Sputter 3 (AJA ATC 2000-F) - Revision history

Silva at 17:36, 30 August 2022

2022-08-30T17:36:57Z

← Older revision		Revision as of 17:36, 30 August 2022
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	{{~~tool~~\|{{PAGENAME}}		{{tool2\|{{PAGENAME}}
	\|picture=Sputter3.jpg		\|picture=Sputter3.jpg
	\|type = Vacuum Deposition		\|type = Vacuum Deposition
	\|super= Tony Bosch		\|super= Tony Bosch
			\|super2= Lee Sawyer
	\|phone=(805)839-3918x217		\|phone=(805)839-3918x217
	\|location=Bay 3		\|location=Bay 3

John d: changed Documentation --> procedures to match the other tools

2022-08-06T18:35:01Z

changed Documentation --> procedures to match the other tools

← Older revision		Revision as of 18:35, 6 August 2022
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	*[https://signupmonkey.ece.ucsb.edu/cgi-bin/users/browse.cgi?tool_ID=20&B1=Show '''The Sputter #3 SignupMonkey page'''] lists the currently installed sputter targets.		*[https://signupmonkey.ece.ucsb.edu/cgi-bin/users/browse.cgi?tool_ID=20&B1=Show '''The Sputter #3 SignupMonkey page'''] lists the currently installed sputter targets.

			=Procedures=
	=Documentation=

	*[[Media:Sputter-3 Operation Procedure Wiki.pdf\|Operating Procedures]]		*[[Media:Sputter-3 Operation Procedure Wiki.pdf\|Operating Procedures]]

	=== Online Training Video ===		===Online Training Video===

	**[https://gauchocast.hosted.panopto.com/Panopto/Pages/Viewer.aspx?id=93633088-cab6-46eb-b200-ae1d010d04f1&start=0 <u>AJA Sputter System Training</u>]		**[https://gauchocast.hosted.panopto.com/Panopto/Pages/Viewer.aspx?id=93633088-cab6-46eb-b200-ae1d010d04f1&start=0 <u>AJA Sputter System Training</u>]

John d: /* Documentation */ made training video section linkable

2022-08-06T18:33:25Z

Documentation: made training video section linkable

← Older revision		Revision as of 18:33, 6 August 2022
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	*[[Media:Sputter-3 Operation Procedure Wiki.pdf\|Operating Procedures]]		*[[Media:Sputter-3 Operation Procedure Wiki.pdf\|Operating Procedures]]

	*Online Training Video:		=== Online Training Video ===

	**[https://gauchocast.hosted.panopto.com/Panopto/Pages/Viewer.aspx?id=93633088-cab6-46eb-b200-ae1d010d04f1&start=0 <u>AJA Sputter System Training</u>]		**[https://gauchocast.hosted.panopto.com/Panopto/Pages/Viewer.aspx?id=93633088-cab6-46eb-b200-ae1d010d04f1&start=0 <u>AJA Sputter System Training</u>]
	**'''Important:''' ''This video is for reference only, and does not give you authorization to use the tool. You must be officially authorized by the supervisor before using this machine.''		**'''Important:''' ''This video is for reference only, and does not give you authorization to use the tool. You must be officially authorized by the supervisor before using this machine.''

Bosch t: /* Documentation */

2022-01-14T19:48:21Z

Documentation

← Older revision		Revision as of 19:48, 14 January 2022
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	*[[Media:Sputter-3 Operation Procedure Wiki.pdf\|Operating Procedures]]		*[[Media:Sputter-3 Operation Procedure Wiki.pdf\|Operating Procedures]]

			*Online Training Video:
			**[https://gauchocast.hosted.panopto.com/Panopto/Pages/Viewer.aspx?id=93633088-cab6-46eb-b200-ae1d010d04f1&start=0 <u>AJA Sputter System Training</u>]
			**'''Important:''' ''This video is for reference only, and does not give you authorization to use the tool. You must be officially authorized by the supervisor before using this machine.''

	=Materials Table=		=Materials Table=

John d: /* Materials Table */ minor cleanup

2021-09-11T04:36:59Z

Materials Table: minor cleanup

@@ Line 12: / Line 12: @@
 }}
 =About=
-The Six-Target DC/RF Sputtering System, built by AJA International uses planar magnetron sources. The sources are contained in tiltable sputter gun modules that allow for maintaining uniformity control at various sample heights. Cross contamination between sources is minimized by using a chimney configuration with very narrow source shutter gaps. Uniformity better than 2% over 90mm. 2 DC sources and 2 RF sources allow for co-deposition of materials, including dedicated magnetic films Fe, Ni, and Co. Other materials, such as ITO, Si, Al, Zr, etc. can be reactively RF sputtered in an O<sub>2</sub> or N<sub>2</sub> environment to produce metal-oxides or nitrides. The deposition chamber is loadlocked providing for fast substrate transfer and consistent, low base pressure. Venting and evacuation are automated with a 1200 l/s turbo (capable of pumping O<sub>2</sub>) achieving an ~ 4.0 E-8 T ultimate pressure. A VAT adaptive pressure control valve is used for process pressure control independent of gas flow. Substrates are clip mounted onto 4 inch carriers. Flow rates are controlled with standard mass flow controllers. Argon is used for the sputter gas, with N<sub>2</sub> and O<sub>2</sub> used for reactive sputtering. Gun power supplies include: 500W DC, 13.56 Mhz 300W RF, and a 50W substrate RF supply for in-situ substrate biasing and pre-cleaning. Samples can be heated to 650°C. The system is recipe driven and computer controlled for reproducible results.
+The Six-Target DC/RF Sputtering System, built by AJA International uses planar magnetron sources. The sources are contained in tiltable sputter gun modules that allow for maintaining uniformity control at various sample heights. Cross contamination between sources is minimized by using a chimney configuration with very narrow source shutter gaps. Uniformity is better than 2% over 90mm.
 =Detailed Specifications=
 *6 target with DC or RF operation
 *Reactive sputtering with N<sub>2</sub> or O<sub>2</sub> using RF or DC
@@ Line 29: / Line 38: @@
 =Documentation=

Bosch t: /* Detailed Specifications */

2020-04-20T16:05:51Z

Detailed Specifications

← Older revision		Revision as of 16:05, 20 April 2020
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	*Magnetic Material Deposition: Fe, Ni, Co		*Magnetic Material Deposition: Fe, Ni, Co
	*SiO<sub>2</sub>, SiN, ITO, AlN, Al2O3 and other metal-oxide/nitrides possible		*SiO<sub>2</sub>, SiN, ITO, AlN, Al2O3 and other metal-oxide/nitrides possible
	*~~Upper~~ E-~~8 T~~ ultimate pressure (3 mT typical operating pressure), load-locked chamber		*Low E-8T ultimate pressure (3 mT typical operating pressure), load-locked chamber
	*4" diameter sample holder		*4" diameter sample holder
	*Gun Tilt, Sample height and rotation adjustments		*Gun Tilt, Sample height and rotation adjustments
	*Deposition uniformity is ~ 1-2% over 4 " diameter		*Deposition uniformity is ~ 1-2% over 4 " diameter
	*Up to ~~800~~°C dep temperature		*Up to 650°C dep temperature
	*RF Biasing of sample during deposition or as a pre-deposition clean		*RF Biasing of sample during deposition or as a pre-deposition clean
	*[https://signupmonkey.ece.ucsb.edu/cgi-bin/users/browse.cgi?tool_ID=20&B1=Show '''The Sputter #3 SignupMonkey page'''] lists the currently installed sputter targets.		*[https://signupmonkey.ece.ucsb.edu/cgi-bin/users/browse.cgi?tool_ID=20&B1=Show '''The Sputter #3 SignupMonkey page'''] lists the currently installed sputter targets.

Bosch t: /* About */

2020-04-20T16:03:51Z

About

← Older revision		Revision as of 16:03, 20 April 2020
Line 12:		Line 12:
	}}		}}
	=About=		=About=
	The Six-Target DC/RF Sputtering System, built by AJA International uses planar magnetron sources. The sources are contained in tiltable sputter gun modules that allow for maintaining uniformity control at various sample heights. Cross contamination between sources is minimized by using a chimney configuration with very narrow source shutter gaps. Uniformity better than 2% over 90mm. 2 DC sources and 2 RF sources allow for co-deposition of materials, including dedicated magnetic films Fe, Ni, and Co. Other materials, such as ITO, Si, Al, Zr, etc. can be reactively RF sputtered in an O<sub>2</sub> or N<sub>2</sub> environment to produce metal-oxides or nitrides. The deposition chamber is loadlocked providing for fast substrate transfer and consistent, low base pressure. Venting and evacuation are automated with a ~~1000~~ l/s ~~magnetically levitated~~ turbo (capable of pumping O<sub>2</sub>) achieving an ~ 9.0 E-8 T ultimate pressure. A VAT adaptive pressure control valve is used for process pressure control independent of gas flow. Substrates are clip mounted onto 4 inch carriers. Flow rates are controlled with standard mass flow controllers. Argon is used for the sputter gas, with N<sub>2</sub> and O<sub>2</sub> used for reactive sputtering. Gun power supplies include: 500W DC ~~magnetron drivers~~, 13.56 Mhz 300W RF ~~supplies~~, and a 50W substrate RF supply for in-situ substrate biasing and pre-cleaning. Samples can be heated to ~~800~~°C. The system is recipe driven and computer controlled for reproducible results.		The Six-Target DC/RF Sputtering System, built by AJA International uses planar magnetron sources. The sources are contained in tiltable sputter gun modules that allow for maintaining uniformity control at various sample heights. Cross contamination between sources is minimized by using a chimney configuration with very narrow source shutter gaps. Uniformity better than 2% over 90mm. 2 DC sources and 2 RF sources allow for co-deposition of materials, including dedicated magnetic films Fe, Ni, and Co. Other materials, such as ITO, Si, Al, Zr, etc. can be reactively RF sputtered in an O<sub>2</sub> or N<sub>2</sub> environment to produce metal-oxides or nitrides. The deposition chamber is loadlocked providing for fast substrate transfer and consistent, low base pressure. Venting and evacuation are automated with a 1200 l/s turbo (capable of pumping O<sub>2</sub>) achieving an ~ 4.0 E-8 T ultimate pressure. A VAT adaptive pressure control valve is used for process pressure control independent of gas flow. Substrates are clip mounted onto 4 inch carriers. Flow rates are controlled with standard mass flow controllers. Argon is used for the sputter gas, with N<sub>2</sub> and O<sub>2</sub> used for reactive sputtering. Gun power supplies include: 500W DC, 13.56 Mhz 300W RF, and a 50W substrate RF supply for in-situ substrate biasing and pre-cleaning. Samples can be heated to 650°C. The system is recipe driven and computer controlled for reproducible results.

	=Detailed Specifications=		=Detailed Specifications=

John d: /* Materials Table */ try to fix targeted link

2017-12-06T07:20:49Z

Materials Table: try to fix targeted link

← Older revision		Revision as of 07:20, 6 December 2017
Line 32:		Line 32:

	= Materials Table =		= Materials Table =
	For the materials tables, please visit the [[~~Sputtering Recipes~~#Sputter_3_.~~28ATC_2000~~-F.29\|Sputter 3<br>(ATC 2000-F)]].		For the materials tables, please visit the [[Sputtering_Recipes#Sputter_3_.28AJA_ATC_2000-F.29\|Sputter 3<br>(ATC 2000-F)]].

John d: /* Detailed Specifications */ reworded

2017-10-31T21:39:19Z

Detailed Specifications: reworded

← Older revision		Revision as of 21:39, 31 October 2017
Line 26:		Line 26:
	*Up to 800°C dep temperature		*Up to 800°C dep temperature
	*RF Biasing of sample during deposition or as a pre-deposition clean		*RF Biasing of sample during deposition or as a pre-deposition clean
	*~~Currently Installed Targets: Please see the~~ [https://signupmonkey.ece.ucsb.edu/cgi-bin/users/browse.cgi?tool_ID=20&B1=Show '''Sputter #3 SignupMonkey page'''].		*[https://signupmonkey.ece.ucsb.edu/cgi-bin/users/browse.cgi?tool_ID=20&B1=Show '''The Sputter #3 SignupMonkey page'''] lists the currently installed sputter targets.

	=Documentation=		=Documentation=

John d: Added link to signupmnkey page for currently installed targets

2017-10-31T21:34:10Z

Added link to signupmnkey page for currently installed targets

← Older revision		Revision as of 21:34, 31 October 2017
Line 26:		Line 26:
	*Up to 800°C dep temperature		*Up to 800°C dep temperature
	*RF Biasing of sample during deposition or as a pre-deposition clean		*RF Biasing of sample during deposition or as a pre-deposition clean
			*Currently Installed Targets: Please see the [https://signupmonkey.ece.ucsb.edu/cgi-bin/users/browse.cgi?tool_ID=20&B1=Show '''Sputter #3 SignupMonkey page'''].

	=Documentation=		=Documentation=