Flip-Chip Bonder (Finetech) - Revision history

John d at 18:12, 18 February 2026

2026-02-18T18:12:53Z

@@ Line 11: / Line 11: @@
 }}
 = About  =
-The Finetech Fineplacer Lambda tool is designed for flip-chip bonding of two parts with an alignment accuracy of about 1um.  The system is a semiautomatic bonder with full computer control of the bonding parameters and an integrated side-camera system for observation during the bond.  Sample sizes as small as 500um on a side to as large as 50mm on a side can be accommodated.  Forces from as small as 0.3N to as large as 500N can be applied to the parts.  Bonding temperatures up to 400C are possible.  The system also has a formic acid module (reduced atmosphere environment) that is used to prevent oxide formation during heated indium bonding.
+The Finetech Fineplacer Lambda tool is designed for flip-chip bonding of two parts with an alignment accuracy of about 1um.  The system is a semiautomatic bonder with full computer control of the bonding parameters and an integrated side-camera system for observation during the bond.

Silva at 18:22, 30 August 2022

2022-08-30T18:22:10Z

← Older revision		Revision as of 18:22, 30 August 2022
Line 1:		Line 1:
	{{~~tool~~\|{{PAGENAME}}		{{tool2\|{{PAGENAME}}
	\|picture=FinetechFlip.jpg		\|picture=FinetechFlip.jpg
	\|type = Packaging		\|type = Packaging
	\|super= Tony Bosch		\|super= Tony Bosch
			\|super2= Bill Millerski
	\|location=Bay 3		\|location=Bay 3
	\|description = Finetech Flip Chip Bonder		\|description = Finetech Flip Chip Bonder

John d: remove incorrect phone/email tags from Tool template

2021-06-30T06:04:22Z

remove incorrect phone/email tags from Tool template

← Older revision		Revision as of 06:04, 30 June 2021
Line 3:		Line 3:
	\|type = Packaging		\|type = Packaging
	\|super= Tony Bosch		\|super= Tony Bosch
	\|phone=(805)839-3918x217
	\|location=Bay 3		\|location=Bay 3
	\|email=bosch@ece.ucsb.edu
	\|description = Finetech Flip Chip Bonder		\|description = Finetech Flip Chip Bonder
	\|manufacturer = [http://www.finetechusa.com/bonders/products/fineplacerr-lambda.html Finetech]		\|manufacturer = [http://www.finetechusa.com/bonders/products/fineplacerr-lambda.html Finetech]

Bosch t: /* About */

2020-04-20T16:30:40Z

About

← Older revision		Revision as of 16:30, 20 April 2020
Line 12:		Line 12:
	}}		}}
	= About =		= About =
	The Finetech Fineplacer Lambda tool is designed for flip-chip bonding of two parts with an alignment accuracy of about ~~0.5um~~. The system is a semiautomatic bonder with full computer control of the bonding parameters and an integrated side-camera system for observation during the bond. Sample sizes as small as 500um on a side to as large as 50mm on a side can be accommodated. Forces from as small as 0.3N to as large as 500N can be applied to the parts. Bonding temperatures up to 400C are possible. The system also has a formic acid module (reduced atmosphere environment) that is used to prevent oxide formation during heated indium bonding.		The Finetech Fineplacer Lambda tool is designed for flip-chip bonding of two parts with an alignment accuracy of about 1um. The system is a semiautomatic bonder with full computer control of the bonding parameters and an integrated side-camera system for observation during the bond. Sample sizes as small as 500um on a side to as large as 50mm on a side can be accommodated. Forces from as small as 0.3N to as large as 500N can be applied to the parts. Bonding temperatures up to 400C are possible. The system also has a formic acid module (reduced atmosphere environment) that is used to prevent oxide formation during heated indium bonding.

Bosch: /* About */

2013-06-13T22:21:30Z

About

← Older revision		Revision as of 22:21, 13 June 2013
Line 12:		Line 12:
	}}		}}
	= About =		= About =
	The Finetech Fineplacer Lambda tool is designed for flip-chip bonding of two parts with an alignment accuracy ~~better~~ of about 0.5um. The system is a semiautomatic bonder with full computer control of the bonding parameters and an integrated side-camera system for observation during the bond. Sample sizes as small as 500um on a side to as large as 50mm on a side can be accommodated. Forces from as small as 0.3N to as large as 500N can be applied to the parts. Bonding temperatures up to ~~350C~~ are possible. The system also has a ~~forming~~ ~~gas~~ module ~~that~~ ~~can~~ be used to ~~clean/~~prevent oxide formation during heated indium bonding.		The Finetech Fineplacer Lambda tool is designed for flip-chip bonding of two parts with an alignment accuracy of about 0.5um. The system is a semiautomatic bonder with full computer control of the bonding parameters and an integrated side-camera system for observation during the bond. Sample sizes as small as 500um on a side to as large as 50mm on a side can be accommodated. Forces from as small as 0.3N to as large as 500N can be applied to the parts. Bonding temperatures up to 400C are possible. The system also has a formic acid module (reduced atmosphere environment) that is used to prevent oxide formation during heated indium bonding.

Zwarburg at 14:03, 11 July 2012

2012-07-11T14:03:57Z

← Older revision		Revision as of 14:03, 11 July 2012
Line 9:		Line 9:
	\|manufacturer = [http://www.finetechusa.com/bonders/products/fineplacerr-lambda.html Finetech]		\|manufacturer = [http://www.finetechusa.com/bonders/products/fineplacerr-lambda.html Finetech]
	\|materials =		\|materials =
			\|toolid=40
	}}		}}
	= About =		= About =

Zwarburg: moved Flip-Chip Bonder to Flip-Chip Bonder (Finetech)

2012-06-28T19:56:50Z

moved Flip-Chip Bonder to Flip-Chip Bonder (Finetech)

← Older revision	Revision as of 19:56, 28 June 2012
(No difference)

Zwarburg: Created page with "{{tool|{{PAGENAME}} |picture=FinetechFlip.jpg |type = Packaging |super= Tony Bosch |phone=(805)839-3918x217 |location=Bay 3 |email=bosch@ece.ucsb.edu |description = Finetech Flip…"

2012-06-28T15:07:00Z

Created page with "{{tool|{{PAGENAME}} |picture=FinetechFlip.jpg |type = Packaging |super= Tony Bosch |phone=(805)839-3918x217 |location=Bay 3 |email=bosch@ece.ucsb.edu |description = Finetech Flip…"

New page

{{tool|{{PAGENAME}}
|picture=FinetechFlip.jpg
|type = Packaging
|super= Tony Bosch
|phone=(805)839-3918x217
|location=Bay 3
|email=bosch@ece.ucsb.edu
|description = Finetech Flip Chip Bonder
|manufacturer = [http://www.finetechusa.com/bonders/products/fineplacerr-lambda.html Finetech]
|materials =
}}
= About =
The Finetech Fineplacer Lambda tool is designed for flip-chip bonding of two parts with an alignment accuracy better of about 0.5um. The system is a semiautomatic bonder with full computer control of the bonding parameters and an integrated side-camera system for observation during the bond. Sample sizes as small as 500um on a side to as large as 50mm on a side can be accommodated. Forces from as small as 0.3N to as large as 500N can be applied to the parts. Bonding temperatures up to 350C are possible. The system also has a forming gas module that can be used to clean/prevent oxide formation during heated indium bonding.