Template:News - Revision history

John d: hyperlink protofab

2026-10-03T23:47:33Z

hyperlink protofab

← Older revision		Revision as of 23:47, 3 October 2026
Line 18:		Line 18:

	=== Die-Bonder & Wirebonder Installed at Protofab ===		=== Die-Bonder & Wirebonder Installed at Protofab ===
	We have installed a [https://protowiki.oasis.ucsb.edu/index.php/Flip-Chip_and_Die_Bonder_(Tresky_T-5300-W) new Tresky Flip-chip/Die-bonder] & [https://protowiki.oasis.ucsb.edu/index.php/Ball_%26_Wedge_Bonding_(F%26S_56i_Wire_Bonder) F&S Wirebonder] at the Protofab. The wirebonder allows fast automatic wirebonding, capable of hundreds of wirebonds in minutes. The die-bonder enables solder bonding chips to carriers/PCB's and related capabilities. Contact staff at the above wiki pages for training.		We have installed a [https://protowiki.oasis.ucsb.edu/index.php/Flip-Chip_and_Die_Bonder_(Tresky_T-5300-W) new Tresky Flip-chip/Die-bonder] & [https://protowiki.oasis.ucsb.edu/index.php/Ball_%26_Wedge_Bonding_(F%26S_56i_Wire_Bonder) F&S Wirebonder] at the [https://protofab.oasis.ucsb.edu/ Protofab]. The wirebonder allows fast automatic wirebonding, capable of hundreds of wirebonds in minutes. The die-bonder enables solder bonding chips to carriers/PCB's and related capabilities. Contact staff at the above wiki pages for training.
	// [[User:John_d\|Demis D. John]] 19:53, 3 October 2026 (UTC)		// [[User:John_d\|Demis D. John]] 19:53, 3 October 2026 (UTC)

John d: moved old artciles

2026-10-03T19:57:05Z

moved old artciles

@@ Line 49: / Line 49: @@
 Demis D. John presented a seminar to the [https://ca-dreams.org/ CA DREAMS Microelectronics Commons Hub] detailing common methods and thought-processes for making novel, advanced microchips as fast and low-cost as possible.  See the [https://www.youtube.com/watch?v=ENdgmvlbsU0 Seminar titled "Scalable Manufacturing in an R&D Lab: Supporting Startup/Research Success in a high-mix environment" on Youtube]
 // [[User:John_d|Demis D. John]] 02:13, 12 June 2026 (UTC)
 <!---------- end of announcements ------------>

John d: added die bonder & wirebonder

2026-10-03T19:53:27Z

added die bonder & wirebonder

← Older revision		Revision as of 19:53, 3 October 2026
Line 16:		Line 16:
	<!---------------------------------------------->		<!---------------------------------------------->
	<!-------- NEWS ITEMS: newest on top -------->		<!-------- NEWS ITEMS: newest on top -------->

			=== Die-Bonder & Wirebonder Installed at Protofab ===
			We have installed a [https://protowiki.oasis.ucsb.edu/index.php/Flip-Chip_and_Die_Bonder_(Tresky_T-5300-W) new Tresky Flip-chip/Die-bonder] & [https://protowiki.oasis.ucsb.edu/index.php/Ball_%26_Wedge_Bonding_(F%26S_56i_Wire_Bonder) F&S Wirebonder] at the Protofab. The wirebonder allows fast automatic wirebonding, capable of hundreds of wirebonds in minutes. The die-bonder enables solder bonding chips to carriers/PCB's and related capabilities. Contact staff at the above wiki pages for training.
			// [[User:John_d\|Demis D. John]] 19:53, 3 October 2026 (UTC)

	=== "Make Microchips!" - new book by Nanofab staff ===		=== "Make Microchips!" - new book by Nanofab staff ===
	Nanofab staff [[Demis D. John]] published an intro-level book for people wanting to learn about making microchips, it is [https://www.amazon.com/dp/B0HDRHG3KM '''available now on Amazon''']. The book compliments the [https://nanofab.ucsb.edu/workforce#bootcamps Cleanroom Bootcamps] and other [https://nanofab.ucsb.edu/workforce workforce development efforts] Demis has launched, to help people get into the semiconductor industry.		Nanofab staff [[Demis D. John]] published an intro-level book for people wanting to learn about making microchips, it is [https://www.amazon.com/dp/B0HDRHG3KM '''available now on Amazon''']. The book compliments the [https://nanofab.ucsb.edu/workforce#bootcamps Cleanroom Bootcamps] and other [https://nanofab.ucsb.edu/workforce workforce development efforts] Demis has launched, to help people get into the semiconductor industry.

John d: /* "Make Microchips!" - new book by Nanofab staff */

2026-10-03T19:41:41Z

"Make Microchips!" - new book by Nanofab staff

← Older revision		Revision as of 19:41, 3 October 2026
Line 17:		Line 17:
	<!-------- NEWS ITEMS: newest on top -------->		<!-------- NEWS ITEMS: newest on top -------->
	=== "Make Microchips!" - new book by Nanofab staff ===		=== "Make Microchips!" - new book by Nanofab staff ===
	Nanofab staff [[Demis D. John]] published an intro-level book for people wanting to learn about making microchips, it is [https://www.amazon.com/dp/B0HDRHG3KM '''''available now on Amazon''''']. The book compliments the [https://nanofab.ucsb.edu/workforce#bootcamps Cleanroom Bootcamps] and other [https://nanofab.ucsb.edu/workforce workforce development efforts] Demis has launched, to help people get into the semiconductor industry.		Nanofab staff [[Demis D. John]] published an intro-level book for people wanting to learn about making microchips, it is [https://www.amazon.com/dp/B0HDRHG3KM '''available now on Amazon''']. The book compliments the [https://nanofab.ucsb.edu/workforce#bootcamps Cleanroom Bootcamps] and other [https://nanofab.ucsb.edu/workforce workforce development efforts] Demis has launched, to help people get into the semiconductor industry.
	// [[User:John_d\|Demis D. John]] 15:30, 22 August 2026 (UTC)		// [[User:John_d\|Demis D. John]] 15:30, 22 August 2026 (UTC)

John d at 19:41, 3 October 2026

2026-10-03T19:41:18Z

← Older revision		Revision as of 19:41, 3 October 2026
Line 17:		Line 17:
	<!-------- NEWS ITEMS: newest on top -------->		<!-------- NEWS ITEMS: newest on top -------->
	=== "Make Microchips!" - new book by Nanofab staff ===		=== "Make Microchips!" - new book by Nanofab staff ===
	Nanofab staff [[Demis D. John]] published an intro-level book for people wanting to learn about making microchips, it is [https://www.amazon.com/dp/B0HDRHG3KM available now on Amazon]. The book compliments the [https://nanofab.ucsb.edu/workforce#bootcamps Cleanroom Bootcamps] and other [https://nanofab.ucsb.edu/workforce workforce development efforts] Demis has launched, to help people get into the semiconductor industry.		Nanofab staff [[Demis D. John]] published an intro-level book for people wanting to learn about making microchips, it is [https://www.amazon.com/dp/B0HDRHG3KM '''''available now on Amazon''''']. The book compliments the [https://nanofab.ucsb.edu/workforce#bootcamps Cleanroom Bootcamps] and other [https://nanofab.ucsb.edu/workforce workforce development efforts] Demis has launched, to help people get into the semiconductor industry.
	// [[User:John_d\|Demis D. John]] 15:30, 22 August 2026 (UTC)		// [[User:John_d\|Demis D. John]] 15:30, 22 August 2026 (UTC)

John d: /* "Make Microchips!" - new book by Nanofab staff */

2026-10-03T18:14:32Z

"Make Microchips!" - new book by Nanofab staff

← Older revision		Revision as of 18:14, 3 October 2026
Line 17:		Line 17:
	<!-------- NEWS ITEMS: newest on top -------->		<!-------- NEWS ITEMS: newest on top -------->
	=== "Make Microchips!" - new book by Nanofab staff ===		=== "Make Microchips!" - new book by Nanofab staff ===
	Nanofab staff [[Demis D. John]] published an intro-level book for people wanting to learn about making microchips, it is [https://www.amazon.com/dp/B0HDRHG3KM available now]. The book compliments the [https://nanofab.ucsb.edu/workforce#bootcamps Cleanroom Bootcamps] and other [https://nanofab.ucsb.edu/workforce workforce development efforts] Demis has launched, to help people get into the semiconductor industry.		Nanofab staff [[Demis D. John]] published an intro-level book for people wanting to learn about making microchips, it is [https://www.amazon.com/dp/B0HDRHG3KM available now on Amazon]. The book compliments the [https://nanofab.ucsb.edu/workforce#bootcamps Cleanroom Bootcamps] and other [https://nanofab.ucsb.edu/workforce workforce development efforts] Demis has launched, to help people get into the semiconductor industry.
	// [[User:John_d\|Demis D. John]] 15:30, 22 August 2026 (UTC)		// [[User:John_d\|Demis D. John]] 15:30, 22 August 2026 (UTC)

John d: fixed date on dreams seminar

2026-10-03T02:15:28Z

fixed date on dreams seminar

← Older revision		Revision as of 02:15, 3 October 2026
Line 41:		Line 41:
	// [[User:John_d\|Demis D. John]] 15:53, 22 August 2026 (UTC)		// [[User:John_d\|Demis D. John]] 15:53, 22 August 2026 (UTC)

	===Video: Scalable ~~Manufacturing~~ ~~tips~~ from Nanofab Staff===		===Video: Scalable R&D Tips from Nanofab Staff===
	Demis D. John presented a seminar to the DREAMS Microelectronics Commons Hub detailing common methods and thought-processes for making novel, advanced microchips as fast and low-cost as possible. See the [https://www.youtube.com/watch?v=ENdgmvlbsU0 Seminar titled "Scalable Manufacturing in an R&D Lab: Supporting Startup/Research Success in a high-mix environment" on Youtube]		Demis D. John presented a seminar to the [https://ca-dreams.org/ CA DREAMS Microelectronics Commons Hub] detailing common methods and thought-processes for making novel, advanced microchips as fast and low-cost as possible. See the [https://www.youtube.com/watch?v=ENdgmvlbsU0 Seminar titled "Scalable Manufacturing in an R&D Lab: Supporting Startup/Research Success in a high-mix environment" on Youtube]
	// [[User:John_d\|Demis D. John]] 02:13, 3 ~~October~~ 2026 (UTC)		// [[User:John_d\|Demis D. John]] 02:13, 12 June 2026 (UTC)

	===DREAMS Hub awarded 2 projects in GaN and 5G/6G technologies===		===DREAMS Hub awarded 2 projects in GaN and 5G/6G technologies===

John d: added DREAMS seminor by Demis

2026-10-03T02:13:54Z

added DREAMS seminor by Demis

← Older revision		Revision as of 02:13, 3 October 2026
Line 40:		Line 40:
	Nanofab staff Foong Fatt, Noah Dutra and Brian Thibeault presented a poster at CS MANTECH (compound semiconductor manufacturing technology) in Portland Oregon. The paper describes using [https://www.pdf.com/products/exensio-analytics-platform/overview/ PDF Solutions Exensio analytics] to do a single-shot dry etch process transfer from the UCSB Nanofab's Oxford Cobra ICP etcher to a different-configuration ICP etcher at UC San Diego's, reproducing etch rate and sidewall profile in a single-shot. The technique used complimentary L9 DOE's at each site to map out the process space, allowing for single-shot matching. [[Media:2026_CSMANTECH_Paper-2366_-_Foong_Fatt_-_Machine_Matching_Methodology_for_Single-shot_Lab_to_Lab_Dry_Etch_Process_Transfer.pdf\|See the full paper here]].		Nanofab staff Foong Fatt, Noah Dutra and Brian Thibeault presented a poster at CS MANTECH (compound semiconductor manufacturing technology) in Portland Oregon. The paper describes using [https://www.pdf.com/products/exensio-analytics-platform/overview/ PDF Solutions Exensio analytics] to do a single-shot dry etch process transfer from the UCSB Nanofab's Oxford Cobra ICP etcher to a different-configuration ICP etcher at UC San Diego's, reproducing etch rate and sidewall profile in a single-shot. The technique used complimentary L9 DOE's at each site to map out the process space, allowing for single-shot matching. [[Media:2026_CSMANTECH_Paper-2366_-_Foong_Fatt_-_Machine_Matching_Methodology_for_Single-shot_Lab_to_Lab_Dry_Etch_Process_Transfer.pdf\|See the full paper here]].
	// [[User:John_d\|Demis D. John]] 15:53, 22 August 2026 (UTC)		// [[User:John_d\|Demis D. John]] 15:53, 22 August 2026 (UTC)

			===Video: Scalable Manufacturing tips from Nanofab Staff===
			Demis D. John presented a seminar to the DREAMS Microelectronics Commons Hub detailing common methods and thought-processes for making novel, advanced microchips as fast and low-cost as possible. See the [https://www.youtube.com/watch?v=ENdgmvlbsU0 Seminar titled "Scalable Manufacturing in an R&D Lab: Supporting Startup/Research Success in a high-mix environment" on Youtube]
			// [[User:John_d\|Demis D. John]] 02:13, 3 October 2026 (UTC)

	===DREAMS Hub awarded 2 projects in GaN and 5G/6G technologies===		===DREAMS Hub awarded 2 projects in GaN and 5G/6G technologies===

John d: linked to CSMANTECH paper

2026-08-22T15:57:57Z

linked to CSMANTECH paper

← Older revision		Revision as of 15:57, 22 August 2026
Line 37:		Line 37:
	// [[User:John_d\|Demis D. John]] 19:51, 27 May 2026 (UTC)		// [[User:John_d\|Demis D. John]] 19:51, 27 May 2026 (UTC)

	===~~CSMANTECH~~ Poster: "Machine Matching Methodology for Single-shot Lab to Lab Dry Etch Process Transfer" ===		===CS MANTECH Poster: "Machine Matching Methodology for Single-shot Lab to Lab Dry Etch Process Transfer" ===
	Nanofab staff Foong Fatt, Noah Dutra and Brian Thibeault presented a poster at CS MANTECH (compound semiconductor manufacturing technology) in Portland Oregon. The paper describes using [https://www.pdf.com/products/exensio-analytics-platform/overview/ PDF Solutions Exensio analytics] to do a single-shot dry etch process transfer from the UCSB Nanofab's Oxford Cobra ICP etcher to a different-configuration ICP etcher at UC San Diego's, reproducing etch rate and sidewall profile in a single-shot. The technique used complimentary L9 DOE's at each site to map out the process space, allowing for single-shot matching.		Nanofab staff Foong Fatt, Noah Dutra and Brian Thibeault presented a poster at CS MANTECH (compound semiconductor manufacturing technology) in Portland Oregon. The paper describes using [https://www.pdf.com/products/exensio-analytics-platform/overview/ PDF Solutions Exensio analytics] to do a single-shot dry etch process transfer from the UCSB Nanofab's Oxford Cobra ICP etcher to a different-configuration ICP etcher at UC San Diego's, reproducing etch rate and sidewall profile in a single-shot. The technique used complimentary L9 DOE's at each site to map out the process space, allowing for single-shot matching. [[Media:2026_CSMANTECH_Paper-2366_-_Foong_Fatt_-_Machine_Matching_Methodology_for_Single-shot_Lab_to_Lab_Dry_Etch_Process_Transfer.pdf\|See the full paper here]].
	// [[User:John_d\|Demis D. John]] 15:53, 22 August 2026 (UTC)		// [[User:John_d\|Demis D. John]] 15:53, 22 August 2026 (UTC)

John d: added csmantech paper

2026-08-22T15:53:28Z

added csmantech paper

← Older revision		Revision as of 15:53, 22 August 2026
Line 36:		Line 36:
	Contact the Protofab lab manager [mailto:arin_abed@ucsb.edu Arin Abed] for more information.		Contact the Protofab lab manager [mailto:arin_abed@ucsb.edu Arin Abed] for more information.
	// [[User:John_d\|Demis D. John]] 19:51, 27 May 2026 (UTC)		// [[User:John_d\|Demis D. John]] 19:51, 27 May 2026 (UTC)

			===CSMANTECH Poster: "Machine Matching Methodology for Single-shot Lab to Lab Dry Etch Process Transfer" ===
			Nanofab staff Foong Fatt, Noah Dutra and Brian Thibeault presented a poster at CS MANTECH (compound semiconductor manufacturing technology) in Portland Oregon. The paper describes using [https://www.pdf.com/products/exensio-analytics-platform/overview/ PDF Solutions Exensio analytics] to do a single-shot dry etch process transfer from the UCSB Nanofab's Oxford Cobra ICP etcher to a different-configuration ICP etcher at UC San Diego's, reproducing etch rate and sidewall profile in a single-shot. The technique used complimentary L9 DOE's at each site to map out the process space, allowing for single-shot matching.
			// [[User:John_d\|Demis D. John]] 15:53, 22 August 2026 (UTC)

	===DREAMS Hub awarded 2 projects in GaN and 5G/6G technologies===		===DREAMS Hub awarded 2 projects in GaN and 5G/6G technologies===