Wet Benches - Revision history

John d: /* Documentation */ explained what is in this doc

2024-09-25T22:03:11Z

Documentation: explained what is in this doc

← Older revision		Revision as of 22:03, 25 September 2024
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	===Std. Operating Procedure (SOP)===		===Std. Operating Procedure (SOP)===

	*[https://docs.google.com/document/d/136TKc7DE-5XGO_uLtxvBeh9g1WGjIqhhLch1iTa6Wcg/edit?usp=sharing Wet Bench Training SOP 4]		*[https://docs.google.com/document/d/136TKc7DE-5XGO_uLtxvBeh9g1WGjIqhhLch1iTa6Wcg/edit?usp=sharing Wet Bench Training SOP 4] - this is the procedure taught during our Wet Bench Trainings.
			**Contains procedures for using benches safely, chemical safety
			**Additional capabilities at the benches (eg. N2 guns, aspirators etc)

	==Solvent Cleaning Benches==		==Solvent Cleaning Benches==

John d: /* Documentation */ expanded "SOP" acronym

2024-09-25T21:59:34Z

Documentation: expanded "SOP" acronym

← Older revision		Revision as of 21:59, 25 September 2024
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	<br />		<br />

	== Documentation ==		==Documentation==

	=== ~~SOP~~ ===		===Std. Operating Procedure (SOP)===

	* [https://docs.google.com/document/d/136TKc7DE-5XGO_uLtxvBeh9g1WGjIqhhLch1iTa6Wcg/edit?usp=sharing Wet Bench Training SOP 4]		*[https://docs.google.com/document/d/136TKc7DE-5XGO_uLtxvBeh9g1WGjIqhhLch1iTa6Wcg/edit?usp=sharing Wet Bench Training SOP 4]

	==Solvent Cleaning Benches==		==Solvent Cleaning Benches==

Mehalana v: Wet Bench SOP Added

2024-03-21T20:24:14Z

Wet Bench SOP Added

← Older revision		Revision as of 20:24, 21 March 2024
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	*Another warning about safety gear		*Another warning about safety gear
	*Built-in Hotplate calibrations done weekly		*Built-in Hotplate calibrations done weekly

			<br />

			== Documentation ==

			=== SOP ===

			* [https://docs.google.com/document/d/136TKc7DE-5XGO_uLtxvBeh9g1WGjIqhhLch1iTa6Wcg/edit?usp=sharing Wet Bench Training SOP 4]

	==Solvent Cleaning Benches==		==Solvent Cleaning Benches==

John d: added NEVER heat: ISO, Toluene etc.

2023-06-12T23:05:34Z

added NEVER heat: ISO, Toluene etc.

← Older revision		Revision as of 23:05, 12 June 2023
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	*Solvent based processing; '''NO SOLVENT HEATING without staff approval.'''		*Solvent based processing; '''NO SOLVENT HEATING without staff approval.'''
	**NMP is ok to heat to 80°C		**NMP is ok to heat to 80°C
	**~~Acetone~~ should ''never'' be heated.		**The following should '''''never'' be heated''': Acetone, Isopropanol, Methanol, Toluene, Ethanol
	*Organic material removal up to 80°C		*Organic material removal up to 80°C
	*Cyanide-based plating and etching ('''NO ACIDS''' at bench)		*Cyanide-based plating and etching ('''NO ACIDS''' at bench)

John d: /* Detailed Specifications */ minor updates, clarified that NMP can be heated, ACE can not

2023-06-12T18:42:02Z

Detailed Specifications: minor updates, clarified that NMP can be heated, ACE can not

← Older revision		Revision as of 18:42, 12 June 2023
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	}}		}}
	===About===		===About===
	The facility contains 4 stainless steel solvent benches for general processing using organic solvents. All solvent waste (except for certain chemicals that are collected) are poured into cups and centrally collected. The benches consist of 2 embedded variable power Crest-ultrasonic units, one kept at 70°C for heating resist strippers and the other kept at room temperature for general solvent work. Laminar flow fume hoods with ~~hepa~~ filtration. Nitrogen guns are also on both sides of the bench for drying samples. Digital stirring hotplates are included for heating and stirring of resist ~~stripers~~ only (No solvent heating). POLOS spin dryers are included in the benches. All processes are done in user-supplied glassware. Solvents are stored in large steel flammable materials cabinets. Two people may use the bench at a time and protective gear such as proper gloves must be used. Solvents supplied by the laboratory are: Acetone, Methanol, Isopropanol, MIBK, MEK, Toluene, EBR100. PR strippers supplied by the lab are: 1165 (NMP), AZ300T (NMP + TMAH), PRX-127. Other chemicals should be OK'd by laboratory staff prior to use in the laboratory.		The facility contains 4 stainless steel solvent benches for general processing using organic solvents. All solvent waste (except for certain chemicals that are collected) are poured into cups and centrally collected. The benches consist of 2 embedded variable power Crest-ultrasonic units, one kept at 80°C for heating resist strippers and the other kept at room temperature for general solvent work. Laminar flow fume hoods with HEPA filtration. Nitrogen guns are also on both sides of the bench for drying samples. Digital stirring hotplates are included for heating and stirring of resist strippers only (No solvent heating). POLOS spin dryers are included in the benches. All processes are done in user-supplied glassware. Solvents are stored in large steel flammable materials cabinets. Two people may use the bench at a time and protective gear such as proper gloves must be used. Solvents supplied by the laboratory are: Acetone, Methanol, Isopropanol, MIBK, MEK, Toluene, EBR100. PR strippers supplied by the lab are: 1165 (NMP), AZ300T (NMP + TMAH), PRX-127. Other chemicals should be OK'd by laboratory staff prior to use in the laboratory.

	===Detailed Specifications===		===Detailed Specifications===
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	*2 7" x 10" Crest Ultrasonic Tanks with heating / variable power		*2 7" x 10" Crest Ultrasonic Tanks with heating / variable power
	*2 Nitrogen guns for sample drying		*2 Nitrogen guns for sample drying
	*Solvent based processing; '''NO SOLVENT HEATING'''		*Solvent based processing; '''NO SOLVENT HEATING without staff approval.'''
			**NMP is ok to heat to 80°C
			**Acetone should ''never'' be heated.
	*Organic material removal up to 80°C		*Organic material removal up to 80°C
	*Cyanide-based plating and etching ('''NO ACIDS''' at bench)		*Cyanide-based plating and etching ('''NO ACIDS''' at bench)
	*Digital hot plate stirrers		*Digital hot plate stirrers
	*POLOS rinse dryers		*POLOS spin-rinse dryers

	<br clear="all">		<br clear="all">
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	**Proximity and Vacuum baking possible, optional lid closure		**Proximity and Vacuum baking possible, optional lid closure
	**Temperatures checked monthly, ±1°C. Please notify if temperature is out of spec.		**Temperatures checked monthly, ±1°C. Please notify if temperature is out of spec.
	*'''NO WAX''' on hotplates		*'''NO WAX''' on built-in hotplates
	**Use tin-foil to protect plate before using wax. Wax only allowed on user-variable hotplates.		**Use tin-foil to protect plate before using wax. Wax only allowed on user-variable hotplates.
	*Other hotplates for user defined temperatures		*Other hotplates for user defined temperatures
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	*HF & TMAH NOT permitted at these benches		*HF & TMAH NOT permitted at these benches
	*POLOS Spray-Spin-Rinse systems		*POLOS Spray-Spin-Rinse systems
	*~~Hepa~~ Filtered Laminar Flow Hoods		*HEPA Filtered Laminar Flow Hoods

	<br clear="all">		<br clear="all">

John d: /* Develop Benches */ added megasonic

2023-01-04T02:22:20Z

Develop Benches: added megasonic

← Older revision		Revision as of 02:22, 4 January 2023
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	*Hot plates for post bakes		*Hot plates for post bakes
	*POLOS Spray-Puddle-Develop-Rinse-Dry systems		*POLOS Spray-Puddle-Develop-Rinse-Dry systems
			*Megasonic ultrasonicating water sprayer wand (Bay 7)
			**Used for wafer surface cleaning
			**Installed on Bay 7 developer POLOS Spinner

	<br clear="all">		<br clear="all">
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	The following equipment is provided at this bench for various types of electroplating.		The following equipment is provided at this bench for various types of electroplating.

	* DC/Pulsed Power supply		*DC/Pulsed Power supply
	* Hotplate / Stirrer		*Hotplate / Stirrer
	* Cables/electrodes		*Cables/electrodes
	* Chemistry hardware for suspending thermocouples, electrodes and samples in beakers.		*Chemistry hardware for suspending thermocouples, electrodes and samples in beakers.

	Users must provide the following:		Users must provide the following:

	* Beakers for chemicals		*Beakers for chemicals
	* Chemistry for performing the electroplating. [[Frequently Asked Questions#Bring a new chemical.2Fmaterial into the lab\|See this FAQ page]] for info on supplied chemicals and bringing new chemicals.		*Chemistry for performing the electroplating. [[Frequently Asked Questions#Bring a new chemical.2Fmaterial into the lab\|See this FAQ page]] for info on supplied chemicals and bringing new chemicals.
	* Other ancillary hardware (tweezers, cases etc.)<br clear="all">		*Other ancillary hardware (tweezers, cases etc.)<br clear="all">

	==Automated Wet-processing Spinners (POLOS)==		==Automated Wet-processing Spinners (POLOS)==

John d: /* Plating Bench */ added basic info of what is/isn't provided.

2022-11-23T18:41:16Z

Plating Bench: added basic info of what is/isn't provided.

← Older revision		Revision as of 18:41, 23 November 2022
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	\|super2= Mike Day		\|super2= Mike Day
	\|location=Bay 5		\|location=Bay 5
	\|description = ?		\|description = Electroplating chemical bench
	\|manufacturer = Pure Aire Corporation		\|manufacturer = Pure Aire Corporation
	\|materials =		\|materials =
	}}		}}
	===About===		===About===
	Custom plating may be performed at this bench. ~~Please~~ ~~contact~~ ~~staff~~ ~~for~~ ~~more~~ ~~info~~ ~~and~~ ~~for~~ ~~allowed~~ ~~chemicals~~.		Custom plating may be performed at this bench. Gold electroplating can be performed with our automated [[Gold Plating Bench\|SEMCON Gold Plating system]], whereas other electroplating solutions should be used on this acid bench.

	===Detailed Specifications===		===Detailed Specifications===

			The following equipment is provided at this bench for various types of electroplating.
	''To Be Added''<br clear="all">

			* DC/Pulsed Power supply
			* Hotplate / Stirrer
			* Cables/electrodes
			* Chemistry hardware for suspending thermocouples, electrodes and samples in beakers.

			Users must provide the following:

			* Beakers for chemicals
			* Chemistry for performing the electroplating. [[Frequently Asked Questions#Bring a new chemical.2Fmaterial into the lab\|See this FAQ page]] for info on supplied chemicals and bringing new chemicals.
			* Other ancillary hardware (tweezers, cases etc.)<br clear="all">

	==Automated Wet-processing Spinners (POLOS)==		==Automated Wet-processing Spinners (POLOS)==

John d: /* Wafer Toxic Corrosive Benches */ changed to tool2, added MikeDay as backup, added materials,mfg,description

2022-10-19T07:28:44Z

Wafer Toxic Corrosive Benches: changed to tool2, added MikeDay as backup, added materials,mfg,description

← Older revision		Revision as of 07:28, 19 October 2022
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	==Wafer Toxic Corrosive Benches==		==Wafer Toxic Corrosive Benches==
	{{~~tool~~\|		{{tool2\|
	\|name=Wafer Toxic Corrosive Bench		\|name= Wafer Toxic Corrosive Bench
	\|picture=WaferToxicBench.jpg		\|picture= WaferToxicBench.jpg
	\|type = Wet Processing		\|type=Wet Processing
	\|super= Aidan Hopkins		\|super= Aidan Hopkins
			\|super2= Mike Day
	\|location=Bay 4		\|location= Bay 4
	\|description = ?
			\|description= Custom Wafer-level Acid Bench
	\|manufacturer = ?		\|manufacturer= Pure Aire Corporation
	\|materials =
			\|materials= HF, PureStrip, KOH, TMAH
	}}		}}

John d: /* About */ note about HF apron PPE

2022-10-03T17:30:25Z

About: note about HF apron PPE

← Older revision		Revision as of 17:30, 3 October 2022
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	\|manufacturer = ?		\|manufacturer = ?
	\|materials =		\|materials =
	}}		}}

			'''NOTE: There is HF at this bench, so proper safety gear, including an <u>apron and face shield</u> must be worn during use. Failure to abide by this rule will result in immediate suspension from the lab.'''

	===About===		===About===
	This bench has vertical baths for processing multiple wafers at a time, and is situated opposite the [[Tube Furnace (Tystar 8300)\|Tystar Thermal Oxidation furnaces]] in order to perform the necessary cleaning of Silicon wafers prior to oxidation.		This bench has vertical baths for processing multiple wafers at a time, and is situated opposite the [[Tube Furnace (Tystar 8300)\|Tystar Thermal Oxidation furnaces]] in order to perform the necessary cleaning of Silicon wafers prior to oxidation.

John d: /* Detailed Specifications */ linked KOH bath to SUM

2022-10-02T05:51:11Z

Detailed Specifications: linked KOH bath to SUM

← Older revision		Revision as of 05:51, 2 October 2022
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	===About===		===About===
	This bench has vertical baths for processing multiple wafers at a time, and is situated opposite the [[Tube Furnace (Tystar 8300)\|Tystar Thermal Oxidation furnaces]] in order to perform the necessary cleaning of Silicon wafers prior to oxidation.		This bench has vertical baths for processing multiple wafers at a time, and is situated opposite the [[Tube Furnace (Tystar 8300)\|Tystar Thermal Oxidation furnaces]] in order to perform the necessary cleaning of Silicon wafers prior to oxidation.

			Up to 6-inch wafers can be accommodated. 4-inch is typical. Various holders are provided.

	Please contact the supervisor for training on this bench, which includes use of the heater controllers, bubblers etc.		Please contact the supervisor for training on this bench, which includes use of the heater controllers, bubblers etc.
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	*HF Bath, vertical		*HF Bath, vertical
	*~~NanoStrip~~ bath, Vertical		*PureStrip bath, Vertical
	**Heated Bath, typically 70°C during use.		**Heated Bath, typically 70°C during use.
	*Quick-Dump-Rinse (QDR) bath, vertical		*Quick-Dump-Rinse (QDR) bath, vertical
	**Rapid DI water rinse of multiple wafers		**Rapid DI water rinse of multiple wafers
	*KOH bath, vertical		*KOH bath, vertical
			**'''Signups Required [https://signupmonkey.ece.ucsb.edu/cgi-bin/users/browse.cgi?tool_ID=73 on SignupMonkey]'''
	**Heated, Typically ~80-90°C during Silicon etching.		***Heated, Typically ~80-90°C during Silicon etching.
	**Covered for water recapture		***Covered for water recapture
	**N2 Bubbler for improved etch uniformity		***N2 Bubbler for improved etch uniformity
	**Up to 9 wafers at a time		***Up to 9 wafers at a time
	*TMAH Bath, Vertical		*TMAH Bath, Vertical
	*Numerous wafer holders and custom cassette sizes stored at the bench for general use.<br clear="all">		*Numerous wafer holders and custom cassette sizes stored at the bench for general use.<br clear="all">