E-Beam 2 (Custom) - Revision history

Sawyer l: Updated SOP Rev

2026-02-12T17:44:50Z

Updated SOP Rev

← Older revision		Revision as of 17:44, 12 February 2026
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	==Documentation==		==Documentation==

	*[https://wiki.nanofab.ucsb.edu/w/images/4/44/~~EB2_SOP_Rev_I~~.pdf E-Beam #2 Standard Operating Procedure]		*[https://wiki.nanofab.ucsb.edu/w/images/8/81/EB2_SOP_Rev_J.pdf E-Beam #2 Standard Operating Procedure]

	==Recipes==		==Recipes==

Sawyer l: SOP rev

2024-10-31T16:32:01Z

SOP rev

← Older revision		Revision as of 16:32, 31 October 2024
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	==Documentation==		==Documentation==

	*[https://wiki.nanofab.ucsb.edu/w/images/d/d5/~~EB2_SOP_Rev_H~~.pdf E-Beam #2 Standard Operating Procedure]		*[https://wiki.nanofab.ucsb.edu/w/images/4/44/EB2_SOP_Rev_I.pdf E-Beam #2 Standard Operating Procedure]

	==Recipes==		==Recipes==

Sawyer l at 15:09, 30 July 2024

2024-07-30T15:09:14Z

← Older revision		Revision as of 15:09, 30 July 2024
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	\|type = Vacuum Deposition		\|type = Vacuum Deposition
	\|super= Lee Sawyer		\|super= Lee Sawyer
	\|super2= ~~Don~~ ~~Freeborn~~		\|super2= Mike Barreraz
	\|phone=(805)839-2123		\|phone=(805)839-2123
	\|location=Bay 3		\|location=Bay 3

Sawyer l: SOP rev (minor)

2023-08-25T18:31:59Z

SOP rev (minor)

← Older revision		Revision as of 18:31, 25 August 2023
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	==Documentation==		==Documentation==

	*[https://wiki.~~nanotech~~.ucsb.edu/w/images/5/57/~~EB2_SOP_Rev_G~~.pdf E-Beam #2 Standard Operating Procedure]		*[https://wiki.nanofab.ucsb.edu/w/images/d/d5/EB2_SOP_Rev_H.pdf E-Beam #2 Standard Operating Procedure]

	==Recipes==		==Recipes==

Sawyer l: SOP rev

2023-05-10T17:35:36Z

SOP rev

← Older revision		Revision as of 17:35, 10 May 2023
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	==Documentation==		==Documentation==

	*[https://wiki.nanotech.ucsb.edu/w/images/9/90/~~EB2_SOP_Rev_F~~.pdf E-Beam #2 Standard Operating Procedure]		*[https://wiki.nanotech.ucsb.edu/w/images/5/57/EB2_SOP_Rev_G.pdf E-Beam #2 Standard Operating Procedure]

	==Recipes==		==Recipes==

Sawyer l: SOP updated

2023-02-15T21:38:20Z

SOP updated

← Older revision		Revision as of 21:38, 15 February 2023
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	==Documentation==		==Documentation==

	*[https://wiki.nanotech.ucsb.edu/w/images/8/80/~~EB2_SOP_Rev_D~~.pdf E-Beam #2 Standard Operating Procedure]		*[https://wiki.nanotech.ucsb.edu/w/images/9/90/EB2_SOP_Rev_F.pdf E-Beam #2 Standard Operating Procedure]

	==Recipes==		==Recipes==

	* [[E-Beam Evaporation Recipes#E-Beam%202%20.28Custom.29\|Recipes > Vac. Deposition > '''E-Beam 2 (Custom)''']]		*[[E-Beam Evaporation Recipes#E-Beam%202%20.28Custom.29\|Recipes > Vac. Deposition > '''E-Beam 2 (Custom)''']]
	** Lists the characterized recipes for this machine - other materials may also be used with staff permission.		**Lists the characterized recipes for this machine - other materials may also be used with staff permission.

John d: /* Materials Table */ fixed recipes link, bolded heating/oxygen

2022-10-25T19:03:33Z

Materials Table: fixed recipes link, bolded heating/oxygen

← Older revision		Revision as of 19:03, 25 October 2022
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	*Automatic vacuum sequencing via CHA Auto-Tech II		*Automatic vacuum sequencing via CHA Auto-Tech II
	*Crystal thickness monitoring		*Crystal thickness monitoring
⚫	*~~Computer controlled heated~~ sample holder, ~~can achieve~~ sample temps up to 370°C
	*Sample size: up to 5” diameter non-heated, 4" diameter heated		*Sample size: up to 5” diameter non-heated, 4" diameter heated
		⚫	*'''Heated''' sample holder (programmable), sample temps up to 370°C
	*Oxygen ~~bleed~~ for maintaining oxide stoichiometry ~~via MKS mass flow controller~~		*'''Oxygen''' gas MFC for maintaining oxide stoichiometry

	==Documentation==		==Documentation==
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	*[https://wiki.nanotech.ucsb.edu/w/images/8/80/EB2_SOP_Rev_D.pdf E-Beam #2 Standard Operating Procedure]		*[https://wiki.nanotech.ucsb.edu/w/images/8/80/EB2_SOP_Rev_D.pdf E-Beam #2 Standard Operating Procedure]

	==~~Materials Table~~==		==Recipes==

	For the materials tables, please visit the [[E-Beam_Evaporation_Recipes#Materials_Table_(E-Beam #2)\|E-Beam Recipe Page]].
			* [[E-Beam Evaporation Recipes#E-Beam%202%20.28Custom.29\|Recipes > Vac. Deposition > '''E-Beam 2 (Custom)''']]
			** Lists the characterized recipes for this machine - other materials may also be used with staff permission.

Sawyer l: Updated photo

2022-09-08T21:35:17Z

Updated photo

← Older revision		Revision as of 21:35, 8 September 2022
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	{{tool2\|{{PAGENAME}}		{{tool2\|{{PAGENAME}}
	\|picture=~~IMG_5388~~.~~JPG~~		\|picture=IMG 5388.jpg
	\|type = Vacuum Deposition		\|type = Vacuum Deposition
	\|super= Lee Sawyer		\|super= Lee Sawyer

Sawyer l: Tool description/specs

2022-09-06T15:42:01Z

Tool description/specs

← Older revision		Revision as of 15:42, 6 September 2022
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	}}		}}
	==About==		==About==
	This electron-beam evaporation system is used for the controlled deposition of thin dielectric films. The films are evaporated from a wide variety of solid sources. The most common dielectrics deposited are: SiO<sub>2</sub>, ~~SiO~~, TiO<sub>2</sub>, Ta<sub>2</sub>O<sub>5</sub>, ~~ITO~~ and SrF<sub>2</sub>. Other materials may be evaporated upon request. Oxygen gas can be bled into the system during deposition to try to maintain the stoichiometry during deposition. Fixturing for heating the substrate can also be used. A crystal thickness monitor is used to control the deposition thickness. The dielectrics deposited by this system are typically used for optical coatings (anti-reflective), electrical insulators, and reactive ion etching masks. Samples up to ~ 5" diameter can be placed into this system for evaporation. Typical deposition rates are several Angstroms/second.		This electron-beam evaporation system is used for the controlled deposition of thin dielectric films. The films are evaporated from a wide variety of solid sources. The most common dielectrics deposited are: SiO<sub>2</sub>, ITO, TiO<sub>2</sub>, Ta<sub>2</sub>O<sub>5</sub>, and SrF<sub>2</sub>. Other materials may be evaporated upon request. Oxygen gas can be bled into the system during deposition to try to maintain the stoichiometry during deposition. Fixturing for heating the substrate can also be used. A crystal thickness monitor is used to control the deposition thickness. The dielectrics deposited by this system are typically used for optical coatings (anti-reflective), electrical insulators, and reactive ion etching masks. Samples up to ~ 5" diameter can be placed into this system for evaporation. Typical deposition rates are several Angstroms/second.

	==Detailed Specifications==		==Detailed Specifications==

	*Temescal ~~10kV~~ power supply		*Temescal CV-6SXL 10 kV power supply
	*Temescal 4-pocket ~~series~~ 260 e-~~beam~~ source		*Temescal 4-pocket Series 260 E-Beam turret source
			*Temescal TemEbeam Controller (EBC); controls the high voltage power supply, electron beam position (up to 8 sweep patterns per pocket), and source pocket position
	*Temescal Electron beam controller with sweep rate and amplitude control
			*Inficon IC/5 Thin Film Deposition Controller
	*Cryo-pumped system with ~ ~~4.0E~~-7 ultimate base pressure		*Cryo-pumped system with low E-7 ultimate base pressure
	*Automatic vacuum sequencing		*Automatic vacuum sequencing via CHA Auto-Tech II
	*Crystal thickness monitoring		*Crystal thickness monitoring
			*Computer controlled heated sample holder, can achieve sample temps up to 370°C
	*Sample size: up to 5” diameter ~~pieces without heat~~, 4" diameter heated		*Sample size: up to 5” diameter non-heated, 4" diameter heated
	*Oxygen bleed for maintaining oxide stoichiometry		*Oxygen bleed for maintaining oxide stoichiometry via MKS mass flow controller

	==Documentation==		==Documentation==

Silva at 17:24, 30 August 2022

2022-08-30T17:24:38Z

← Older revision		Revision as of 17:24, 30 August 2022
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	{{~~tool~~\|{{PAGENAME}}		{{tool2\|{{PAGENAME}}
	\|picture=IMG_5388.JPG		\|picture=IMG_5388.JPG
	\|type = Vacuum Deposition		\|type = Vacuum Deposition
	\|super= Lee Sawyer		\|super= Lee Sawyer
			\|super2= Don Freeborn
	\|phone=(805)839-2123		\|phone=(805)839-2123
	\|location=Bay 3		\|location=Bay 3