Process Group Internships - Revision history

John d at 00:33, 11 January 2026

2026-01-11T00:33:49Z

← Older revision		Revision as of 00:33, 11 January 2026
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	* [[Nanofab Job Postings\|Upcoming Internship Openings]]		* [[Nanofab Job Postings\|Upcoming Internship Openings]]
	* [[Process Group Interns\|Current Interns]]		* [[Process Group Interns\|Current Interns]]

			<br>

	__TOC__		__TOC__

John d at 00:33, 11 January 2026

2026-01-11T00:33:04Z

← Older revision		Revision as of 00:33, 11 January 2026
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	No prerequisites/prior knowledge needed; for anyone 16 years old and up; Minimum 6 months commitment (break during summer is acceptable).		No prerequisites/prior knowledge needed; for anyone 16 years old and up; Minimum 6 months commitment (break during summer is acceptable).

	* [[Nanofab Job Postings Upcoming Internship Openings]]		* [[Nanofab Job Postings\|Upcoming Internship Openings]]
	* [[Process Group Interns\|Current Interns]]		* [[Process Group Interns\|Current Interns]]

John d: added links to job postings and current interns, and a bit more info

2026-01-11T00:32:46Z

added links to job postings and current interns, and a bit more info

← Older revision		Revision as of 00:32, 11 January 2026
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	The NanoFab hosts UCSB Undergraduate Interns throughout the school year and summer.		The NanoFab hosts UCSB Undergraduate Interns throughout the school year and summer.

			No prerequisites/prior knowledge needed; for anyone 16 years old and up; Minimum 6 months commitment (break during summer is acceptable).

			* [[Nanofab Job Postings Upcoming Internship Openings]]
			* [[Process Group Interns\|Current Interns]]

			__TOC__

	=== Internship Goals ===		=== Internship Goals ===

John d: /* Process Control for Increased Uptime */

2025-11-25T01:53:18Z

Process Control for Increased Uptime

← Older revision		Revision as of 01:53, 25 November 2025
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	** See the intern-generated SPC data here: [[Process Group - Process Control Data\|Process Control Data]]		** See the intern-generated SPC data here: [[Process Group - Process Control Data\|Process Control Data]]
	* '''OCAP/Repair''': Work with tool engineers to identify & diagnose equipment problems.		* '''OCAP/Repair''': Work with tool engineers to identify & diagnose equipment problems.
	** If Process Engineers identify an Out-of-Control process, Interns are involved in the communications & testing of tool repairs.		** If Process Engineers identify an Out-of-Control process, Interns are involved in the communications & testing of tool repairs, until process is back "in control".

	==== Process Control for Increased Uptime ====		==== Process Control (SPC) for Increased Uptime ====
	* Interns run process-control on the lab's most critical/high-usage tools.		* Interns run process-control on the lab's most critical/high-usage tools & update [[Process Group - Process Control Data\|SPC charts]].
	* Calibration processes are identical each time (unlike lab user's processes), allowing apples-to-apples comparisons.		* Calibration processes are identical each time (unlike lab user's processes), allowing apples-to-apples comparisons.
	* Regular meetings with Process Engineers allow us to proactively identify equipment/process issues, failing tool components, and schedule repairs/remedies sooner than if detected by a lab user.		* Regular meetings with Process Engineers allow us to proactively identify equipment/process issues, failing tool components, and schedule repairs/remedies sooner than if detected by a lab user.

John d: links to spc data and tools etc

2025-09-11T18:49:22Z

links to spc data and tools etc

← Older revision		Revision as of 18:49, 11 September 2025
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	** Communications with		** Communications with
	*** lab users (scheduling around other users)		*** lab users (scheduling around other users)
	*** equipment ~~staff~~ (reporting tool issues)		*** equipment engineers (training, handling/reporting tool issues)
	*** process supervisors/managers (reviewing process control data)		*** process supervisors/managers (reviewing process control data, OCAP actions)
	* '''Equipment''': Become comfortable with learning different ~~SOP's~~ of similar tool types		* '''Equipment''': Become comfortable with learning different Operating Procedures of similar tool types
	** Eg. 4 different plasma depositions, 4 different ICP etchers etc.		** Eg. 4 different plasma depositions, 4 different ICP etchers etc.
	** Once an intern has learned 3 different PECVD deposition tools, it is trivial to learn a new PECVD tool even from an unfamiliar manufacturer.		** Once an intern has learned 3 different PECVD deposition tools, it is trivial to learn a new PECVD tool even from an unfamiliar manufacturer.
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	** Combining ''Equipment Operating Procedures'' with ''Process Travelers'' instructions at run-time.		** Combining ''Equipment Operating Procedures'' with ''Process Travelers'' instructions at run-time.
	** Data collection with standardized digital filenames & directory structures, available online to all lab users.		** Data collection with standardized digital filenames & directory structures, available online to all lab users.
			** [https://docs.google.com/spreadsheets/d/1fTDNXxpf4tgNYLIEs_jvehG1KvtXqqTRDBI7sHNAVvo/edit?gid=0#gid=0 Click on the '''date''' of any SPC data row here to see a Traveler & Data folder] filled out by interns (or here is [https://drive.google.com/drive/folders/10v4pElyxNBTe4kJw8fMtuBtj54M5vkPx one example]).
			*** Every Calibration process has the same format: see other intern-run processes here: [[Process Group - Process Control Data\|Process Control Data]]
	* '''[https://en.wikipedia.org/wiki/Statistical_process_control SPC]''': Perform metrology, process control, create SPC charts		* '''[https://en.wikipedia.org/wiki/Statistical_process_control SPC]''': Perform metrology, process control, create SPC charts
	** Data from the Travelers are entered into online spreadsheets, which calculate SPC charts		** Data from the Travelers are entered into online spreadsheets, which calculate SPC charts
	** Some interns create/modify SPC charts when needed for newly developed Cals.		** Some interns create/modify SPC charts when needed for newly developed Cals.
			** See the intern-generated SPC data here: [[Process Group - Process Control Data\|Process Control Data]]
	* '''OCAP/Repair''': Work with tool engineers to identify & diagnose equipment problems.		* '''OCAP/Repair''': Work with tool engineers to identify & diagnose equipment problems.
	** If Process Engineers identify an Out-of-Control process, Interns are involved in the communications & testing of tool repairs.		** If Process Engineers identify an Out-of-Control process, Interns are involved in the communications & testing of tool repairs.
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	=== Phase 1: Deposition Cals (1st Quarter) ===		=== Phase 1: Deposition Cals (1st Quarter) ===

	* Interns ~~learn~~ 4 different deposition tools, in the following order:		* Interns run 4 different deposition tools weekly, in the following order:
	** Plasmatherm PECVD 1		** [[PECVD 1 (PlasmaTherm 790)\|Plasmatherm PECVD 1]]
	** Advanced Vacuum PECVD 2,		** [[PECVD 2 (Advanced Vacuum)\|Advanced Vacuum PECVD 2]],
	** Unaxis ICP-PECVD,		** [[ICP-PECVD (Unaxis VLR)\|Unaxis ICP-PECVD]],
	** Veeco Ion Beam Deposition		** [[Ion Beam Deposition (Veeco NEXUS)\|Veeco Ion Beam Sputter Deposition]]
	** 3-4 different films (SiO<sub>2</sub>, Si<sub>3</sub>N<sub>4</sub>, Low-stress-Si<sub>3</sub>N<sub>4</sub>) are run on <u>each tool</u>.		** 3-4 different films (SiO<sub>2</sub>, Si<sub>3</sub>N<sub>4</sub>, Low-stress-Si<sub>3</sub>N<sub>4</sub>) are run on <u>each tool</u>.
	* Every film undergoes the following metrology:		* Every film undergoes the following metrology:
	** Ellipsometry: Thin-film thickness and refractive index at 2 different wavelengths.		** [[Ellipsometer (Woollam)\|Ellipsometry]]: Thin-film thickness and refractive index at 2 different wavelengths.
	** Reflectometry Wafer Mapping: Thin-film Uniformity across the wafer.		** [[Optical Film Thickness & Wafer-Mapping (Filmetrics F50)\|Reflectometry Wafer Mapping]]: Thin-film Uniformity across the wafer.
	** Particle Count: laser-scanning via Surfscan, at two different particle-size/range settings		** [[Surface Analysis (KLA/Tencor Surfscan)\|Particle Count]]: laser-scanning via Surfscan, at two different particle-size/range settings
	** Thin-Film Stress: requires before & after wafer bow measurements via laser scanning		** [[Film Stress (Tencor Flexus)\|Thin-Film Stress]]: requires before & after wafer bow measurements via laser scanning
			* Follow Process Protocols:
			** Follow and Record Data onto Travelers for every Cal run, save metro data into publicly-accessible folders.
			** Update all [[Process Group - Process Control Data\|SPC data tables]] and charts accurately, report any "out of control" process issues.
	* By the end of 1st Quarter, Interns are running 9-12 thin-film cals every 2 weeks.		* By the end of 1st Quarter, Interns are running 9-12 thin-film cals every 2 weeks.

	=== Phase 2: EtchCals and LithoCals (2nd Quarter) ===		=== Phase 2: EtchCals and LithoCals (2nd Quarter) ===

	* Interns ~~learn~~ 4 different ICP Etchers:		* Interns run 4 different ICP Etchers weekly:
	** Plasmatherm SLR Fluorine Etcher		** [[Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)\|Plasmatherm SLR Fluorine ICP Etcher]] - SiO2 and Si etching
	** Oxford Cobra III-V Etcher		** [[Oxford ICP Etcher (PlasmaPro 100 Cobra)\|Oxford Cobra III-V ICP Etcher]] - InP etching
	** Plasmatherm DSEiii		** [[DSEIII (PlasmaTherm/Deep Silicon Etcher)\|Plasmatherm DSEiii]] - Bosch etching of Silicon
	** Panasonic ICP #2		** [[ICP Etch 2 (Panasonic E626I)\|Panasonic ICP #2]] - SiO2 and GaAs etching
	** 1-2 different Etches per tool; one "insensitive" to chamber condition, one "sensitive" to chamber condition.		** 1-2 different Etches per tool; one "insensitive" to chamber condition, one "sensitive" to chamber condition.
⚫	* Interns ~~learn~~ ASML DUV Stepper lithography: photoresist coating, exposure and develop.
⚫	** Critical particulate-sensitive process, cal shows any particles present
⚫	*** Intern's techniques are remedied if particles are detected.
	* Metrology on each EtchCal:		* Metrology on each EtchCal:
	** SEM of manually Cleaved Cross-section		** [[SEM 1 (JEOL IT800SHL)\|SEM]] of manually Cleaved Cross-section
			** Cleaving samples for cross-sectional SEM.
	** Profilometry & Etch-Rate Calculation		** [[Step Profilometer (DektakXT)\|Profilometry]] & Etch-Rate Calculation
	** Etch Selectivity Calculation via pre/post hardmask removal profilometry		** Etch Selectivity Calculation via pre/post hardmask removal profilometry
		⚫	* Interns run weekly [[Stepper 3 (ASML DUV)\|ASML DUV Stepper lithography]]: photoresist coating, exposure and develop.
		⚫	** Critical particulate-sensitive process, cal shows any particles present
		⚫	*** Intern's techniques are remedied if particles are detected.
	* Metro on each LithoCal:		* Metro on each LithoCal:
	** SEM for Critical Dimension measurement; multiple locations on wafer.		** [[SEM 1 (JEOL IT800SHL)\|SEM]] for Critical Dimension measurement; multiple locations on wafer.
	** Identification of "hotspot" particulate contamination on wafer/tool.		** Identification of "hotspot" particulate contamination on wafer/tool.
			* Follow Process Protocols:
⚫	* By the end of 2nd Quarter, Interns are running LithoCals and ~2 ~~Etchcals~~ weekly, with multiple SEM sessions. They are proficient at SEM by the end of the 2nd quarter.
			** Follow and Record Data onto Travelers for every Cal run, save metro data into publicly-accessible folders.
			** Update all [[Process Group - Process Control Data\|SPC data tables]] and charts accurately, report any "out of control" process issues.
		⚫	* By the end of 2nd Quarter, Interns are running LithoCals and ~2 EtchCals weekly, with multiple SEM sessions. They are proficient at SEM by the end of the 2nd quarter.

John d: header level fix

2024-12-09T16:46:33Z

header level fix

← Older revision		Revision as of 16:46, 9 December 2024
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	The skills acquired for each goal are as follows:		The skills acquired for each goal are as follows:

	=== Industry-relevant Experience ===		==== Industry-relevant Experience ====

	* '''Protocols''': Interns become comfortable in a busy semiconductor 'fab environment. After 2-3 months of regular usage the interns are fully comfortable with:		* '''Protocols''': Interns become comfortable in a busy semiconductor 'fab environment. After 2-3 months of regular usage the interns are fully comfortable with:
	** Cleanroom safety & protocols such as PPE, safe waste disposal etc.		** Cleanroom safety & protocols such as PPE, safe waste disposal etc.
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	** If Process Engineers identify an Out-of-Control process, Interns are involved in the communications & testing of tool repairs.		** If Process Engineers identify an Out-of-Control process, Interns are involved in the communications & testing of tool repairs.

	=== Process Control for Increased Uptime ===		==== Process Control for Increased Uptime ====

	* Interns run process-control on the lab's most critical/high-usage tools.		* Interns run process-control on the lab's most critical/high-usage tools.
	* Calibration processes are identical each time (unlike lab user's processes), allowing apples-to-apples comparisons.		* Calibration processes are identical each time (unlike lab user's processes), allowing apples-to-apples comparisons.

John d at 21:12, 6 November 2024

2024-11-06T21:12:46Z

John d: Intenrhsip Goals heading

2024-11-06T21:09:52Z

Intenrhsip Goals heading

← Older revision		Revision as of 21:09, 6 November 2024
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	The NanoFab hosts UCSB Undergraduate Interns throughout the school year and summer.		The NanoFab hosts UCSB Undergraduate Interns throughout the school year and summer.

			=== Internship Goals ===
	Our goals are twofold:		Our goals are twofold:

	# Acquire [[Process Group - Process Control Data\|Process Control Data]] ~~that~~ NanoFab staff ~~use to~~ proactively identify equipment/process problems, and		# Acquire [[Process Group - Process Control Data\|Process Control Data]] so NanoFab staff can proactively identify equipment/process problems, and
	# Give [[Process Group Interns\|Interns]] in-~~lab~~ industry-relevant experience to minimize the training required at any ~~semiconductor/~~microelectronics company/research group.		# Give [[Process Group Interns\|Interns]] hands-on industry-relevant experience to minimize the training required at any microelectronics company/research group.

John d: internship goals, skillss learns and detailed 2-phase approach

2024-11-06T21:00:19Z

internship goals, skillss learns and detailed 2-phase approach

New page

The NanoFab hosts UCSB Undergraduate Interns throughout the school year and summer.

Our goals are twofold:

# Acquire [[Process Group - Process Control Data|Process Control Data]] that NanoFab staff use to proactively identify equipment/process problems, and
# Give [[Process Group Interns|Interns]] in-lab industry-relevant experience to minimize the training required at any semiconductor/microelectronics company/research group.

The skills acquired for each goal are as follows:

=== Industry-relevant Experience ===

* '''Protocols''': Interns become comfortable in a busy semiconductor 'fab environment. After 2-3 months of regular usage the interns are fully comfortable with:
** Cleanroom safety & protocols such as PPE, safe waste disposal etc.
** Managing their own schedule to accomplish weekly processing tasks.
** Multi-tasking to run simultaneous processes fast and efficiently.
*** Interns learn new tools only once their current cals have been condensed into a few hours.
** Communications with
*** lab users (scheduling around other users)
*** equipment staff (reporting tool issues)
*** process supervisors/managers (reviewing process control data)
* '''Equipment''': Become comfortable with learning different SOP's of similar tool types
** Eg. 4 different plasma depositions, 4 different ICP etchers etc.
** Once an intern has learned 3 different PECVD deposition tools, it is trivial to learn a new PECVD tool even from an unfamiliar manufacturer.
* [https://en.wikipedia.org/wiki/Manufacturing_execution_system '''MES''']: Learn to utilize production tracking/communications
** Travelers/Process Followers/Run Cards & associated data directories are created and filled out at run-time for every calibration. (Digital/online via Google Sheets+Drive)
** Matching up ''Equipment Operating Procedures'' with ''Process Travelers'' at run-time.
** Data collection with standardized digital filenames and directory structures, available online to all lab users.
* '''[https://en.wikipedia.org/wiki/Statistical_process_control SPC]''': Perform metrology, process control, create SPC charts
** Data from the Travelers are entered into online spreadsheets, which calculate SPC charts
** Some interns create/modify SPC charts when needed for newly developed Cals.
* '''OCAP/Repair''': Work with tool engineers to identify & diagnose equipment problems.
** If Process Engineers identify an Out-of-Control process, Interns are involved in the communications & testing of tool repairs.

=== Process Control for Increased Uptime ===

* Interns run process-control on the lab's most critical/high-usage tools.
* Calibration processes are identical each time (unlike lab user's processes), allowing apples-to-apples comparisons.
* Regular meetings with Process Engineers allow us to proactively identify equipment/process issues, failing tool components, and schedule repairs/remedies sooner than if detected by a lab user.
* Lab users are notified of process anomalies & repair plans, reducing bad outcomes for lab users.
* "Contamination" checks via On-Demand process-checks
** Determine whether a new process affects other processes on the same tool, by running pre/post Cal Etches.
** On ICP Etchers, enables data-driven equipment sharing between processes.
** Enables lab-users to quickly determine whether problems lie with the Equipment/"contamination", another user's process or their own Process.

== Job Description: 2 phases ==
Internships are generally run in 2 phases, with each phase being approx. 1 Quarter (3 months) long.

=== Phase 1: Deposition Cals (1st Quarter) ===

* Interns learn 4 different deposition tools, in the following order:
** Plasmatherm PECVD 1
** Advanced Vacuum PECVD 2,
** Unaxis ICP-PECVD,
** Veeco Ion Beam Deposition
** 3-4 different films (SiO2, Si3N4, Low-stress-Si3N4) are run on each tool.
* Every film undergoes the following metrology:
** Ellipsometry: Thin-film thickness and refractive index at 2 different wavelengths.
** Reflectometry Wafer Mapping: Thin-film Uniformity across the wafer.
** Particle Count: laser-scanning via Surfscan, at two different particle-size/range settings
** Thin-Film Stress: requires before & after wafer bow measurements via laser scanning
* By the end of 1st Quarter, Interns are running 9-12 thin-film cals every 2 weeks.

=== Phase 2: EtchCals and LithoCals (2nd Quarter) ===

* Interns learn 4 different ICP Etchers:
** Plasmatherm SLR Fluorine Etcher
** Oxford Cobra III-V Etcher
** Plasmatherm DSEiii
** Panasonic ICP #2
** 1-2 different Etches per tool; one "insensitive" to chamber condition, one "sensitive" to chamber condition.
* Interns learn ASML DUV Stepper lithography: photoresist coating, exposure and develop.
** Critical particulate-sensitive process, cal shows any particles present
*** Intern's techniques are remedied if particles are detected.
* Metrology on each EtchCal:
** SEM of manually Cleaved Cross-section
** Profilometry & Etch-Rate Calculation
** Etch Selectivity Calculation via pre/post hardmask removal profilometry
* Metro on each LithoCal:
** SEM for Critical Dimension measurement; multiple locations on wafer.
** Identification of "hotspot" particulate contamination on wafer/tool.
* By the end of 2nd Quarter, Interns are running LithoCals and ~2 Etchcals weekly, with multiple SEM sessions. They are proficient at SEM by the end of the 2nd quarter.

← Older revision		Revision as of 21:12, 6 November 2024
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	Our goals are twofold:		Our goals are twofold:

	# Acquire [[Process Group - Process Control Data\|Process Control Data]] so NanoFab staff can proactively identify equipment/process problems, and		# '''Increased Tool Uptime''': Acquire [[Process Group - Process Control Data\|Process Control Data]] so NanoFab staff can proactively identify equipment/process problems, and
	# Give [[Process Group Interns\|Interns]] hands-on industry-relevant experience to minimize the training required at any microelectronics company/research group.		# '''Industry-Relevant Experience''': Give [[Process Group Interns\|Interns]] hands-on industry-relevant experience to minimize the training required at any microelectronics company/research group.


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	=== Industry-relevant Experience ===		=== Industry-relevant Experience ===

	* '''Protocols''': Interns become comfortable in a busy semiconductor 'fab environment. After 2-3 months of regular usage the interns are fully comfortable with:		* '''Protocols''': Interns become comfortable in a busy semiconductor 'fab environment. After 2-3 months of regular usage the interns are fully comfortable with:
	** Cleanroom safety & protocols such as PPE, safe waste disposal etc.		** Cleanroom safety & protocols such as PPE, safe waste disposal etc.
	** Managing their own schedule to accomplish weekly processing tasks.		** Managing their own schedule to accomplish weekly processing tasks.
Line 24:		Line 24:
	** Eg. 4 different plasma depositions, 4 different ICP etchers etc.		** Eg. 4 different plasma depositions, 4 different ICP etchers etc.
	** Once an intern has learned 3 different PECVD deposition tools, it is trivial to learn a new PECVD tool even from an unfamiliar manufacturer.		** Once an intern has learned 3 different PECVD deposition tools, it is trivial to learn a new PECVD tool even from an unfamiliar manufacturer.
	* [https://en.wikipedia.org/wiki/Manufacturing_execution_system '''MES''']: Learn to utilize production tracking/communications		* [https://en.wikipedia.org/wiki/Manufacturing_execution_system '''MES''']: Learn to utilize production tracking/communications tools
	** Travelers/Process Followers~~/Run Cards~~ & associated data directories are created and filled out at run-time for every calibration. (Digital/online via Google Sheets+Drive)		** Travelers/Process Followers & associated data directories are created and filled out at run-time for every calibration. (Digital/online via Google Sheets+Drive)
	** ~~Matching up~~ ''Equipment Operating Procedures'' with ''Process Travelers'' at run-time.		** Combining ''Equipment Operating Procedures'' with ''Process Travelers'' instructions at run-time.
	** Data collection with standardized digital filenames ~~and~~ directory structures, available online to all lab users.		** Data collection with standardized digital filenames & directory structures, available online to all lab users.
	* '''[https://en.wikipedia.org/wiki/Statistical_process_control SPC]''': Perform metrology, process control, create SPC charts		* '''[https://en.wikipedia.org/wiki/Statistical_process_control SPC]''': Perform metrology, process control, create SPC charts
	** Data from the Travelers are entered into online spreadsheets, which calculate SPC charts		** Data from the Travelers are entered into online spreadsheets, which calculate SPC charts