Vacuum Deposition Recipes: Difference between revisions
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===[[Process Group - Process Control Data#Deposition .28Process Control Data.29|<u>Process Control Data</u>]]=== |
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{{Recipe Table Explanation}} |
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<small>''See [[Process Group - Process Control Data#Deposition .28Process Control Data.29|linked page]] for process control data (calibration data over time, such as dep. rate, refractive index, stress etc.) over time, for a selection of highly used tools/films.''</small> |
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===Deposition Tools/Materials Table=== |
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''The Key/Legend for this table's <code>A...R6</code> values is at the [[Vacuum Deposition Recipes#Process Ranking Table|<u>bottom of the page</u>]].'' |
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| width="65" bgcolor="#daf1ff" |[[Sputtering_Recipes#Sputter_3_.28AJA_ATC_2000-F.29|Sputter 3<br>(AJA ATC 2000-F)]] |
| width="65" bgcolor="#daf1ff" |[[Sputtering_Recipes#Sputter_3_.28AJA_ATC_2000-F.29|Sputter 3<br>(AJA ATC 2000-F)]] |
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| width="65" bgcolor="#daf1ff" |[[Sputtering_Recipes#Sputter_4_.28AJA_ATC_2200-V.29|Sputter 4<br>(AJA ATC 2200-V)]] |
| width="65" bgcolor="#daf1ff" |[[Sputtering_Recipes#Sputter_4_.28AJA_ATC_2200-V.29|Sputter 4<br>(AJA ATC 2200-V)]] |
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| width="65" bgcolor="#daf1ff" |[https://wiki.nanotech.ucsb.edu/ |
| width="65" bgcolor="#daf1ff" |[https://wiki.nanotech.ucsb.edu/w/index.php?title=Sputtering_Recipes#Sputter_5_.28AJA_ATC_2200-V.29 Sputter 5 (AJA ATC 2200-V)] |
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| width="55" bgcolor="#daf1ff" |[[Sputtering_Recipes#Ion_Beam_Deposition_.28Veeco_NEXUS.29|Ion Beam<br>Deposition (Veeco Nexus)]] |
| width="55" bgcolor="#daf1ff" |[[Sputtering_Recipes#Ion_Beam_Deposition_.28Veeco_NEXUS.29|Ion Beam<br>Deposition (Veeco Nexus)]] |
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| width="45" bgcolor="#daf1ff" |[[Thermal Evaporation Recipes#Thermal_Evap_1|Thermal<br>Evap 1]] |
| width="45" bgcolor="#daf1ff" |[[Thermal Evaporation Recipes#Thermal_Evap_1|Thermal<br>Evap 1]] |
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! bgcolor="#d0e7ff" align="center" |Ag |
! bgcolor="#d0e7ff" align="center" |Ag |
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| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 1 .28Sharon.29|R2]] |
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| bgcolor="#eeffff" |{{Al/E3}} |
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| bgcolor="#eeffff" |[[Sputtering Recipes|A]] |
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| bgcolor="#eeffff" |[[Sputtering Recipes|A]] |
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| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 3 .28Temescal.29|R2]] |
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| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 4 .28CHA.29|R2]] |
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| bgcolor="#eeffff" |[[Sputtering Recipes|R1]] |
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| bgcolor="#eeffff" |[[Thermal Evaporation Recipes#Thermal Evaporator 1|R1]] |
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| bgcolor="#eeffff" |[[Thermal Evaporation Recipes#Thermal Evaporator 2|R1]] |
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! bgcolor="#d0e7ff" align="center" |Al |
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|[[E-Beam Evaporation Recipes#E-Beam 1 .28Sharon.29|R2]] |
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|[[E-Beam Evaporation Recipes#E-Beam 3 .28Temescal.29|R2]] |
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|[[Sputtering Recipes| |
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|R1 |
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|<br>[[Sputtering_Recipes#Ion_Beam_Deposition_.28Veeco_NEXUS.29|A]] |
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|[[Thermal Evaporation Recipes| |
|[[Thermal Evaporation Recipes#Thermal Evaporator 1|R3]] |
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! bgcolor="#d0e7ff" align="center" |Al<sub>2</sub>O<sub>3</sub> |
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| bgcolor="#eeffff" |[https://wiki.nanotech.ucsb.edu/wiki/index.php/Sputtering_Recipes#Al2O3_deposition_.28IBD.29 R] |
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| bgcolor="#eeffff" |[[Atomic Layer Deposition Recipes#Al2O3 deposition .28ALD CHAMBER 3.29|R4]] |
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| bgcolor="#eeffff" |{{rl|Atomic Layer Deposition Recipes|Al2O3 deposition (ALD CHAMBER 3)}} |
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|[[E-Beam Evaporation Recipes#E-Beam 1 .28Sharon.29|R1]] |
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! bgcolor="#d0e7ff" align="center" |AlN |
! bgcolor="#d0e7ff" align="center" |AlN |
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|[[Sputtering_Recipes#Ion_Beam_Deposition_.28Veeco_NEXUS.29|A]] |
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! bgcolor="#d0e7ff" align="center" |Au |
! bgcolor="#d0e7ff" align="center" |Au |
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| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 1 .28Sharon.29|R2]] |
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| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 3 .28Temescal.29|R2]] |
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| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 4 .28CHA.29|R2]] |
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| bgcolor="#eeffff" |[[Sputtering Recipes| |
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! bgcolor="#d0e7ff" align="center" |C |
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| bgcolor="#eeffff" align="center" |[[E-Beam Evaporation Recipes#E-Beam 1 .28Sharon.29|R3]] |
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! bgcolor="#d0e7ff" align="center" |CeO<sub>2</sub> |
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! bgcolor="#d0e7ff" align="center" |Ge |
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! bgcolor="#d0e7ff" align="center" |Nb |
! bgcolor="#d0e7ff" align="center" |Nb |
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! bgcolor="#d0e7ff" align="center" |Ni |
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| bgcolor="#eeffff" | |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" | |
| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 3 .28Temescal.29|R2]] |
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| bgcolor="#eeffff" |[[Thermal Evaporation Recipes| |
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! bgcolor="#d0e7ff" align="center" |Pd |
! bgcolor="#d0e7ff" align="center" |Pd |
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|[[E-Beam Evaporation Recipes#E-Beam 1 .28Sharon.29|R2]] |
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|{{Al/E1}} |
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|<br> |
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|[[E-Beam Evaporation Recipes#E-Beam 3 .28Temescal.29|R2]] |
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|[[E-Beam Evaporation Recipes#E-Beam 4 .28CHA.29|R2]] |
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|[[Thermal Evaporation Recipes#Thermal Evaporator 1|R3]] |
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! bgcolor="#d0e7ff" align="center" |Pt |
! bgcolor="#d0e7ff" align="center" |Pt |
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| bgcolor="#eeffff" | |
| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 1 .28Sharon.29|R2]] |
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| bgcolor="#eeffff" |<br> |
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| bgcolor="#eeffff" |{{Al/E3}} |
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| bgcolor="#eeffff" |{{Al/E4}} |
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| bgcolor="#eeffff" |[[Sputtering Recipes|A]] |
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| bgcolor="#eeffff" |{{rl|Sputtering Recipes|Sputter 4 (AJA ATC 2200-V)}} |
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| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 3 .28Temescal.29|R2]] |
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| bgcolor="#eeffff" |[[E-Beam Evaporation Recipes#E-Beam 4 .28CHA.29|R2]] |
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| bgcolor="#eeffff" |[[Sputtering Recipes|R3]] |
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| bgcolor="#eeffff" |[[Sputtering Recipes|R3]] |
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| bcolor="EEFFFF" |[[Sputtering Recipes|R3]] |
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| bgcolor="#eeffff" | |
| bgcolor="#eeffff" |[[Atomic Layer Deposition Recipes#Pt deposition .28ALD CHAMBER 1.29|R4]] |
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| bgcolor="#eeffff" |<br> |
| bgcolor="#eeffff" |<br> |
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|- |
|- |
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! bgcolor="#d0e7ff" align="center" |Ru |
! bgcolor="#d0e7ff" align="center" |Ru |
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|[[E-Beam Evaporation Recipes#E-Beam 1 .28Sharon.29|R2]] |
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|{{Al/E1}} |
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|<br> |
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|<br> |
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|[[E-Beam Evaporation Recipes#E-Beam 4 .28CHA.29|R2]] |
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|{{Al/E4}} |
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|<br> |
|<br> |
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|[[Sputtering Recipes#Ru Deposition .28Sputter 4.29|R3]] |
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|<br> |
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|{{rl|Atomic Layer Deposition Recipes|Ru deposition (ALD CHAMBER 1)}} |
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| bgcolor="#eeffff" |<br>[[Sputtering_Recipes#Ion_Beam_Deposition_.28Veeco_NEXUS.29|A]] |
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| bgcolor="#eeffff" |<br>[[Sputtering_Recipes#Ion_Beam_Deposition_.28Veeco_NEXUS.29|A]] |
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| bgcolor="#eeffff" |[[Atomic Layer Deposition Recipes#Pt deposition .28ALD CHAMBER 1.29|R4]] |
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| bgcolor="#eeffff" |{{rl|Atomic Layer Deposition Recipes|ZrO2 deposition (ALD CHAMBER 3)}} |
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===Process Ranking Table=== |
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Processes in the table above are ranked by their "''Process Maturity Level''" as follows: |
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{| class="wikitable" |
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|'''Process Level''' |
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| colspan="11" |'''Description of Process Level Ranking''' |
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|- |
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|A |
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| colspan="11" |Process '''A'''llowed and materials available but never done |
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|- |
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|R1 |
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| colspan="11" |Process has been ran at least once |
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|- |
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|R2 |
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| colspan="11" |Process has been ran and/or procedure is documented or/and data available |
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|- |
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|R3 |
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| colspan="11" |Process has been ran, procedure is documented, and data is available |
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|- |
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|R4 |
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| colspan="11" |Process has a documented procedure with regular (≥4x per year) data '''or''' lookahead/in-Situ control available |
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|- |
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|R5 |
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| colspan="11" |Process has a documented procedure with regular (≥4x per year) data '''and''' lookahead/in-Situ control available |
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|- |
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|R6 |
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| colspan="11" |Process has a documented procedure, regular ( ≥4x per year) data, and control charts/limits available |
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|} |
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[[Category:Processing]] |
[[Category:Processing]] |
Latest revision as of 21:57, 7 November 2024
Process Control Data
See linked page for process control data (calibration data over time, such as dep. rate, refractive index, stress etc.) over time, for a selection of highly used tools/films.
Deposition Tools/Materials Table
The Key/Legend for this table's A...R6
values is at the bottom of the page.
Process Ranking Table
Processes in the table above are ranked by their "Process Maturity Level" as follows:
Process Level | Description of Process Level Ranking | ||||||||||
A | Process Allowed and materials available but never done | ||||||||||
R1 | Process has been ran at least once | ||||||||||
R2 | Process has been ran and/or procedure is documented or/and data available | ||||||||||
R3 | Process has been ran, procedure is documented, and data is available | ||||||||||
R4 | Process has a documented procedure with regular (≥4x per year) data or lookahead/in-Situ control available | ||||||||||
R5 | Process has a documented procedure with regular (≥4x per year) data and lookahead/in-Situ control available | ||||||||||
R6 | Process has a documented procedure, regular ( ≥4x per year) data, and control charts/limits available |