Wafer Coating Process Traveler1 - Revision history

Biljana at 20:32, 30 March 2020

2020-03-30T20:32:39Z

← Older revision		Revision as of 20:32, 30 March 2020
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	e) Unload wafers '''ONLY''' when all runs are finished.		e) Unload wafers '''ONLY''' when all runs are finished.

	=== '''Unaxis deposition -300nm SiN LS film @250°C''' ===		=== '''Unaxis deposition - 300nm SiN LS film @250°C''' ===
	a) Prepare three 4”wafers:		a) Prepare three 4”wafers:
	* for seasoning (regular Si wafer ~500nm thick)		* for seasoning (regular Si wafer ~500nm thick)

Biljana at 20:32, 30 March 2020

2020-03-30T20:32:13Z

← Older revision		Revision as of 20:32, 30 March 2020
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	=== '''1. Unaxis deposition - 300nm SiO2 LDR film @250°C''' ===		=== '''Unaxis deposition - 300nm SiO2 LDR film @250°C''' ===
	a) Prepare three 4” wafers:		a) Prepare three 4” wafers:
	* for seasoning (regular Si wafer ~500nm thick)		* for seasoning (regular Si wafer ~500nm thick)
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	e) Unload wafers '''ONLY''' when all runs are finished.		e) Unload wafers '''ONLY''' when all runs are finished.

	=== '''2. Unaxis deposition - 300nm SiO2 HDR film @250°C''' ===		=== '''Unaxis deposition - 300nm SiO2 HDR film @250°C''' ===
	a) Prepare three 4” wafers:		a) Prepare three 4” wafers:
	* for seasoning (regular Si wafer ~500nm thick)		* for seasoning (regular Si wafer ~500nm thick)
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	e) Unload wafers '''ONLY''' when all runs are finished.		e) Unload wafers '''ONLY''' when all runs are finished.

	=== '''3. Unaxis deposition - 300nm SiN film @250°C''' ===		=== '''Unaxis deposition - 300nm SiN film @250°C''' ===
	a) Prepare three 4” wafers:		a) Prepare three 4” wafers:
	* for seasoning (regular Si wafer ~500nm thick)		* for seasoning (regular Si wafer ~500nm thick)
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	e) Unload wafers '''ONLY''' when all runs are finished.		e) Unload wafers '''ONLY''' when all runs are finished.

	=== 4. '''Unaxis deposition -300nm SiN LS film @250°C''' ===		=== '''Unaxis deposition -300nm SiN LS film @250°C''' ===
	a) Prepare three 4”wafers:		a) Prepare three 4”wafers:
	* for seasoning (regular Si wafer ~500nm thick)		* for seasoning (regular Si wafer ~500nm thick)

Biljana: /* 1. Unaxis deposition - 300nm SiO2 LDR film @250°C */

2020-03-30T20:30:53Z

1. Unaxis deposition - 300nm SiO2 LDR film @250°C

Show changes

Biljana: /* 1. Unaxis deposition - 300nm of SiO2 LDR film @250°C */

2020-03-30T20:15:18Z

1. Unaxis deposition - 300nm of SiO2 LDR film @250°C

← Older revision		Revision as of 20:15, 30 March 2020
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	=== '''1. Unaxis deposition - 300nm of SiO2 LDR film @250°C''' ===		=== '''1. Unaxis deposition - 300nm SiO2 LDR film @250°C''' ===
	a) Prepare three 4” wafers:		a) Prepare three 4” wafers:

	· for seasoning (regular Si wafer ~500nm thick)		for seasoning (regular Si wafer ~500nm thick)

	· for deposition (your wafer for deposition)		for deposition (your wafer for deposition)

	· for cleaning ( Si thick wafer~0.8-1um)		for cleaning ( Si thick wafer~0.8-1um)

	b) Load all wafers in a cassette, making sure major flat is facing outside (toward you). Try to align flats for all three wafers.		b) Load all wafers in a cassette, making sure major flat is facing outside (toward you). Try to align flats for all three wafers.
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	You can repeat the previous step for each wafer. This way after loading the wafers and selecting for each wafer correct recipe, you could leave and come back when all runs are finished. You should monitor process at the very beginning to make sure there are no any issues with the run.		You can repeat the previous step for each wafer. This way after loading the wafers and selecting for each wafer correct recipe, you could leave and come back when all runs are finished. You should monitor process at the very beginning to make sure there are no any issues with the run.

	· There is '''only one SiO2 seasoning recipe''' that is used for both LDR and HDR depositions. The goal in this step is to prepare the chamber and deposit ~200nm of SiO2 on walls.		There is '''only one SiO2 seasoning recipe''' that is used for both LDR and HDR depositions. The goal in this step is to prepare the chamber and deposit ~200nm of SiO2 on walls.

	e) Unload wafers ONLY when all runs are finished.		e) Unload wafers ONLY when all runs are finished.

Biljana: subheadings

2020-03-30T19:54:17Z

subheadings

← Older revision		Revision as of 19:54, 30 March 2020
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	e) Unload wafers ONLY when all runs are finished.		e) Unload wafers ONLY when all runs are finished.

	'''2. Unaxis SiO2 HDR @250°C deposition'''		=== '''2. Unaxis SiO2 HDR @250°C deposition''' ===

	a) Prepare three 4” wafers:		a) Prepare three 4” wafers:

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	e) Unload wafers ONLY when all runs are finished.		e) Unload wafers ONLY when all runs are finished.

	'''3. Unaxis SiN @250°C deposition'''		=== '''3. Unaxis SiN @250°C deposition''' ===

	a) Prepare three 4” wafers:		a) Prepare three 4” wafers:

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	e) Unload wafers ONLY when all runs are finished.		e) Unload wafers ONLY when all runs are finished.

	4. '''Unaxis SiN LS @250°C''' '''deposition'''		=== 4. '''Unaxis SiN LS @250°C''' '''deposition''' ===

	a) Prepare three 4”wafers:		a) Prepare three 4”wafers:

Biljana: subheading

2020-03-30T19:53:10Z

subheading

← Older revision		Revision as of 19:53, 30 March 2020
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			=== '''1. Unaxis deposition - 300nm of SiO2 LDR film @250°C''' ===
	Unaxis_SOP_3-30-2020.docx
			a) Prepare three 4” wafers:

			· for seasoning (regular Si wafer ~500nm thick)

			· for deposition (your wafer for deposition)

			· for cleaning ( Si thick wafer~0.8-1um)

			b) Load all wafers in a cassette, making sure major flat is facing outside (toward you). Try to align flats for all three wafers.

			c) Edit '''standard recipes''' (for seasoning, deposition, and cleaning). You can '''ONLY change the time''' in the recipe.

			Seasoning recipe name: '''SiO2 seasoning''', '''t=2min'''

			Deposition recipe name: S'''iO2 LDR 250°C''', '''t=780 sec'''

			Cleaning recipe name: '''Post dep PD''', '''t=900sec'''

			d) Run the job (name the job/select the wafer, execute the job)

			You can repeat the previous step for each wafer. This way after loading the wafers and selecting for each wafer correct recipe, you could leave and come back when all runs are finished. You should monitor process at the very beginning to make sure there are no any issues with the run.

			· There is '''only one SiO2 seasoning recipe''' that is used for both LDR and HDR depositions. The goal in this step is to prepare the chamber and deposit ~200nm of SiO2 on walls.

			e) Unload wafers ONLY when all runs are finished.

			'''2. Unaxis SiO2 HDR @250°C deposition'''

			a) Prepare three 4” wafers:

			· for seasoning (regular Si wafer ~500nmthick)

			· for deposition (your wafer for deposition)

			· for cleaning ( Si thick wafer~0.8-1um )

			b) Load all wafers in a cassette, making sure major flat is facing outside (toward you). Try to align flats for all three wafers.

			c) Edit '''standard recipes''' (for seasoning, deposition, and cleaning). You can '''ONLY change the time''' in the recipe.

			Seasoning recipe name: '''SiO2 seasoning, t=2min'''

			Deposition recipe name: '''SiO2 HDR 250°C''', '''t=180 sec'''

			Cleaning recipe name: '''Post dep PD''', '''t=900sec'''

			d) Run the job (name the job/select the wafer, execute the job)

			You can repeat the previous step for each wafer. This way after loading the wafers and selecting for each wafer correct recipe, you could leave and come back when all runs are finished. You should monitor process at the very beginning to make sure there are no any issues with the run.

			· There is '''only one SiO2 seasoning recipe''' that is used for both LDR and HDR depositions. The goal in this step is to prepare the chamber and deposit ~200nm of SiO2 on walls.

			e) Unload wafers ONLY when all runs are finished.

			'''3. Unaxis SiN @250°C deposition'''

			a) Prepare three 4” wafers:

			· for seasoning (regular Si wafer ~500nmthick)

			· for deposition (your wafer for deposition)

			· for cleaning ( Si thick wafer~0.8-1um)

			b) Load all wafers in a cassette, making sure major flat is facing outside (toward you). Try to align flats for all three wafers.

			c) Edit '''standard recipes''' (for seasoning, deposition, and cleaning). You can '''ONLY change the time''' in the recipe.

			Seasoning recipe name: '''SiN seasoning''', '''t=5min'''

			Deposition recipe name: '''SiN 250°C, t=480 sec'''

			Cleaning recipe name: '''Post dep PD,''' '''t=1500sec'''

			d) Run the job (name the job/select the wafer, execute the job)

			You can repeat the previous step for each wafer. This way after loading the wafers and selecting for each wafer correct recipe, you could leave and come back when all runs are finished. You should monitor process at the very beginning to make sure there are no any issues with the run.

			e) Unload wafers ONLY when all runs are finished.

			4. '''Unaxis SiN LS @250°C''' '''deposition'''

			a) Prepare three 4”wafers:

			· for seasoning (regular Si wafer ~500nmthick)

			· for deposition (your wafer for deposition)

			· for cleaning ( Si thick wafer~0.8-1um )

			b) Load all wafers in a cassette, making sure major flat is facing outside (toward you). Try to align flats for all three wafers.

			c) Edit '''standard recipes''' (for seasoning, deposition, and cleaning). You can '''ONLY change the time''' in the recipe.

			Seasoning recipe name: '''SiN seasoning''', '''t=2min'''

			Deposition recipe name: '''SiN LS''' '''250°C''', '''t=180 sec'''

			Cleaning recipe name: '''Post dep PD,''' '''t=1500sec'''

			d) Run the job (name the job/select the wafer, execute the job)

			You can repeat the previous step for each wafer. This way after loading the wafers and selecting for each wafer correct recipe, you could leave and come back when all runs are finished. You should monitor process at the very beginning to make sure there are no any issues with the run.

			e) Unload wafers ONLY when all runs are finished.

Biljana at 19:52, 30 March 2020

2020-03-30T19:52:05Z

← Older revision	Revision as of 19:52, 30 March 2020
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		Unaxis_SOP_3-30-2020.docx

Biljana: Blanked the page

2020-03-30T19:50:42Z

Blanked the page

← Older revision		Revision as of 19:50, 30 March 2020
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	[[Unaxis_SOP_3-30-2020.docx]]

Biljana at 19:44, 30 March 2020

2020-03-30T19:44:54Z

← Older revision		Revision as of 19:44, 30 March 2020
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	Unaxis_SOP_3-30-2020.docx		[[Unaxis_SOP_3-30-2020.docx]]

Biljana: Created page with "Unaxis_SOP_3-30-2020.docx"

2020-03-30T19:09:00Z

Created page with "Unaxis_SOP_3-30-2020.docx"

New page

Unaxis_SOP_3-30-2020.docx