IR Aligner (SUSS MJB-3 IR) - Revision history

Sawyer l: SOP rev

2020-08-07T18:56:36Z

SOP rev

← Older revision		Revision as of 18:56, 7 August 2020
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	*[https://wiki.nanotech.ucsb.edu/wiki/images/d/de/MJB_3_SOP.pdf MJB 3 Standard Operating Procedure]		*[https://wiki.nanotech.ucsb.edu/wiki/images/d/de/MJB_3_SOP.pdf MJB 3 Standard Operating Procedure]
	*[https://wiki.nanotech.ucsb.edu/w/images/1/11/MJB_3_IR_Alignment_Mode_Conversion.pdf MJB 3 IR Alignment Mode Conversion Procedure]		*[https://wiki.nanotech.ucsb.edu/w/images/1/11/MJB_3_IR_Alignment_Mode_Conversion.pdf MJB 3 IR Alignment Mode Conversion Procedure]
	*[https://wiki.nanotech.ucsb.edu/w/images/1/10/~~MJB_3_IR_Camera_SOP~~.pdf MJB 3 IR Camera Operating Procedure]		*[https://wiki.nanotech.ucsb.edu/w/images/7/70/MJB_3_IR_Camera_SOP_Rev_B.pdf MJB 3 IR Camera Operating Procedure]

Sawyer l: System information

2020-07-16T17:02:40Z

System information

← Older revision		Revision as of 17:02, 16 July 2020
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	}}		}}
	==About==		==About==
	This is a high-performance contact mask aligner with backside alignment capability for opaque materials using IR. It is a versatile, user-friendly compact unit that has a foot print of 600 x 800 mm². The resolution (depending on contact mode, optics and exposure wavelength and "operator technique") is ~~far~~ ~~into~~ ~~the~~ ~~submicron~~ ~~region~~. The aligner is configured for the near-UV window (365 and 405 nm) and both left and has the "vacuum contact" option extending resolution to ~0.5 microns. Higher resolution optic systems that can be supplied by Suss are given below. The standard soft and hard contact modes of mechanical and pneumatic pressure respectively, only give resolution to 1-2 microns. Exposures can be done on substrates from small "piece parts" of less than 1 cm square to substrates of 3 inch diameter or square. Masks up to 4 inches in size can be used although patterns should be well away from the ~~maskplate~~ edges due to the fact such plates can only be shifted ~ x mm ~~and~~ ~~substrate~~ ~~chuck~~ ~~+/-~~ 3 mm.		This is a high-performance contact mask aligner with backside alignment capability for opaque materials using IR. It is a versatile, user-friendly compact unit that has a foot print of 600 x 800 mm². The resolution (depending on contact mode, optics and exposure wavelength and "operator technique") is down to 1 micron (hard contact). The aligner is configured for the near-UV window (365 and 405 nm). Exposures can be done on substrates from small "piece parts" of less than 1 cm square to substrates of 3 inch diameter or square. Masks up to 4 inches in size can be used although patterns should be well away from the mask plate edges due to the fact such plates can only be shifted a limited distance in the x and y.

	==Detailed Specifications==		==Detailed Specifications==
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	*Exposure optics:		*Exposure optics:
	**280-450 nm/200 W mercury lamp (can filter to 350 nm)		**280-450 nm/200 W mercury lamp (can filter to 350 nm)
	*Additional manufacturer options (none installed on our systems):
	**DUV (polychromatic): 240-260 nm/350 W Cd-Xe lamp; 0.2 micron resolution (PMMA)
	**DUV (monochromatic): 248 nm/KrF excimer laser; 0.3 micron resolution (PMMA)
	**193 nm/ArF excimer laser; 0.2 micron resolution (PMMA)
	*Uniformity:		*Uniformity:
	**±3% over 2" diameter		**±3% over 2" diameter
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	==Special Notes / Additional Comments==		==Special Notes / Additional Comments==

	*~~All units have~~ 200 W mercury ~~lamps~~		*200 W mercury lamp
			*Top side alignment (visible) can be performed on this aligner as well with a quick tooling change
	*Infrared Transmission Alignment System		*Infrared Transmission Alignment System:
	*All models can be equipped for back side alignment using infrared light; this is used when a mask needs to be aligned to features on the substrate backside but exposed to light on the front or resist side
		⚫	**Motor positioned IR light source under chuck
		⚫	**Special glass chucks transparent to IR but opaque to UV and visible light
		⚫	**In-line video camera/monitor for substrate backside viewing and alignment to front-side
			*This aligner does not support vacuum contact mode
	*For processes using this tool please go to the contact lithography process page		*For processes using this tool please go to the contact lithography process page
	*This includes:
	*Modified alignment stage
⚫	*Motor positioned IR light source under chuck
⚫	*Special glass ~~chuck~~ transparent to IR but opaque to UV and visible light
⚫	*In-line video camera/monitor for substrate backside viewing and alignment to front-side
	*(Note: The vacuum contact mode is not allowed in the ITA System)

	==Documentation==		==Documentation==

Sawyer l: added additional documentation

2020-07-16T16:54:30Z

added additional documentation

← Older revision		Revision as of 16:54, 16 July 2020
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	*[https://wiki.nanotech.ucsb.edu/wiki/images/d/de/MJB_3_SOP.pdf MJB 3 Standard Operating Procedure]		*[https://wiki.nanotech.ucsb.edu/wiki/images/d/de/MJB_3_SOP.pdf MJB 3 Standard Operating Procedure]
	*[https://wiki.nanotech.ucsb.edu/w/images/1/11/MJB_3_IR_Alignment_Mode_Conversion.pdf MJB 3 Alignment Mode Conversion Procedure]		*[https://wiki.nanotech.ucsb.edu/w/images/1/11/MJB_3_IR_Alignment_Mode_Conversion.pdf MJB 3 IR Alignment Mode Conversion Procedure]
			*[https://wiki.nanotech.ucsb.edu/w/images/1/10/MJB_3_IR_Camera_SOP.pdf MJB 3 IR Camera Operating Procedure]

Sawyer l: added additional documentation

2020-07-16T16:52:38Z

added additional documentation

← Older revision		Revision as of 16:52, 16 July 2020
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	*[https://wiki.nanotech.ucsb.edu/wiki/images/d/de/MJB_3_SOP.pdf MJB 3 Standard Operating Procedure]		*[https://wiki.nanotech.ucsb.edu/wiki/images/d/de/MJB_3_SOP.pdf MJB 3 Standard Operating Procedure]
			*[https://wiki.nanotech.ucsb.edu/w/images/1/11/MJB_3_IR_Alignment_Mode_Conversion.pdf MJB 3 Alignment Mode Conversion Procedure]

Jcrode: Text replacement - "www.nanotech.ucsb.edu/wiki/" to "wiki.nanotech.ucsb.edu/wiki/"

2020-04-07T01:27:17Z

Text replacement - "www.nanotech.ucsb.edu/wiki/" to "wiki.nanotech.ucsb.edu/wiki/"

← Older revision		Revision as of 01:27, 7 April 2020
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	==Documentation==		==Documentation==

	*[https://~~www~~.nanotech.ucsb.edu/wiki/images/d/de/MJB_3_SOP.pdf MJB 3 Standard Operating Procedure]		*[https://wiki.nanotech.ucsb.edu/wiki/images/d/de/MJB_3_SOP.pdf MJB 3 Standard Operating Procedure]

Sawyer l: /* About */ correct about and spec section

2019-10-24T18:23:39Z

About: correct about and spec section

← Older revision		Revision as of 18:23, 24 October 2019
Line 12:		Line 12:
	}}		}}
	==About==		==About==
	This is a high-performance mask aligner ~~used~~ for ~~contact~~ ~~exposure~~ ~~processes~~. It is a versatile, user-friendly compact unit that has a foot print of 600 x 800 mm². The resolution (depending on contact mode, optics and exposure wavelength and "operator technique") is far into the submicron region. ~~Our~~ ~~left unit~~ is configured for the near-UV window (365 and 405 nm) and both left and ~~right units have~~ the "vacuum contact" option extending resolution to ~0.5 microns. Higher resolution optic systems that can be supplied by Suss are given below. The standard soft and hard contact modes of mechanical and pneumatic pressure respectively, only give resolution to 1-2 microns. Exposures can be done on substrates from small "piece parts" of less than 1 cm square to substrates of 3 inch diameter or square~~. Special black chucks may be used for transparent materials. For backside alignment through opaque our IR aligner can be used and is described below~~. Masks up to 4 inches in size can be used although patterns should be well away from the maskplate edges due to the fact such plates can only be shifted ~ x mm and substrate chuck +/- 3 mm.		This is a high-performance contact mask aligner with backside alignment capability for opaque materials using IR. It is a versatile, user-friendly compact unit that has a foot print of 600 x 800 mm². The resolution (depending on contact mode, optics and exposure wavelength and "operator technique") is far into the submicron region. The aligner is configured for the near-UV window (365 and 405 nm) and both left and has the "vacuum contact" option extending resolution to ~0.5 microns. Higher resolution optic systems that can be supplied by Suss are given below. The standard soft and hard contact modes of mechanical and pneumatic pressure respectively, only give resolution to 1-2 microns. Exposures can be done on substrates from small "piece parts" of less than 1 cm square to substrates of 3 inch diameter or square. Masks up to 4 inches in size can be used although patterns should be well away from the maskplate edges due to the fact such plates can only be shifted ~ x mm and substrate chuck +/- 3 mm.

	==Detailed Specifications==		==Detailed Specifications==
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	*Wafer / substrate thickness: 0-4.5 mm		*Wafer / substrate thickness: 0-4.5 mm
	*Exposure optics:		*Exposure optics:
	**~~Left unit:~~ 280-450 nm/200 W mercury lamp		**280-450 nm/200 W mercury lamp (can filter to 350 nm)
	**Right unit: 350-450 nm/200 W mercury lamp
	**IR unit: 280-450 nm/200 W mercury lamp
	*Additional manufacturer options (none installed on our systems):		*Additional manufacturer options (none installed on our systems):
	**DUV (polychromatic): 240-260 nm/350 W Cd-Xe lamp; 0.2 micron resolution (PMMA)		**DUV (polychromatic): 240-260 nm/350 W Cd-Xe lamp; 0.2 micron resolution (PMMA)
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	*(Note: The vacuum contact mode is not allowed in the ITA System)		*(Note: The vacuum contact mode is not allowed in the ITA System)

	== Documentation ==		==Documentation==

	* [https://www.nanotech.ucsb.edu/wiki/images/d/de/MJB_3_SOP.pdf MJB 3 Standard Operating Procedure]		*[https://www.nanotech.ucsb.edu/wiki/images/d/de/MJB_3_SOP.pdf MJB 3 Standard Operating Procedure]

Sawyer l: add SOP link, doc section

2019-09-16T21:41:09Z

add SOP link, doc section

← Older revision		Revision as of 21:41, 16 September 2019
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	\|toolid=32		\|toolid=32
	}}		}}
	= About =		==About==
	This is a high-performance mask aligner used for contact exposure processes. It is a versatile, user-friendly compact unit that has a foot print of 600 x 800 mm². The resolution (depending on contact mode, optics and exposure wavelength and "operator technique") is far into the submicron region. Our left unit is configured for the near-UV window (365 and 405 nm) and both left and right units have the "vacuum contact" option extending resolution to ~0.5 microns. Higher resolution optic systems that can be supplied by Suss are given below. The standard soft and hard contact modes of mechanical and pneumatic pressure respectively, only give resolution to 1-2 microns. Exposures can be done on substrates from small "piece parts" of less than 1 cm square to substrates of 3 inch diameter or square. Special black chucks may be used for transparent materials. For backside alignment through opaque our IR aligner can be used and is described below. Masks up to 4 inches in size can be used although patterns should be well away from the maskplate edges due to the fact such plates can only be shifted ~ x mm and substrate chuck +/- 3 mm.		This is a high-performance mask aligner used for contact exposure processes. It is a versatile, user-friendly compact unit that has a foot print of 600 x 800 mm². The resolution (depending on contact mode, optics and exposure wavelength and "operator technique") is far into the submicron region. Our left unit is configured for the near-UV window (365 and 405 nm) and both left and right units have the "vacuum contact" option extending resolution to ~0.5 microns. Higher resolution optic systems that can be supplied by Suss are given below. The standard soft and hard contact modes of mechanical and pneumatic pressure respectively, only give resolution to 1-2 microns. Exposures can be done on substrates from small "piece parts" of less than 1 cm square to substrates of 3 inch diameter or square. Special black chucks may be used for transparent materials. For backside alignment through opaque our IR aligner can be used and is described below. Masks up to 4 inches in size can be used although patterns should be well away from the maskplate edges due to the fact such plates can only be shifted ~ x mm and substrate chuck +/- 3 mm.

	=Detailed Specifications=		==Detailed Specifications==

	*Wafer size: 3" max. for vacuum mode; 4” for soft contact (3” x 3” exposure area)		*Wafer size: 3" max. for vacuum mode; 4” for soft contact (3” x 3” exposure area)
	*Substrate size: 3" x 3" max.		*Substrate size: 3" x 3" max.
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	**±5% over 3" diameter		**±5% over 3" diameter

	=Special Notes / Additional Comments=		==Special Notes / Additional Comments==

	*All units have 200 W mercury lamps		*All units have 200 W mercury lamps
	*Infrared Transmission Alignment System		*Infrared Transmission Alignment System
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	*In-line video camera/monitor for substrate backside viewing and alignment to front-side		*In-line video camera/monitor for substrate backside viewing and alignment to front-side
	*(Note: The vacuum contact mode is not allowed in the ITA System)		*(Note: The vacuum contact mode is not allowed in the ITA System)

			== Documentation ==

			* [https://www.nanotech.ucsb.edu/wiki/images/d/de/MJB_3_SOP.pdf MJB 3 Standard Operating Procedure]

Sawyer l: Contact info changed to Lee S.

2019-04-02T23:21:47Z

Contact info changed to Lee S.

← Older revision		Revision as of 23:21, 2 April 2019
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	\|picture=SussAlignerIR.jpg		\|picture=SussAlignerIR.jpg
	\|type = Lithography		\|type = Lithography
	\|super= ~~Don~~ ~~Freeborn~~		\|super= Lee Sawyer
	\|phone=(805)~~839~~-~~3918x216~~		\|phone=(805) 893-2123
	\|location=Bay 6		\|location=Bay 6
	\|email=~~freeborn~~@~~ece.~~ucsb.edu		\|email=lee_sawyer@ucsb.edu
	\|description = Mask Aligner - MJB 3 UV400 IR		\|description = Mask Aligner - MJB 3 UV400 IR
	\|manufacturer = Karl Suss America		\|manufacturer = Karl Suss America

Zwarburg at 13:51, 11 July 2012

2012-07-11T13:51:11Z

← Older revision		Revision as of 13:51, 11 July 2012
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	\|manufacturer = Karl Suss America		\|manufacturer = Karl Suss America
	\|materials =		\|materials =
			\|toolid=32
	}}		}}
	= About =		= About =

Zwarburg: /* Detailed Specifications */

2012-06-30T22:04:39Z

Detailed Specifications

← Older revision		Revision as of 22:04, 30 June 2012
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	**±5% over 3" diameter		**±5% over 3" diameter

	=Special Notes / Additional Comments		=Special Notes / Additional Comments=
	*All units have 200 W mercury lamps		*All units have 200 W mercury lamps
	*Infrared Transmission Alignment System		*Infrared Transmission Alignment System