Wafer scanning process traveler - Revision history

Biljana: /* Wafers to Use */ updated surfscan instructions.

2024-01-05T00:05:00Z

Wafers to Use: updated surfscan instructions.

← Older revision		Revision as of 00:05, 5 January 2024
Line 9:		Line 9:
	Surfscan 6200 (located in bay5) is used for scanning wafers. There are two standard recipes that could be used for scanning wafers: UCSBTEST1 (for scanning 8” wafers) and UCSBTEST2 (for scanning 4"wafers). The recipe UCSBTEST2 is used as a template to create other two standard recipes: "UCSB Gain4" (measuring small particles 0.16-1.6um) and "UCSB Gain2" (measuring larger particles 1.6-28um).		Surfscan 6200 (located in bay5) is used for scanning wafers. There are two standard recipes that could be used for scanning wafers: UCSBTEST1 (for scanning 8” wafers) and UCSBTEST2 (for scanning 4"wafers). The recipe UCSBTEST2 is used as a template to create other two standard recipes: "UCSB Gain4" (measuring small particles 0.16-1.6um) and "UCSB Gain2" (measuring larger particles 1.6-28um).

	We have cassettes only for 4" and 8" wafers. If you plan to scan wafers that have different size, you need to provide your own cassette and calibrate it. If you need to scan wafer pieces, you need to develop your own procedure how to scan it.		We have cassettes only for 4", 6" and 8" wafers. If you plan to scan wafers that have different size, you need to provide your own cassette and calibrate it. If you need to scan wafer pieces, you need to develop your own procedure how to scan it.

	==Scanning procedure for 4" Si wafers==		==Scanning procedure for 4" Si wafers==
	~~Note that only the~~ '''right-cassette/indexer''' is calibrated for 4-inch ~~(100mm)~~ wafers.		The '''right-cassette/indexer''' is calibrated for 4-inch and 6-inch Si wafers. The '''left-cassette/indexer''' is available for 8inch Si wafers (not calibrated).

	===Scan before process step===		===Scan before process step===

	#Log in (access code is boss)		#Log in (access code is boss)
	#Load wafers (face up) to the cassette that says " 4inch Surfscan"		#Load wafers (face up) to the cassette that says " 4inch Surfscan"
	#Place the cassette with wafers to the right indexer		#Place the cassette with wafers to the right indexer
	#In the menu option select "CASS" (this will read all wafers that are loaded into the cassette)		#In the menu option select "CASS" (this will read all wafers that are loaded into the cassette)

Biljana: /* Scan before process step */ updates scanning procesure

2024-01-04T23:57:50Z

Scan before process step: updates scanning procesure

← Older revision		Revision as of 23:57, 4 January 2024
Line 17:		Line 17:

	#Log in (access code is boss)		#Log in (access code is boss)
	#Load wafers (face up) to the cassette that says " ~~SURFSCAN~~" .		#Load wafers (face up) to the cassette that says " 4inch Surfscan"
	#Place the cassette with wafers to the right indexer.		#Place the cassette with wafers to the right indexer
	#In the menu option select "~~CAS~~" (this will read all wafers that are in the ~~carrier~~).		#In the menu option select "CASS" (this will read all wafers that are loaded into the cassette)
	#Go to "Recipes"		#Go to "Recipes"
	#Select one of the recipes:		#Select one of the recipes:
	#*UCSB ~~Gain4~~ (measuring small particles 0.16-1.6um)		#*UCSB G4 0.16-1.6 (measuring small particles 0.16-1.6um)
	#*UCSB ~~Gain2~~ (measuring larger particles 1.6-28um)		#*UCSB G2 1.6-28.0 (measuring larger particles 1.6-28um)
	#**(Recipe "UCSBTEST2" is used as a template to create recipes UCSB Gain2 and UCSB Gain4)		#**Recipe "UCSBTEST2" is used as a template to create recipes UCSB Gain2 and UCSB Gain4
	#View the recipe and modify it if needed ( if recipe modified, select bin split/default to save changes).		#View the recipe and modify it if needed (if recipe is modified, select bin split/default to save changes)
	#Select the wafer in catalog box you want to scan ~~(you~~ ~~can~~ ~~select~~ ~~one~~ ~~wafer or you can~~ scan ~~all~~ ~~wafers-AUTO~~ ~~option~~).		#Select the wafer in the catalog box you want to scan, and press START (it would scan only one wafer)
			#Select AUTO option If you want to scan all wafers in the catalog box, followed by START
	#Select START.
	#Wait until scan is finished.		#Wait until scan is finished
	#Record:		#Record:
	#*'''LPD Cnt''' (sum of all particles #1- #8), particles #1(0.160-0.213)um, particles #8(1.20-1.60)um		#*'''LPD Cnt''' (sum of all particles #1- #8), particles #1(0.160-0.213)um, particles #8(1.20-1.60)um
	#*'''Haze''' (region(%), average(ppm), peak(ppm)).		#*'''Haze''' (region(%), average(ppm), peak(ppm))
	#Take a picture of the scan (by phone).		#Take a picture of the scan (by phone)
	#Select "Home" so indexer moves up to loading/unloading position.		#Select "Home" so indexer moves up to loading/unloading position
	#Unload wafers.		#Unload wafers
	#Log out.		#Log out

	====Data Recording====		====Data Recording====

	*Run the above process TWICE: once for recipe "Gain 2" (sizes 1.6µm to 28µm) and another for recipe "Gain 4" (sizes 0.160µm to 1.6µm).		*Run the above process TWICE: once for recipe "Gain 2" (sizes 1.6µm to 28µm) and another for recipe "Gain 4" (sizes 0.160µm to 1.6µm)
	*Record the following:		*Record the following:
	**"total particle count",		**"total particle count",

Biljana: /* Scanning procedure for 4" Si wafers */

2024-01-04T23:46:43Z

Scanning procedure for 4" Si wafers

← Older revision		Revision as of 23:46, 4 January 2024
Line 68:		Line 68:
	[[File:Surfscan P1 SiN 221208Z5G4 after.jpg\|alt=Photo of surfscan showing high particle count nd hexagonal grid pattern in particle concentrations.\|none\|thumb\|426x426px\|Example of high particles detected after deposition step. Gas inlet showerhead pattern is seen, suggesting the source of the particles.]]		[[File:Surfscan P1 SiN 221208Z5G4 after.jpg\|alt=Photo of surfscan showing high particle count nd hexagonal grid pattern in particle concentrations.\|none\|thumb\|426x426px\|Example of high particles detected after deposition step. Gas inlet showerhead pattern is seen, suggesting the source of the particles.]]
	<br />		<br />

	==Plotting Process Control Data==		==Plotting Process Control Data==
	Make an Excel spreadsheet. Enter information for Gain4 and Gain2 (particles#1, particles#8, LPD, haze) before and after deposition. For each gain calculate Delta (LPDad - LPDbd). Make a plot (Particulates vs. Date).		Make an Excel spreadsheet. Enter information for Gain4 and Gain2 (particles#1, particles#8, LPD, haze) before and after deposition. For each gain calculate Delta (LPDad - LPDbd). Make a plot (Particulates vs. Date).

John d: /* Wafers to Use */ mention regular prime grade

2023-03-21T20:10:51Z

Wafers to Use: mention regular prime grade

← Older revision		Revision as of 20:10, 21 March 2023
Line 3:		Line 3:

	==Wafers to Use==		==Wafers to Use==
	The wafers for process calibration are ordered from a wafer supplier that sells high grade, quality wafers. ~~these~~ are 4"Si wafers, with low particle count (Particles: <=10 @ >=0.3 microns). Wafers should be handled carefully, because every loading and unloading will add some particulates.		The wafers for process calibration are ordered from a wafer supplier that sells high grade, quality wafers. These are 4-inch Si wafers, with low particle count (Particles: <=10 @ >=0.3 microns). Wafers should be handled carefully, because every loading and unloading will add some particulates.

			Regular Prime grade wafers also work well, but note that initial pre-process particle measurement may be higher - this is ok as long as you measure ''before'' the process step, and subtract that value from the ''after'' process value. If your ''before'' measurement shows high (eg. >200 particles), do not use that wafer for particle checks, discard it and find a better wafer.

	Surfscan 6200 (located in bay5) is used for scanning wafers. There are two standard recipes that could be used for scanning wafers: UCSBTEST1 (for scanning 8” wafers) and UCSBTEST2 (for scanning 4"wafers). The recipe UCSBTEST2 is used as a template to create other two standard recipes: "UCSB Gain4" (measuring small particles 0.16-1.6um) and "UCSB Gain2" (measuring larger particles 1.6-28um).		Surfscan 6200 (located in bay5) is used for scanning wafers. There are two standard recipes that could be used for scanning wafers: UCSBTEST1 (for scanning 8” wafers) and UCSBTEST2 (for scanning 4"wafers). The recipe UCSBTEST2 is used as a template to create other two standard recipes: "UCSB Gain4" (measuring small particles 0.16-1.6um) and "UCSB Gain2" (measuring larger particles 1.6-28um).
Line 57:		Line 59:
	===Example Surfscan photos===		===Example Surfscan photos===

	==== Low particle example ====		====Low particle example====
	Here are two example photos for UCSB Gain4, and UCSB Gain2 recipes, showing acceptable particle levels:		Here are two example photos for UCSB Gain4, and UCSB Gain2 recipes, showing acceptable particle levels:
	[[File:UCSBTEST2 .png\|none\|thumb\|422x422px\|Recipe UCSB Gain4 for smaller particulates (0.160µm to 1.6µm)]]		[[File:UCSBTEST2 .png\|none\|thumb\|422x422px\|Recipe UCSB Gain4 for smaller particulates (0.160µm to 1.6µm)]]

John d at 20:07, 21 March 2023

2023-03-21T20:07:55Z

← Older revision		Revision as of 20:07, 21 March 2023
Line 37:		Line 37:
	====Data Recording====		====Data Recording====

	* Run the above process TWICE: once for recipe "Gain 2" (sizes 1.6µm to 28µm) and another for recipe "Gain 4" (sizes 0.160µm to 1.6µm).		*Run the above process TWICE: once for recipe "Gain 2" (sizes 1.6µm to 28µm) and another for recipe "Gain 4" (sizes 0.160µm to 1.6µm).
	* Record the following:		*Record the following:
	** "total particle count",		**"total particle count",
	** "Haze %" and		**"Haze %" and
	**<u>Take photos of the results screen</u> showing all binning and wafer particle distribution. See example photos below.		**<u>Take photos of the results screen</u> showing all binning and wafer particle distribution. See example photos below.

Line 47:		Line 47:
	===Perform process step===		===Perform process step===

	* Run the deposition or other process on your wafer.		*Run the deposition or other process on your wafer.
	* Be careful of adding particles during handling - eg. don't leave wafer out on table unnecessarily, keep it in the case and do not agitate the wafer in the case.		*Be careful of adding particles during handling - eg. don't leave wafer out on table unnecessarily, keep it in the case and do not agitate the wafer in the case.

	===Scan after process calibration===		===Scan after process calibration===

	* Repeat the same procedure above for scanning.		*Repeat the same procedure above for scanning.
	* Subtract pre-scan particle counts, to remove pre-process particles that were already on the wafer.		*Subtract pre-scan particle counts, to remove pre-process particles that were already on the wafer.

	===Example Surfscan photos===		===Example Surfscan photos===

			==== Low particle example ====
	Here are two example photos for UCSB Gain4, and UCSB Gain2 recipes, showing acceptable particle levels:		Here are two example photos for UCSB Gain4, and UCSB Gain2 recipes, showing acceptable particle levels:
	[[File:UCSBTEST2 .png\|none\|thumb\|422x422px\|Recipe UCSB Gain4 for smaller particulates (0.160µm to 1.6µm)]]		[[File:UCSBTEST2 .png\|none\|thumb\|422x422px\|Recipe UCSB Gain4 for smaller particulates (0.160µm to 1.6µm)]]
	[[File:UCSBTEST1.png\|none\|thumb\|425x425px\|Recipe UCSB Gain2 for larger particulates (1.6µm to 28µm)]]		[[File:UCSBTEST1.png\|none\|thumb\|425x425px\|Recipe UCSB Gain2 for larger particulates (1.6µm to 28µm)]]

	=== High Particle Example ===		====High Particle Example====
	The following shows examples of high particle levels detected ''after'' a deposition process step.		The following shows examples of high particle levels detected ''after'' a deposition process step.
	[[File:Surfscan P1 SiN 221208Z5G4 after.jpg\|alt=Photo of surfscan showing high particle count nd hexagonal grid pattern in particle concentrations.\|none\|thumb\|426x426px\|Example of high particles detected after deposition step. Gas inlet showerhead pattern is seen, suggesting the source of the particles.]]		[[File:Surfscan P1 SiN 221208Z5G4 after.jpg\|alt=Photo of surfscan showing high particle count nd hexagonal grid pattern in particle concentrations.\|none\|thumb\|426x426px\|Example of high particles detected after deposition step. Gas inlet showerhead pattern is seen, suggesting the source of the particles.]]

John d: /* Data Recording */ updated surfscan photos, added examples of before/after and high particle photos.

2023-03-21T20:07:03Z

Data Recording: updated surfscan photos, added examples of before/after and high particle photos.

← Older revision		Revision as of 20:07, 21 March 2023
Line 36:		Line 36:

	====Data Recording====		====Data Recording====
⚫	Run the above process TWICE once for recipe "Gain 2" and another for recipe "Gain 4".

		⚫	* Run the above process TWICE: once for recipe "Gain 2" (sizes 1.6µm to 28µm) and another for recipe "Gain 4" (sizes 0.160µm to 1.6µm).
	Record the following:		* Record the following:
		⚫	** "total particle count",
		⚫	** "Haze %" and
		⚫	**<u>Take photos of the results screen</u> showing all binning and wafer particle distribution. See example photos below.

			[[File:Surfscan G4 before example - P1 230317E7G4 before.jpg\|alt=Photo of Surfscan screen showing low particles on wafer.\|none\|thumb\|381x381px\|Typical "before" process step Surfscan measurement. A std. Prime Grade Silicon wafer may have 50-100 particles out of the cassette. Note the tweezer pickup location, on the bottom in this photo.]]
⚫	*"total particle count",
⚫	*"Haze %" and
⚫	*Take photos of the results screen showing all binning and wafer particle distribution.

	===Perform process step===		===Perform process step===
⚫	Run the deposition or other process on your wafer.

		⚫	* Run the deposition or other process on your wafer.
	Be careful of adding particles during handling - eg. don't leave wafer out on table unnecessarily, keep it in the case and do not agitate the wafer in the case.		* Be careful of adding particles during handling - eg. don't leave wafer out on table unnecessarily, keep it in the case and do not agitate the wafer in the case.

	===Scan after process calibration===		===Scan after process calibration===
⚫	Repeat the same procedure above for scanning.

		⚫	* Repeat the same procedure above for scanning.
	Subtract pre-scan particle counts.
			* Subtract pre-scan particle counts, to remove pre-process particles that were already on the wafer.

	===Surfscan photos===		===Example Surfscan photos===
	Here are two example photos for UCSB Gain4, and UCSB Gain2:		Here are two example photos for UCSB Gain4, and UCSB Gain2 recipes, showing acceptable particle levels:
	[[File:UCSBTEST2 .png\|none\|thumb\|422x422px\|Recipe UCSB Gain4 for smaller particulates]]		[[File:UCSBTEST2 .png\|none\|thumb\|422x422px\|Recipe UCSB Gain4 for smaller particulates (0.160µm to 1.6µm)]]
	[[File:UCSBTEST1.png\|none\|thumb\|425x425px\|Recipe UCSB Gain2 for larger particulates]]		[[File:UCSBTEST1.png\|none\|thumb\|425x425px\|Recipe UCSB Gain2 for larger particulates (1.6µm to 28µm)]]

			=== High Particle Example ===
			The following shows examples of high particle levels detected ''after'' a deposition process step.
			[[File:Surfscan P1 SiN 221208Z5G4 after.jpg\|alt=Photo of surfscan showing high particle count nd hexagonal grid pattern in particle concentrations.\|none\|thumb\|426x426px\|Example of high particles detected after deposition step. Gas inlet showerhead pattern is seen, suggesting the source of the particles.]]
			<br />
	==Plotting Process Control Data==		==Plotting Process Control Data==
	Make an Excel spreadsheet. Enter information for Gain4 and Gain2 (particles#1, particles#8, LPD, haze) before and after deposition. For each gain calculate Delta (LPDad - LPDbd). Make a plot (Particulates vs. Date).		Make an Excel spreadsheet. Enter information for Gain4 and Gain2 (particles#1, particles#8, LPD, haze) before and after deposition. For each gain calculate Delta (LPDad - LPDbd). Make a plot (Particulates vs. Date).

John d at 21:51, 23 January 2023

2023-01-23T21:51:48Z

← Older revision		Revision as of 21:51, 23 January 2023
Line 9:		Line 9:
	We have cassettes only for 4" and 8" wafers. If you plan to scan wafers that have different size, you need to provide your own cassette and calibrate it. If you need to scan wafer pieces, you need to develop your own procedure how to scan it.		We have cassettes only for 4" and 8" wafers. If you plan to scan wafers that have different size, you need to provide your own cassette and calibrate it. If you need to scan wafer pieces, you need to develop your own procedure how to scan it.

	==Scanning procedure for 4" Si wafers ~~( right indexer)~~==		==Scanning procedure for 4" Si wafers==
			Note that only the '''right-cassette/indexer''' is calibrated for 4-inch (100mm) wafers.

	===Scan before process ~~calibration~~===		===Scan before process step===

	#Log in (access code is boss)		#Log in (access code is boss)
Line 43:		Line 44:
	*Take photos of the results screen showing all binning and wafer particle distribution.		*Take photos of the results screen showing all binning and wafer particle distribution.

	===Perform ~~your~~ process step===		===Perform process step===
	Run the deposition or other process on your wafer.		Run the deposition or other process on your wafer.

	Be careful of adding particles- eg. don't leave wafer out on table unnecessarily, keep it in the case and do not agitate the wafer.		Be careful of adding particles during handling - eg. don't leave wafer out on table unnecessarily, keep it in the case and do not agitate the wafer in the case.

	===Scan after process calibration===		===Scan after process calibration===
	Repeat the same procedure above for scanning.		Repeat the same procedure above for scanning.

	Subtract pre-scan particle counts		Subtract pre-scan particle counts.

	===Surfscan photos===		===Surfscan photos===
Line 220:		Line 221:
	Haze From is the smallest haze value collected. Haze From defaults to 1/250 the current Haze Range setting but can be set to a different value, as needed. During a scan, the instrument collects haze data from the measurable wafer surface, separated into 832 x 860-µm segments called tiles. Haze maps display the average haze value per tile. Haze histograms display the distribution of haze values. Average haze for a wafer is calculated by averaging the haze values of all tiles on the wafer.		Haze From is the smallest haze value collected. Haze From defaults to 1/250 the current Haze Range setting but can be set to a different value, as needed. During a scan, the instrument collects haze data from the measurable wafer surface, separated into 832 x 860-µm segments called tiles. Haze maps display the average haze value per tile. Haze histograms display the distribution of haze values. Average haze for a wafer is calculated by averaging the haze values of all tiles on the wafer.

	====== What is "Haze"? ======		======What is "Haze"?======
	Haze is a measure of the light scattered off of a surface. Lower roughness translates into less scattered light and a lower haze. Residual particles scatter light and also increase haze.		Haze is a measure of the light scattered off of a surface. Lower roughness translates into less scattered light and a lower haze. Residual particles scatter light and also increase haze.

John d: /* Selecting a Haze range */ added example

2023-01-23T18:29:31Z

Selecting a Haze range: added example

← Older revision		Revision as of 18:29, 23 January 2023
Line 220:		Line 220:
	Haze From is the smallest haze value collected. Haze From defaults to 1/250 the current Haze Range setting but can be set to a different value, as needed. During a scan, the instrument collects haze data from the measurable wafer surface, separated into 832 x 860-µm segments called tiles. Haze maps display the average haze value per tile. Haze histograms display the distribution of haze values. Average haze for a wafer is calculated by averaging the haze values of all tiles on the wafer.		Haze From is the smallest haze value collected. Haze From defaults to 1/250 the current Haze Range setting but can be set to a different value, as needed. During a scan, the instrument collects haze data from the measurable wafer surface, separated into 832 x 860-µm segments called tiles. Haze maps display the average haze value per tile. Haze histograms display the distribution of haze values. Average haze for a wafer is calculated by averaging the haze values of all tiles on the wafer.

	What is ~~haze~~?		====== What is "Haze"? ======
	Haze is a measure of the light scattered off of a surface. Lower roughness translates into less scattered light and a lower haze. Residual particles scatter light and also increase haze. ~~Typical haze values are less than 0.1 ppm in the narrow normal channel for a highly polished, reflective surface.~~		Haze is a measure of the light scattered off of a surface. Lower roughness translates into less scattered light and a lower haze. Residual particles scatter light and also increase haze.

			For example, surface roughness, or high-density particulates that are smaller than the tool detection limit could be included as "Haze".

			Typical haze values are less than 0.1 ppm in the narrow normal channel for a highly polished, reflective surface.

	=====Selecting throughput=====		=====Selecting throughput=====

John d: deleted claibration and SPC sections (not installed)

2023-01-23T18:27:59Z

deleted claibration and SPC sections (not installed)

← Older revision		Revision as of 18:27, 23 January 2023
Line 274:		Line 274:
	*If the instrument displays Data Overload in the status box, instrument sensitivity is too high. Count accuracy and repeatability might not be reliable. Reduce sensitivity by raising threshold, reducing gain, or increasing throughput.		*If the instrument displays Data Overload in the status box, instrument sensitivity is too high. Count accuracy and repeatability might not be reliable. Reduce sensitivity by raising threshold, reducing gain, or increasing throughput.
	*If the histogram shows an exponentially increasing distribution at the low end of the graph, the instrument might be collecting phantom defects or haze noise. Raise threshold and gain proportionately.		*If the histogram shows an exponentially increasing distribution at the low end of the graph, the instrument might be collecting phantom defects or haze noise. Raise threshold and gain proportionately.

	===Calibration===
	This chapter describes Surfscan 6200 calibration procedures available through the Calibration application: polystyrene latex (PSL) spheres on a substrate, haze, and cassette calibration. PSL spheres on substrate calibration allows you to <u>add calibration curves for new substrates and film thicknesses or edit existing curves</u>. The instrument uses the calibration to calculate defect sizes. See Section 6.2, “Calibrating PSL Spheres on a Substrate” in [https://wiki.nanotech.ucsb.edu/w/images/9/96/Surfscan-Operation-Manual.pdf Operation-Manual.] The haze calibration procedure produces a haze calibration curve that can be modified as necessary. See Section 6.4, “Haze Calibration” in [https://wiki.nanotech.ucsb.edu/w/images/9/96/Surfscan-Operation-Manual.pdf Operation-Manual.]The cassette calibration procedure allows you to calibrate for one or more wafer cassettes and to save cassette calibrations. See Section 6.5, “Cassette Calibration” in [https://wiki.nanotech.ucsb.edu/w/images/9/96/Surfscan-Operation-Manual.pdf Operation-Manual.]

	====Cassette Calibration====
	This section describes calibrating the instrument for the cassettes used by the instrument. The cassette calibration procedure allows you to calibrate for a cassette. During calibration, the instrument measures the movement required to load substrates from slots that are second from the top and second from the bottom. The instrument moves the puck toward the substrate in upper slot with vacuum on. The indexer then lowers the wafer toward the puck. When the instrument senses a reduction in vacuum pressure, indicating contact with the substrate, the instrument records the number of moves taken. The instrument moves the puck to the lower slot and repeats the test. If cassette calibration fails, check the following:

	*The locator is correctly installed.
	*The cassette is firmly seated on the locator.
	*The substrates do not touch the rails or back of the cassette.
	*In some cases, it might be necessary to move the substrates 2 to 3 mm (approximately 1/8 in.) toward the front of the cassette to insure that they lie flat.

	Since the distance between slots (slot pitch) and other dimensions of cassettes can vary, the Surfscan 6200 allows more than one cassette type to be calibrated and stored at one time. When different cassettes are used, the cassette type must be assigned to one of the standard cassette heights, set to one or more wafer sizes, and calibrated for each size. Cassette types can be deleted when no longer needed.

	'''To calibrate the instrument to a cassette''':

	1. Choose Cassette from the Calibration application Procedure menu.

	2. Choose the substrate diameter size from the Size menu. The program displays the Select Cassette dialog box.

	3. Select the cassette type to calibrate.

	4. Choose START to begin the calibration routine. The application displays the Cassette Calibration window showing the right cassette.

	5. As stated by the Place Cassette dialog box, make sure that wafers are loaded only into slots that are second from the top and second from the bottom of the cassette. The major flats of wafers must face toward the front of the cassette. Firmly seat the cassette on the locator plate.

	6. Choose Start Calibration to calibrate. The instrument indexes the cassette and informs you if it does not find wafers in both slots. (If one or both wafers are not found, return to Step 4.)

	7. The puck moves toward the wafer in the upper slot with vacuum turned on and pauses momentarily when a reduction in pressure is sensed. The puck then moves to the wafer in the lower slot and repeats the test. The instrument displays a summary of the calibration results.

	If the calibration was unsuccessful, start the calibration again. If the wafers are tilted toward the front or back as the puck finds the substrate, verify that

	*The cassette is firmly seated on the locator.
	*The locator is correctly installed.
	*The substrates do not touch the rails or back of the cassette.

	*The flats of wafers face forward. Start the calibration again. If the substrates still tilt, move them 2 to 3 mm (approximately 1/8 in.) toward the front of the cassette.

	8. Before using the new calibrated cassette for production, fill the cassette with dummy wafers and use the Move command to unload and load wafers for each slot. Watch for handling errors. If any occur, consider using different cassettes or contact your Tencor Service Representative for a system adjustment.

	You can add and delete a cassette type in Select Cassette dialog box.

	Setup menus

	===Statistical Process Control Options===
	This chapter describes the Surfscan 6000-series Statistical Process Control (SPC) package, a software billable option. The SPC feature provides an SPC Editor, SPC Display utility, and a database extraction function using Browser.

	*Using the SPC Editor, you can create an SPC definition for displaying control charts and tabular data. You can specify the data to analyze, the upper and lower chart limits, and the default data display (X-MR chart, C-Chart, tabular, or any combination of these displays). Fab and Process IDs can be entered for each SPC definition.
	*Using the SPC Display utility, you can display the current data assigned to an SPC file in chart, table, or chart and table form. You also can change the range of points used in charts and tables.
	*SPC charts can be printed using the standard instrument screen print features.
	*The contents of an SPC data file can be printed in tabular format.
	*Browser is used to extract wafer records from the database. The extracted data is stored in an SPC data file.

	===Glossary===
	Add a document with glossary.

John d at 18:26, 23 January 2023

2023-01-23T18:26:28Z

← Older revision		Revision as of 18:26, 23 January 2023
Line 1:		Line 1:
	Biljana Stamenic, NanoFab Staff, April 2020		<small>''[[Biljana Stamenic]], NanoFab Staff, April 2020''</small>
	Below is the procedure we use for calibrating particle counts on various machines, primarily depositions.		Below is the procedure we use for calibrating particle counts on various machines, primarily depositions.

Line 34:		Line 34:
	#Log out.		#Log out.

	==== Data Recording ====		====Data Recording====
	Run the above process TWICE once for recipe "Gain 2" and another for recipe "Gain 4".		Run the above process TWICE once for recipe "Gain 2" and another for recipe "Gain 4".

	Record the following:		Record the following:

	* "total particle count",		*"total particle count",
	* "Haze %" and		*"Haze %" and
	* Take photos of the results screen showing all binning and wafer particle distribution.		*Take photos of the results screen showing all binning and wafer particle distribution.

	=== Perform your process step ===		===Perform your process step===
	Run the deposition or other process on your wafer.		Run the deposition or other process on your wafer.