Chemical-Mechanical Polisher (Logitech) - Revision history

Silva at 18:03, 30 August 2022

2022-08-30T18:03:19Z

2022-08-23T20:51:29Z

Instructions

← Older revision		Revision as of 20:51, 23 August 2022
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	=[[Instructions]]=		=[[Instructions]]=
	https://wiki.nanotech.ucsb.edu/~~wiki~~/~~File:~~CMP.pdf		https://wiki.nanotech.ucsb.edu/w/images/c/c0/CMP.pdf

2022-08-23T20:18:14Z

Instructions

← Older revision		Revision as of 20:18, 23 August 2022
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	=[[Instructions]]=		=[[Instructions]]=
			https://wiki.nanotech.ucsb.edu/wiki/File:CMP.pdf
	CMP SOP

2022-08-23T20:15:11Z

Instructions

← Older revision		Revision as of 20:15, 23 August 2022
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	Each process is often unique in geometry and material combinations so that independent process development is required for most CMP applications.		Each process is often unique in geometry and material combinations so that independent process development is required for most CMP applications.

	=Instructions=		=[[Instructions]]=
	CMP SOP		CMP SOP

2022-08-23T20:12:28Z

CMP SOP

← Older revision		Revision as of 20:12, 23 August 2022
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	Each process is often unique in geometry and material combinations so that independent process development is required for most CMP applications.		Each process is often unique in geometry and material combinations so that independent process development is required for most CMP applications.

			=Instructions=
			CMP SOP

2022-03-04T00:06:37Z

link to Logitech Bonder

← Older revision		Revision as of 00:06, 4 March 2022
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	}}		}}
	= About =		=About=
	The Logitech Orbis system is used in the facility for fine-scale polishing and planarization of a variety of materials including glass, silicon, GaAs, InP, GaN, etc. Wafers up to 6” diameter can be polished on the system. Several slurries and pads are available to provide a range of polishing options depending on the material being processed. Pieces can also be handled on the system. Each process is often unique in geometry and material combinations so that independent process development is required for most CMP applications. Logitech directly assists our users through expert consultation.		The Logitech Orbis system is used in the facility for fine-scale polishing and planarization of a variety of materials including glass, silicon, GaAs, InP, GaN, etc. Wafers up to 6” diameter can be polished on the system.

			Several slurries and pads are available to provide a range of polishing options depending on the material being processed. Pieces can also be handled on the system by wax-mounting with the [[Wafer Bonder (Logitech WBS7)\|Logitech Bonder]].

			Each process is often unique in geometry and material combinations so that independent process development is required for most CMP applications.

2021-10-28T15:31:59Z

2020-04-15T17:45:00Z

2015-07-10T21:38:34Z

2012-07-11T14:06:28Z

← Older revision		Revision as of 14:06, 11 July 2012
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	\|manufacturer = [http://www.logitech.uk.com/products-solutions/products-and-accessories.aspx Logitech]		\|manufacturer = [http://www.logitech.uk.com/products-solutions/products-and-accessories.aspx Logitech]
	\|materials =		\|materials =
			\|toolid=50
	}}		}}
	= About =		= About =