Dicing Saw (ADT)

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Dicing Saw (ADT)
Location Backend Lab: ESB 1111
Tool Type Packaging
Manufacturer Advanced Dicing Technologies Ltd.
Model ADT 7100
Description ADT Dicing Saw

Primary Supervisor Lee Sawyer
(805) 893-2123

Secondary Supervisor

Aidan Hopkins


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The Model 7100 Series is a semi-automatic dicing saw. Semiconductor, glass, and plastic substrates of all types can be automatically or manually cut. This dicing Saw is optimized for multi-angle dicing of tight tolerance substrates up to 200 mm diameter in size.

Check the Dicing Saw Recipes page for the blades we currently stock.

An ADT WM-966 tape applicator is used to mount samples to UV-release tape for dicing and an Ultron Systems UH104-8 UV lamp system is used to release samples post dicing.

Contact Staff for blades and dicing frames for your group.

Detailed Specifications

  • Maximum Wafer Size: 8"
  • Parts mounted to UV-release tape for dicing
  • Automated cut maps at multiple angles (0° and 90° typical)
  • ~Few micron alignment to on-wafer features.
  • Thermocarbon Resnoid dicing blades provided by Staff

Operating Procedures


Be sure to also see the recipes for protecting your sample from dicing dust, and mounting/unmounting.