YES-150C-Various-Resists - Revision history

Jcrode: Text replacement - "/wiki/index.php" to "/w/index.php"

2021-09-04T19:51:14Z

Text replacement - "/wiki/index.php" to "/w/index.php"

← Older revision		Revision as of 19:51, 4 September 2021
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	Once pressure flattens etching is complete.		Once pressure flattens etching is complete.

	There is uncertainty in the exact completion time, somewhere between the peak pressure and the point where it goes flat. Using known PR thicknesses (spun at standard spin speeds - see the [https://wiki.nanotech.ucsb.edu/~~wiki~~/index.php?title=Lithography_Recipes#PositivePR datasheets]) you can estimate etch rate from these plots.		There is uncertainty in the exact completion time, somewhere between the peak pressure and the point where it goes flat. Using known PR thicknesses (spun at standard spin speeds - see the [https://wiki.nanotech.ucsb.edu/w/index.php?title=Lithography_Recipes#PositivePR datasheets]) you can estimate etch rate from these plots.

	[[File:YES150CResists.jpg\|660x660px]]		[[File:YES150CResists.jpg\|660x660px]]

2021-09-04T19:49:23Z

Text replacement - "/wiki/index.php/" to "/wiki/index.php?title="

← Older revision		Revision as of 19:49, 4 September 2021
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	Once pressure flattens etching is complete.		Once pressure flattens etching is complete.

	There is uncertainty in the exact completion time, somewhere between the peak pressure and the point where it goes flat. Using known PR thicknesses (spun at standard spin speeds - see the [https://wiki.nanotech.ucsb.edu/wiki/index.php/Lithography_Recipes#PositivePR datasheets]) you can estimate etch rate from these plots.		There is uncertainty in the exact completion time, somewhere between the peak pressure and the point where it goes flat. Using known PR thicknesses (spun at standard spin speeds - see the [https://wiki.nanotech.ucsb.edu/wiki/index.php?title=Lithography_Recipes#PositivePR datasheets]) you can estimate etch rate from these plots.

	[[File:YES150CResists.jpg\|660x660px]]		[[File:YES150CResists.jpg\|660x660px]]

2020-04-07T01:27:36Z

Text replacement - "www.nanotech.ucsb.edu/wiki/" to "wiki.nanotech.ucsb.edu/wiki/"

← Older revision		Revision as of 01:27, 7 April 2020
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	Once pressure flattens etching is complete.		Once pressure flattens etching is complete.

	There is uncertainty in the exact completion time, somewhere between the peak pressure and the point where it goes flat. Using known PR thicknesses (spun at standard spin speeds - see the [https://~~www~~.nanotech.ucsb.edu/wiki/index.php/Lithography_Recipes#PositivePR datasheets]) you can estimate etch rate from these plots.		There is uncertainty in the exact completion time, somewhere between the peak pressure and the point where it goes flat. Using known PR thicknesses (spun at standard spin speeds - see the [https://wiki.nanotech.ucsb.edu/wiki/index.php/Lithography_Recipes#PositivePR datasheets]) you can estimate etch rate from these plots.

	[[File:YES150CResists.jpg\|660x660px]]		[[File:YES150CResists.jpg\|660x660px]]

2019-09-25T16:46:23Z

link to PR datasheets

← Older revision		Revision as of 16:46, 25 September 2019
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	Once pressure flattens etching is complete.		Once pressure flattens etching is complete.

	There is uncertainty in the exact completion time, somewhere between the peak pressure and the point where it goes flat. Using known PR thicknesses (spun at standard spin speeds - see the datasheets) you can estimate etch rate from these plots.		There is uncertainty in the exact completion time, somewhere between the peak pressure and the point where it goes flat. Using known PR thicknesses (spun at standard spin speeds - see the [https://www.nanotech.ucsb.edu/wiki/index.php/Lithography_Recipes#PositivePR datasheets]) you can estimate etch rate from these plots.

	[[File:YES150CResists.jpg\|660x660px]]		[[File:YES150CResists.jpg\|660x660px]]

2019-09-25T16:45:34Z

← Older revision		Revision as of 16:45, 25 September 2019
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	Once pressure flattens etching is complete.		Once pressure flattens etching is complete.

	There is uncertainty in the exact completion time, somewhere between the peak pressure and the point where it goes flat. Using known PR thicknesses you can estimate etch rate from these plots.		There is uncertainty in the exact completion time, somewhere between the peak pressure and the point where it goes flat. Using known PR thicknesses (spun at standard spin speeds - see the datasheets) you can estimate etch rate from these plots.

	[[File:YES150CResists.jpg\|660x660px]]		[[File:YES150CResists.jpg\|660x660px]]

2019-09-25T16:44:11Z

description

← Older revision		Revision as of 16:44, 25 September 2019
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	Pressure drop indicates completion of etch. ~~Once pressure flattens etching is complete.~~		Pressure drop indicates completion of etch.

			Once pressure flattens etching is complete.
⚫	[[File:YES150CResists.jpg]]

			There is uncertainty in the exact completion time, somewhere between the peak pressure and the point where it goes flat. Using known PR thicknesses you can estimate etch rate from these plots.

		⚫	[[File:YES150CResists.jpg\|660x660px]]

2019-09-19T00:33:30Z

minor edit spelling

← Older revision		Revision as of 00:33, 19 September 2019
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	Pressure drop indicates completion of etch. Once pressure ~~flatttens~~ etching is complete.		Pressure drop indicates completion of etch. Once pressure flattens etching is complete.

	[[File:YES150CResists.jpg]]		[[File:YES150CResists.jpg]]

2019-09-19T00:32:31Z

minor edit

← Older revision		Revision as of 00:32, 19 September 2019
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			Pressure drop indicates completion of etch. Once pressure flatttens etching is complete.

	[[File:YES150CResists.jpg]]		[[File:YES150CResists.jpg]]

2019-09-19T00:26:10Z

New page

[[File:YES150CResists.jpg]]