Lift-off DUV Lift-off: LOR Underlayers - Revision history

John d: /* LOR10A - ~1µm underlayer */ link to LOR10A datasheet

2026-09-23T22:43:28Z

LOR10A - ~1µm underlayer: link to LOR10A datasheet

← Older revision		Revision as of 22:43, 23 September 2026
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	\|Spin LOR10A		\|Spin LOR10A
	\|Recipe 5: 3000 rpm		\|Recipe 5: 3000 rpm
			\|[[Media:Lor pds.pdf\|See datasheet for spin curves]]
	\|
	\|-		\|-
	\|Backside clean		\|Backside clean
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	\|Typ. ~1-2µm		\|Typ. ~1-2µm
	\|}		\|}
			<code>''Contributed by Alex Spott.''</code>

	=== LOR30C - ~30µm underlayer ===		=== LOR30C - ~30µm underlayer ===
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	'''Cons''': High and uncontrollable undercut. You can't switch to flood expose / 101A like you can with PMGI so you're stuck with the undercut you get whenever it's done developing. Not suitable for close features.		'''Cons''': High and uncontrollable undercut. You can't switch to flood expose / 101A like you can with PMGI so you're stuck with the undercut you get whenever it's done developing. Not suitable for close features.

	<code>Contributed by Alex Spott.</code>		<code>''Contributed by Alex Spott.''</code>

John d: added LOR 10A recipe from alex spott

2026-09-23T22:39:20Z

added LOR 10A recipe from alex spott

← Older revision		Revision as of 22:39, 23 September 2026
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	=== ~~LOR30C~~ ===		=== LOR10A - ~1µm underlayer ===
			{\| class="wikitable"
			\|Dehydration bake
			\|≥150°C
			\|5 min
			\|-
			\|Spin LOR10A
			\|Recipe 5: 3000 rpm
			\|
			\|-
			\|Backside clean
			\|Spin/spray: Remover PG / Acetone / IPA
			\|required for ASML DUV
			\|-
			\|Softbake
			\|200°C on lift-pins.
			Use recipe: "''STD 200C 5min''"
			\|5 min
			\|-
			\|Spin LOR10A
			\|Recipe 5: 3000 rpm
			\|
			\|-
			\|Backside clean
			\|Spin/spray: Remover PG / Acetone / IPA
			\|
			\|-
			\|Softbake
			\|200 C on pins. Use recipe 200 C 5 min.
			\|5 min
			\|-
			\|Spin UV6-0.8
			\|Recipe 6 3500 rpm
			\|
			\|-
			\|Softbake
			\|135C
			\|1 min
			\|-
			\|Backside clean
			\|Spin/spray Acetone/IPA
			\|
			\|-
			\|Expose
			\|~21-25mJ - you may need to optimize
			Focus = +0.2
			\|ASML
			\|-
			\|Post exposure bake
			\|135C
			\|90 sec
			\|-
			\|Develop AZ726MIF
			\|no agitation
			\|usually > 2.5min
			\|-
			\|Microscope Inspect
			\|Check undercut
			\|Typ. ~1-2µm
			\|}

			=== LOR30C - ~30µm underlayer ===

	# Dehydrate (O2 plasma or 150°C, 2 min+), no adhesion promoter		# Dehydrate (O2 plasma or 150°C, 2 min+), no adhesion promoter

John d: John d moved page Lift-off DUV Lift-off: UV6 imaging resist + LOR Underlayers to Lift-off DUV Lift-off: LOR Underlayers: need more generic process title

2026-09-23T22:32:25Z

John d moved page Lift-off DUV Lift-off: UV6 imaging resist + LOR Underlayers to Lift-off DUV Lift-off: LOR Underlayers: need more generic process title

← Older revision	Revision as of 22:32, 23 September 2026
(No difference)

John d: alex spott's recipe

2026-09-23T22:31:46Z

alex spott's recipe

New page

=== LOR30C ===

# Dehydrate (O2 plasma or 150°C, 2 min+), no adhesion promoter
# Spin LOR30C at various speeds depending on thickness desired
## [[Media:Lor pds.pdf|See datasheet for spin-curves]].
# 180°C, 4 min
# Spin/bake imaging layer - according to Imaging PR recipe
# Expose ASML
# Post-bake imaging layer - according to Imaging PR recipe
# Develop AZ 300MiF - varies:
## Develop times range between 2 min to as long as 6 or 8 minutes (it's consistent for the same mask and same materials, but varies for process steps, topography, and materials).
# Strips in 80C NMP 20–30 min

'''Pros''': Thick in a single layer, excellent coverage for tall features, varying topography, and filling vias. Rarely has cracking issues, no ramp baking required, typically minimal bubbles from feature corners.

'''Cons''': High and uncontrollable undercut. You can't switch to flood expose / 101A like you can with PMGI so you're stuck with the undercut you get whenever it's done developing. Not suitable for close features.

<code>Contributed by Alex Spott.</code>