Tube Furnace Wafer Bonding (Thermco) - Revision history

Millerski w: Updated SOP

2023-10-30T21:55:29Z

Updated SOP

← Older revision		Revision as of 21:55, 30 October 2023
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	\|toolid=43		\|toolid=43
	}}		}}
	= About =		=About=
	This wafer fusion furnace is a custom built unit designed for the fusion of different material types (such InP and Si) to create new heterostructures for novel electronic and optoelectronic devices. Custom made bonding fixtures are loaded into the furnace through a purged glove-box that is oxygen free to below 10 ppm with a dew point near -80°C. The furnace is nitrogen purged and can operate up from 200°C to 1200°C. Many different materials are allowed and maximum temperature is dependent on the materials themselves, to avoid contamination of the furnace.		This wafer fusion furnace is a custom built unit designed for the fusion of different material types (such InP and Si) to create new heterostructures for novel electronic and optoelectronic devices. Custom made bonding fixtures are loaded into the furnace through a purged glove-box that is oxygen free to below 10 ppm with a dew point near -80°C. The furnace is nitrogen purged and can operate up from 200°C to 1200°C. Many different materials are allowed and maximum temperature is dependent on the materials themselves, to avoid contamination of the furnace.

	= Detailed Specifications =		=Detailed Specifications=

	*Temperatures 200°C to 1200°C		*Temperatures 200°C to 1200°C
	*4 inch diameter furnace		*4 inch diameter furnace
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	*Dew point near -80°C		*Dew point near -80°C
	*Custom bonding fixtures of various materials allowed		*Custom bonding fixtures of various materials allowed

			= Operation Procedures =

			* [https://wiki.nanofab.ucsb.edu/w/images/2/2f/Tube_Furnace_Wafer_Bonding_SOP.pdf Tube Furnace Operation Procedure]

Silva at 18:11, 30 August 2022

2022-08-30T18:11:52Z

← Older revision		Revision as of 18:11, 30 August 2022
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	{{~~tool~~\|{{PAGENAME}}		{{tool2\|{{PAGENAME}}
	\|picture=WaferThermco.jpg		\|picture=WaferThermco.jpg
	\|type = Thermal Processing		\|type = Thermal Processing
	\|super= Bill Millerski		\|super= Bill Millerski
			\|super2= Mike Silva
	\|phone=(805)839-3918x219		\|phone=(805)839-3918x219
	\|location=Bay 4		\|location=Bay 4

Silva at 15:33, 28 October 2021

2021-10-28T15:33:02Z

← Older revision		Revision as of 15:33, 28 October 2021
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	\|picture=WaferThermco.jpg		\|picture=WaferThermco.jpg
	\|type = Thermal Processing		\|type = Thermal Processing
	\|super= ~~Tony~~ ~~Bosch~~		\|super= Bill Millerski
	\|phone=(805)839-3918x219		\|phone=(805)839-3918x219
	\|location=Bay 4		\|location=Bay 4

Silva at 17:47, 15 April 2020

2020-04-15T17:47:37Z

← Older revision		Revision as of 17:47, 15 April 2020
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	\|picture=WaferThermco.jpg		\|picture=WaferThermco.jpg
	\|type = Thermal Processing		\|type = Thermal Processing
	\|super= ~~Mike~~ ~~Silva~~		\|super= Tony Bosch
	\|phone=(805)839-3918x219		\|phone=(805)839-3918x219
	\|location=Bay 4		\|location=Bay 4

Zwarburg at 14:05, 11 July 2012

2012-07-11T14:05:57Z

← Older revision		Revision as of 14:05, 11 July 2012
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	\|manufacturer = Thermco		\|manufacturer = Thermco
	\|materials =		\|materials =
			\|toolid=43
	}}		}}
	= About =		= About =

Zwarburg: Created page with "{{tool|{{PAGENAME}} |picture=WaferThermco.jpg |type = Thermal Processing |super= Mike Silva |phone=(805)839-3918x219 |location=Bay 4 |email=silva@ece.ucsb.edu |description = Wafe…"

2012-07-02T18:24:37Z

Created page with "{{tool|{{PAGENAME}} |picture=WaferThermco.jpg |type = Thermal Processing |super= Mike Silva |phone=(805)839-3918x219 |location=Bay 4 |email=silva@ece.ucsb.edu |description = Wafe…"

New page

{{tool|{{PAGENAME}}
|picture=WaferThermco.jpg
|type = Thermal Processing
|super= Mike Silva
|phone=(805)839-3918x219
|location=Bay 4
|email=silva@ece.ucsb.edu
|description = Wafer Fusion Furnace
|manufacturer = Thermco
|materials =
}}
= About =
This wafer fusion furnace is a custom built unit designed for the fusion of different material types (such InP and Si) to create new heterostructures for novel electronic and optoelectronic devices. Custom made bonding fixtures are loaded into the furnace through a purged glove-box that is oxygen free to below 10 ppm with a dew point near -80°C. The furnace is nitrogen purged and can operate up from 200°C to 1200°C. Many different materials are allowed and maximum temperature is dependent on the materials themselves, to avoid contamination of the furnace.

= Detailed Specifications =
*Temperatures 200°C to 1200°C
*4 inch diameter furnace
*Nitrogen ambient at atmospheric pressure
*Oxygen control in glove box to less than 10 ppm
*Dew point near -80°C
*Custom bonding fixtures of various materials allowed