ICP Etch 1 (Panasonic E646V): Difference between revisions

From UCSB Nanofab Wiki
Jump to navigation Jump to search
No edit summary
Line 9: Line 9:
|toolid=22
|toolid=22
}}
}}
= About =
= About =


⚫
This is a multi-chamber tool for etching of a variety of materials. The chamber is configured as an ICP etching tool with 1250 W ICP power, 600 W RF substrate power, and RT-80°C operation with back-side He cooling and an electrostatic chuck to maintain controlled surface temperatures during etching. This chamber has Cl<sub>2</sub>, BCl<sub>3</sub>, CF<sub>4</sub>, CHF<sub>3</sub>, SF<sub>6</sub>, Ar, N<sub>2</sub>, He, and O<sub>2</sub> for gas sources and can be used to etch a variety of materials from SiO<sub>2</sub> to metals to compound semiconductors. The chamber evacuated with a 2000 lpm Osaka Vacuum magnetically levitated turbo pump, allowing for fast pump down. The system accepts 6” wafers (JEIDA Std) or pieces mounted to the wafers.
This ICP is a time machine. It can literally take you into the future of nanotechnology. Just look at it. Amazing!

⚫
This is a single-chamber tool for etching of a variety of materials. The chamber is configured as an ICP etching tool with 1250 W ICP power, 600 W RF substrate power, and RT-80°C operation with back-side He cooling and an electrostatic chuck to maintain controlled surface temperatures during etching. This chamber has Cl<sub>2</sub>, BCl<sub>3</sub>, CF<sub>4</sub>, CHF<sub>3</sub>, SF<sub>6</sub>, Ar, N<sub>2</sub>, He, and O<sub>2</sub> for gas sources and can be used to etch a variety of materials from SiO<sub>2</sub> to metals to compound semiconductors. The chamber evacuated with a 2000 lpm Osaka Vacuum magnetically levitated turbo pump, allowing for fast pump down. The system accepts 6” wafers (JEIDA Std) or pieces mounted to the wafers.


= Detailed Specifications =
= Detailed Specifications =
Line 24: Line 22:
*Load-Locked
*Load-Locked
*Up to 20 steps per recipe
*Up to 20 steps per recipe
*Laser monitor with 679.60nm wavelength


=Documentation=
=Documentation=
*{{fl|ICP1-Gas-Change-CHF3-AR.pdf|Gas Change Procedure (CHF3 & AR)}}
*{{fl|ICP1-Gas-Change-CHF3-AR.pdf|Gas Change Procedure (CHF3 & AR)}}
*{{fl|Gas Change CF4-SF6-CF4.pdf|Gas Change Procedure (CF4 & SF6)}}
*{{fl|Gas Change CF4-SF6-CF4.pdf|Gas Change Procedure (CF4 & SF6)}}
*{{file|Panasonic 1 instructions.pdf|Panasonic _1_instructions.pdf}}
*{{fl|Changing N2 to He.pdf|Gas Change Procedure (N2 & He)}}

Revision as of 22:50, 13 June 2015

ICP Etch 1 (Panasonic E646V)
ICP2.jpg
Tool Type Dry Etch
Location Bay 2
Supervisor Don Freeborn
Supervisor Phone (805) 893-7975
Supervisor E-Mail dfreeborn@ece.ucsb.edu
Description ?
Manufacturer Panasonic Factory Solutions, Japan
Dry Etch Recipes
Sign up for this tool


About

This is a multi-chamber tool for etching of a variety of materials. The chamber is configured as an ICP etching tool with 1250 W ICP power, 600 W RF substrate power, and RT-80°C operation with back-side He cooling and an electrostatic chuck to maintain controlled surface temperatures during etching. This chamber has Cl2, BCl3, CF4, CHF3, SF6, Ar, N2, He, and O2 for gas sources and can be used to etch a variety of materials from SiO2 to metals to compound semiconductors. The chamber evacuated with a 2000 lpm Osaka Vacuum magnetically levitated turbo pump, allowing for fast pump down. The system accepts 6” wafers (JEIDA Std) or pieces mounted to the wafers.

Detailed Specifications

  • 1250 W ICP source, 600 W RF Sample Bias Source in etching chamber
  • RT - 80°C sample temperature for etching
  • Etch pressure from 0.1 Pa to 5 Pa (0.75 mT - 37.5 mT)
  • Cl2, BCl3, CF4, CHF3, SF6, Ar, N2, He, and O2 in etch chamber
  • Pieces possible by mounting to 6” wafer
  • Load-Locked
  • Up to 20 steps per recipe

Documentation

Retrieved from "https://wiki.nanofab.ucsb.edu/w/index.php?title=ICP_Etch_1_(Panasonic_E646V)&oldid=153647"