Test Data of etching SiO2 with CHF3/CF4: Difference between revisions

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{| class="wikitable"
| colspan="5" |ICP#1: 0.5Pa, 50/900W, CHF3/CF4=10/30 sccm, time=210 sec
| colspan="5" |ICP#2: 0.5Pa, 50/900W, CHF3/CF4=10/30 sccm, time=210 sec
|-
|-
|Date
|Date
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|Etch Selectivity (SiO2/PR)
|Etch Selectivity (SiO2/PR)
|Averaged Sidewall Angle (<sup>o</sup>)
|Averaged Sidewall Angle (<sup>o</sup>)
|-
|10-8-2018
|SiO2#02
|160
|1.23
|82.1
|-
|-
|1/28/2019
|1/28/2019
|I21901
|I11901
|110
|146
|1.35
|1.23
|
|
|}
|}

Revision as of 18:26, 29 January 2019

ICP#2: 0.5Pa, 50/900W, CHF3/CF4=10/30 sccm, time=210 sec
Date Sample# Etch Rate (nm/min) Etch Selectivity (SiO2/PR) Averaged Sidewall Angle (o)
10-8-2018 SiO2#02 160 1.23 82.1
1/28/2019 I21901 146 1.23

File:SiO2 Etch using ICP2-no O2-a.pdf