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	<id>https://wiki.nanofab.ucsb.edu/w/index.php?action=history&amp;feed=atom&amp;title=HF_Vapor_Etch</id>
	<title>HF Vapor Etch - Revision history</title>
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	<updated>2026-05-09T21:13:00Z</updated>
	<subtitle>Revision history for this page on the wiki</subtitle>
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	<entry>
		<id>https://wiki.nanofab.ucsb.edu/w/index.php?title=HF_Vapor_Etch&amp;diff=3301&amp;oldid=prev</id>
		<title>Ningcao: /* About */</title>
		<link rel="alternate" type="text/html" href="https://wiki.nanofab.ucsb.edu/w/index.php?title=HF_Vapor_Etch&amp;diff=3301&amp;oldid=prev"/>
		<updated>2014-01-31T22:51:23Z</updated>

		<summary type="html">&lt;p&gt;&lt;span class=&quot;autocomment&quot;&gt;About&lt;/span&gt;&lt;/p&gt;
&lt;table style=&quot;background-color: #fff; color: #202122;&quot; data-mw=&quot;interface&quot;&gt;
				&lt;col class=&quot;diff-marker&quot; /&gt;
				&lt;col class=&quot;diff-content&quot; /&gt;
				&lt;col class=&quot;diff-marker&quot; /&gt;
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				&lt;tr class=&quot;diff-title&quot; lang=&quot;en&quot;&gt;
				&lt;td colspan=&quot;2&quot; style=&quot;background-color: #fff; color: #202122; text-align: center;&quot;&gt;← Older revision&lt;/td&gt;
				&lt;td colspan=&quot;2&quot; style=&quot;background-color: #fff; color: #202122; text-align: center;&quot;&gt;Revision as of 22:51, 31 January 2014&lt;/td&gt;
				&lt;/tr&gt;&lt;tr&gt;
  &lt;td colspan=&quot;2&quot; class=&quot;diff-lineno&quot;&gt;Line 12:&lt;/td&gt;
  &lt;td colspan=&quot;2&quot; class=&quot;diff-lineno&quot;&gt;Line 12:&lt;/td&gt;
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&lt;tr&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;}} &lt;/div&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;}} &lt;/div&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;= About  =&lt;/div&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;= About  =&lt;/div&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td class=&quot;diff-marker&quot; data-marker=&quot;−&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #ffe49c; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;applications of this tool are mainly in MEMS-device fabrication areas (releasing a MEMS structure by etching a sacrificial SiO&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt; layer below) with the use of Al&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt;O&amp;lt;sub&amp;gt;3&amp;lt;/sub&amp;gt;, Al or some other metal as an etch mask at 45&amp;lt;sup&amp;gt;o&amp;lt;/sup&amp;gt;C.  The tool uses vapor HF (VHF), EtOH (Ethanol vapor is an Alcohol-based one, ionizing the HF and activating etching, influencing within wafer etch uniformity, and being most compatible with VHF), and N&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt; gases and can process small sample(s) (on a 8&amp;lt;sup&amp;gt;&quot;&amp;lt;/sup&amp;gt; Si carrier wafer) up to an 8&amp;lt;sup&amp;gt;&quot;&amp;lt;/sup&amp;gt; wafer. There are 5 standard etch recipes installed in the tool with the SiO&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt; etch rate from low to high. The SiO&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt; under etch rate is from ~10nm/min to ~350nm/min.&lt;/div&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot; data-marker=&quot;+&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #a3d3ff; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;&lt;ins style=&quot;font-weight: bold; text-decoration: none;&quot;&gt;The &lt;/ins&gt;applications of this tool are mainly in MEMS-device fabrication areas (releasing a MEMS structure by etching a sacrificial SiO&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt; layer below) with the use of Al&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt;O&amp;lt;sub&amp;gt;3&amp;lt;/sub&amp;gt;, Al or some other metal as an etch mask at 45&amp;lt;sup&amp;gt;o&amp;lt;/sup&amp;gt;C.  The tool uses vapor HF (VHF), EtOH (Ethanol vapor is an Alcohol-based one, ionizing the HF and activating etching, influencing within wafer etch uniformity, and being most compatible with VHF), and N&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt; gases and can process small sample(s) (on a 8&amp;lt;sup&amp;gt;&quot;&amp;lt;/sup&amp;gt; Si carrier wafer) up to an 8&amp;lt;sup&amp;gt;&quot;&amp;lt;/sup&amp;gt; wafer. There are 5 standard etch recipes installed in the tool with the SiO&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt; etch rate from low to high. The SiO&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt; under etch rate is from ~10nm/min to ~350nm/min.&lt;/div&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;br /&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;br /&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;=Documentation=&lt;/div&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;=Documentation=&lt;/div&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;/table&gt;</summary>
		<author><name>Ningcao</name></author>
	</entry>
	<entry>
		<id>https://wiki.nanofab.ucsb.edu/w/index.php?title=HF_Vapor_Etch&amp;diff=3300&amp;oldid=prev</id>
		<title>Ningcao: /* About */</title>
		<link rel="alternate" type="text/html" href="https://wiki.nanofab.ucsb.edu/w/index.php?title=HF_Vapor_Etch&amp;diff=3300&amp;oldid=prev"/>
		<updated>2014-01-31T22:49:38Z</updated>

		<summary type="html">&lt;p&gt;&lt;span class=&quot;autocomment&quot;&gt;About&lt;/span&gt;&lt;/p&gt;
&lt;table style=&quot;background-color: #fff; color: #202122;&quot; data-mw=&quot;interface&quot;&gt;
				&lt;col class=&quot;diff-marker&quot; /&gt;
				&lt;col class=&quot;diff-content&quot; /&gt;
				&lt;col class=&quot;diff-marker&quot; /&gt;
				&lt;col class=&quot;diff-content&quot; /&gt;
				&lt;tr class=&quot;diff-title&quot; lang=&quot;en&quot;&gt;
				&lt;td colspan=&quot;2&quot; style=&quot;background-color: #fff; color: #202122; text-align: center;&quot;&gt;← Older revision&lt;/td&gt;
				&lt;td colspan=&quot;2&quot; style=&quot;background-color: #fff; color: #202122; text-align: center;&quot;&gt;Revision as of 22:49, 31 January 2014&lt;/td&gt;
				&lt;/tr&gt;&lt;tr&gt;
  &lt;td colspan=&quot;2&quot; class=&quot;diff-lineno&quot;&gt;Line 12:&lt;/td&gt;
  &lt;td colspan=&quot;2&quot; class=&quot;diff-lineno&quot;&gt;Line 12:&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;}} &lt;/div&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;}} &lt;/div&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;= About  =&lt;/div&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;= About  =&lt;/div&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td class=&quot;diff-marker&quot; data-marker=&quot;−&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #ffe49c; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;&lt;del style=&quot;font-weight: bold; text-decoration: none;&quot;&gt;The &lt;/del&gt;applications of this tool are mainly in MEMS-device fabrication areas (releasing a MEMS structure by etching a sacrificial SiO&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt; layer below) with the use of Al&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt;O&amp;lt;sub&amp;gt;3&amp;lt;/sub&amp;gt;, Al or some other metal as an etch mask at 45&amp;lt;sup&amp;gt;o&amp;lt;/sup&amp;gt;C.  The tool uses vapor HF (VHF), EtOH (Ethanol vapor is an Alcohol-based one, ionizing the HF and activating etching, influencing within wafer etch uniformity, and being most compatible with VHF), and N&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt; gases and can process small sample(s) (on a 8&amp;lt;sup&amp;gt;&quot;&amp;lt;/sup&amp;gt; Si carrier wafer) up to an 8&amp;lt;sup&amp;gt;&quot;&amp;lt;/sup&amp;gt; wafer. There are 5 standard etch recipes installed in the tool with the SiO&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt; etch rate from low to high. The SiO&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt; under etch rate is from ~10nm/min to ~350nm/min.&lt;/div&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot; data-marker=&quot;+&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #a3d3ff; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;applications of this tool are mainly in MEMS-device fabrication areas (releasing a MEMS structure by etching a sacrificial SiO&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt; layer below) with the use of Al&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt;O&amp;lt;sub&amp;gt;3&amp;lt;/sub&amp;gt;, Al or some other metal as an etch mask at 45&amp;lt;sup&amp;gt;o&amp;lt;/sup&amp;gt;C.  The tool uses vapor HF (VHF), EtOH (Ethanol vapor is an Alcohol-based one, ionizing the HF and activating etching, influencing within wafer etch uniformity, and being most compatible with VHF), and N&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt; gases and can process small sample(s) (on a 8&amp;lt;sup&amp;gt;&quot;&amp;lt;/sup&amp;gt; Si carrier wafer) up to an 8&amp;lt;sup&amp;gt;&quot;&amp;lt;/sup&amp;gt; wafer. There are 5 standard etch recipes installed in the tool with the SiO&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt; etch rate from low to high. The SiO&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt; under etch rate is from ~10nm/min to ~350nm/min.&lt;/div&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td colspan=&quot;2&quot; class=&quot;diff-empty diff-side-deleted&quot;&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot; data-marker=&quot;+&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #a3d3ff; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;br /&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;=Documentation=&lt;/div&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;=Documentation=&lt;/div&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;*[[media:SPTS-Primaxx_uEtch_Presentation-a.pdf|System Manual]]&lt;/div&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;*[[media:SPTS-Primaxx_uEtch_Presentation-a.pdf|System Manual]]&lt;/div&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;/table&gt;</summary>
		<author><name>Ningcao</name></author>
	</entry>
	<entry>
		<id>https://wiki.nanofab.ucsb.edu/w/index.php?title=HF_Vapor_Etch&amp;diff=3299&amp;oldid=prev</id>
		<title>Ningcao: /* Documentation */</title>
		<link rel="alternate" type="text/html" href="https://wiki.nanofab.ucsb.edu/w/index.php?title=HF_Vapor_Etch&amp;diff=3299&amp;oldid=prev"/>
		<updated>2014-01-31T22:37:50Z</updated>

		<summary type="html">&lt;p&gt;&lt;span class=&quot;autocomment&quot;&gt;Documentation&lt;/span&gt;&lt;/p&gt;
&lt;table style=&quot;background-color: #fff; color: #202122;&quot; data-mw=&quot;interface&quot;&gt;
				&lt;col class=&quot;diff-marker&quot; /&gt;
				&lt;col class=&quot;diff-content&quot; /&gt;
				&lt;col class=&quot;diff-marker&quot; /&gt;
				&lt;col class=&quot;diff-content&quot; /&gt;
				&lt;tr class=&quot;diff-title&quot; lang=&quot;en&quot;&gt;
				&lt;td colspan=&quot;2&quot; style=&quot;background-color: #fff; color: #202122; text-align: center;&quot;&gt;← Older revision&lt;/td&gt;
				&lt;td colspan=&quot;2&quot; style=&quot;background-color: #fff; color: #202122; text-align: center;&quot;&gt;Revision as of 22:37, 31 January 2014&lt;/td&gt;
				&lt;/tr&gt;&lt;tr&gt;
  &lt;td colspan=&quot;2&quot; class=&quot;diff-lineno&quot;&gt;Line 17:&lt;/td&gt;
  &lt;td colspan=&quot;2&quot; class=&quot;diff-lineno&quot;&gt;Line 17:&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;*[[media:SPTS-Primaxx_uEtch_Presentation-b.pdf|System Manual]]&lt;/div&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;*[[media:SPTS-Primaxx_uEtch_Presentation-b.pdf|System Manual]]&lt;/div&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;*[[media:25-Dry_Etch_of_Unaxis_ICP-grown_SiO2_using_Vapor_HF_tool-a.pdf|Si Etching Profile &amp;amp; Results]]&lt;/div&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;*[[media:25-Dry_Etch_of_Unaxis_ICP-grown_SiO2_using_Vapor_HF_tool-a.pdf|Si Etching Profile &amp;amp; Results]]&lt;/div&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td class=&quot;diff-marker&quot; data-marker=&quot;−&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #ffe49c; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;*[[media:|Si Etching Profile &amp;amp; Results]]&lt;/div&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot; data-marker=&quot;+&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #a3d3ff; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;*[[media:&lt;ins style=&quot;font-weight: bold; text-decoration: none;&quot;&gt;26-Dry_Etch_of_Unaxis_ICP-grown_SiO2_using_Vapor_HF_tool-b.pdf&lt;/ins&gt;|Si Etching Profile &amp;amp; Results]]&lt;/div&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;/table&gt;</summary>
		<author><name>Ningcao</name></author>
	</entry>
	<entry>
		<id>https://wiki.nanofab.ucsb.edu/w/index.php?title=HF_Vapor_Etch&amp;diff=3298&amp;oldid=prev</id>
		<title>Ningcao: /* Documentation */</title>
		<link rel="alternate" type="text/html" href="https://wiki.nanofab.ucsb.edu/w/index.php?title=HF_Vapor_Etch&amp;diff=3298&amp;oldid=prev"/>
		<updated>2014-01-31T22:37:20Z</updated>

		<summary type="html">&lt;p&gt;&lt;span class=&quot;autocomment&quot;&gt;Documentation&lt;/span&gt;&lt;/p&gt;
&lt;table style=&quot;background-color: #fff; color: #202122;&quot; data-mw=&quot;interface&quot;&gt;
				&lt;col class=&quot;diff-marker&quot; /&gt;
				&lt;col class=&quot;diff-content&quot; /&gt;
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				&lt;col class=&quot;diff-content&quot; /&gt;
				&lt;tr class=&quot;diff-title&quot; lang=&quot;en&quot;&gt;
				&lt;td colspan=&quot;2&quot; style=&quot;background-color: #fff; color: #202122; text-align: center;&quot;&gt;← Older revision&lt;/td&gt;
				&lt;td colspan=&quot;2&quot; style=&quot;background-color: #fff; color: #202122; text-align: center;&quot;&gt;Revision as of 22:37, 31 January 2014&lt;/td&gt;
				&lt;/tr&gt;&lt;tr&gt;
  &lt;td colspan=&quot;2&quot; class=&quot;diff-lineno&quot;&gt;Line 16:&lt;/td&gt;
  &lt;td colspan=&quot;2&quot; class=&quot;diff-lineno&quot;&gt;Line 16:&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;*[[media:SPTS-Primaxx_uEtch_Presentation-a.pdf|System Manual]]&lt;/div&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;*[[media:SPTS-Primaxx_uEtch_Presentation-a.pdf|System Manual]]&lt;/div&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;*[[media:SPTS-Primaxx_uEtch_Presentation-b.pdf|System Manual]]&lt;/div&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;*[[media:SPTS-Primaxx_uEtch_Presentation-b.pdf|System Manual]]&lt;/div&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td class=&quot;diff-marker&quot; data-marker=&quot;−&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #ffe49c; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;*[[media:|Si Etching Profile &amp;amp; Results]]&lt;/div&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot; data-marker=&quot;+&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #a3d3ff; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;*[[media:&lt;ins style=&quot;font-weight: bold; text-decoration: none;&quot;&gt;25-Dry_Etch_of_Unaxis_ICP-grown_SiO2_using_Vapor_HF_tool-a.pdf&lt;/ins&gt;|Si Etching Profile &amp;amp; Results]]&lt;/div&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;*[[media:|Si Etching Profile &amp;amp; Results]]&lt;/div&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;*[[media:|Si Etching Profile &amp;amp; Results]]&lt;/div&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;/table&gt;</summary>
		<author><name>Ningcao</name></author>
	</entry>
	<entry>
		<id>https://wiki.nanofab.ucsb.edu/w/index.php?title=HF_Vapor_Etch&amp;diff=3297&amp;oldid=prev</id>
		<title>Ningcao: /* Documentation */</title>
		<link rel="alternate" type="text/html" href="https://wiki.nanofab.ucsb.edu/w/index.php?title=HF_Vapor_Etch&amp;diff=3297&amp;oldid=prev"/>
		<updated>2014-01-31T22:36:29Z</updated>

		<summary type="html">&lt;p&gt;&lt;span class=&quot;autocomment&quot;&gt;Documentation&lt;/span&gt;&lt;/p&gt;
&lt;table style=&quot;background-color: #fff; color: #202122;&quot; data-mw=&quot;interface&quot;&gt;
				&lt;col class=&quot;diff-marker&quot; /&gt;
				&lt;col class=&quot;diff-content&quot; /&gt;
				&lt;col class=&quot;diff-marker&quot; /&gt;
				&lt;col class=&quot;diff-content&quot; /&gt;
				&lt;tr class=&quot;diff-title&quot; lang=&quot;en&quot;&gt;
				&lt;td colspan=&quot;2&quot; style=&quot;background-color: #fff; color: #202122; text-align: center;&quot;&gt;← Older revision&lt;/td&gt;
				&lt;td colspan=&quot;2&quot; style=&quot;background-color: #fff; color: #202122; text-align: center;&quot;&gt;Revision as of 22:36, 31 January 2014&lt;/td&gt;
				&lt;/tr&gt;&lt;tr&gt;
  &lt;td colspan=&quot;2&quot; class=&quot;diff-lineno&quot;&gt;Line 16:&lt;/td&gt;
  &lt;td colspan=&quot;2&quot; class=&quot;diff-lineno&quot;&gt;Line 16:&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;*[[media:SPTS-Primaxx_uEtch_Presentation-a.pdf|System Manual]]&lt;/div&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;*[[media:SPTS-Primaxx_uEtch_Presentation-a.pdf|System Manual]]&lt;/div&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;*[[media:SPTS-Primaxx_uEtch_Presentation-b.pdf|System Manual]]&lt;/div&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;*[[media:SPTS-Primaxx_uEtch_Presentation-b.pdf|System Manual]]&lt;/div&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td class=&quot;diff-marker&quot; data-marker=&quot;−&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #ffe49c; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;*[[media:&lt;del style=&quot;font-weight: bold; text-decoration: none;&quot;&gt;25-Dry_Etch_of_Unaxis_ICP-grown_SiO2_using_Vapor_HF_tool-1.pdf&lt;/del&gt;|Si Etching Profile &amp;amp; Results]]&lt;/div&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot; data-marker=&quot;+&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #a3d3ff; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;*[[media:|Si Etching Profile &amp;amp; Results]]&lt;/div&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td class=&quot;diff-marker&quot; data-marker=&quot;−&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #ffe49c; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;*[[media:&lt;del style=&quot;font-weight: bold; text-decoration: none;&quot;&gt;26-Dry_Etch_of_Unaxis_ICP-grown_SiO2_using_Vapor_HF_tool-2.pdf&lt;/del&gt;|Si Etching Profile &amp;amp; Results]]&lt;/div&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot; data-marker=&quot;+&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #a3d3ff; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;*[[media:|Si Etching Profile &amp;amp; Results]]&lt;/div&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;/table&gt;</summary>
		<author><name>Ningcao</name></author>
	</entry>
	<entry>
		<id>https://wiki.nanofab.ucsb.edu/w/index.php?title=HF_Vapor_Etch&amp;diff=3286&amp;oldid=prev</id>
		<title>Ningcao: /* Documentation */</title>
		<link rel="alternate" type="text/html" href="https://wiki.nanofab.ucsb.edu/w/index.php?title=HF_Vapor_Etch&amp;diff=3286&amp;oldid=prev"/>
		<updated>2014-01-30T23:44:39Z</updated>

		<summary type="html">&lt;p&gt;&lt;span class=&quot;autocomment&quot;&gt;Documentation&lt;/span&gt;&lt;/p&gt;
&lt;table style=&quot;background-color: #fff; color: #202122;&quot; data-mw=&quot;interface&quot;&gt;
				&lt;col class=&quot;diff-marker&quot; /&gt;
				&lt;col class=&quot;diff-content&quot; /&gt;
				&lt;col class=&quot;diff-marker&quot; /&gt;
				&lt;col class=&quot;diff-content&quot; /&gt;
				&lt;tr class=&quot;diff-title&quot; lang=&quot;en&quot;&gt;
				&lt;td colspan=&quot;2&quot; style=&quot;background-color: #fff; color: #202122; text-align: center;&quot;&gt;← Older revision&lt;/td&gt;
				&lt;td colspan=&quot;2&quot; style=&quot;background-color: #fff; color: #202122; text-align: center;&quot;&gt;Revision as of 23:44, 30 January 2014&lt;/td&gt;
				&lt;/tr&gt;&lt;tr&gt;
  &lt;td colspan=&quot;2&quot; class=&quot;diff-lineno&quot;&gt;Line 15:&lt;/td&gt;
  &lt;td colspan=&quot;2&quot; class=&quot;diff-lineno&quot;&gt;Line 15:&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;=Documentation=&lt;/div&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;=Documentation=&lt;/div&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;*[[media:SPTS-Primaxx_uEtch_Presentation-a.pdf|System Manual]]&lt;/div&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;*[[media:SPTS-Primaxx_uEtch_Presentation-a.pdf|System Manual]]&lt;/div&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td class=&quot;diff-marker&quot; data-marker=&quot;−&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #ffe49c; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;*[[media:|System Manual]]&lt;/div&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot; data-marker=&quot;+&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #a3d3ff; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;*[[media:&lt;ins style=&quot;font-weight: bold; text-decoration: none;&quot;&gt;SPTS-Primaxx_uEtch_Presentation-b.pdf&lt;/ins&gt;|System Manual]]&lt;/div&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;*[[media:25-Dry_Etch_of_Unaxis_ICP-grown_SiO2_using_Vapor_HF_tool-1.pdf|Si Etching Profile &amp;amp; Results]]&lt;/div&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;*[[media:25-Dry_Etch_of_Unaxis_ICP-grown_SiO2_using_Vapor_HF_tool-1.pdf|Si Etching Profile &amp;amp; Results]]&lt;/div&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;*[[media:26-Dry_Etch_of_Unaxis_ICP-grown_SiO2_using_Vapor_HF_tool-2.pdf|Si Etching Profile &amp;amp; Results]]&lt;/div&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;*[[media:26-Dry_Etch_of_Unaxis_ICP-grown_SiO2_using_Vapor_HF_tool-2.pdf|Si Etching Profile &amp;amp; Results]]&lt;/div&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;/table&gt;</summary>
		<author><name>Ningcao</name></author>
	</entry>
	<entry>
		<id>https://wiki.nanofab.ucsb.edu/w/index.php?title=HF_Vapor_Etch&amp;diff=3284&amp;oldid=prev</id>
		<title>Ningcao: /* Documentation */</title>
		<link rel="alternate" type="text/html" href="https://wiki.nanofab.ucsb.edu/w/index.php?title=HF_Vapor_Etch&amp;diff=3284&amp;oldid=prev"/>
		<updated>2014-01-30T23:43:51Z</updated>

		<summary type="html">&lt;p&gt;&lt;span class=&quot;autocomment&quot;&gt;Documentation&lt;/span&gt;&lt;/p&gt;
&lt;table style=&quot;background-color: #fff; color: #202122;&quot; data-mw=&quot;interface&quot;&gt;
				&lt;col class=&quot;diff-marker&quot; /&gt;
				&lt;col class=&quot;diff-content&quot; /&gt;
				&lt;col class=&quot;diff-marker&quot; /&gt;
				&lt;col class=&quot;diff-content&quot; /&gt;
				&lt;tr class=&quot;diff-title&quot; lang=&quot;en&quot;&gt;
				&lt;td colspan=&quot;2&quot; style=&quot;background-color: #fff; color: #202122; text-align: center;&quot;&gt;← Older revision&lt;/td&gt;
				&lt;td colspan=&quot;2&quot; style=&quot;background-color: #fff; color: #202122; text-align: center;&quot;&gt;Revision as of 23:43, 30 January 2014&lt;/td&gt;
				&lt;/tr&gt;&lt;tr&gt;
  &lt;td colspan=&quot;2&quot; class=&quot;diff-lineno&quot;&gt;Line 15:&lt;/td&gt;
  &lt;td colspan=&quot;2&quot; class=&quot;diff-lineno&quot;&gt;Line 15:&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;=Documentation=&lt;/div&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;=Documentation=&lt;/div&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;*[[media:SPTS-Primaxx_uEtch_Presentation-a.pdf|System Manual]]&lt;/div&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;*[[media:SPTS-Primaxx_uEtch_Presentation-a.pdf|System Manual]]&lt;/div&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td colspan=&quot;2&quot; class=&quot;diff-empty diff-side-deleted&quot;&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot; data-marker=&quot;+&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #a3d3ff; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;*[[media:|System Manual]]&lt;/div&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;*[[media:25-Dry_Etch_of_Unaxis_ICP-grown_SiO2_using_Vapor_HF_tool-1.pdf|Si Etching Profile &amp;amp; Results]]&lt;/div&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;*[[media:25-Dry_Etch_of_Unaxis_ICP-grown_SiO2_using_Vapor_HF_tool-1.pdf|Si Etching Profile &amp;amp; Results]]&lt;/div&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;*[[media:26-Dry_Etch_of_Unaxis_ICP-grown_SiO2_using_Vapor_HF_tool-2.pdf|Si Etching Profile &amp;amp; Results]]&lt;/div&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;*[[media:26-Dry_Etch_of_Unaxis_ICP-grown_SiO2_using_Vapor_HF_tool-2.pdf|Si Etching Profile &amp;amp; Results]]&lt;/div&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;/table&gt;</summary>
		<author><name>Ningcao</name></author>
	</entry>
	<entry>
		<id>https://wiki.nanofab.ucsb.edu/w/index.php?title=HF_Vapor_Etch&amp;diff=3283&amp;oldid=prev</id>
		<title>Ningcao: /* Documentation */</title>
		<link rel="alternate" type="text/html" href="https://wiki.nanofab.ucsb.edu/w/index.php?title=HF_Vapor_Etch&amp;diff=3283&amp;oldid=prev"/>
		<updated>2014-01-30T23:43:17Z</updated>

		<summary type="html">&lt;p&gt;&lt;span class=&quot;autocomment&quot;&gt;Documentation&lt;/span&gt;&lt;/p&gt;
&lt;table style=&quot;background-color: #fff; color: #202122;&quot; data-mw=&quot;interface&quot;&gt;
				&lt;col class=&quot;diff-marker&quot; /&gt;
				&lt;col class=&quot;diff-content&quot; /&gt;
				&lt;col class=&quot;diff-marker&quot; /&gt;
				&lt;col class=&quot;diff-content&quot; /&gt;
				&lt;tr class=&quot;diff-title&quot; lang=&quot;en&quot;&gt;
				&lt;td colspan=&quot;2&quot; style=&quot;background-color: #fff; color: #202122; text-align: center;&quot;&gt;← Older revision&lt;/td&gt;
				&lt;td colspan=&quot;2&quot; style=&quot;background-color: #fff; color: #202122; text-align: center;&quot;&gt;Revision as of 23:43, 30 January 2014&lt;/td&gt;
				&lt;/tr&gt;&lt;tr&gt;
  &lt;td colspan=&quot;2&quot; class=&quot;diff-lineno&quot;&gt;Line 14:&lt;/td&gt;
  &lt;td colspan=&quot;2&quot; class=&quot;diff-lineno&quot;&gt;Line 14:&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;The applications of this tool are mainly in MEMS-device fabrication areas (releasing a MEMS structure by etching a sacrificial SiO&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt; layer below) with the use of Al&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt;O&amp;lt;sub&amp;gt;3&amp;lt;/sub&amp;gt;, Al or some other metal as an etch mask at 45&amp;lt;sup&amp;gt;o&amp;lt;/sup&amp;gt;C.  The tool uses vapor HF (VHF), EtOH (Ethanol vapor is an Alcohol-based one, ionizing the HF and activating etching, influencing within wafer etch uniformity, and being most compatible with VHF), and N&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt; gases and can process small sample(s) (on a 8&amp;lt;sup&amp;gt;&quot;&amp;lt;/sup&amp;gt; Si carrier wafer) up to an 8&amp;lt;sup&amp;gt;&quot;&amp;lt;/sup&amp;gt; wafer. There are 5 standard etch recipes installed in the tool with the SiO&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt; etch rate from low to high. The SiO&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt; under etch rate is from ~10nm/min to ~350nm/min.&lt;/div&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;The applications of this tool are mainly in MEMS-device fabrication areas (releasing a MEMS structure by etching a sacrificial SiO&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt; layer below) with the use of Al&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt;O&amp;lt;sub&amp;gt;3&amp;lt;/sub&amp;gt;, Al or some other metal as an etch mask at 45&amp;lt;sup&amp;gt;o&amp;lt;/sup&amp;gt;C.  The tool uses vapor HF (VHF), EtOH (Ethanol vapor is an Alcohol-based one, ionizing the HF and activating etching, influencing within wafer etch uniformity, and being most compatible with VHF), and N&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt; gases and can process small sample(s) (on a 8&amp;lt;sup&amp;gt;&quot;&amp;lt;/sup&amp;gt; Si carrier wafer) up to an 8&amp;lt;sup&amp;gt;&quot;&amp;lt;/sup&amp;gt; wafer. There are 5 standard etch recipes installed in the tool with the SiO&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt; etch rate from low to high. The SiO&amp;lt;sub&amp;gt;2&amp;lt;/sub&amp;gt; under etch rate is from ~10nm/min to ~350nm/min.&lt;/div&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;=Documentation=&lt;/div&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;=Documentation=&lt;/div&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td class=&quot;diff-marker&quot; data-marker=&quot;−&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #ffe49c; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;*[[media:|System Manual]]&lt;/div&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot; data-marker=&quot;+&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #a3d3ff; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;*[[media:&lt;ins style=&quot;font-weight: bold; text-decoration: none;&quot;&gt;SPTS-Primaxx_uEtch_Presentation-a.pdf&lt;/ins&gt;|System Manual]]&lt;/div&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;*[[media:25-Dry_Etch_of_Unaxis_ICP-grown_SiO2_using_Vapor_HF_tool-1.pdf|Si Etching Profile &amp;amp; Results]]&lt;/div&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;*[[media:25-Dry_Etch_of_Unaxis_ICP-grown_SiO2_using_Vapor_HF_tool-1.pdf|Si Etching Profile &amp;amp; Results]]&lt;/div&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;*[[media:26-Dry_Etch_of_Unaxis_ICP-grown_SiO2_using_Vapor_HF_tool-2.pdf|Si Etching Profile &amp;amp; Results]]&lt;/div&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;*[[media:26-Dry_Etch_of_Unaxis_ICP-grown_SiO2_using_Vapor_HF_tool-2.pdf|Si Etching Profile &amp;amp; Results]]&lt;/div&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;/table&gt;</summary>
		<author><name>Ningcao</name></author>
	</entry>
	<entry>
		<id>https://wiki.nanofab.ucsb.edu/w/index.php?title=HF_Vapor_Etch&amp;diff=3280&amp;oldid=prev</id>
		<title>Ningcao: /* Documentation */</title>
		<link rel="alternate" type="text/html" href="https://wiki.nanofab.ucsb.edu/w/index.php?title=HF_Vapor_Etch&amp;diff=3280&amp;oldid=prev"/>
		<updated>2014-01-30T19:48:55Z</updated>

		<summary type="html">&lt;p&gt;&lt;span class=&quot;autocomment&quot;&gt;Documentation&lt;/span&gt;&lt;/p&gt;
&lt;table style=&quot;background-color: #fff; color: #202122;&quot; data-mw=&quot;interface&quot;&gt;
				&lt;col class=&quot;diff-marker&quot; /&gt;
				&lt;col class=&quot;diff-content&quot; /&gt;
				&lt;col class=&quot;diff-marker&quot; /&gt;
				&lt;col class=&quot;diff-content&quot; /&gt;
				&lt;tr class=&quot;diff-title&quot; lang=&quot;en&quot;&gt;
				&lt;td colspan=&quot;2&quot; style=&quot;background-color: #fff; color: #202122; text-align: center;&quot;&gt;← Older revision&lt;/td&gt;
				&lt;td colspan=&quot;2&quot; style=&quot;background-color: #fff; color: #202122; text-align: center;&quot;&gt;Revision as of 19:48, 30 January 2014&lt;/td&gt;
				&lt;/tr&gt;&lt;tr&gt;
  &lt;td colspan=&quot;2&quot; class=&quot;diff-lineno&quot;&gt;Line 15:&lt;/td&gt;
  &lt;td colspan=&quot;2&quot; class=&quot;diff-lineno&quot;&gt;Line 15:&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;=Documentation=&lt;/div&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;=Documentation=&lt;/div&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;*[[media:|System Manual]]&lt;/div&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;*[[media:|System Manual]]&lt;/div&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td class=&quot;diff-marker&quot; data-marker=&quot;−&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #ffe49c; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;*[[media&lt;del style=&quot;font-weight: bold; text-decoration: none;&quot;&gt;:File&lt;/del&gt;:25-Dry_Etch_of_Unaxis_ICP-grown_SiO2_using_Vapor_HF_tool-1.pdf|Si Etching Profile &amp;amp; Results]]&lt;/div&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot; data-marker=&quot;+&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #a3d3ff; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;*[[media:25-Dry_Etch_of_Unaxis_ICP-grown_SiO2_using_Vapor_HF_tool-1.pdf|Si Etching Profile &amp;amp; Results]]&lt;/div&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;*[[media:26-Dry_Etch_of_Unaxis_ICP-grown_SiO2_using_Vapor_HF_tool-2.pdf|Si Etching Profile &amp;amp; Results]]&lt;/div&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;*[[media:26-Dry_Etch_of_Unaxis_ICP-grown_SiO2_using_Vapor_HF_tool-2.pdf|Si Etching Profile &amp;amp; Results]]&lt;/div&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;/table&gt;</summary>
		<author><name>Ningcao</name></author>
	</entry>
	<entry>
		<id>https://wiki.nanofab.ucsb.edu/w/index.php?title=HF_Vapor_Etch&amp;diff=3279&amp;oldid=prev</id>
		<title>Ningcao: /* Documentation */</title>
		<link rel="alternate" type="text/html" href="https://wiki.nanofab.ucsb.edu/w/index.php?title=HF_Vapor_Etch&amp;diff=3279&amp;oldid=prev"/>
		<updated>2014-01-30T19:47:56Z</updated>

		<summary type="html">&lt;p&gt;&lt;span class=&quot;autocomment&quot;&gt;Documentation&lt;/span&gt;&lt;/p&gt;
&lt;table style=&quot;background-color: #fff; color: #202122;&quot; data-mw=&quot;interface&quot;&gt;
				&lt;col class=&quot;diff-marker&quot; /&gt;
				&lt;col class=&quot;diff-content&quot; /&gt;
				&lt;col class=&quot;diff-marker&quot; /&gt;
				&lt;col class=&quot;diff-content&quot; /&gt;
				&lt;tr class=&quot;diff-title&quot; lang=&quot;en&quot;&gt;
				&lt;td colspan=&quot;2&quot; style=&quot;background-color: #fff; color: #202122; text-align: center;&quot;&gt;← Older revision&lt;/td&gt;
				&lt;td colspan=&quot;2&quot; style=&quot;background-color: #fff; color: #202122; text-align: center;&quot;&gt;Revision as of 19:47, 30 January 2014&lt;/td&gt;
				&lt;/tr&gt;&lt;tr&gt;
  &lt;td colspan=&quot;2&quot; class=&quot;diff-lineno&quot;&gt;Line 16:&lt;/td&gt;
  &lt;td colspan=&quot;2&quot; class=&quot;diff-lineno&quot;&gt;Line 16:&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;*[[media:|System Manual]]&lt;/div&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;*[[media:|System Manual]]&lt;/div&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;*[[media:File:25-Dry_Etch_of_Unaxis_ICP-grown_SiO2_using_Vapor_HF_tool-1.pdf|Si Etching Profile &amp;amp; Results]]&lt;/div&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;*[[media:File:25-Dry_Etch_of_Unaxis_ICP-grown_SiO2_using_Vapor_HF_tool-1.pdf|Si Etching Profile &amp;amp; Results]]&lt;/div&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td class=&quot;diff-marker&quot; data-marker=&quot;−&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #ffe49c; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;*[[media:|Si Etching Profile &amp;amp; Results]]&lt;/div&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot; data-marker=&quot;+&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #a3d3ff; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;*[[media:&lt;ins style=&quot;font-weight: bold; text-decoration: none;&quot;&gt;26-Dry_Etch_of_Unaxis_ICP-grown_SiO2_using_Vapor_HF_tool-2.pdf&lt;/ins&gt;|Si Etching Profile &amp;amp; Results]]&lt;/div&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;/table&gt;</summary>
		<author><name>Ningcao</name></author>
	</entry>
</feed>