Automated Wafer Cleaver (Loomis LSD-155LT) - Revision history

John d: /* Recipes */ link to Mechanical_Polisher_(Allied)

2024-09-04T00:24:47Z

Recipes: link to Mechanical_Polisher_(Allied)

← Older revision		Revision as of 00:24, 4 September 2024
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	*Multiple scribe and cleave options including 'scribe and break', 'notch and cleave', and 'peck and cleave'.		*Multiple scribe and cleave options including 'scribe and break', 'notch and cleave', and 'peck and cleave'.
	*Users should try and follow the 3 to 1 ratio (distance between cleaves should be 3X the thickness of the substrate) although some material like InP and GaAs can occasionally be cleaved closer to 2 to 1.		*Users should try and follow the 3 to 1 ratio (distance between cleaves should be 3X the thickness of the substrate) although some material like InP and GaAs can occasionally be cleaved closer to 2 to 1.
			**Thinning the substrate allows for much easier cleaving and cleave lines closer together.

	==Operating Procedures==		==Operating Procedures==
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	*Recipes > Packaging > '''[[Wafer Cleaver Recipes (LSD-155LT)]]'''		*Recipes > Packaging > '''[[Wafer Cleaver Recipes (LSD-155LT)]]'''
	*Wafer thinning is critical, see the Wafer Lapping (Allied ~~XYZ~~) tool as well.		*Wafer thinning is critical, see the [[Mechanical Polisher (Allied)\|Wafer Lapping (Allied 10-1110)]] tool as well.

Hopkins a at 15:16, 26 September 2023

2023-09-26T15:16:15Z

← Older revision		Revision as of 15:16, 26 September 2023
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	==Operating Procedures==		==Operating Procedures==

	*[https://wiki.~~nanotech~~.ucsb.edu/~~LoomisSOP~~.~~pdf~~ Loomis LSD-155LT Standard Operating Procedure]		*[https://wiki.nanofab.ucsb.edu/w/images/d/d6/Loomis_Scriber_SOP.docx Loomis LSD-155LT Standard Operating Procedure]

	==Recipes==		==Recipes==

Hopkins a at 18:06, 16 August 2023

2023-08-16T18:06:20Z

← Older revision		Revision as of 18:06, 16 August 2023
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	{{tool2\|{{PAGENAME}}		{{tool2\|{{PAGENAME}}
	\|picture=~~LoomisLSD155lt~~.jpg		\|picture=IMG_0554.jpg
	\|type = Packaging		\|type = Packaging
	\|super= Aidan Hopkins		\|super= Aidan Hopkins

Ffoong: /* Recipes */

2023-08-15T21:48:17Z

Recipes

← Older revision		Revision as of 21:48, 15 August 2023
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	==Recipes==		==Recipes==

	*Recipes > Packaging > '''Wafer Cleaver Recipes (LSD-155LT)'''		*Recipes > Packaging > '''[[Wafer Cleaver Recipes (LSD-155LT)]]'''
	*Wafer thinning is critical, see the Wafer Lapping (Allied XYZ) tool as well.		*Wafer thinning is critical, see the Wafer Lapping (Allied XYZ) tool as well.

Hopkins a: /* Detailed Specifications */

2023-05-16T15:04:10Z

Detailed Specifications

← Older revision		Revision as of 15:04, 16 May 2023
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	*Automated cut maps at multiple angles (0° and 90° typical)		*Automated cut maps at multiple angles (0° and 90° typical)
	*~few micron alignment to on-wafer features.		*~few micron alignment to on-wafer features.
			*Multiple scribe and cleave options including 'scribe and break', 'notch and cleave', and 'peck and cleave'.
	*TBD
			*Users should try and follow the 3 to 1 ratio (distance between cleaves should be 3X the thickness of the substrate) although some material like InP and GaAs can occasionally be cleaved closer to 2 to 1.

	==Operating Procedures==		==Operating Procedures==

Hopkins a: /* About */

2023-05-16T14:59:30Z

About

← Older revision		Revision as of 14:59, 16 May 2023
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	}}		}}
	==About==		==About==
			The Loomis LSD-155Lt is a production scribe and break system that can be used for processing large grids, arrays of laser bars, cleaving high quality mirror facets, and dicing wafers.
	TBD: Insert info general here.

	==Detailed Specifications==		==Detailed Specifications==

	*Maximum Wafer Size:		*Maximum Wafer Size: 4"
	*Parts mounted to ~~UV-release~~ tape ~~for~~ ~~cutting~~		*Parts mounted to low tack tape and used in conjunction with 6" plastic rings.
	*Automated cut maps at multiple angles (0° and 90° typical)		*Automated cut maps at multiple angles (0° and 90° typical)
	*~few micron alignment to on-wafer features.		*~few micron alignment to on-wafer features.
	* TBD		*TBD

	==Operating Procedures==		==Operating Procedures==
Line 29:		Line 29:

	*Recipes > Packaging > '''Wafer Cleaver Recipes (LSD-155LT)'''		*Recipes > Packaging > '''Wafer Cleaver Recipes (LSD-155LT)'''
	* Wafer thinning is critical, see the Wafer Lapping (Allied XYZ) tool as well.		*Wafer thinning is critical, see the Wafer Lapping (Allied XYZ) tool as well.

John d: initial page

2023-04-15T03:11:15Z

initial page

New page

{{tool2|{{PAGENAME}}
|picture=LoomisLSD155lt.jpg
|type = Packaging
|super= Aidan Hopkins
|super2=
|location=Backend Lab: ESB 1111
|description = Loomis Automated Wafer Cleaver
|model = LSD-155LT
|manufacturer = Loomis Industries Inc.
|materials = III-V's, thin Silicon
|toolid=
}}
==About==
TBD: Insert info general here.

==Detailed Specifications==

*Maximum Wafer Size:
*Parts mounted to UV-release tape for cutting
*Automated cut maps at multiple angles (0° and 90° typical)
*~few micron alignment to on-wafer features.
* TBD

==Operating Procedures==

*[https://wiki.nanotech.ucsb.edu/LoomisSOP.pdf Loomis LSD-155LT Standard Operating Procedure]

==Recipes==

*Recipes > Packaging > '''Wafer Cleaver Recipes (LSD-155LT)'''
* Wafer thinning is critical, see the Wafer Lapping (Allied XYZ) tool as well.