S-Cubed Flexi - Operating Procedure - Revision history

Gopimeena: Updated SOP (SOP file in Nanofab equipment folder)

2024-08-12T15:44:19Z

Updated SOP (SOP file in Nanofab equipment folder)

John d at 21:39, 8 November 2022

2022-11-08T21:39:54Z

← Older revision		Revision as of 21:39, 8 November 2022
Line 37:		Line 37:
	<br />		<br />

	===~~Allowed~~ Recipes===		===Available PR Spin Recipes===
	'''Recipes > Lithography >''' [[Lithography Recipes#Automated Coat.2FDevelop System Recipes .28S-Cubed Flexi.29\|'''<u>Automated Coater Recipes</u>''']] - See all available spin-coat recipes for this machine. Only Staff may edit/create recipes.		'''Recipes > Lithography >''' [[Lithography Recipes#Automated Coat.2FDevelop System Recipes .28S-Cubed Flexi.29\|'''<u>Automated Coater Recipes</u>''']] - See all available spin-coat recipes for this machine. Only Staff may edit/create recipes.
	'''<big><u>NEVER RUN DEVELOPER RECIPES on this machine!</u></big>'''		'''<big><u>NEVER RUN DEVELOPER RECIPES on this machine!</u></big>'''

John d: /* Allowed Recipes */ link to recipes

2022-11-08T21:39:31Z

Allowed Recipes: link to recipes

← Older revision		Revision as of 21:39, 8 November 2022
Line 38:		Line 38:

	===Allowed Recipes===		===Allowed Recipes===
			'''Recipes > Lithography >''' [[Lithography Recipes#Automated Coat.2FDevelop System Recipes .28S-Cubed Flexi.29\|'''<u>Automated Coater Recipes</u>''']] - See all available spin-coat recipes for this machine. Only Staff may edit/create recipes.
	{\| class="wikitable"
	\|+''Ask [[Tony Bosch\|Staff]] if you need a new recipe.''
	\|'''<u>Coating Material</u>'''
	\|'''<u>Route/Chain</u>'''
	\|'''<u>Name</u>'''
	\|'''<u>Spin Speed</u>'''
	\|'''<u>Bake Temp</u>'''
	\|'''<u>Notes</u>'''
	\|-
	\|'''DS-K101'''
	\|Route
	\|Coat-DS-K101-304[5Krpm]-185C
	\|
	\|
	\|Requires: HP4=185°C

	• [[DS-K101-304 Bake Temp. versus Develop Rate\|DSK Bake vs. Dev rate]]
	\|-
	\|'''UV6-0.8'''
	\|Route
	\|Staff > Coat-UV6[3.5K]-135C
	\|3.5krpm
	\|135°C
	\|Requires: HP1=135°C
	\|-
	\|'''DS-K101 + UV6'''
	\|Chain
	\|Staff > Coat-DSK101[5K]-220C-UV6[3.5K]-135C
	\|DSK: 5krpm
	UV6: 3.5krpm
	\|DSK: 220°C
	UV6: 135°C
	\|Requires:

	– HP4=220°C

	– HP1=135°C

	Plan for ~10-15 min per wafer.
	\|-
	\|'''Hotplate Set'''
	\|Route
	\|SET-HP4-220C
	\|
	\|
	\|Hotplate 4 (top) between 218-222°C when done.
	\|-
	\|
	\|
	\|
	\|
	\|
	\|
	\|}
	'''<big><u>NEVER RUN DEVELOPER RECIPES on this machine!</u></big>'''		'''<big><u>NEVER RUN DEVELOPER RECIPES on this machine!</u></big>'''

Bosch t: /* Initial */

2022-10-18T16:22:50Z

Initial

← Older revision		Revision as of 16:22, 18 October 2022
Line 15:		Line 15:

	*Check liquid supplies		*Check liquid supplies
			**Check PR, if the PR bottle is empty (see large bubbles in tube) use the "report tool issue" in signupmonkey. '''''<big><u>Users are not authorized to change or add any of the chemistries</u></big>'''''.
	**Check PR + EBR bottles by weight (lift by hand). Replace EBR if needed, just unscrew and put into new bottle. If PR bottle empty (see large bubbles in tube) let TonyB/SeanD know, <u>not user replaceable</u>.

	(If running PMGI, check if nozzles cleaned)		(If running PMGI, check if nozzles cleaned)
Line 23:		Line 23:
	*Check if hot plates are set to the needs temperatures. If not, run Temp-change recipe:		*Check if hot plates are set to the needs temperatures. If not, run Temp-change recipe:

	#Load dummy wafer (clean underside)		#Load dummy wafer ('''''<u>clean underside</u>''''')
	#run recipe: Staff>SET-<HP#>-<TEMP> recipe corresponding to needed temp.		#run recipe: Staff>SET-<HP#>-<TEMP> recipe corresponding to needed temp.
	##Eg. '''Staff > SET-HP4-220C''' will set hotplate 4 to 220°C		##Eg. '''Staff > SET-HP4-220C''' will set hotplate 4 to 220°C
Line 33:		Line 33:
	*Load test "mechanical" wafer - run a test run of your desired recipe, make sure spin looks ok. Important for first UV6 run after >6hrs idle. 1st Mechanical wafer will likely show radial nonuniformity as dried PR is ejected. 2nd test wafer should spin with high uniformity.		*Load test "mechanical" wafer - run a test run of your desired recipe, make sure spin looks ok. Important for first UV6 run after >6hrs idle. 1st Mechanical wafer will likely show radial nonuniformity as dried PR is ejected. 2nd test wafer should spin with high uniformity.

	*Load your wafers into Left Cassette, run your Route~~. Use filter ONLY [Staff]~~.		*Load your wafers into Left Cassette "Load Port 1", run your Route.

	<br />		<br />
Line 92:		Line 92:
	\|		\|
	\|}		\|}
	'''NEVER RUN DEVELOPER RECIPES on this machine!'''		'''<big><u>NEVER RUN DEVELOPER RECIPES on this machine!</u></big>'''

	The developer recipes are prone to damage the hardware if not handled correctly - system is <u>NOT AVAILABLE for automated develop</u> at this time.		The developer recipes are prone to damage the hardware if not handled correctly - system is <u>NOT AVAILABLE for automated develop</u> at this time.

John d: link to DSK bake vs dev rate, recipe minor updates

2022-05-02T23:13:36Z

link to DSK bake vs dev rate, recipe minor updates

← Older revision		Revision as of 23:13, 2 May 2022
Line 4:		Line 4:
	Processes currently available to lab users:		Processes currently available to lab users:

	* DS-K101 BARC (can be used like DUV42P)		*DS-K101 BARC (can be used like DUV42P)
			**[[DS-K101-304 Bake Temp. versus Develop Rate\|See this table of develop rate vs. bake temp for DS-K101]]
	* UV6 Positive DUV Resist		*UV6 Positive DUV Resist
⚫	* ''(PMGI and PMMA not yet available for general use)''
			**Various spin speeds available.
		⚫	*''(PMGI and PMMA not yet available for general use)''

	===Initial===		===Initial===

	* Make sure system is not running a process - Lot view shows no wafers or batches running.		*Make sure system is not running a process - Lot view shows no wafers or batches running.

	* Check liquid supplies		*Check liquid supplies
	** Check PR + EBR bottles by weight (lift by hand). Replace EBR if needed, just unscrew and put into new bottle. If PR bottle empty (see large bubbles in tube) let TonyB/SeanD know, <u>not user replaceable</u>.		**Check PR + EBR bottles by weight (lift by hand). Replace EBR if needed, just unscrew and put into new bottle. If PR bottle empty (see large bubbles in tube) let TonyB/SeanD know, <u>not user replaceable</u>.

	(If running PMGI, check if nozzles cleaned)		(If running PMGI, check if nozzles cleaned)

	* Check PR nozzle "bath" - make sure it's not clogged (should have a bit of liquid, but not above drain hole). If it does, use wooden stick of swab to unclog.		*Check PR nozzle "bath" - make sure it's not clogged (should have a bit of liquid, but not above drain hole). If it does, use wooden stick of swab to unclog.

	* Check if hot plates are set to the needs temperatures. If not, run Temp-change recipe:		*Check if hot plates are set to the needs temperatures. If not, run Temp-change recipe:

	# Load dummy wafer (clean underside)		#Load dummy wafer (clean underside)
	# run recipe: Staff>SET-<HP#>-<TEMP> recipe corresponding to needed temp.		#run recipe: Staff>SET-<HP#>-<TEMP> recipe corresponding to needed temp.
	## Eg. '''Staff > SET-HP4-220C''' will set hotplate 4 to 220°C		##Eg. '''Staff > SET-HP4-220C''' will set hotplate 4 to 220°C
	# Check that hotplate reach desired temp.(will overshoot by ~2-3°C)		#Check that hotplate reach desired temp.(will overshoot by ~2-3°C)
	# After 5min bake, need +/-2°C before running process.		#After 5min bake, need +/-2°C before running process.

	=== Run Wafers ===		===Run Wafers===

	* Load test "mechanical" wafer - run a test run of your desired recipe, make sure spin looks ok. Important for first UV6 run after >6hrs idle. 1st Mechanical wafer will likely show radial nonuniformity as dried PR is ejected. 2nd test wafer should spin with high uniformity.		*Load test "mechanical" wafer - run a test run of your desired recipe, make sure spin looks ok. Important for first UV6 run after >6hrs idle. 1st Mechanical wafer will likely show radial nonuniformity as dried PR is ejected. 2nd test wafer should spin with high uniformity.

	* Load your wafers into Left Cassette, run your Route. Use filter ONLY [Staff].		*Load your wafers into Left Cassette, run your Route. Use filter ONLY [Staff].

	<br />		<br />

	=== Allowed Recipes ===		===Allowed Recipes===
	{\| class="wikitable"		{\| class="wikitable"
	\|+''Ask [[Tony Bosch\|Staff]] if you need a new recipe.''		\|+''Ask [[Tony Bosch\|Staff]] if you need a new recipe.''
			\|'''<u>Coating Material</u>'''
	\|
	\|'''<u>Route/Chain</u>'''		\|'''<u>Route/Chain</u>'''
	\|'''<u>Name</u>'''		\|'''<u>Name</u>'''
Line 45:		Line 47:
	\|'''<u>Notes</u>'''		\|'''<u>Notes</u>'''
	\|-		\|-
	\|'''DS-K101 ~~recipes~~'''		\|'''DS-K101'''
	\|Route		\|Route
	\|Coat-DS-K101-304[5Krpm]-185C		\|Coat-DS-K101-304[5Krpm]-185C
	\|		\|
	\|		\|
			\|Requires: HP4=185°C
	\|

			• [[DS-K101-304 Bake Temp. versus Develop Rate\|DSK Bake vs. Dev rate]]
	\|-		\|-
	\|'''UV6 ~~Recipes~~'''		\|'''UV6-0.8'''
	\|Route		\|Route
	\|Staff > Coat-UV6[3.5K]-135C		\|Staff > Coat-UV6[3.5K]-135C
	\|3.5krpm		\|3.5krpm
	\|135°C		\|135°C
			\|Requires: HP1=135°C
	\|
	\|-		\|-
	\|'''DS-K101 + UV6 ~~Recipes~~'''		\|'''DS-K101 + UV6'''
	\|Chain		\|Chain
	\|Staff > Coat-DSK101[5K]-220C-UV6[3.5K]-135C		\|Staff > Coat-DSK101[5K]-220C-UV6[3.5K]-135C
Line 66:		Line 70:
	\|DSK: 220°C		\|DSK: 220°C
	UV6: 135°C		UV6: 135°C
			\|Requires:
	\|

			– HP4=220°C

			– HP1=135°C

			Plan for ~10-15 min per wafer.
	\|-		\|-
	\|'''Hotplate Set ~~recipes~~'''		\|'''Hotplate Set'''
	\|Route		\|Route
	\|SET-HP4-220C		\|SET-HP4-220C
	\|		\|
	\|		\|
	\|~~Check that hotplate~~ 4 (top) is between 218-222°C when done.		\|Hotplate 4 (top) between 218-222°C when done.
	\|-		\|-
	\|		\|

John d: inital procedure, and initial recipes

2022-05-02T23:05:57Z

inital procedure, and initial recipes

@@ Line 1: / Line 1: @@
 {{WIP}}
- '''Only staff & designated maintenance users are allowed to write recipes on this tool!
+ '''Only staff & designated maintenance users are allowed to write recipes on this tool!  '''
- Maintaining low particle counts on this tool is extremely important, so users must strictly follow the training procedures.'''
+ Maintaining low particle counts on this tool is extremely important, so users must strictly follow the training procedures. The Underside of your wafers must be clean to avoid contamination!

John d: initial secitons, draft only

2020-08-26T18:47:51Z

initial secitons, draft only

New page

{{WIP}}
'''Only staff & designated maintenance users are allowed to write recipes on this tool!
Maintaining low particle counts on this tool is extremely important, so users must strictly follow the training procedures.'''

== Initial ==
make sure system is not running, is on correct screen etc.

Check liquids

CHeck if nozzle has been cleaned, TBD?

RUn a test wafer, look for uniformity.

== Wafer Load ==
TBD, including check

== Run Recipe ==