Wafer Bonder (Logitech WBS7) - Revision history

Millerski w: Updated SOP

2023-10-30T21:50:20Z

Updated SOP

← Older revision		Revision as of 21:50, 30 October 2023
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	==Operation Procedures==		==Operation Procedures==

			* [https://wiki.nanofab.ucsb.edu/w/images/7/7a/Logitech_Wafer_Bonder_Operating_Instructions.pdf Wafer Bonder Operation Procedure]

	==Recipes==		==Recipes==

John d: /* Recipes */ minro note of what is in the recipe sections

2023-08-07T19:47:32Z

Recipes: minro note of what is in the recipe sections

← Older revision		Revision as of 19:47, 7 August 2023
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	==Recipes==		==Recipes==
			''Known working recipes for bonding wafers, and tips & tricks for developing your own:''

	*Recipes > Packaging Recipes > [https://wiki.nanotech.ucsb.edu/w/index.php?title=Packaging_Recipes#Wafer_Bonder_.28Logitech_WBS7.29 Wafer Bonder (Logitech WBS7)]		*Recipes > Packaging Recipes > [https://wiki.nanotech.ucsb.edu/w/index.php?title=Packaging_Recipes#Wafer_Bonder_.28Logitech_WBS7.29 Wafer Bonder (Logitech WBS7)]

Silva at 18:15, 30 August 2022

2022-08-30T18:15:29Z

← Older revision		Revision as of 18:15, 30 August 2022
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	{{~~tool~~\|{{PAGENAME}}		{{tool2\|{{PAGENAME}}
	\|picture=Logitech_WSBU-6_Wafer_Bonder_-_photo_-_800px.png		\|picture=Logitech_WSBU-6_Wafer_Bonder_-_photo_-_800px.png
	\|type = Thermal Processing		\|type = Thermal Processing
	\|super= Bill Millerski		\|super= Bill Millerski
			\|super2= Don Freeborn
	\|phone=(805)839-3918x216		\|phone=(805)839-3918x216
	\|location=Bay 5		\|location=Bay 5

John d: /* About */ links to applicable tools

2022-03-04T00:04:21Z

About: links to applicable tools

← Older revision		Revision as of 00:04, 4 March 2022
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	\|manufacturer = Logitech		\|manufacturer = Logitech
	}}		}}
	== About ==		==About==

	This tool is most often used for bonding samples to Silicon carrier wafers with CrystalBond wax.		This tool is most often used for bonding samples to Silicon carrier wafers with CrystalBond wax.

	This mounting method can be used for		This mounting method can be used for

	* securing ~~small~~ parts for use on 100mm tools (such as the CMP)		*securing smaller parts for use on 100mm tools (such as the [[Chemical-Mechanical Polisher (Logitech)\|CMP]])
	* providing a carrier wafer for through-etching of the ~~sample~~ ~~wafer~~		*providing a carrier wafer for through-etching of Silicon wafers on the [[DSEIII (PlasmaTherm/Deep Silicon Etcher)\|Bosch Etcher]]
	* for dicing
			*for [[Dicing Saw (ADT)\|dicing]]
	* for lithography		*for [[lithography]]

	A user can place the two wafers to be bonded in contact, with the adhesive in between (such as wax, photoresist etc.). A rubber membrane is lowered on top, creating a small vacuum chamber. The tool can then be programmed to heat the wafers and melt the wax/cure the adhesive, while vacuum is pulled in the chamber, which pulls the rubber membrane down onto the top wafer. This flattens the bond and evacuates bubbles from between the wafers, providing a planar bond.		A user can place the two wafers to be bonded in contact, with the adhesive in between (such as wax, photoresist etc.). A rubber membrane is lowered on top, creating a small vacuum chamber. The tool can then be programmed to heat the wafers and melt the wax/cure the adhesive, while vacuum is pulled in the chamber, which pulls the rubber membrane down onto the top wafer. This flattens the bond and evacuates bubbles from between the wafers, providing a planar bond.

	We also have recipes for spin-coating the crystalbond wax, allowing for a uniform coating of the adhesive wax.		We also have recipes for spin-coating the crystalbond wax, allowing for a uniform coating of the adhesive wax.
	==Detailed Specifications==		==Detailed Specifications==

	* Substrate Size: 4"-6"		*Substrate Size: 4"-6"
	* Temperature Range: 20°C-188°C		*Temperature Range: 20°C-188°C

	==Operation Procedures==		==Operation Procedures==

	== Recipes ==		==Recipes==

	* Recipes > Packaging Recipes > [https://wiki.nanotech.ucsb.edu/w/index.php?title=Packaging_Recipes#Wafer_Bonder_.28Logitech_WBS7.29 Wafer Bonder (Logitech WBS7)]		*Recipes > Packaging Recipes > [https://wiki.nanotech.ucsb.edu/w/index.php?title=Packaging_Recipes#Wafer_Bonder_.28Logitech_WBS7.29 Wafer Bonder (Logitech WBS7)]

Silva at 15:34, 28 October 2021

2021-10-28T15:34:44Z

← Older revision		Revision as of 15:34, 28 October 2021
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	\|picture=Logitech_WSBU-6_Wafer_Bonder_-_photo_-_800px.png		\|picture=Logitech_WSBU-6_Wafer_Bonder_-_photo_-_800px.png
	\|type = Thermal Processing		\|type = Thermal Processing
	\|super= ~~Brian~~ ~~Lingg~~		\|super= Bill Millerski
	\|phone=(805)839-3918x216		\|phone=(805)839-3918x216
	\|location=Bay 5		\|location=Bay 5

Jcrode: Text replacement - "/wiki/index.php" to "/w/index.php"

2021-09-04T19:51:52Z

Text replacement - "/wiki/index.php" to "/w/index.php"

← Older revision		Revision as of 19:51, 4 September 2021
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	== Recipes ==		== Recipes ==
	* Recipes > Packaging Recipes > [https://wiki.nanotech.ucsb.edu/~~wiki~~/index.php?title=Packaging_Recipes#Wafer_Bonder_.28Logitech_WBS7.29 Wafer Bonder (Logitech WBS7)]		* Recipes > Packaging Recipes > [https://wiki.nanotech.ucsb.edu/w/index.php?title=Packaging_Recipes#Wafer_Bonder_.28Logitech_WBS7.29 Wafer Bonder (Logitech WBS7)]

Jcrode: Text replacement - "/wiki/index.php/" to "/wiki/index.php?title="

2021-09-04T19:48:43Z

Text replacement - "/wiki/index.php/" to "/wiki/index.php?title="

← Older revision		Revision as of 19:48, 4 September 2021
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	== Recipes ==		== Recipes ==
	* Recipes > Packaging Recipes > [https://wiki.nanotech.ucsb.edu/wiki/index.php/Packaging_Recipes#Wafer_Bonder_.28Logitech_WBS7.29 Wafer Bonder (Logitech WBS7)]		* Recipes > Packaging Recipes > [https://wiki.nanotech.ucsb.edu/wiki/index.php?title=Packaging_Recipes#Wafer_Bonder_.28Logitech_WBS7.29 Wafer Bonder (Logitech WBS7)]

Silva at 17:53, 15 April 2020

2020-04-15T17:53:53Z

← Older revision		Revision as of 17:53, 15 April 2020
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	\|picture=Logitech_WSBU-6_Wafer_Bonder_-_photo_-_800px.png		\|picture=Logitech_WSBU-6_Wafer_Bonder_-_photo_-_800px.png
	\|type = Thermal Processing		\|type = Thermal Processing
	\|super= ~~Don~~ ~~Freeborn~~		\|super= Brian Lingg
	\|phone=(805)839-3918x216		\|phone=(805)839-3918x216
	\|location=Bay 5		\|location=Bay 5

Jcrode: Text replacement - "www.nanotech.ucsb.edu/wiki/" to "wiki.nanotech.ucsb.edu/wiki/"

2020-04-07T01:32:18Z

Text replacement - "www.nanotech.ucsb.edu/wiki/" to "wiki.nanotech.ucsb.edu/wiki/"

← Older revision		Revision as of 01:32, 7 April 2020
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	== Recipes ==		== Recipes ==
	* Recipes > Packaging Recipes > [https://~~www~~.nanotech.ucsb.edu/wiki/index.php/Packaging_Recipes#Wafer_Bonder_.28Logitech_WBS7.29 Wafer Bonder (Logitech WBS7)]		* Recipes > Packaging Recipes > [https://wiki.nanotech.ucsb.edu/wiki/index.php/Packaging_Recipes#Wafer_Bonder_.28Logitech_WBS7.29 Wafer Bonder (Logitech WBS7)]

John d: /* About */ minor formatting, added CMP mounting use

2019-04-09T17:11:45Z

About: minor formatting, added CMP mounting use

← Older revision		Revision as of 17:11, 9 April 2019
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	== About ==		== About ==

	This tool is most often used for bonding samples to Silicon carrier wafers with CrystalBond wax. ~~This can be used for through-etching of the sample wafer, for dicing, or sometimes for lithography.~~		This tool is most often used for bonding samples to Silicon carrier wafers with CrystalBond wax.

			This mounting method can be used for
			* securing small parts for use on 100mm tools (such as the CMP)
			* providing a carrier wafer for through-etching of the sample wafer
			* for dicing
			* for lithography
	A user can place the two wafers to be bonded in contact, with the adhesive in between (such as wax, photoresist etc.). A rubber membrane is lowered on top, creating a small vacuum chamber. The tool can then be programmed to heat the wafers and melt the wax/cure the adhesive, while vacuum is pulled in the chamber, which pulls the rubber membrane down onto the top wafer. This flattens the bond and evacuates bubbles from between the wafers, providing a planar bond.		A user can place the two wafers to be bonded in contact, with the adhesive in between (such as wax, photoresist etc.). A rubber membrane is lowered on top, creating a small vacuum chamber. The tool can then be programmed to heat the wafers and melt the wax/cure the adhesive, while vacuum is pulled in the chamber, which pulls the rubber membrane down onto the top wafer. This flattens the bond and evacuates bubbles from between the wafers, providing a planar bond.

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	==Detailed Specifications==		==Detailed Specifications==
	* Substrate Size: 4"-6"		* Substrate Size: 4"-6"
	* Temperature Range: ~~20c~~-~~188c~~		* Temperature Range: 20°C-188°C

	==Operation Procedures==		==Operation Procedures==