Wafer Bonder (SUSS SB6-8E) - Revision history

John d: non-operation

2025-12-10T20:52:44Z

non-operation

← Older revision		Revision as of 20:52, 10 December 2025
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	\|materials =		\|materials =
	\|toolid=41		\|toolid=41
	}}		}}
			'''THIS TOOL IS NON-OPERATIONAL. Unable to be repaired at this time. 2024'''

	=About=		=About=
	This is Karl-Suss model SB-6 substrate bonder. Wafer bonding of pieces to 6” wafers can be done at pressures from 5e-5 to 3e3 mBar and from 50°C to 550°C. This tool mates with the Karl-Suss MA-6 aligner to allow for aligned bonding. Forces up to 20 kN for a 150 mm wafer size are available. The system supports thermal compression as well as anodic bonding (up to 2000 V). The system is computer controlled with a windows environment allowing for multiple recipe steps and saving of recipes and data. The system is configured for manual loading of wafers.		This is Karl-Suss model SB-6 substrate bonder. Wafer bonding of pieces to 6” wafers can be done at pressures from 5e-5 to 3e3 mBar and from 50°C to 550°C. This tool mates with the Karl-Suss MA-6 aligner to allow for aligned bonding. Forces up to 20 kN for a 150 mm wafer size are available. The system supports thermal compression as well as anodic bonding (up to 2000 V). The system is computer controlled with a windows environment allowing for multiple recipe steps and saving of recipes and data. The system is configured for manual loading of wafers.

Hopkins a: /* Documentation */

2023-09-20T17:53:18Z

Documentation

← Older revision		Revision as of 17:53, 20 September 2023
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	=Documentation=		=Documentation=

	*Bonder Pressure Rules Visual Aid		*[https://wiki.nanofab.ucsb.edu/w/images/1/12/Bonder_Pressure_Rules_Vis_Aid.docx Bonder Pressure Rules Visual Aid]
	*[https://wiki.nanofab.ucsb.edu/w/images/5/5c/Suss_Bonder_Recipe_Guidelines.docx Bonder Recipe Guidelines]		*[https://wiki.nanofab.ucsb.edu/w/images/5/5c/Suss_Bonder_Recipe_Guidelines.docx Bonder Recipe Guidelines]

Hopkins a at 14:33, 20 September 2023

2023-09-20T14:33:42Z

← Older revision		Revision as of 14:33, 20 September 2023
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	=Documentation=		=Documentation=

	*Bonder Pressure Rules Visual Aid		*Bonder Pressure Rules Visual Aid
	*Bonder Recipe Guidelines		*[https://wiki.nanofab.ucsb.edu/w/images/5/5c/Suss_Bonder_Recipe_Guidelines.docx Bonder Recipe Guidelines]

Hopkins a at 14:24, 20 September 2023

2023-09-20T14:24:56Z

← Older revision		Revision as of 14:24, 20 September 2023
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	*Windows-based computer control		*Windows-based computer control
	*Wafer bonder currently set up for 4" wafers		*Wafer bonder currently set up for 4" wafers

			=Documentation=
			*Bonder Pressure Rules Visual Aid
			*Bonder Recipe Guidelines

John d: /* Detailed Specifications */ link to MA6

2023-01-04T01:53:50Z

Detailed Specifications: link to MA6

← Older revision		Revision as of 01:53, 4 January 2023
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	}}		}}
	= About =		=About=
	This is Karl-Suss model SB-6 substrate bonder. Wafer bonding of pieces to 6” wafers can be done at pressures from 5e-5 to 3e3 mBar and from 50°C to 550°C. This tool mates with the Karl-Suss MA-6 aligner to allow for aligned bonding. Forces up to 20 kN for a 150 mm wafer size are available. The system supports thermal compression as well as anodic bonding (up to 2000 V). The system is computer controlled with a windows environment allowing for multiple recipe steps and saving of recipes and data. The system is configured for manual loading of wafers.		This is Karl-Suss model SB-6 substrate bonder. Wafer bonding of pieces to 6” wafers can be done at pressures from 5e-5 to 3e3 mBar and from 50°C to 550°C. This tool mates with the Karl-Suss MA-6 aligner to allow for aligned bonding. Forces up to 20 kN for a 150 mm wafer size are available. The system supports thermal compression as well as anodic bonding (up to 2000 V). The system is computer controlled with a windows environment allowing for multiple recipe steps and saving of recipes and data. The system is configured for manual loading of wafers.

	=Detailed Specifications=		=Detailed Specifications=

	*Wafer bonding from 50°C to 550°C, +/- 5 degrees accuracy, +/- 3% uniformity		*Wafer bonding from 50°C to 550°C, +/- 5 degrees accuracy, +/- 3% uniformity
	*Upper and lower heating of samples		*Upper and lower heating of samples
	*5e-5 to 3e3 Torr environment bonding pressure, with Nitrogen		*5e-5 to 3e3 Torr environment bonding pressure, with Nitrogen
	*Sample size: pieces to 6” wafers, aligned bonding by using MA/BA-6 aligner		*Sample size: pieces to 6” wafers, aligned bonding by using the [[Contact Aligner (SUSS MA-6)\|MA/BA-6 aligner]] - contact supervisor for setup.
	*Anodic bonding to 2000 V		*Anodic bonding to 2000 V
	*Windows-based computer control		*Windows-based computer control

Silva at 17:15, 30 August 2022

2022-08-30T17:15:22Z

← Older revision		Revision as of 17:15, 30 August 2022
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	{{~~tool~~\|{{PAGENAME}}		{{tool2\|{{PAGENAME}}
	\|picture=WaferBonder.jpg		\|picture=WaferBonder.jpg
	\|type = Thermal Processing		\|type = Thermal Processing

Silva at 17:14, 30 August 2022

2022-08-30T17:14:51Z

← Older revision		Revision as of 17:14, 30 August 2022
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	\|picture=WaferBonder.jpg		\|picture=WaferBonder.jpg
	\|type = Thermal Processing		\|type = Thermal Processing
	\|super= ~~Lee~~ ~~Sawyer~~		\|super= Aidan Hopkins
			\|super2= Lee Sawyer
	\|phone=(805)839-3918x216		\|phone=(805)839-3918x216
	\|location=Bay 7		\|location=Bay 7

Silva at 17:52, 15 April 2020

2020-04-15T17:52:44Z

← Older revision		Revision as of 17:52, 15 April 2020
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	\|picture=WaferBonder.jpg		\|picture=WaferBonder.jpg
	\|type = Thermal Processing		\|type = Thermal Processing
	\|super= ~~Don~~ ~~Freeborn~~		\|super= Lee Sawyer
	\|phone=(805)839-3918x216		\|phone=(805)839-3918x216
	\|location=Bay 7		\|location=Bay 7

Freeborn d: /* Detailed Specifications */

2019-01-29T15:51:49Z

Detailed Specifications

← Older revision		Revision as of 15:51, 29 January 2019
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	*Anodic bonding to 2000 V		*Anodic bonding to 2000 V
	*Windows-based computer control		*Windows-based computer control
			*Wafer bonder currently set up for 4" wafers

Zwarburg at 20:46, 18 July 2012

2012-07-18T20:46:36Z

← Older revision		Revision as of 20:46, 18 July 2012
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	{{tool\|{{PAGENAME}}		{{tool\|{{PAGENAME}}
	\|picture=WaferBonder.jpg		\|picture=WaferBonder.jpg
	\|type = ~~Packaging~~		\|type = Thermal Processing
	\|super= Don Freeborn		\|super= Don Freeborn
	\|phone=(805)839-3918x216		\|phone=(805)839-3918x216