Automated Coat/Develop System (S-Cubed Flexi): Difference between revisions

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=About=
=About=


The S3 is a Coater/Developer system that has 4 hotplate each with independent temperature control and a chill plate. A central robot picks your wafer/s from a cassette, processes them and returns them to the cassette. The system is recipe driven with a high degree of process control and minimal backside contamination. At this time only full size substrates are allowed on this system. The S3 Coater is still in process development and not open for general use.
The S3 is a Coater/Developer system that has 4 hotplates each with independent temperature control and a chill plate. A central robot picks your wafer/s from a cassette, processes them and returns them to the cassette. The system is recipe driven with a high degree of process control and minimal backside contamination. At this time only full size substrates are allowed on this system. The S3 Coater is still in process development and not open for general use.


=Detailed Specifications=
=Detailed Specifications=

Revision as of 19:36, 24 February 2020

Automated Coat/Develop System (S-Cubed Flexi)
TBD.jpg
Tool Type Wet Processing
Location Bay 7
Supervisor Tony Bosch
Supervisor Phone (805) 893-3486
Supervisor E-Mail bosch@ece.ucsb.edu
Description Automatic Coat/Bake/Develop
Manufacturer S-Cubed
Model Flexi (Custom)
Wet Processing Recipes
Sign up for this tool 


THIS TOOL IS ONLY FOR STAFF USE AT THIS TIME.

About

The S3 is a Coater/Developer system that has 4 hotplates each with independent temperature control and a chill plate. A central robot picks your wafer/s from a cassette, processes them and returns them to the cassette. The system is recipe driven with a high degree of process control and minimal backside contamination. At this time only full size substrates are allowed on this system. The S3 Coater is still in process development and not open for general use.

Detailed Specifications

  • Wafer Size: 100mm (150mm possible but not set up)
  • PR Coating Properties:
    • Uniformity < 1.0%
    • < 100 particles on 100mm wafer
  • Photoresists/Underlayers Available:
    • UV6-0.8
    • DS-K101-304
    • PMMA
    • PMGI SF11
    • PMGI SF5
  • Solvents Available:
    • EBR100
  • Developers Available:
    • AZ 300 MiF

Process Information

Operating Procedures

  • To Be Added
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