Oxygen Plasma System Recipes - Revision history

John d: /* Ashers (Technics PEII) */ deleted Gasonics section

2026-03-11T01:18:14Z

Ashers (Technics PEII): deleted Gasonics section

← Older revision		Revision as of 01:18, 11 March 2026
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	Use glass slides to prevent wafers from sliding on platen.		Use glass slides to prevent wafers from sliding on platen.

	==[[Plasma Clean (Gasonics 2000)]]==
	Recipes are posted at the tool, with photoresist etch rates.

	==[[Plasma Clean (YES EcoClean)]]==		==[[Plasma Clean (YES EcoClean)]]==

John d: /* Ashers (Technics PEII) */

2026-03-11T01:16:15Z

Ashers (Technics PEII)

← Older revision		Revision as of 01:16, 11 March 2026
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	*Power = 100W		*Power = 100W
	*Etch Rate ≈ 50-100 nm/min. Varies.		*Etch Rate ≈ 50-100 nm/min. Varies.
	*Process notes: ~~Make~~ sure to PR-protect the underside, ''and'' the bevel/wafer edge, as the SiN can be removed in those areas as well if not covered by PR. You can coat the wafer bevel/edge using a swab, manually "painting" the bevel while the wafer is on a PR spinner vacuum chuck, and then the Brewer Lift-pin hotplate (Bay 7) to bake at ~100-110degC.		*Process notes: If the back or edges of the SiN-coated wafer is important to keep SiN coated, you need to make sure to PR-protect the wafer underside, ''and'' the bevel/wafer edge, as the SiN can be removed in those areas as well if not covered by PR. You can coat the wafer bevel/edge using a swab, manually "painting" the bevel while the wafer is on a PR spinner vacuum chuck, and then the Brewer Lift-pin hotplate (Bay 7) to bake at ~100-110degC.

	====Chamber Clean after CF4 Etching====		====Chamber Clean after CF4 Etching====
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	O2; 300mT / 100W - on either Technics asher.		O2; 300mT / 100W - on either Technics asher.

	~15sec to make a surface hydrophilic, eg. before wet etching or applying ~~photoreist~~.		~15sec to make a surface hydrophilic, eg. before wet etching or applying HMDS/photoresist.

	~30-~~120sec~~ to improve wirebonding pad metal prior to deposition of liftoff metal.		~30sec-3min to improve wirebonding pad metal prior to deposition of liftoff metal.

	~1-5min to remove polymerized photoresist/scum after dry etching		~1-5min to remove polymerized photoresist/scum after dry etching

John d: added links to "ICP systems for O2 etching"

2026-02-05T19:55:17Z

added links to "ICP systems for O2 etching"

← Older revision		Revision as of 19:55, 5 February 2026
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	*[https://signupmonkey.ece.ucsb.edu/wiki/images/e/ec/ExSitu_0.8mbar_Line2.JPG ExSitu_0.8mbar_Line2 – 0.8mbar, O<sub>2</sub> 100/75W]		*[https://signupmonkey.ece.ucsb.edu/wiki/images/e/ec/ExSitu_0.8mbar_Line2.JPG ExSitu_0.8mbar_Line2 – 0.8mbar, O<sub>2</sub> 100/75W]
	*[https://signupmonkey.ece.ucsb.edu/wiki/images/0/02/Dis_0.2mbar_Line2.JPG Dis 0.2mbar_Line2 – 0.2mbar, O<sub>2</sub>, 125/75W]		*[https://signupmonkey.ece.ucsb.edu/wiki/images/0/02/Dis_0.2mbar_Line2.JPG Dis 0.2mbar_Line2 – 0.2mbar, O<sub>2</sub>, 125/75W]

			== ICP-RIE Systems for O2 Plasma cleaning ==
			Many of our RIE and ICP etchers have O2 plasma recipes for either PR strip or BARC etching.

			We have found that ''in situ'' photoresist strip is usually the best process - running the PR strip without the wafer having left the vacuum chamber. Many etching tools allow you to chain sequential recipes together to make this faster.

			Here is a list of those recipes, also found on those tool's recipe pages:

			* [[RIE Etching Recipes#Photoresist and ARC (RIE 5)\|RIE#5]] - PR and BARC etching
			* [[ICP Etching Recipes#Photoresist .26 ARC .28Fluorine ICP Etcher.29\|Fluorine ICP Etcher]] - PR Strip & BARC etching
			* [[ICP Etching Recipes#Photoresist and ARC etching (Panasonic 2)\|Panasonic ICP #2]] - PR Strip & BARC etching

Ffoong: add a useful paper

2025-11-21T22:55:08Z

add a useful paper

← Older revision		Revision as of 22:55, 21 November 2025
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	*[[SPR220-7 at 3kW various temperature without N2 gas\|O2 only recipes without N2 gas: SPR220-7 at 3kW various temperature]]		*[[SPR220-7 at 3kW various temperature without N2 gas\|O2 only recipes without N2 gas: SPR220-7 at 3kW various temperature]]
	*[[Comparison of ash rate for different gas mixtures, especially between O2 only vs O2/N2 mixture.\|Comparison of ash rate for O2-only vs O2/N2 mixture]]		*[[Comparison of ash rate for different gas mixtures, especially between O2 only vs O2/N2 mixture.\|Comparison of ash rate for O2-only vs O2/N2 mixture]]
			*Refernce paper: [[Influence of Additive N2 on O2 Plasma Ashing Process in Inductively Coupled Plasma.pdf]]
	*[[Gold surface oxidation (darkening) due to O2/N2 plasma; the need for O2 only recipe.\|Gold surface oxidation (darkening) due to O2/N2 plasma; the need for O2 only recipes]]		*[[Gold surface oxidation (darkening) due to O2/N2 plasma; the need for O2 only recipe.\|Gold surface oxidation (darkening) due to O2/N2 plasma; the need for O2 only recipes]]
	*Note: Ruthenium layers will likely partially oxidize in these recipes, possibly turning brown.		*Note: Ruthenium layers will likely partially oxidize in these recipes, possibly turning brown.

John d: /* SiN Etching */ PR backside protect

2024-05-15T20:23:46Z

SiN Etching: PR backside protect

← Older revision		Revision as of 20:23, 15 May 2024
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	*Power = 100W		*Power = 100W
	*Etch Rate ≈ 50-100 nm/min. Varies.		*Etch Rate ≈ 50-100 nm/min. Varies.
			*Process notes: Make sure to PR-protect the underside, ''and'' the bevel/wafer edge, as the SiN can be removed in those areas as well if not covered by PR. You can coat the wafer bevel/edge using a swab, manually "painting" the bevel while the wafer is on a PR spinner vacuum chuck, and then the Brewer Lift-pin hotplate (Bay 7) to bake at ~100-110degC.

	====Chamber Clean after CF4 Etching====		====Chamber Clean after CF4 Etching====

John d: /* N2/O2 Recipes */ note that wafers get hotter than recipe name indicates.

2024-03-01T20:55:29Z

N2/O2 Recipes: note that wafers get hotter than recipe name indicates.

← Older revision		Revision as of 20:55, 1 March 2024
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	*Variations: (underlined portion of filename above)		*Variations: (underlined portion of filename above)
	**Temperature: 100C, 130C, 150C,180C		**Temperature: 100C, 130C, 150C,180C
			***NOTE: some wafers will get hotter than the indicated temperature, due to optical absorption. See below for alternative recipes that avoid this.
	**Power: 3kW, 0.7kW		**Power: 3kW, 0.7kW
	***3kW is very fast for full PR strip, but often increases substrate temperature significantly.		***3kW is very fast for full PR strip, but often increases substrate temperature significantly.

John d: /* N2/O2 effect on Gold contacts & Substrate Temperature */ minor additions to clarify gold optical absorption

2024-02-29T20:46:12Z

N2/O2 effect on Gold contacts & Substrate Temperature: minor additions to clarify gold optical absorption

← Older revision		Revision as of 20:46, 29 February 2024
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	====N<sub>2</sub>/O<sub>2</sub> effect on Gold contacts & Substrate Temperature====		====N<sub>2</sub>/O<sub>2</sub> effect on Gold contacts & Substrate Temperature====
	These recipes, at both 3kW and 0.7kW, have a tendency to oxidize Gold, turning Gold contacts brown. ~~The~~ optical emission of the N2 plasma emits strongly in the visible, which is absorbed by ~~many metals~~ (especially Blue/UV), causing additional heating of the surface. If your devices contain gold contacts, or are very temperature sensitive, consider using our O2-only recipes below.		These Nitrogen-containing recipes, at both 3kW and 0.7kW, have a tendency to oxidize Gold, turning Gold contacts brown. We found that the optical emission of the N<sub>2</sub> plasma emits strongly in the visible, which is absorbed especially by Gold (especially Blue/UV optical absorption, that's why Gold looks yellow), causing additional heating of the surface, perhaps as much as 100°C hotter. If your devices contain gold contacts, or are very temperature sensitive, consider using our O2-only recipes below.

	===O<sub>2</sub>-Only Recipes===		===O<sub>2</sub>-Only Recipes===

John d: /* Plasma Clean (YES EcoClean) */ links to recipe screenshots for both N2-O2 & O2

2023-11-30T19:02:16Z

Plasma Clean (YES EcoClean): links to recipe screenshots for both N2-O2 & O2

← Older revision		Revision as of 19:02, 30 November 2023
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	**These recipes used to be named “180C-3kW-3min”, prior to 2023-09-15.		**These recipes used to be named “180C-3kW-3min”, prior to 2023-09-15.
	**The new, Renamed recipes are identical, except have a 1x pump/purge added to the start of the cycle to improve repeatability.		**The new, Renamed recipes are identical, except have a 1x pump/purge added to the start of the cycle to improve repeatability.
	*Variations: (underlined portion of filename)		*Variations: (underlined portion of filename above)
	**Temperature: 100C, 130C, 150C,180C		**Temperature: 100C, 130C, 150C,180C
	**Power: 3kW, 0.7kW		**Power: 3kW, 0.7kW
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	***0.7kW reduces substrate temperature, although exact values are not known.		***0.7kW reduces substrate temperature, although exact values are not known.
	**Time: Various times are available, with strings such as "30sec", "1min", "3min" etc.		**Time: Various times are available, with strings such as "30sec", "1min", "3min" etc.
			*[[YES Recipe Screenshots: STD-N2-O2\|Recipe screenshots]]

	====Recipe Characterization:====		====Recipe Characterization:====
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	*Recipe Names: "'''STD-O2-<u>100C</u>-<u>3kW</u>-<u>3min</u>'''"		*Recipe Names: "'''STD-O2-<u>100C</u>-<u>3kW</u>-<u>3min</u>'''"
	*Variations:		*Variations: (underlined portion of filename above)
	**<u>Temperature</u>: 100C, 130C, 150C, 180C		**<u>Temperature</u>: 100C, 130C, 150C, 180C
	**<u>Power</u>: 3kW		**<u>Power</u>: 3kW
	**<u>Time</u>: Various times are available, with strings such as "30sec", "1min", "3min" up to "15min"		**<u>Time</u>: Various times are available, with strings such as "30sec", "1min", "3min" up to "15min"
			*[[YES Recipe Screenshots: STD-O2\|Recipe Screenshots]]

	====O<sub>2</sub> Recipe Characterization====		====O<sub>2</sub> Recipe Characterization====

John d: /* Plasma Clean (YES EcoClean) */ added Ru oxidation in O2-only

2023-11-16T23:46:38Z

Plasma Clean (YES EcoClean): added Ru oxidation in O2-only

← Older revision		Revision as of 23:46, 16 November 2023
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	====Recipe Names:====		====Recipe Names:====

	*~~'''<u>''TO BE RENAMED''</u>''':~~ "'''STD-N2-O2-<u>180C</u>-<u>3kW</u>-<u>3min</u>'''"		*"'''STD-N2-O2-<u>180C</u>-<u>3kW</u>-<u>3min</u>'''"
	**These recipes used to be named “180C-3kW-3min”, prior to 2023-09-15.		**These recipes used to be named “180C-3kW-3min”, prior to 2023-09-15.
	**The new ~~renamed~~ recipes are identical, except have a 1x pump/purge added to the start of the cycle to improve repeatability.		**The new, Renamed recipes are identical, except have a 1x pump/purge added to the start of the cycle to improve repeatability.
	*Variations: (underlined portion of filename)		*Variations: (underlined portion of filename)
	**Temperature: 100C, 130C, 150C,180C		**Temperature: 100C, 130C, 150C,180C
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	====N<sub>2</sub>/O<sub>2</sub> effect on Gold contacts & Substrate Temperature====		====N<sub>2</sub>/O<sub>2</sub> effect on Gold contacts & Substrate Temperature====
	These recipes, at both 3kW and 0.7kW, have a tendency to oxidize Gold, turning Gold contacts brown. The optical emission of the N2 plasma emits strongly in the visible, which is absorbed by many metals (especially Blue/UV), causing additional heating of the surface. If your devices contain gold contacts, or are very temperature sensitive, consider using our O2-only ~~recipe~~ below.		These recipes, at both 3kW and 0.7kW, have a tendency to oxidize Gold, turning Gold contacts brown. The optical emission of the N2 plasma emits strongly in the visible, which is absorbed by many metals (especially Blue/UV), causing additional heating of the surface. If your devices contain gold contacts, or are very temperature sensitive, consider using our O2-only recipes below.

	===O<sub>2</sub>-Only Recipes===		===O<sub>2</sub>-Only Recipes===
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	*[[Comparison of ash rate for different gas mixtures, especially between O2 only vs O2/N2 mixture.\|Comparison of ash rate for O2-only vs O2/N2 mixture]]		*[[Comparison of ash rate for different gas mixtures, especially between O2 only vs O2/N2 mixture.\|Comparison of ash rate for O2-only vs O2/N2 mixture]]
	*[[Gold surface oxidation (darkening) due to O2/N2 plasma; the need for O2 only recipe.\|Gold surface oxidation (darkening) due to O2/N2 plasma; the need for O2 only recipes]]		*[[Gold surface oxidation (darkening) due to O2/N2 plasma; the need for O2 only recipe.\|Gold surface oxidation (darkening) due to O2/N2 plasma; the need for O2 only recipes]]
			*Note: Ruthenium layers will likely partially oxidize in these recipes, possibly turning brown.

	'''Internal To Add:'''		'''Internal To Add:'''

John d: /* N2/O2 Recipes */ clarified recipe renaming, and hearing of wafers

2023-09-09T17:08:48Z

N2/O2 Recipes: clarified recipe renaming, and hearing of wafers

← Older revision		Revision as of 17:08, 9 September 2023
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	====Recipe Names:====		====Recipe Names:====

	*'''<u>''TO BE ~~ADDED~~''</u>''': "'''STD-N2-O2-<u>180C</u>-<u>3kW</u>-<u>3min</u>'''"		*'''<u>''TO BE RENAMED''</u>''': "'''STD-N2-O2-<u>180C</u>-<u>3kW</u>-<u>3min</u>'''"
			**These recipes used to be named “180C-3kW-3min”, prior to 2023-09-15.
	*Variations:
			**The new renamed recipes are identical, except have a 1x pump/purge added to the start of the cycle to improve repeatability.
			*Variations: (underlined portion of filename)
	**Temperature: 100C, 130C, 150C,180C		**Temperature: 100C, 130C, 150C,180C
	**Power: 3kW, 0.7kW		**Power: 3kW, 0.7kW
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	*[[YES-SPR220-Various-Temps\|SPR220-7 at 3kW various Temps with N2/O2 recipes]]		*[[YES-SPR220-Various-Temps\|SPR220-7 at 3kW various Temps with N2/O2 recipes]]

	3kW recipes appear to gradually heat wafers beyond the hotplate temperature, and also expose the underside of the wafer. Very efficient cleaning of positive photoresists.		3kW recipes appear to gradually heat wafers beyond the hotplate temperature, and also expose the underside of the wafer. Very efficient cleaning of positive photoresists, but exact temperature is unknown and may increase with time.

	====N<sub>2</sub>/O<sub>2</sub> effect on Gold contacts & Substrate Temperature====		====N<sub>2</sub>/O<sub>2</sub> effect on Gold contacts & Substrate Temperature====