Wafer Cleaver (PELCO Flip-Scribe) - Revision history

John d: changed room --> ESB 1111

2022-12-13T14:57:26Z

changed room --> ESB 1111

← Older revision		Revision as of 14:57, 13 December 2022
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	\|type = Packaging		\|type = Packaging
	\|super= Brian Thibeault		\|super= Brian Thibeault
	\|location=ESB ~~1106?~~		\|location=ESB 1111
	\|description = Manual Cleaving		\|description = Manual Cleaving
	\|model = [https://www.tedpella.com/Material-Sciences_html/PELCO-FlipScribe.aspx PELCO Flip-Scribe]		\|model = [https://www.tedpella.com/Material-Sciences_html/PELCO-FlipScribe.aspx PELCO Flip-Scribe]

John d: John d moved page Wafer Cleaver (PELCO LatticeAx) to Wafer Cleaver (PELCO Flip-Scribe) without leaving a redirect: wrong name

2022-03-01T22:06:25Z

John d moved page Wafer Cleaver (PELCO LatticeAx) to Wafer Cleaver (PELCO Flip-Scribe) without leaving a redirect: wrong name

← Older revision	Revision as of 22:06, 1 March 2022
(No difference)

Thibeault: /* Operating Procedures */

2022-03-01T19:12:57Z

Operating Procedures

← Older revision		Revision as of 19:12, 1 March 2022
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	==Operating Procedures==		==Operating Procedures==

	*[[LatticeAx SOP]] - To be added		*Flipscribe [[LatticeAx SOP\|SOP]] - To be added

John d: LatticeAx --> Flip-Scribe

2022-03-01T16:46:50Z

LatticeAx --> Flip-Scribe

← Older revision		Revision as of 16:46, 1 March 2022
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	}}		}}
	==About==		==About==
	The ~~LatticeAx~~ is a manual cleaving system, with a diamond tip that scribes along the underside of the part/wafer. The user manually drags the part across the diamond scribe, using the guides and stops to push the part in a controlled, straight line.		The Flip-Scribe is a manual scribe+break cleaving system, with a diamond tip that scribes along the underside of the part/wafer. The user manually drags the part across the diamond scribe, using the guides and stops to push the part in a controlled, straight line.
	Manual breaking tools are provided to perform the break after scribing.		Manual breaking tools are provided to perform the break after scribing.

			Can scribe/break ~350µm thick sapphire wafers. Thicker/more difficult to cleave parts should be thinned down on the [[Mechanical Polisher (Allied)\|Allied Polisher]] before cleaving.

	==Detailed Specifications==		==Detailed Specifications==

	* Wafer/Parts Sizes: 4" down to ~10mm		*Wafer/Parts Sizes: 4" down to ~10mm
			*Digital microscope w/ laptop for finer alignment
			*~100µm alignment accuracy

	==Operating Procedures==		==Operating Procedures==

	* [[LatticeAx SOP]] - To be added		*[[LatticeAx SOP]] - To be added


	==Recipes==		==Recipes==

	*Recipes > Packaging > '''[[Packaging Recipes#LatticeAx\|To Be Added]]'''		*Recipes > Packaging > '''[[Packaging Recipes#LatticeAx\|''To Be Added'']]'''

	Be sure to also see the recipes for protecting your sample from dicing dust on the [[Packaging Recipes]] page.		Be sure to also see the recipes for protecting your sample from dicing dust on the [[Packaging Recipes\|'''Packaging Recipes''']] page.

John d: links to Mfg

2022-03-01T16:43:07Z

links to Mfg

← Older revision		Revision as of 16:43, 1 March 2022
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	\|location=ESB 1106?		\|location=ESB 1106?
	\|description = Manual Cleaving		\|description = Manual Cleaving
			\|model = [https://www.tedpella.com/Material-Sciences_html/PELCO-FlipScribe.aspx PELCO Flip-Scribe]
	\|model = LatticeAx
	\|manufacturer = ~~PELCO~~		\|manufacturer = [https://www.tedpella.com TedPella Inc.]
	\|materials =		\|materials =
	\|toolid=		\|toolid=

John d: new tool page

2022-03-01T16:27:49Z

new tool page

New page

{{tool|{{PAGENAME}}
|picture=LatticeAx.jpg
|type = Packaging
|super= Brian Thibeault
|location=ESB 1106?
|description = Manual Cleaving
|model = LatticeAx
|manufacturer = PELCO
|materials =
|toolid=
}}
==About==
The LatticeAx is a manual cleaving system, with a diamond tip that scribes along the underside of the part/wafer. The user manually drags the part across the diamond scribe, using the guides and stops to push the part in a controlled, straight line.
Manual breaking tools are provided to perform the break after scribing.

==Detailed Specifications==

* Wafer/Parts Sizes: 4" down to ~10mm

==Operating Procedures==

* [[LatticeAx SOP]] - To be added

==Recipes==

*Recipes > Packaging > '''[[Packaging Recipes#LatticeAx|To Be Added]]'''

Be sure to also see the recipes for protecting your sample from dicing dust on the [[Packaging Recipes]] page.