Lithography Recipes - Revision history

John d: /* Lift-Off Recipes */ link to DUV_Flood_Expose

2026-02-04T23:05:20Z

Lift-Off Recipes: link to DUV_Flood_Expose

← Older revision		Revision as of 23:05, 4 February 2026
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	*{{fl\|Bi-LayerContactprocesswithPMGI.pdf\|I-Line Lift-Off: Bi-Layer Process with PMGI Underlayer and Contact Aligner}}		*{{fl\|Bi-LayerContactprocesswithPMGI.pdf\|I-Line Lift-Off: Bi-Layer Process with PMGI Underlayer and Contact Aligner}}
	**''Multiple processes for Metal thicknesses ~800nm to ~2.5µm''		**''Multiple processes for Metal thicknesses ~800nm to ~2.5µm''
	**''Uses multiple DUV Flood exposure/develop cycles to create undercut.''		**''Uses multiple [[DUV Flood Expose\|DUV Flood exposure]]/develop cycles to create undercut.''
	**''Can be transferred to other I-Line litho tools (Stepper, MLA etc.)''		**''Can be transferred to other I-Line litho tools (Stepper, MLA etc.)''
	**<u>Updates to the process:</u>		**<u>Updates to the process:</u>
	***You now only need to do 5min DUV Flood exposure each cycle (lamp optics were replaced)		***You now only need to do 5min [[DUV Flood Expose\|DUV Flood exposure]] each cycle (lamp optics were replaced)
	***Use the new "101B" developer, which replaced the "SAL/101A" developers but works the same.		***Use the new "101B" developer, which replaced the "SAL/101A" developers but works the same.
	**There are 2 DUV Flood exposure + 101B develop steps because the first exposure doesn't expose the entire PMGI - because PMGI absorbs DUV very strongly so the light doesn't penetrate to the bottom of thick PMGI on the first exposure.		**There are 2 [[DUV Flood Expose\|DUV Flood exposure]] + 101B develop steps because the first exposure doesn't expose the entire PMGI - because PMGI absorbs DUV very strongly so the light doesn't penetrate to the bottom of thick PMGI on the first exposure.
	*[[Lift-Off with DUV Imaging + PMGI Underlayer\|DUV Lift-Off: UV6 Imaging Resist + PMGI Underlayer]]		*[[Lift-Off with DUV Imaging + PMGI Underlayer\|DUV Lift-Off: UV6 Imaging Resist + PMGI Underlayer]]
	**''Single-expose/develop process''		**''Single-expose/develop process''

John d: /* General Photolithography Techniques */ add small-sample spinning

2025-12-05T18:41:31Z

General Photolithography Techniques: add small-sample spinning

← Older revision		Revision as of 18:41, 5 December 2025
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	*''These techniques are required for loading full-wafers into etchers that use top-side clamps, to prevent photoresist from sticking to the clamp (and potentially destroying your wafer).''		*''These techniques are required for loading full-wafers into etchers that use top-side clamps, to prevent photoresist from sticking to the clamp (and potentially destroying your wafer).''
	*''For contact lithography, this improves the proximity of the mask plate and sample, improving resolution. For some projection systems, such as the [[Maskless Aligner (Heidelberg MLA150)\|Maskless Aligner]], EBR can help with autofocus issues.''		*''For contact lithography, this improves the proximity of the mask plate and sample, improving resolution. For some projection systems, such as the [[Maskless Aligner (Heidelberg MLA150)\|Maskless Aligner]], EBR can help with autofocus issues.''
			*''For small samples (<1cm) some techniques here to reduce edge-bead via shims.''

	====[https://www.microchemicals.com/technical_information/reflow_photoresist.pdf '''Photoresist reflow (MicroChem)''']====		====[https://www.microchemicals.com/technical_information/reflow_photoresist.pdf '''Photoresist reflow (MicroChem)''']====

John d: fixed EBL recipes link

2025-11-20T18:22:27Z

fixed EBL recipes link

← Older revision		Revision as of 18:22, 20 November 2025
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	#***[[Stepper Recipes#Stepper 3 .28ASML DUV.29\|Stepper #3: ASML PAS 5500/300]] (DUV)		#***[[Stepper Recipes#Stepper 3 .28ASML DUV.29\|Stepper #3: ASML PAS 5500/300]] (DUV)
	#**[[Direct-Write Lithography Recipes\|<u>Direct-Write Recipes</u>]]		#**[[Direct-Write Lithography Recipes\|<u>Direct-Write Recipes</u>]]
	#***[[Direct-Write Lithography Recipes#Maskless Aligner .28Heidelberg MLA150.29\|Heidelberg MLA150]]		#***[[Direct-Write Lithography Recipes#Maskless Aligner .28Heidelberg MLA150.29\|Heidelberg MLA150 (I-Line)]]
	#***[[Lithography Recipes#E-Beam Lithography Recipes\|~~JEOL~~ ~~JBX-6300FS~~ ~~EBL~~]]		#***[[Direct-Write Lithography Recipes#E-Beam Lithography Recipes (Raith EBPG 5150+)\|Raith EBPG 5150+ (Electron-Beam)]]
	#***[[Lithography Recipes#FIB Lithography Recipes .28Raith Velion.29\|Raith Velion FIB]]		#***[[Lithography Recipes#FIB Lithography Recipes .28Raith Velion.29\|Raith Velion FIB (Ion Beam)]]
	#**[[Lithography Recipes#Automated Coat.2FDevelop System Recipes .28S-Cubed Flexi.29\|Automated Coater Recipes (S-Cubed Flexi)]]		#**[[Lithography Recipes#Automated Coat.2FDevelop System Recipes .28S-Cubed Flexi.29\|Automated Coater Recipes (S-Cubed Flexi)]]
	#[[Lithography Recipes#General Photolithography Techniques\|'''General Photolithography Techniques''']]		#[[Lithography Recipes#General Photolithography Techniques\|'''General Photolithography Techniques''']]

John d: /* Lift-Off Recipes */ explained double-DUV-flood of PMGI

2025-08-29T19:24:31Z

Lift-Off Recipes: explained double-DUV-flood of PMGI

← Older revision		Revision as of 19:24, 29 August 2025
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	**''Uses multiple DUV Flood exposure/develop cycles to create undercut.''		**''Uses multiple DUV Flood exposure/develop cycles to create undercut.''
	**''Can be transferred to other I-Line litho tools (Stepper, MLA etc.)''		**''Can be transferred to other I-Line litho tools (Stepper, MLA etc.)''
			**<u>Updates to the process:</u>
			***You now only need to do 5min DUV Flood exposure each cycle (lamp optics were replaced)
			***Use the new "101B" developer, which replaced the "SAL/101A" developers but works the same.
			**There are 2 DUV Flood exposure + 101B develop steps because the first exposure doesn't expose the entire PMGI - because PMGI absorbs DUV very strongly so the light doesn't penetrate to the bottom of thick PMGI on the first exposure.
	*[[Lift-Off with DUV Imaging + PMGI Underlayer\|DUV Lift-Off: UV6 Imaging Resist + PMGI Underlayer]]		*[[Lift-Off with DUV Imaging + PMGI Underlayer\|DUV Lift-Off: UV6 Imaging Resist + PMGI Underlayer]]
	**''Single-expose/develop process''		**''Single-expose/develop process''

Noahdutra: /* Process Ranking Table */ adding to R4 definition

2025-08-22T19:59:30Z

Process Ranking Table: adding to R4 definition

← Older revision		Revision as of 19:59, 22 August 2025
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	\|-		\|-
	\|R4		\|R4
	\| colspan="11" \|Process has a documented procedure with regular (≥4x per year) data		\| colspan="11" \|Process has a documented procedure with regular (≥4x per year) data '''no''' in-Situ control available
	\|-		\|-
	\|R5		\|R5

Noahdutra: /* Process Ranking Table */ changed ranking table and all R4s to R3s

2025-08-21T21:15:26Z

Process Ranking Table: changed ranking table and all R4s to R3s

Noahdutra: made R3s into R4

2025-08-14T21:22:05Z

made R3s into R4

← Older revision		Revision as of 21:22, 14 August 2025
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	\|{{rl\|Stepper Recipes\|Positive Resist (AutoStep 200)\|R4}}		\|{{rl\|Stepper Recipes\|Positive Resist (AutoStep 200)\|R4}}
	\|		\|
	\|{{rl\|MLA Recipes\|Positive Resist (MLA 150)\|R3}}		\|{{rl\|MLA Recipes\|Positive Resist (MLA 150)\|R4}}
	\|- bgcolor="EEFFFF"		\|- bgcolor="EEFFFF"
	\| bgcolor="#D0E7FF" align="center" \|[//wiki.nanotech.ucsb.edu/w/images/3/3f/SPR220-Positive-Resist-Datasheet.pdf SPR 220-3.0]		\| bgcolor="#D0E7FF" align="center" \|[//wiki.nanotech.ucsb.edu/w/images/3/3f/SPR220-Positive-Resist-Datasheet.pdf SPR 220-3.0]
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	\|{{rl\|Stepper Recipes\|DUV-42P-6\|R3}}		\|{{rl\|Stepper Recipes\|DUV-42P-6\|R4}}
	\|		\|
	\|-		\|-
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	\|		\|
	\|		\|
	\|{{rl\|Stepper Recipes\|DS-K101-304\|R3}}		\|{{rl\|Stepper Recipes\|DS-K101-304\|R4}}
	\|		\|
	\|-		\|-

John d: links to photolith techniques

2025-07-31T22:00:15Z

links to photolith techniques

← Older revision		Revision as of 22:00, 31 July 2025
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	#[[Lithography Recipes#General Photolithography Techniques\|'''General Photolithography Techniques''']]		#[[Lithography Recipes#General Photolithography Techniques\|'''General Photolithography Techniques''']]
	#*''Techniques for improving litho. or solving common photolith. problems.''		#*''Techniques for improving litho. or solving common photolith. problems.''
			#*[[Photolithography - Improving Adhesion Photoresist Adhesion\|HMDS Process for Improving Adhesion]]
			#*[[Photolithography - Manual Edge-Bead Removal Techniques\|Edge-Bead Removal Techniques]]
			#*[https://www.microchemicals.com/technical_information/reflow_photoresist.pdf Photoresist reflow (MicroChem)]
			#*[[Lithography Calibration - Analyzing a Focus-Exposure Matrix]]
	#'''[[Lithography Recipes#Lift-Off Recipes\|Lift-Off Recipes]]'''		#'''[[Lithography Recipes#Lift-Off Recipes\|Lift-Off Recipes]]'''
	#*''Verified Recipes for lift-off using various photolith. tools''		#*''Verified Recipes for lift-off using various photolith. tools''

Biljana: /* Process Ranking Table */

2025-05-19T19:11:14Z

Process Ranking Table

← Older revision		Revision as of 19:11, 19 May 2025
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	\|-		\|-
	\| bgcolor="#D0E7FF" align="center" \|[//wiki.nanotech.ucsb.edu/w/images/5/5e/AZnLOF2020-Negative-Resist-Datasheet.pdf AZnLOF 2035]		\| bgcolor="#D0E7FF" align="center" \|[//wiki.nanotech.ucsb.edu/w/images/5/5e/AZnLOF2020-Negative-Resist-Datasheet.pdf AZnLOF 2035]
	\| bgcolor="~~EEFFFF~~" \|A		\| bgcolor="#D0E7FF" \|A
	\| {{rl\|Contact_Alignment_Recipes\|Negative Resist (MA-6)\|R1}}		\| {{rl\|Contact_Alignment_Recipes\|Negative Resist (MA-6)\|R1}}
	\| bgcolor="EEFFFF" \|A		\| bgcolor="EEFFFF" \|A

Biljana: /* Process Ranking Table */

2025-05-19T19:10:01Z

Process Ranking Table

← Older revision		Revision as of 19:10, 19 May 2025
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	\| bgcolor="#D0E7FF" align="center" \|[//wiki.nanotech.ucsb.edu/w/images/5/5e/AZnLOF2020-Negative-Resist-Datasheet.pdf AZnLOF 2035]		\| bgcolor="#D0E7FF" align="center" \|[//wiki.nanotech.ucsb.edu/w/images/5/5e/AZnLOF2020-Negative-Resist-Datasheet.pdf AZnLOF 2035]
	\| bgcolor="EEFFFF" \|A		\| bgcolor="EEFFFF" \|A
			\| {{rl\|Contact_Alignment_Recipes\|Negative Resist (MA-6)\|R1}}
	\| bgcolor="EEFFFF" \|R1
	\| bgcolor="EEFFFF" \|A		\| bgcolor="EEFFFF" \|A
	\| bgcolor="EEFFFF" \|A		\| bgcolor="EEFFFF" \|A

← Older revision		Revision as of 18:22, 20 November 2025
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	#***[[Stepper Recipes#Stepper 3 .28ASML DUV.29\|Stepper #3: ASML PAS 5500/300]] (DUV)		#***[[Stepper Recipes#Stepper 3 .28ASML DUV.29\|Stepper #3: ASML PAS 5500/300]] (DUV)
	#**[[Direct-Write Lithography Recipes\|<u>Direct-Write Recipes</u>]]		#**[[Direct-Write Lithography Recipes\|<u>Direct-Write Recipes</u>]]
	#***[[Direct-Write Lithography Recipes#Maskless Aligner .28Heidelberg MLA150.29\|Heidelberg MLA150]]		#***[[Direct-Write Lithography Recipes#Maskless Aligner .28Heidelberg MLA150.29\|Heidelberg MLA150 (I-Line)]]
	#***[[Lithography Recipes#E-Beam Lithography Recipes\|~~JEOL~~ ~~JBX-6300FS~~ ~~EBL~~]]		#***[[Direct-Write Lithography Recipes#E-Beam Lithography Recipes (Raith EBPG 5150+)\|Raith EBPG 5150+ (Electron-Beam)]]
	#***[[Lithography Recipes#FIB Lithography Recipes .28Raith Velion.29\|Raith Velion FIB]]		#***[[Lithography Recipes#FIB Lithography Recipes .28Raith Velion.29\|Raith Velion FIB (Ion Beam)]]
	#**[[Lithography Recipes#Automated Coat.2FDevelop System Recipes .28S-Cubed Flexi.29\|Automated Coater Recipes (S-Cubed Flexi)]]		#**[[Lithography Recipes#Automated Coat.2FDevelop System Recipes .28S-Cubed Flexi.29\|Automated Coater Recipes (S-Cubed Flexi)]]
	#[[Lithography Recipes#General Photolithography Techniques\|'''General Photolithography Techniques''']]		#[[Lithography Recipes#General Photolithography Techniques\|'''General Photolithography Techniques''']]

← Older revision		Revision as of 19:11, 19 May 2025
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	\|-		\|-
	\| bgcolor="#D0E7FF" align="center" \|[//wiki.nanotech.ucsb.edu/w/images/5/5e/AZnLOF2020-Negative-Resist-Datasheet.pdf AZnLOF 2035]		\| bgcolor="#D0E7FF" align="center" \|[//wiki.nanotech.ucsb.edu/w/images/5/5e/AZnLOF2020-Negative-Resist-Datasheet.pdf AZnLOF 2035]
	\| bgcolor="~~EEFFFF~~" \|A		\| bgcolor="#D0E7FF" \|A
	\| {{rl\|Contact_Alignment_Recipes\|Negative Resist (MA-6)\|R1}}		\| {{rl\|Contact_Alignment_Recipes\|Negative Resist (MA-6)\|R1}}
	\| bgcolor="EEFFFF" \|A		\| bgcolor="EEFFFF" \|A

← Older revision		Revision as of 19:10, 19 May 2025
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	\| bgcolor="#D0E7FF" align="center" \|[//wiki.nanotech.ucsb.edu/w/images/5/5e/AZnLOF2020-Negative-Resist-Datasheet.pdf AZnLOF 2035]		\| bgcolor="#D0E7FF" align="center" \|[//wiki.nanotech.ucsb.edu/w/images/5/5e/AZnLOF2020-Negative-Resist-Datasheet.pdf AZnLOF 2035]
	\| bgcolor="EEFFFF" \|A		\| bgcolor="EEFFFF" \|A
			\| {{rl\|Contact_Alignment_Recipes\|Negative Resist (MA-6)\|R1}}
	\| bgcolor="EEFFFF" \|R1
	\| bgcolor="EEFFFF" \|A		\| bgcolor="EEFFFF" \|A
	\| bgcolor="EEFFFF" \|A		\| bgcolor="EEFFFF" \|A

← Older revision		Revision as of 21:15, 21 August 2025
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	\|-		\|-
	\|R1		\|R1
	\| colspan="11" \|Process has been ~~run~~ at least once		\| colspan="11" \|Process has been ran at least once
	\|-		\|-
	\|R2		\|R2
	\| colspan="11" \|Process has been ~~run~~ and~~/or~~ procedure is documented ~~or/and data available~~		\| colspan="11" \|Process has been ran and procedure is documented
	\|-		\|-
	\|R3		\|R3
	\| colspan="11" \|Process has been ~~run~~, procedure is documented, and data is available		\| colspan="11" \|Process has been ran, procedure is documented, and data is available
	\|-		\|-
	\|R4		\|R4
	\| colspan="11" \|Process has a documented procedure with regular (≥4x per year) data ~~'''or''' lookahead/in-situ control available~~		\| colspan="11" \|Process has a documented procedure with regular (≥4x per year) data
	\|-		\|-
	\|R5		\|R5
	\| colspan="11" \|Process has a documented procedure with regular (≥4x per year) data '''and''' ~~lookahead/~~in-~~situ~~ control available		\| colspan="11" \|Process has a documented procedure with regular (≥4x per year) data '''and''' in-Situ control available
	\|-		\|-
	\|R6		\|R6
	\| colspan="11" \|Process has a documented procedure~~, regular ( ≥4x per year) data,~~ and control charts & ~~limits~~ ~~available~~		\| colspan="11" \|Process has a documented procedure and control charts/limits available. Controlled process.
	\|}		\|}

	''Click the tool title to go to recipes for that tool.''		''Click the tool title to go to recipes for that tool.''

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	\|A		\|A
	\|{{rl\|Contact_Alignment_Recipes\|Positive Resist (MA-6)}}		\|{{rl\|Contact_Alignment_Recipes\|Positive Resist (MA-6)}}
	\|{{rl\|Stepper Recipes\|Positive Resist (GCA 6300)\|R4}}		\|{{rl\|Stepper Recipes\|Positive Resist (GCA 6300)\|R3}}
	\|{{rl\|Stepper Recipes\|Positive Resist (AutoStep 200)\|R5}}		\|{{rl\|Stepper Recipes\|Positive Resist (AutoStep 200)\|R5}}
	\|		\|
	\|{{rl\|MLA Recipes\|Positive Resist (MLA 150)\|R4}}		\|{{rl\|MLA Recipes\|Positive Resist (MLA 150)\|R3}}
	\|-		\|-
	\| bgcolor="#D0E7FF" align="center" \|[//wiki.nanotech.ucsb.edu/w/images/2/29/SPR955-Positive-Resist-Datasheet.pdf SPR 955 CM-1.8]		\| bgcolor="#D0E7FF" align="center" \|[//wiki.nanotech.ucsb.edu/w/images/2/29/SPR955-Positive-Resist-Datasheet.pdf SPR 955 CM-1.8]
	\|A		\|A
	\|A		\|A
	\|{{rl\|Stepper Recipes\|Positive Resist (GCA 6300)\|R4}}		\|{{rl\|Stepper Recipes\|Positive Resist (GCA 6300)\|R3}}
	\|{{rl\|Stepper Recipes\|Positive Resist (AutoStep 200)\|R4}}		\|{{rl\|Stepper Recipes\|Positive Resist (AutoStep 200)\|R3}}
	\|		\|
	\|{{rl\|MLA Recipes\|Positive Resist (MLA 150)\|R4}}		\|{{rl\|MLA Recipes\|Positive Resist (MLA 150)\|R3}}
	\|- bgcolor="EEFFFF"		\|- bgcolor="EEFFFF"
	\| bgcolor="#D0E7FF" align="center" \|[//wiki.nanotech.ucsb.edu/w/images/3/3f/SPR220-Positive-Resist-Datasheet.pdf SPR 220-3.0]		\| bgcolor="#D0E7FF" align="center" \|[//wiki.nanotech.ucsb.edu/w/images/3/3f/SPR220-Positive-Resist-Datasheet.pdf SPR 220-3.0]
	\|{{rl\|Contact_Alignment_Recipes\|Positive Resist (MJB-3)}}		\|{{rl\|Contact_Alignment_Recipes\|Positive Resist (MJB-3)}}
	\|{{rl\|Contact_Alignment_Recipes\|Positive Resist (MA-6)}}		\|{{rl\|Contact_Alignment_Recipes\|Positive Resist (MA-6)}}
	\|{{rl\|Stepper Recipes\|Positive Resist (GCA 6300)\|R4}}		\|{{rl\|Stepper Recipes\|Positive Resist (GCA 6300)\|R3}}
	\|{{rl\|Stepper Recipes\|Positive Resist (AutoStep 200)\|R4}}		\|{{rl\|Stepper Recipes\|Positive Resist (AutoStep 200)\|R3}}
	\|		\|
	\|{{rl\|MLA Recipes\|Positive Resist (MLA 150)}}		\|{{rl\|MLA Recipes\|Positive Resist (MLA 150)}}
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	\|{{rl\|Contact_Alignment_Recipes\|Positive Resist (MJB-3)}}		\|{{rl\|Contact_Alignment_Recipes\|Positive Resist (MJB-3)}}
	\|{{rl\|Contact_Alignment_Recipes\|Positive Resist (MA-6)}}		\|{{rl\|Contact_Alignment_Recipes\|Positive Resist (MA-6)}}
	\|{{rl\|Stepper Recipes\|Positive Resist (GCA 6300)\|R4}}		\|{{rl\|Stepper Recipes\|Positive Resist (GCA 6300)\|R3}}
	\|{{rl\|Stepper Recipes\|Positive Resist (AutoStep 200)\|R4}}		\|{{rl\|Stepper Recipes\|Positive Resist (AutoStep 200)\|R3}}
	\|		\|
	\|{{rl\|MLA Recipes\|Positive_Resist_.28MLA150.29}}		\|{{rl\|MLA Recipes\|Positive_Resist_.28MLA150.29}}
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	\|{{rl\|Contact_Alignment_Recipes\|Positive Resist (MJB-3)}}		\|{{rl\|Contact_Alignment_Recipes\|Positive Resist (MJB-3)}}
	\|{{rl\|Contact_Alignment_Recipes\|Negative Resist (MA-6)}}		\|{{rl\|Contact_Alignment_Recipes\|Negative Resist (MA-6)}}
	\|{{rl\|Stepper Recipes\|Negative Resist (GCA 6300)\|R4}}		\|{{rl\|Stepper Recipes\|Negative Resist (GCA 6300)\|R3}}
	\|{{rl\|Stepper Recipes\|Negative Resist (AutoStep 200)\|R4}}		\|{{rl\|Stepper Recipes\|Negative Resist (AutoStep 200)\|R3}}
	\|		\|
	\|{{rl\|MLA Recipes\|Negative Resist (MLA 150)\|R4}}		\|{{rl\|MLA Recipes\|Negative Resist (MLA 150)\|R3}}
	\|-		\|-
	\| bgcolor="#D0E7FF" align="center" \|[//wiki.nanotech.ucsb.edu/w/images/5/5e/AZnLOF2020-Negative-Resist-Datasheet.pdf AZnLOF 2035]		\| bgcolor="#D0E7FF" align="center" \|[//wiki.nanotech.ucsb.edu/w/images/5/5e/AZnLOF2020-Negative-Resist-Datasheet.pdf AZnLOF 2035]
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	\|{{rl\|Contact_Alignment_Recipes\|Positive Resist (MA-6)}}		\|{{rl\|Contact_Alignment_Recipes\|Positive Resist (MA-6)}}
	\|A		\|A
	\|{{rl\|Stepper Recipes\|Negative Resist (AutoStep 200)\|R4}}		\|{{rl\|Stepper Recipes\|Negative Resist (AutoStep 200)\|R3}}
	\|		\|
	\|A		\|A
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	\|{{rl\|Stepper Recipes\|DUV-42P-6\|R4}}		\|{{rl\|Stepper Recipes\|DUV-42P-6\|R3}}
	\|		\|
	\|-		\|-
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	\|{{rl\|Stepper Recipes\|DS-K101-304\|R4}}		\|{{rl\|Stepper Recipes\|DS-K101-304\|R3}}
	\|		\|
	\|-		\|-