SEM 1 (JEOL IT800SHL) - Revision history

John d at 09:09, 6 December 2025

2025-12-06T09:09:52Z

← Older revision		Revision as of 09:09, 6 December 2025
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	The [[SEM Sample Coater (Hummer)\|'''<u>Hummer coater</u>''']] is used to deposit a thin AuPd on your samples, to reduce electrical charging of insulating samples (such as SiO2 substrates, or thick >1µm layers of SiO2 or PR).		The [[SEM Sample Coater (Hummer)\|'''<u>Hummer coater</u>''']] is used to deposit a thin AuPd on your samples, to reduce electrical charging of insulating samples (such as SiO2 substrates, or thick >1µm layers of SiO2 or PR).

			=== Nabity Electron-Beam Patterning ===
	This SEM also has an Electron-Beam Lithography Nabity system. Contact Aidan Hopkins for info.		This SEM also has an Electron-Beam Lithography Nabity system. Contact the [[Aidan Hopkins\|tool supervisor]] for info.

	==Detailed Specifications==		==Detailed Specifications==

John d at 09:08, 6 December 2025

2025-12-06T09:08:38Z

← Older revision		Revision as of 09:08, 6 December 2025
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	}}		}}
	{{ToolActions		{{ToolActions
	\|toolid =		\|toolid = 75
	\|ProcessControlURL =		\|ProcessControlURL =
	\|ProceduresURL =		\|ProceduresURL =

John d: added toolactions but no ID!

2025-12-06T08:59:03Z

added toolactions but no ID!

← Older revision		Revision as of 08:59, 6 December 2025
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	\|toolid=		\|toolid=
	}}		}}
			{{ToolActions
			\|toolid =
			\|ProcessControlURL =
			\|ProceduresURL =
			\|TrainingURL =
			}}
	==About==		==About==
	The JEOL IT800HSL Field Emission Scanning Electron Microscope is used for imaging a variety of samples made in the facility.		The JEOL IT800HSL Field Emission Scanning Electron Microscope is used for imaging a variety of samples made in the facility.

Noahdutra: /* Operating Procedures */ Added CalTech Resource on SEM imaging concepts in "operating procedures" section at bottom of page

2025-07-24T17:14:30Z

Operating Procedures: Added CalTech Resource on SEM imaging concepts in "operating procedures" section at bottom of page

← Older revision		Revision as of 17:14, 24 July 2025
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	*[https://wiki.nanofab.ucsb.edu/w/images/1/10/JEOL_IT800SHL_Operating_Procedure.docx JEOL IT800SHL Operating Procedure].		*[https://wiki.nanofab.ucsb.edu/w/images/1/10/JEOL_IT800SHL_Operating_Procedure.docx JEOL IT800SHL Operating Procedure].
			*[https://www.youtube.com/watch?v=eOyfoMRHfgE&list=PL7Lb5X_YIzOnhm1ei1YtK-uIhT1UgKP4f CalTech Kavli SEM Imaging Concepts]
	*[https://www.youtube.com/watch?v=YeukVt1Fyi0 Optimizing Astigmatism (CalTech Nanoscience Institute)]		*[https://www.youtube.com/watch?v=YeukVt1Fyi0 Optimizing Astigmatism (CalTech Nanoscience Institute)]
	**Stig is the most common cause of blurry images, and requires practice to improve/knowing what to look for.		**Stig is the most common cause of blurry images, and requires practice to improve/knowing what to look for.

John d: /* Operating Procedures */

2024-11-02T17:48:26Z

Operating Procedures

← Older revision		Revision as of 17:48, 2 November 2024
Line 64:		Line 64:
	**Stig is the most common cause of blurry images, and requires practice to improve/knowing what to look for.		**Stig is the most common cause of blurry images, and requires practice to improve/knowing what to look for.
	**A Common mistake is to optimize stig on flat lines (eg. a cleaved edge or line/space features). This always leads to accidentally skewing the stig in the direction of the lines. Instead, make sure to optimize on a roundish feature, such as a piece of dust/debris.		**A Common mistake is to optimize stig on flat lines (eg. a cleaved edge or line/space features). This always leads to accidentally skewing the stig in the direction of the lines. Instead, make sure to optimize on a roundish feature, such as a piece of dust/debris.
	*[[Hummer SEM Sample Coater - Techniques to reduce charging in SEMs\|Hummer SEM Sample Coater - thin Au/Pd coating to reduce charging in SEMs]]		*[[Hummer SEM Sample Coater - Techniques to reduce charging in SEMs\|Hummer SEM Sample Coater - how to apply a thin Au/Pd coating to reduce charging in SEMs]]
	*[[JEOL IT800SHL - Reduced Charging Imaging Modes\|Charge-Free Imaging]] - SEM settings to reduce charging during imaging.		*[[JEOL IT800SHL - Reduced Charging Imaging Modes\|Charge-Free Imaging]] - SEM settings to reduce charging during imaging.

John d: /* Operating Procedures */ link to reduced cahrging imaging modes page

2024-11-02T16:41:57Z

Operating Procedures: link to reduced cahrging imaging modes page

← Older revision		Revision as of 16:41, 2 November 2024
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	==Operating Procedures==		==Operating Procedures==

	*J[https://wiki.nanofab.ucsb.edu/w/images/1/10/JEOL_IT800SHL_Operating_Procedure.docx ~~EOL~~ IT800SHL Operating Procedure].		*[https://wiki.nanofab.ucsb.edu/w/images/1/10/JEOL_IT800SHL_Operating_Procedure.docx JEOL IT800SHL Operating Procedure].
	*[https://www.youtube.com/watch?v=YeukVt1Fyi0 Optimizing Astigmatism (CalTech Nanoscience Institute)]		*[https://www.youtube.com/watch?v=YeukVt1Fyi0 Optimizing Astigmatism (CalTech Nanoscience Institute)]
	**Stig is the most common cause of blurry images, and requires practice to improve/knowing what to look for.		**Stig is the most common cause of blurry images, and requires practice to improve/knowing what to look for.
	**A Common mistake is to optimize stig on flat lines (eg. a cleaved edge or line/space features). This always leads to accidentally skewing the stig in the direction of the lines. Instead, make sure to optimize on a roundish feature, such as a piece of dust/debris.		**A Common mistake is to optimize stig on flat lines (eg. a cleaved edge or line/space features). This always leads to accidentally skewing the stig in the direction of the lines. Instead, make sure to optimize on a roundish feature, such as a piece of dust/debris.
	*[[Hummer SEM Sample Coater - Techniques to reduce charging in SEMs]]		*[[Hummer SEM Sample Coater - Techniques to reduce charging in SEMs\|Hummer SEM Sample Coater - thin Au/Pd coating to reduce charging in SEMs]]
			*[[JEOL IT800SHL - Reduced Charging Imaging Modes\|Charge-Free Imaging]] - SEM settings to reduce charging during imaging.

John d: /* Operating Procedures */ link to hummer techniques

2024-08-02T00:16:08Z

Operating Procedures: link to hummer techniques

← Older revision		Revision as of 00:16, 2 August 2024
Line 64:		Line 64:
	**Stig is the most common cause of blurry images, and requires practice to improve/knowing what to look for.		**Stig is the most common cause of blurry images, and requires practice to improve/knowing what to look for.
	**A Common mistake is to optimize stig on flat lines (eg. a cleaved edge or line/space features). This always leads to accidentally skewing the stig in the direction of the lines. Instead, make sure to optimize on a roundish feature, such as a piece of dust/debris.		**A Common mistake is to optimize stig on flat lines (eg. a cleaved edge or line/space features). This always leads to accidentally skewing the stig in the direction of the lines. Instead, make sure to optimize on a roundish feature, such as a piece of dust/debris.
			*[[Hummer SEM Sample Coater - Techniques to reduce charging in SEMs]]

John d: /* Imaging */ added minor descriptions on detector types

2024-07-30T02:24:29Z

Imaging: added minor descriptions on detector types

Hopkins a: /* Mechanical */

2024-05-16T20:01:59Z

Mechanical

@@ Line 57: / Line 57: @@
 **Tilt: -5 to 70 degrees (depending on sample holder and offset)
 **Rotation: 360 degrees
 ==Operating Procedures==

Hopkins a: /* Capabilities */

2024-05-16T20:01:41Z

Capabilities

← Older revision		Revision as of 20:01, 16 May 2024
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	===Capabilities===		===Capabilities===
	The system has multiple detectors, detailed below.		The system has multiple detectors, detailed below.
	Low-vacuum mode reduces sample charging by introducing N2 gas into the chamber, without sacrificing imaging quality (using a special vacuum nozzle on the electron column)~~. Our system is equipped with a gentle-beam mode of operation where bias is put on the stage, allowing for high resolution imaging at low electron energies impinging the surface~~. Both of these are useful for imaging low conductivity and insulating materials without the need for conductive layer coatings.		Low-vacuum mode reduces sample charging by introducing N2 gas into the chamber, without sacrificing imaging quality (using a special vacuum nozzle on the electron column). Both of these are useful for imaging low conductivity and insulating materials without the need for conductive layer coatings.

	The system can accept a 6” wafer, but only ~~XYZXYZ~~ mm of the wafer is accessible with the stage movement.		The system can accept a 6” wafer, but only 140mm (X) and 80mm (Y) of the wafer is accessible with the stage movement.

	The [[SEM Sample Coater (Hummer)\|'''<u>Hummer coater</u>''']] is used to deposit a thin AuPd on your samples, to reduce electrical charging of insulating samples (such as SiO2 substrates, or thick >1µm layers of SiO2 or PR).		The [[SEM Sample Coater (Hummer)\|'''<u>Hummer coater</u>''']] is used to deposit a thin AuPd on your samples, to reduce electrical charging of insulating samples (such as SiO2 substrates, or thick >1µm layers of SiO2 or PR).

	This SEM also has an Electron-Beam Lithography Nabity system. Contact ~~the~~ ~~supervisor~~ for info.		This SEM also has an Electron-Beam Lithography Nabity system. Contact Aidan Hopkins for info.

	==Detailed Specifications==		==Detailed Specifications==

← Older revision		Revision as of 02:24, 30 July 2024
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	**BD: Beam deceleration		**BD: Beam deceleration
	***Applies negative voltage to sample stage to increase effective acceleration without increasing beam acceleration (reducing charging).		***Applies negative voltage to sample stage to increase effective acceleration without increasing beam acceleration (reducing charging).
	**SHL: Super hybrid lens		**SHL: Super hybrid lens ("immersion" lens)
	*Detectors		*Detectors
	**SED: Secondary electron detector (low angle)		**SED: Secondary electron detector (low angle) - ''default''
	**UHD: Ultra high resolution detector		**UHD: Ultra high resolution detector
	**SBED: Scintillated back scatter electron detector		**SBED: Scintillated back scatter electron detector
	***Inserts between the objective lens and the sample		***Inserts between the objective lens and the sample, high Z-contrast
	**LVBED: Low vacuum back scatter electron detector		**LVBED: Low vacuum back scatter electron detector
	**LVSED: Low vacuum secondary electron detector		**LVSED: Low vacuum secondary electron detector
Line 62:		Line 62:
	*J[https://wiki.nanofab.ucsb.edu/w/images/1/10/JEOL_IT800SHL_Operating_Procedure.docx EOL IT800SHL Operating Procedure].		*J[https://wiki.nanofab.ucsb.edu/w/images/1/10/JEOL_IT800SHL_Operating_Procedure.docx EOL IT800SHL Operating Procedure].
	*[https://www.youtube.com/watch?v=YeukVt1Fyi0 Optimizing Astigmatism (CalTech Nanoscience Institute)]		*[https://www.youtube.com/watch?v=YeukVt1Fyi0 Optimizing Astigmatism (CalTech Nanoscience Institute)]
	**Stig is the most common cause of blurry images.		**Stig is the most common cause of blurry images, and requires practice to improve/knowing what to look for.
	**A Common mistake is to optimize stig on flat lines (eg. a cleaved edge or line/space features). This always leads to accidentally skewing the stig in the direction of the lines. Instead, make sure to optimize on a roundish feature, such as a piece of dust/debris.		**A Common mistake is to optimize stig on flat lines (eg. a cleaved edge or line/space features). This always leads to accidentally skewing the stig in the direction of the lines. Instead, make sure to optimize on a roundish feature, such as a piece of dust/debris.