Atomic Layer Deposition (Oxford FlexAL) - Revision history

Sawyer l: Update SOP rev

2023-03-08T21:56:16Z

Update SOP rev

← Older revision		Revision as of 21:56, 8 March 2023
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	=Procedures & Documentation=		=Procedures & Documentation=

	*[//wiki.nanotech.ucsb.edu/~~wiki~~/images/5/52/~~Cluster_operating_instructions~~.pdf Operating Instructions]		*[https://wiki.nanotech.ucsb.edu/w/images/4/40/Oxford_Cluster_Tool_Operating_Instructions_Rev_B.pdf Operating Instructions]
	**Includes recipe names for various films, and approx. dep. rates		**Includes recipe names for various films, and approx. dep. rates
	*Film Thicknesses are restricted to '''30nm or less'''.		*Film Thicknesses are restricted to '''30nm or less'''.

Silva at 17:36, 30 August 2022

2022-08-30T17:36:06Z

← Older revision		Revision as of 17:36, 30 August 2022
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	{{~~tool~~\|{{PAGENAME}}		{{tool2\|{{PAGENAME}}
	\|picture=FlexAL.jpg		\|picture=FlexAL.jpg
	\|type = Vacuum Deposition		\|type = Vacuum Deposition
	\|super= Bill Millerski		\|super= Bill Millerski
			\|super2= Lee Sawyer
	\|phone=(805)839-2655		\|phone=(805)839-2655
	\|location=Bay 2		\|location=Bay 2

Thibeault: /* Cluster Configuration */

2021-11-18T17:15:31Z

Cluster Configuration

← Older revision		Revision as of 17:15, 18 November 2021
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	The Oxford Instruments FlexAL Atomic Layer Deposition system at UCSB is a plasma-enhanced ALD system for the precise growth of ultra-thin oxides and nitrides. Self-limiting layer by layer growth ensures precise control, film conformality, and repeatability of the films.		The Oxford Instruments FlexAL Atomic Layer Deposition system at UCSB is a plasma-enhanced ALD system for the precise growth of ultra-thin oxides and nitrides. Self-limiting layer by layer growth ensures precise control, film conformality, and repeatability of the films.

	The system currently has metallorganic precursors for Aluminum, Hafnium, Titanium, Platinum, Zirconium, and Silicon oxides and nitrides. Water and Ozone are available for thermal oxides and Oxygen, Ammonia, Nitrogen, and Hydrogen are available for plasma assisted oxides and nitrides. Remote ICP plasma powers up to 600W are possible.		The system currently has metallorganic precursors for Aluminum, Hafnium, Titanium, Platinum, Zirconium, and Silicon oxides and nitrides as well as Ruthenium and Platinum. Water and Ozone are available for thermal oxides and Oxygen, Ammonia, Nitrogen, and Hydrogen are available for plasma assisted oxides and nitrides. Remote ICP plasma powers up to 600W are possible.

	The system is load-locked and can accommodate sample temperatures up to 550°C. Processing temperature windows are defined for each material based on growth limitations. The system is step-by-step programmable through a flexible GUI interface.		The system is load-locked and can accommodate sample temperatures up to 550°C. Processing temperature windows are defined for each material based on growth limitations. The system is step-by-step programmable through a flexible GUI interface.
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	We have three separate chambers on the Oxford Cluster tool, two of which are ALD chambers.		We have three separate chambers on the Oxford Cluster tool, two of which are ALD chambers.

	~~One~~ ALD chamber ~~is dedicated to~~ ~~metals~~ ~~and~~ ~~the~~ ~~other~~ is ~~dedicated~~ to ~~dielectrics~~. The other chamber on the cluster is the [[CAIBE (Oxford Ion Mill)\|Oxford Ion Mill]].		ALD chamber sources are configured with different precursors based on demand. The other chamber on the cluster is the [[CAIBE (Oxford Ion Mill)\|Oxford Ion Mill]].

	*Chamber #1: ALD ~~Metal~~ ~~Films~~ ~~only~~		*Chamber #1: ALD: Al2O3, SiO2, Ru, Pt, Al:ZnO
	*Chamber #2: [[CAIBE (Oxford Ion Mill)\|Oxford Ion Mill (CAIBE)]]		*Chamber #2: [[CAIBE (Oxford Ion Mill)\|Oxford Ion Mill (CAIBE)]]
	*Chamber #3: ~~ALD~~ ~~Dielectrics~~ ~~Films~~ ~~only~~		*Chamber #3: Al2O3, SiO2, HfO2, ZrO2, TiN

	=Procedures & Documentation=		=Procedures & Documentation=

Silva at 15:12, 28 October 2021

2021-10-28T15:12:12Z

← Older revision		Revision as of 15:12, 28 October 2021
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	\|type = Vacuum Deposition		\|type = Vacuum Deposition
	\|super= Bill Millerski		\|super= Bill Millerski
	\|phone=(805)839-~~3918x210~~		\|phone=(805)839-2655
	\|location=Bay 2		\|location=Bay 2
	\|email=~~lingg~~@~~ece.~~ucsb.edu		\|email=wmillerski@ucsb.edu
	\|description = Oxford FlexAL Atomic Layer Deposition		\|description = Oxford FlexAL Atomic Layer Deposition
	\|manufacturer = [http://www.oxford-instruments.com/businesses/plasma-technology/Pages/plasma-technology.aspx Oxford Instruments Plasma Technologies]		\|manufacturer = [http://www.oxford-instruments.com/businesses/plasma-technology/Pages/plasma-technology.aspx Oxford Instruments Plasma Technologies]

Silva at 15:11, 28 October 2021

2021-10-28T15:11:10Z

← Older revision		Revision as of 15:11, 28 October 2021
Line 2:		Line 2:
	\|picture=FlexAL.jpg		\|picture=FlexAL.jpg
	\|type = Vacuum Deposition		\|type = Vacuum Deposition
	\|super= ~~Brian~~ ~~Lingg~~		\|super= Bill Millerski
	\|phone=(805)839-3918x210		\|phone=(805)839-3918x210
	\|location=Bay 2		\|location=Bay 2

Silva at 14:28, 28 October 2021

2021-10-28T14:28:00Z

← Older revision		Revision as of 14:28, 28 October 2021
Line 2:		Line 2:
	\|picture=FlexAL.jpg		\|picture=FlexAL.jpg
	\|type = Vacuum Deposition		\|type = Vacuum Deposition
	\|super= ~~Bill~~ ~~Millerski~~		\|super= Brian Lingg
	\|phone=(805)839-3918x210		\|phone=(805)839-3918x210
	\|location=Bay 2		\|location=Bay 2

Silva at 14:27, 28 October 2021

2021-10-28T14:27:43Z

← Older revision		Revision as of 14:27, 28 October 2021
Line 2:		Line 2:
	\|picture=FlexAL.jpg		\|picture=FlexAL.jpg
	\|type = Vacuum Deposition		\|type = Vacuum Deposition
	\|super= ~~Brian~~ ~~Lingg~~		\|super= Bill Millerski
	\|phone=(805)839-3918x210		\|phone=(805)839-3918x210
	\|location=Bay 2		\|location=Bay 2

John d: corrected chamber --> metal/dielectric designation

2020-07-01T14:57:29Z

corrected chamber --> metal/dielectric designation

← Older revision		Revision as of 14:57, 1 July 2020
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	We have three separate chambers on the Oxford Cluster tool, two of which are ALD chambers.		We have three separate chambers on the Oxford Cluster tool, two of which are ALD chambers.

	One ALD chamber is dedicated to metals and the other dedicated to dielectrics. The other chamber on the cluster is the [[CAIBE (Oxford Ion Mill)\|Oxford Ion Mill]].		One ALD chamber is dedicated to metals and the other is dedicated to dielectrics. The other chamber on the cluster is the [[CAIBE (Oxford Ion Mill)\|Oxford Ion Mill]].

	*Chamber #1: ALD ~~Dielectrics~~ Films only		*Chamber #1: ALD Metal Films only
	*Chamber #2: [[CAIBE (Oxford Ion Mill)\|Oxford Ion Mill (CAIBE)]]		*Chamber #2: [[CAIBE (Oxford Ion Mill)\|Oxford Ion Mill (CAIBE)]]
	*Chamber #3: ALD ~~Metal~~ Films only		*Chamber #3: ALD Dielectrics Films only

	=Procedures & Documentation=		=Procedures & Documentation=

John d: /* ALD Recipes */ bolded recipes page

2020-06-22T17:57:39Z

ALD Recipes: bolded recipes page

← Older revision		Revision as of 17:57, 22 June 2020
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	==ALD Recipes==		==ALD Recipes==

	*~~See the~~ [[Atomic_Layer_Deposition_Recipes\|Atomic Layer Deposition: Recipes]] page ~~for~~ recipes and ~~thin-film~~ data/measurements.		*The [[Atomic_Layer_Deposition_Recipes\|'''Atomic Layer Deposition: Recipes''']] page shows all available recipes and data/measurements.
	*Only staff-provided recipes are allowed to be run on this tool, as achieving the atomic-layer regime is rather complex. [[Bill Mitchell]] is the resident expert on ALD recipe development.		*Only staff-provided recipes are allowed to be run on this tool, as achieving the atomic-layer regime is rather complex. [[Bill Mitchell]] is the resident expert on ALD recipe development.

John d: /* Procedures & Documentation */ changed to "ask tool supervisor" instead of BillM

2020-04-23T17:14:28Z

Procedures & Documentation: changed to "ask tool supervisor" instead of BillM

← Older revision		Revision as of 17:14, 23 April 2020
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	**Includes recipe names for various films, and approx. dep. rates		**Includes recipe names for various films, and approx. dep. rates
	*Film Thicknesses are restricted to '''30nm or less'''.		*Film Thicknesses are restricted to '''30nm or less'''.
	**'''Thicker films are allowed with prior staff approval''' - please ask [[~~Bill~~ ~~Mitchell~~]] if you want to deposit a thicker film!		**'''Thicker films are allowed with prior staff approval''' - please ask [[Brian Lingg\|Tool Supervisor]] if you want to deposit a thicker film!

	==ALD Recipes==		==ALD Recipes==