents, and should be performed at the solvent benches in the photolith area.
==Plating Bench==
The Solvent/Plating bench contains cyanide-based plating and etching solutions. Never use acid solutions at this bench.
==Photoresist Storage, Handling, and Waste==
Photoresists can contain many solvents and aromatics that are potentially toxic. Special care must be exercised when handling these materials. All photoresist fumes must be exhausted or otherwise contained through careful procedures at the photolith wet benches. The primary photoresist storage area is the lab refrigerator located bay 6. Some resists do not need refrigeration and are stored in the flammables cabinet next to the refrigerator (PMGI, PMMA, etc). Before transferring refrigerated PR from the main bottle to your in-use bottle, place main bottle on designated photoresist warming racks for a minimum of 2 hours, or until the bottle is at room temperature, whichever is longer. Large transfer pipettes are provided for transferring PR from the main bottle to your in-use bottle. To prevent PR flakes from contaminating the main bottle, please inspect the main bottle cap and bottle threads for PR, and remove any PR with an acetone wipe before replacing cap. After transfer, place main bottle back in the refrigerator. You may store your in-use, fully labeled PR bottle in the stainless steel PR storage cabinet in a bin labeled with your research group name. Disposable droppers, syringes, and filters are provided for the application of photoresist on your substrate. You may store photoresist in the PR storage cabinet for a maximum of 6 months. Nanofab staff will remove in-use PR bottles older than 6 months, and will also remove any bottle not correctly labeled with contents, date, and ownership. Nanofab wipes and pipettes contaminated with PR must be placed in the beakers at the back of the spinner benches. Do not place PR contaminated materials in the trashcans, as this will allow photoresist fumes to migrate throughout the photolith area. Dispose of waste photoresist bottles by placing your labeled bottle in the yellow solvent waste cabinet in chase 5.
==Photoresist Strippers==
Use of heated strippers is limited to the stainless steel solvent benches. It is recommended you use the heated water bath to heat your stripper to 80 C. If you choose to use a hot plate to heat commercial photoresist strippers, we realize the hot plate surface temperature will need to be set above 80 C. Ideally, you should use a temperature probe inserted in the liquid as the feedback control for the hot plate. If you have the hot plate surface temperature set above 80 C, you must actively monitor the temperature of the stripper using a thermometer (or equivalent) and limit the stripper temperature to a maximum of 80 degrees C. You must be in the vicinity of the hotplate whenever you are heating strippers with the hot plate surface set above 80 degrees C if you are not using a temperature probe for feedback control of the hot plate.
'''The following photoresist strippers are stocked:'''
*Shipley 1165
*AZ 300T
*Shipley SVC-14
*PRX-127
==Chemical Waste Disposal==
===General Guidelines===
#The correct method of disposal for any chemical waste in our inventory is posted throughout the Nanofab, and also indicated in a file titled “Nanofab Chemical Storage/Use/Disposal”, located on the desktops of all optical microscope computers in the Nanofab.
#'''DO NOT DISPOSE OF SOLVENTS IN THE ACID DRAIN, OR ACIDS AND BASES IN THE SOLVENT DRAINS DUE TO POSSIBLE EXPLOSION OR THE CREATION OF OTHER HAZARDOUS SITUATIONS.'''
===All chemical waste is disposed in one of three methods:===
'''Acid Drains'''
:Most (but not all) water-based chemicals use this method. The acid drain empties into a waste chemical pH neutralization system located in the Nanofab mechanical room. This is the primary drain in the Nanofab. All liquids entering the sink drain at any polypropylene wet bench in the Nanofab run through this treatment system.

:To dispose of an acid or base, pour the liquid down the drain using the plenum flush. If you spill an acid or base onto the top surface of a bench, first rinse the surface thoroughly with water, then turn on the plenum flush to rinse the bench drain. Do not pour solvents down the acid drain.
'''Solvent Drains'''
:Most (but not all) solvent waste use this method. The solvent drain waste is pumped to a storage tank located in the Nanofab mechanical room. The waste solvents are transported to the EH&S chemical waste processing facility.
'''Collection of Waste'''
:Always fill out the Environmental Health and Safety waste disposal form when storing waste chemicals in the appropriate cabinet.
==Disposing of Empty Acid, Base, and Solvent Bottles==
Thoroughly rinse empty acid and base bottles three times with DI water, and then place in a trashcan. Place completely empty solvent bottles in the trashcan, making sure caps are in place. The exception to this policy is empty 49% HF bottles, which should be returned to the HF storage cabinet.
=Nanofab Apparel and Gloves=
==Bunnysuits and Booties==
You must wear a full bunnysuit to enter the Nanofab (hood, coverall, shoe covers). Facial covers are optional. Change bunnysuits weekly if used often, or at least once a month if used sporadically. Store coverall and hoods on numbered hangers in the gowning room. Reserve a hanger by placing a stainless steel “hanger reserve clip” on the hanger number. Store booties in the corresponding numbered slot in the bootie storage rack. Sandals or any other open toed shoes are not allowed in the Nanofab at any time.
==Eye Protection==
ANSI-approved eye protection must be worn at all times in the Nanofab, except when using optical microscopes. All eye protection eyewear must be ANSI-approved, as indicated by the “Z87” stamp required on the eyewear. You are welcome to use personal prescription safety eyewear which is ANSI-approved. Three types of safety eyewear are stocked in the Nanofab:
#'''Uvex Astro 3000''', for use by people who do not wear vision correction glasses. These safety glasses have a black frame.
#'''Uvex Astro OTG 3001''', for use by people who do wear vision correction glasses. These safety glasses are intended to be worn over vision correction glasses, and have a blue frame.
#'''U.S. Safety Faceshield'''. This full faceshields must be worn when working with dangerous chemicals or materials. Always use a faceshield when working at the HF bench.
==Aprons and Gloves==
===General Information===
Always wear gloves when in the Nanofab. Acid aprons are required when handling HF and other highly corrosive or toxic chemicals.
===Five types of gloves are available in the Nanofab:===
{| style="font-size: 95%;" border="1" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center; font-size: 95%"
|-bgcolor=#D0E7FF
!align=center bgcolor=#D0E7FF width="75"|'''Material'''
!align=center bgcolor=#D0E7FF width="150"|'''Manufacturer/Model'''
!align=center bgcolor=#D0E7FF width="75"|'''Color'''
!align=center bgcolor=#D0E7FF width="100"|'''Thickness'''
!align=center bgcolor=#D0E7FF width="150"|'''Stocked Sizes'''
|-
|PVC||Kimtech G5 Co-Polymer||Clear||0.10mm (4 mil)||S, M, L, XL
|-
|Latex||Kimtech G3 Latex||Tan||0.20mm (8 mil)||6, 6.5, 7, 7.5, 8, 8.5, 9, 10
|-
|Nitrile||Best CleaN-Dex Ultimate||White||0.15mm (6 mil)||XS, S, M, L, XL
|-
|Nitrile||MAPA StanSolve A-30||Green||0.28mm (11 mil)||7, 8, 9, 10, 11
|-
|Blend||MAPA TRIonic E-194||Tan||0.50mm (20 mil)||6, 7, 8, 9, 10, 11
|-
|}

*'''Polyvinyl Chloride (PVC)''': Kimtech G5 Co-Polymer
:A relatively inexpensive static free general-purpose glove, poor for most organics. These gloves break down rapidly in acetone.
*'''Latex''': Kimtech G3 Latex
:A general-purpose glove, poor for most organics, okay with aldehydes and keytones.
*'''Nitrile, White''': Best CleaN-Dex Ultimate
:This thin general purpose low cost glove offers marginal protection from many keytones, okay with some acids and bases.
*'''Nitrile, Green''': MAPA StanSolve A-30
:A thicker nitrile glove that affords increased protection over the CleaN-Dex white nitrile glove.
*'''Nitrile/Neoprene/Latex Blend''': MAPA TRIonic E-194
:This glove is the standard wet processing glove. A blend of latex, neoprene, and carboxylated nitrile, which offers excellent protection from corrosives and solvents such as HF and acetone. Highly resistant to cuts, tears, and snags. Always use this glove when processing with HF, TMAH, or Bromine.

=General Nanofab Information=
==Iris Camera Access System==
The iris camera access system provides security to the Nanofab, and allows tracking of the time each user spends in the Nanofab. ALWAYS scan in when entering the lab and scan out when exiting the lab, even when attending training sessions or performing beneficial work. Violating this policy will result in a two-week suspension for the first incidence, and possible permanent suspension for recurring incidences.
==Scheduling Tool/Equipment Use and Tool Supervisors==
Tool use is scheduled in one of two ways:
#either through the web-based system “Signupmonkey” at URL: http://signupmonkey.ece.ucsb.edu
#or first come/first served
*If a tool is listed on Signupmonkey, you must obtain permission from the supervisor of the tool in order to schedule use of the tool. This is typically accomplished by attending a training session.
*Some tools are not scheduled using Signupmonkey because the cycle period is typically short and use of the tool is most efficient without using signupmonkey.
*All tools in the Nanofab have a supervisor, regardless of whether the tool is listed on Signupmonkey.
*If you have problems with any tool, please inform the supervisor either by email, or direct communication (phone, etc).
==Credit for Beneficial Work in the Nanofab==
You will receive 1.5 hours of free processing time for each hour spent performing maintenance on lab equipment, conducting training sessions, or any time spent performing work beneficial to the general operation of the lab. Please indicate time spent performing beneficial work on the sign-up sheet just inside the gowning room.
==Wet Bench Housekeeping==
Always leave wet benches clean, dry, and organized. This includes cleaning up all spills, storing glassware and chemicals, etc. If a bench is not clean when you start a task, you still have the responsibility to leave it clean. If you leave a wet bench in disarray, or leave an unlabeled container on a bench, you can be suspended from the Nanofab. Do not cover the exhaust holes on the bench tops, as this will impede the laminar flow of air through the bench and possibly expose you or other Nanofab users to toxic fumes.
==Hotplates==
Hot plates used for heating chemicals must be attended. This means you must be in the Nanofab and near the hot plat whenever it is in use. (This does not apply to PR baking hotplates on the PR spinner benches.)
==Nanofab Paper==
The only paper allowed in the lab is Nanofab type paper. We stock many different types of Nanofab paper for the lab, including photocopier (or laserwriter) paper, sticky labels, and assorted notebooks. If you require a special type of Nanofab paper, ask and we will try to obtain it. You can laminate regular paper for use in the lab. Use pens, not pencils, for writing in the lab.
==Nanofab Wipes==
We stock four types of wipes in the lab
#'''S/Pec-Wipe 3''' is a cellulose/polyester blend with high absorption but medium particle and fiber generation.
#'''Berkshire Poly1200''' is a 100% knit polyethylene wipe with low particulate generation, but also with relatively low absorption.
#'''PRO-STAT''' is a cellulose blend presaturated with isopropyl alcohol and DI water.
#'''BIOHAZ''' are used to line photoresist spinner catch cups
==Preparing Equipment for Entry into the Nanofab==
All equipment entering the lab must be clean. The procedure for cleaning equipment for entry is:
#Vacuum while equipment is outside the lab
#Wipe down all accessible surfaces with propanol or EKC "Lab Clean" using Nanofab wipes while equipment is outside the lab
#Move equipment into the lab
#Vacuum with HEPA filtered vacuum cleaner when inside the lab
==Maintenance Ways==
You may enter maintenance ways without wearing a bunnysuit from outside the Nanofab, or while wearing a bunnysuit from inside the Nanofab.
==Notes on Particle Counts in the Nanofab==
The Nanofab was surveyed with a particle counter, with generally good results. All wet bench work surfaces have extremely low particle counts, better than class 10. The open areas in the lithography area are all better than class 100, and mostly better than class 10. The remainder of the Nanofab tests better than class 1000, and often better than class 100. The Nanofab design specifications stipulated class 100 for litho, class 1000 for everything else. The Nanofab is easily meeting these specs. 

The effectiveness of facemasks was investigated by placing the particle counter directly under a person’s neck while the person moved his head back and forth. Facemasks reduced particle counts, from the equivalent of class 500 without masks to class 100 with masks. Again, this was sampling just below the neck, not at typical substrate surfaces.

The choice of wipes used in the Nanofab has a more pronounced affect on particle counts. In general, wipes trade absorbency for low particle generation. The Spec-Wipe 3 is the stocked polyester/cellulose blend, high absorbency wipe designed for use in class 100 cleanrooms. Dragging the sampling tube across the surface of a Spec-Wipe 3 resulted in a class 1000 level particle counts. The Berkshire Polx 1200 wipe is the stocked low particle count, 100% knit polyester wipe. This wipe is not as absorbent at the Spec-Wipe 3, but generates fewer particles. Dragging the sampling tube across the surface of a Berkshire Polx 1200 wipe resulted in lower than class 100 level particle counts.

To summarize, the Nanofab is meeting and exceeding design specifications for particle counts. If you would like to further reduce particles on your substrates, you may implement the following practices, in order of effectiveness:
*Use only Berkshire Polx 1200 wipes if your process requires placing your substrate on a wipe
*Use a facemask if your process requires you to work above your substrate on a table. Facemasks do not reduce particle counts on substrates in wet benches.
==Procedure for the Use and Handling of Precious Metals==
Gold, platinum, palladium, and various alloys of these metals are stocked by the UCSB Nanofab. Each research group can be issued a precious metal supply. This supply must be stored in a small lockable container, along with a log sheet for recording the use of these metals. Precious metas, the lockable security container, and log sheets will be issued by the Nanofab manager. All use of precious metals must be accurately recorded on the log sheet, and include user name, date, metal type, metal weight before use, and metal weight after use. Multiple digital scales have been acquired and placed throughout the Nanofab to facilitate weighing of these metals. When requesting additional precious metals, the completed log sheet must be presented to the Nanofab manager. Any discrepancies in recorded precious metal use will result in charges to the principle investigator corresponding to the value of the precious metal discrepancy.
=Communications and Internet Access=
==Wireless Access in the Nanofab and Couryard Café==
Currently, we have two wireless networks available to Nanofab users:
===Nanofab Wireless Access:===
The Nanofab has three access points located in the Nanofab. This network is operated by Nanofab staff, and offers anonymous access. You may connect to this network by selecting the following network and entering the password.
*network: ''nanofab''
*password: ''ece!nanofab''

===UCSB Wireless Network===
The Courtyard Café, as well as other locations on campus, provide access to the UCSB wireless network.
*'''External Users''' (Other universities or industrial users)
:Access accounts to external Nanofab user (other university or industrial users) are provided as requested by the Nanofab manager. Please contact the Nanofab manager if you would like an account.
*'''Local academic users''' (UCSB grad students, staff, etc)
:Local academic users can access the UCSB wireless network by using their UCSBNetID and password. Information regarding setup of a UCSBNetID and password: https://my.sa.ucsb.edu/U-reset/AccountManagement.aspx

=Ball Bonding, Wire Bonding, and Packaging Services=
We have established an arrangement with PLT Technology to provide various ball bonding and packaging services to UCSB Nanofab users. The service can be provided for you by PLT technology, a local Santa Barbara company, and will be invoiced to your PI through our normal Nanofab recharge system. This service is offered to both academic and industrial Nanofab researchers. A description of the services and associated rates is below. Peter Tihanyi of PLT Technology will provide the service. Peter has a high level of expertise with these processes, especially involving unique or research-type substrates and processes. If you would like to utilize Peter's services, please contact Peter by email to start the process. All equipment noted below is in-house at PLT and in good working condition.

::Peter Tihanyi 
::PLT Technology, Inc 
::420 East Haley Street 
::Santa Barbara, CA 93101 
::Phone: 805-280-1834 
::[http://www.laserdiodeservices.com] 
::pltlaser@silcom.com 

*Au wire bonding service using K&S model 4124 gold ball bonder. The charge is $120 for the setup of the system and a minimum charge of $120, which includes up to 20 Au wires bonded. Each additional set of 20 wires is $120.
*Semiconductor device soldering (laser diodes, other lasers, electronics, etc) using indium deposition on a heat sink in high vacuum (3x10-7 tore). Device placement is accomplished using a Royce model 110 pick and place station with ± 0.5um accuracy on heat sink, with flux/organics free soldering in a vacuum chamber using protective gas during the soldering process. This flux-free soldering process was developed by Peter Tihanyi for spacecraft applications. The charge for this process is $120 per hour. There is a minimum charge of 8 hours for each soldering process which includes deposition of indium, chip placement, and chip soldering. The number of devices that can be soldered at the same time depends primarily on the heat sink size. We can supply C-mounts and 9mm packages for $30 each.
*Vacuum or N2 back-fill of 9mm and TO-3 packages utilizing a POLARIS Accu-Weld 4000 tool. This tool can also be setup for other package configurations. PLT has fixtures for both 9mm and TO-3 packages. However, new fixturing will be required for other package types. The service for 9mm and TO-3 packages up to 10 pieces is $800. We can supply the package for $30 each.
*Laser diode testing for wavelengths from 400nm to 1600nm utilizing a ILX Lightwave model LPA-9084 laser diode parameter analyzer. The charge is $120 per hour for C-mount. The use of other package types is dependent on the heat sink size, but many other package types can be accommodated.
*Semiconductor substrate scribe and break service utilizing a Loomis model 100 LSD tool. The setup charge is$120, with a rate of $120 per hour.
*Lapping and polishing service utilizing a Logitech model PM2 tool. The rate is $120 per hour, with a minimum of 8 hours. Various substrate materials can be processed, including Ga and InP.

=Fostering SEI Research at NNIN =
Through our participation in the National Nanotechnology Infrastructure Network (NNIN), we are committed to fostering research on the social and ethical implications of nanotechnology. Nanofab users are at the forefront of nanotechnology and can offer unique insight into this research. To this end, from time to time, users may be invited to participate in a research project, such as by answering a survey or participating in an interview. Although users are free to decline, and their decision to participate or not to participate will have no bearing on their ability to use the Nanofab, we sincerely hope that users will consider each request and accept as many invitations as they can in the spirit of advancing knowledge on social and ethical issues and helping to ensure that NNIN remains a leader in nanotechnology innovation.   We are also committed to ensuring that these projects are relevant to NNIN, unburdensome to its users, and have met appropriate ethical standards. Thus, we will only release users' contact information to projects that have received prior approval from NNIN.  

If you have any questions, please contact NNIN's Director, Dr. Sandip Tiwari st222@cornell.edu or NNIN's SEI Coodinator, Dr. Katherine McComas kam19@cornell.edu.
=Nanofab Summer Intern Policy =

Whenever the intern is in the Nanofab, the mentor must also be in the Nanofab. Interns may use tools that do not require training sessions, such as microscopes, etc, unless the supervisor of these tools objects. Interns can work at photolith benches, and use components of the photolith benches, unless the supervisor of the bench objects. Interns will need to follow normal Nanofab access procedures, including initiation meeting with the Nanofab manager.

Interns will be allowed to use one or two mainline Nanofab tools after completing training conducted by Nanofab staff. Mainline tools are tools scheduled through our web site signupmonkey. Certain tools will be unavailable to interns due to extremely heavy use or other concerns.

==Tools unavailable for intern use during Summer 2012:==
{|
|-valign="top"
|
*[[Stepper 1 (GCA 6300)]]
*[[Stepper 2 (AutoStep 200)]]
*[[Stepper 3 (ASML DUV)]]
*[[E-Beam Lithography System (JEOL JBX-6300FS)]]
*[[AFM-based Nanolithography Tool (NanoMan)]]
*[[Wafer Bonder (SUSS SB6-8E)]]
*[[Holographic Lith/PL Setup (Custom)]]
*[[E-Beam 3 (Temescal)]]
*[[E-Beam 4 (CHA)]]
*[[Sputter 1 (Custom)]]
*[[Sputter 2 (SFI Endeavor)]]
*[[Sputter 5 (Lesker AXXIS)]]
*[[ICP-PECVD (Unaxis VLR)]]
*[[Ion Beam Deposition (Veeco NEXUS)]]
*[[RIE 1 (Custom)]]
*[[RIE 5 (PlasmaTherm)]]
*[[Si Deep RIE (PlasmaTherm/Bosch Etch)]]
||
*[[ICP-Etch (Unaxis VLR)]]
*[[ICP Etch 1 (Panasonic E626I)]]
*[[ICP Etch 2 (Panasonic E640)]]
*[[XeF2 Etch (Xetch)|XeF2 Etch (Xetch)]]
*[[Plasma Activation (EVG 810)]]
*[[HF Vapor Etch]]
*Wet Etch Benches (Acid etch and HF etch)
*Wet Etch Wafer Scale Bench (Acid etch and HF etch)
*[[Chemical-Mechanical Polisher (Logitech)]]
*[[Rapid Thermal Processor (AET RX6)]]
* [[Flip-Chip Bonder (Finetech)]]
* [[Dicing Saw (ADT)]]
* [[Field Emission SEM 1 (FEI Sirion)]]
* [[Field Emission SEM 2 (JEOL 7600F)]]
* [[Surface Analysis (KLA/Tencor Surfscan)]]
* [[Deep UV Optical Microscope (Olympus)]]
|}

Tool List

2016-05-17T22:44:40Z

Reynolds t: /* Dry Etch */

Tool List

2016-05-17T22:43:48Z

Reynolds t: /* Dry Etch */

__NOTOC__
=Lithography=
{|
|-valign="top"
|width=300|
* [[Suss Aligners (SUSS MJB-3)]]
* [[IR Aligner (SUSS MJB-3 IR)]]
* [[DUV Flood Expose]]
* [[Ovens 1, 2 & 3 (Labline)]]
* [[Oven 4 (Fisher)]]
* [[High Temp Oven (Blue M)]]
* [[Vacuum Oven (YES)]]
* [[Holographic Lith/PL Setup (Custom)]]
|width=400|
* [[Stepper 1 (GCA 6300)]]
* [[Stepper 2 (AutoStep 200)]]
* [[Stepper 3 (ASML DUV)]]
* [[E-Beam Lithography System (JEOL JBX-6300FS)]]
* [[Nano-Imprint (Nanonex NX2000)]]
* [[Contact Aligner (SUSS MA-6)]]
|-
|}

= Vacuum Deposition =

{|
|- valign="top"
| width="300" |
*[[E-Beam 1 (Sharon)]]
*[[E-Beam 2 (Custom)]]
*[[E-Beam 3 (Temescal)]]
*[[E-Beam 4 (CHA)]]
*[[Sputter 2 (SFI Endeavor)]]
*[[Sputter 3 (AJA ATC 2000-F)]]
*[[Sputter 4 (AJA ATC 2200-V)]]
*[[Sputter 5 (Lesker AXXIS)]]

| width="400" |
*[[PECVD 1 (PlasmaTherm 790)]]
*[[PECVD 2 (Advanced Vacuum)]]
*[[Thermal Evap 1]]
*[[Thermal Evap 2 (Solder)]]
*[[ICP-PECVD (Unaxis VLR)]]
*[[Ion Beam Deposition (Veeco NEXUS)]]
*[[Molecular Vapor Deposition]]
*[[Atomic Layer Deposision (Oxford FlexAL)]]

|}

= Dry Etch =

{|
|- valign="top"
| width="300" |
*[[RIE 2 (MRC)]]
*[[RIE 3 (MRC)]]
*[[RIE 5 (PlasmaTherm)]]
*[[Si Deep RIE (PlasmaTherm/Bosch Etch)]]
*[[Ashers (Technics PEII)]]
*[[UV Ozone Reactor]]
*[[CAIBE (Oxford Ion Mill)]]
| width="400" |
*[[ICP Etch 1 (Panasonic E626I)]]
*[[ICP Etch 2 (Panasonic E620)]]
*[[ICP-Etch (Unaxis VLR)]]
*[[Plasma Clean (Gasonics 2000)]]
*[[XeF2 Etch (Xetch)|XeF2 Etch (Xetch)]]
*[[Plasma Activation (EVG 810)]]
*[[Vapor HF Etch]]

|}

=Wet Processing=
{|
|-valign="top"
|width=300|
* [[Wet Benches]]
**[[Solvent Cleaning Benches]]
**[[Spin Coat Benches]]
**[[Develop Benches]]
**[[Toxic Corrosive Benches]]
**[[HF/TMAH Processing Benches]]
**[[Plating Bench]]
|width=400|
* [[Gold Plating Bench]]
* [[Critical Point Dryer]]
* [[Spin Rinse Dryer (SemiTool)]]
* [[Chemical-Mechanical Polisher (Logitech)]]
|-
|}

=Thermal Processing=
* [[Rapid Thermal Processor (AET RX6)]]
* [[Strip Annealer]]
* [[Tube Furnace (Tystar 8300)]]
* [[Tube Furnace Wafer Bonding (Thermco)]]
* [[Tube Furnace AlGaAs Oxidation (Linberg)]]
* [[Wafer Bonder (SUSS SB6-8E)]]

=Packaging=
* [[Dicing Saw (ADT)]]
* [[Flip-Chip Bonder (Finetech)]]
* [[Vacuum Sealer]]
* [[Wire Saw (Takatori)]]

=Inspection, Test and Characterization=
{|
|-valign="top"
|width=300|
* [[Field Emission SEM 1 (FEI Sirion)]]
* [[Field Emission SEM 2 (JEOL 7600F)]]
* [[Step Profile (Dektak IIA)]]
* [[Step Profilometer (Dektak 6M)]]
* [[Ellipsometer (Rudolph)]]
* [[Microscopes]]
* [[Probe Station & Curve Tracer]]
* [[Optical Film Thickness (Filmetrics)]]
* [[Optical Film Thickness (Nanometric)]]
* [[Goniometer]]
|width=400|
* [[Film Stress (Tencor Flexus)]]
* [[SEM Sample Coater (Hummer)]]
* [[Surface Analysis (KLA/Tencor Surfscan)]]
* [[Photo-emission & IR Microscope (QFI)]]
* [[Ellipsometer (Woollam)]]
* [[Resistivity Mapper (CDE RESMAP)]]
* [[Laser Scanning Confocal M-scope (Olympus LEXT)]]
* [[Deep UV Optical Microscope (Olympus)]]
* [[Fluorescence Microscope (Olympus MX51)]]
* [[Atomic Force Microsope (Dimension 3100/Nanoscope IVA)]]
|-
|}

ICP Etching Recipes

2016-05-17T22:40:57Z

Reynolds t:

{{recipes|Dry Etching}}
=[[Si Deep RIE (PlasmaTherm/Bosch Etch)]]=
==Single-step Si Etching (not Bosch Process!) (Si Deep RIE)==
*[[media:10-Si_Etch_using_DRIE_(single-step).pdf|Single-step Si Vertical Etch Recipe - SF6-C4F8-Ar]]

=[[ICP Etch 1 (Panasonic E626I)]]=
==SiO2 Etching (Panasonic 1)==
*[[media:Panasonic1-SiO-Etch.pdf|SiO2 Vertical Etch Recipe Parameters - CHF3]]
*[[media:Panasonic1-SiO2-Data-Process-Variation-CHF3-revA.pdf|SiO2 CHF3 Etch Variations]]

==SiNx Etching (Panasonic 1)==
*[[media:Panasonic1-SiN-Etch-Plasma-CF4-O2-ICP-revA.pdf|SiNx Etch Rates and Variations - CF4-O2]]

==Al Etch (Panasonic 1)==
*[[media:Panasonic-1-Al-Etch-RevA.pdf|Al Etch Recipes - Cl2BCl3]]
*[[media:32-Reducing_AlCl3_Corrosion_with_CHF3_plasma.pdf|AlCl3 Erosion Issue and the Solution]]

==Cr Etch (Panasonic 1)==
*[[media:Panasonic-1-Cr-Etch-revA.pdf|Cr Etch Recipes - Cl2O2]]

==Ti Etch (Panasonic 1)==
*[[media:Panasonic-1-Ti-Etch-Deep-RevA.pdf|Ti Deep Etch Recipes - Cl2Ar]]

==W-TiW Etch (Panasonic 1)==
*[[media:Panasonic1-TiW-W-Etch-Plasma-RIE-RevA.pdf|Ti-TiW Etch Recipes - SF6Ar]]

==GaAs-AlGaAs Etch (Panasonic 1)==
*[[media:Panasonic1-GaAs-PhotonicCrystal-RIE-Plasma-Nanoscale-Etch-RevA.pdf|GaAs-Nanoscale Etch Recipe - PR mask - Cl2-BCl3-Ar]]
*[[media:12-Plasma_Etching_of_AlGaAs-Panasonic_ICP-1-Etcher.pdf|AlGaAs Etch Recipes - Cl2N2]]
*[[media:Panasonic1-GaAs-Via-Etch-Plasma-RIE-Fast-DRIE-RevA.pdf|GaAs DRIE via Etch Recipes - Cl2-BCl3-Ar PR passivation]]

==GaN Etch (Panasonic 1)==
*[[media:07-GaN_Etch-Panasonic-ICP-1.pdf|GaN Etch Recipes Cl2N2]]
*[[media:Panasonic1-GaN-AlGaN-Selective-Etch-Plasma-RIE-ICP-RevA.pdf|GaN Selective Etch over AlGaN Recipes BCl3-SF6]]

==SiC Etch (Panasonic 1)==
*[[media:Panasonic 1-SiC-ICP-RIE-Etch-Plasma-SF6-RevA.pdf|SiC Etch Recipes Ni Mask - SF6]]

==Sapphire Etch (Panasonic 1)==
*[[media:Panasonic1-sapphire-etch-RIE-Plasma-BCl3-ICP-RevA.pdf|Sapphire Etch Recipes Ni and PR Mask - BCl3-Cl2]]

=[[ICP Etch 2 (Panasonic E620)]]=
Recipes starting points for materials without processes listed can be obtained from Panasonic1 recipe files. The chambers are slightly different, but essentially the same, requiring only small program changes to obtain similar results.

==SiO2 Etching (Panasonic 2)==
*[[media:Panasonic2-SiOx-Recipe.pdf|SiO2 Vertical Etch Recipe - CHF3]]
*[[media:33-Etching_SiO2_with_Vertical_Side-wall.pdf|SiO2 Vertical Etch Recipe#2 - CF4/CHF3]]
*[[media:Panasonic2-ICP-Plasma-Etch-SiO2-nanoscale-rev1.pdf|SiO2 Nanoscale Etch Recipe - CHF3/O2]]

==SiNx Etching (Panasonic 2)==
*[[media:Panasonic2-ICP-Plasma-Etch-SiN-nanoscale-rev1.pdf|SiNx Nanoscale Etch Recipe - CHF3/O2]]

==Al Etch (Panasonic 2)==
*[[media:Panasonic-1-Al-Etch-RevA.pdf|Al Etch Recipes - use panasonic 1 parameters, etch rate 50% higher]]

==GaAs Etch (Panasonic 2)==
*[[media:16-GaAs_etch-ICP-2.pdf|GaAs Etch Recipes - Panasonic 2 - Cl2N2]]

=[[ICP-Etch (Unaxis VLR)]]=
==GaAs-AlGaAs Etch (Unaxis VLR) ==
*[[media:15-GaAs_etch-Unaxis_ICP_etcher.pdf|GaAs Etch Recipe (Cl2N2 30C)]]
*[[media:14-AlAs-GR-cal_etch-Unaxis_ICP_etcher.pdf|AlGaAs Etch Recipe (Cl2N2 30C)]]

==InP-InGaAs-InAlAs Etch (Unaxis VLR)==
*[[media:UNAXIS-VLR-InP-Etch-200C-Recipe.pdf|InP Etch Recipe (Cl2N2Ar 200C)]]
*[[media:18-InP-based_etching-Cl2N2Ar.pdf|InP-based Material Etch Profile (Cl2N2Ar200C)]]
*[[media:UNAXIS-VLR-InP-Etch-Ar-200C-Recipe.pdf|Unaxis InP Etch Recipe (Cl2H2 Ar 200C) Parameters]]
*[[media:17-InP%26InGaAs_etch-Cl2H2Ar-Unaxis-VLR.pdf|InP-InGaAs Etch Profile (Cl2H2 Ar 200C)]]
*[[media:43-Issue_with_the_etch_of_InP-InGaAs-and-_InAlAs-b.pdf|InGaAs-InAlAs Etch Issure (Cl2H2 Ar 200C)]]
*[[media:50-InP_Etch-2-17-2016.pdf|InP Etch (Cl2H2Ar 200C)2-17-2016]]

==GaN Etch (Unaxis VLR)==
*[[media:09-Plasma_Etching_of_GaN-UnaxisPM1.pdf|GaN Etch Recipe (Cl2BCl3 Ar 85C)]]

Staff List

2015-12-21T18:36:47Z

Reynolds t:

{| class="wikitable" style="font-size: 95%;" border="1" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:left; font-size: 95%"
|-bgcolor=#D0E7FF
!align=center bgcolor=#D0E7FF width="150"|'''Name'''
!align=center bgcolor=#D0E7FF width="250"|'''Title'''
!align=center bgcolor=#D0E7FF width="150"|'''Phone'''
!align=center bgcolor=#D0E7FF width="100"|'''E-mail'''
|-
|-
|[[Tony Bosch]]||Senior Development Engineer||(805) 893-3918X217||bosch@ece.ucsb.edu
|-
|[[Ning Cao]]||Principal Development Engineer||(805) 893-4689||ningcao@ece.ucsb.edu
|-
|[[Don Freeborn]]||Senior Development Engineer||(805) 893-3918x216||dfreeborn@ece.ucsb.edu
|-
|[[Aidan Hopkins]]||Assistant Development Engineer||(805) 893-3918x208||hopkins@ece.ucsb.edu
|-
|[[Bill Mitchell]]||Principal Development Engineer||(805) 893-4974||mitchell@ece.ucsb.edu
|-
|[[Tom Reynolds]]||Lab Manager||(805) 893-3918x215||reynolds@ece.ucsb.edu
|-
|[[Mike Silva]]||Senior Development Engineer||(805) 893-3918x219||silva@ece.ucsb.edu
|-
|[[Biljana Stamenic]]||Senior Development Engineer||(805) 893-4002 ||biljana@ece.ucsb.edu
|-
|[[Brian Thibeault]]||Project Scientist||(805) 893-2268||thibeault@ece.ucsb.edu
|-
|[[Luis Zuzunaga]]||Research Assistant||(805) 893-3918x218||luis@ece.ucsb.edu
|-
|[[Brian Lingg]]||Senior Development Engineer||(805) 893-3918x210||lingg@ece.ucsb.edu
|-
|[[Tino Sy]]||Development Technician||(805) 893-3918x209||sy@ece.ucsb.edu
|-
|[[Mike Day]]||Senior Development Engineer||(805) 893-3918x223||day@ece.ucsb.edu
|}

Staff List

2015-12-21T18:34:55Z

Reynolds t:

[[Link title]]{| class="wikitable" style="font-size: 95%;" border="1" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:left; font-size: 95%"
|-bgcolor=#D0E7FF
!align=center bgcolor=#D0E7FF width="150"|'''Name'''
!align=center bgcolor=#D0E7FF width="250"|'''Title'''
!align=center bgcolor=#D0E7FF width="150"|'''Phone'''
!align=center bgcolor=#D0E7FF width="100"|'''E-mail'''
|-
|-
|[[Tony Bosch]]||Senior Development Engineer||(805) 893-3918X217||bosch@ece.ucsb.edu
|-
|[[Ning Cao]]||Principal Development Engineer||(805) 893-4689||ningcao@ece.ucsb.edu
|-
|[[Don Freeborn]]||Senior Development Engineer||(805) 893-3918x216||dfreeborn@ece.ucsb.edu
|-
|[[Aidan Hopkins]]||Assistant Development Engineer||(805) 893-3918x208||hopkins@ece.ucsb.edu
|-
|[[Bill Mitchell]]||Principal Development Engineer||(805) 893-4974||mitchell@ece.ucsb.edu
|-
|[[Tom Reynolds]]||Lab Manager||(805) 893-3918x215||reynolds@ece.ucsb.edu
|-
|[[Mike Silva]]||Senior Development Engineer||(805) 893-3918x219||silva@ece.ucsb.edu
|-
|[[Biljana Stamenic]]||Senior Development Engineer||(805) 893-4002 ||biljana@ece.ucsb.edu
|-
|[[Brian Thibeault]]||Project Scientist||(805) 893-2268||thibeault@ece.ucsb.edu
|-
|[[Luis Zuzunaga]]||Research Assistant||(805) 893-3918x218||luis@ece.ucsb.edu
|-
|[[Brian Lingg]]||Senior Development Engineer||(805) 893-3918x210||lingg@ece.ucsb.edu
|-
|[[Tino Sy]]||Development Technician||(805) 893-3918x209||sy@ece.ucsb.edu
|-
|[[Mike Day]]||Senior Development Engineer||(805) 893-3918x223||day@ece.ucsb.edu
|}

Staff List

2015-12-21T18:28:37Z

Reynolds t: