Lithography Recipes: Difference between revisions

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*{{fl|Liftoff-Techniques.pdf|Description/Tutorial}}
*{{fl|Liftoff-Techniques.pdf|Description/Tutorial}}
*{{fl|Bi-LayerContactprocesswithPMGI.pdf|Bi-Layer Process with PMGI Underlayer and Contact Aligner}}
*{{fl|Bi-LayerContactprocesswithPMGI.pdf|Bi-Layer Process with PMGI Underlayer and Contact Aligner}}
==Recipes==
<br>
{{Recipe Table Explanation}}
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Revision as of 20:23, 8 November 2012

Lift-Off Techniques

Recipes

  • R = Recipe is available. Clicking this link will take you to the recipe.
  • A = Material is available for use, but no recipes are provided.
Lithography Recipes

Contact Aligners Steppers Flood Expose E-Beam Lithography
Positive Resists SUSS MJB-3 SUSS MA-6 Stepper 1
(GCA 6300)
Stepper 2
(AutoStep 200)
Stepper 3
(ASML DUV)
MLA150
(Heidelberg)
AZ4110 R1
AZ4210 R1






AZ4330RS R1
OCG 825-35CS







SPR 950-0.8
SPR 955 CM-0.9







SPR 955 CM-1.8
SPR 220-3.0 R1






SPR 220-7.0 R1
THMR-IP3600 HP D







UV6-0.7
Negative Resists SUSS MJB-3 SUSS MA-6 Stepper 1
(GCA 6300)
Stepper 2
(AutoStep 200)
Stepper 3
(ASML DUV)
MLA150
(Heidelberg)
AZ5214-EIR R1
AZnLOF 2020 R1
AZnLOF 2035
AZnLOF 2070
AZnLOF P5510
UVN30-0.5
SU-8 2015
Underlayers SUSS MJB-3 SUSS MA-6 Stepper 1
(GCA 6300)
Stepper 2
(AutoStep 200)
Stepper 3
(ASML DUV)
MLA150
(Heidelberg)
PMGI SF-11







PMGI SF-15
LOL 2000
XHRIC-11 (BARC)
AR-2 (BARC)
DS-K 101-307 (BARC)
Overlayers SUSS MJB-3 SUSS MA-6 Stepper 1
(GCA 6300)
Stepper 2
(AutoStep 200)
Stepper 3
(ASML DUV)
MLA150
(Heidelberg)
CEM-365 IS
E-Beam Resists SUSS MJB-3 SUSS MA-6 Stepper 1
(GCA 6300)
Stepper 2
(AutoStep 200)
Stepper 3
(ASML DUV)
MLA150
(Heidelberg)
??????
???????
Nanoimprint Resists SUSS MJB-3 SUSS MA-6 Stepper 1
(GCA 6300)
Stepper 2
(AutoStep 200)
Stepper 3
(ASML DUV)
MLA150
(Heidelberg)
MR-I 7020
Nanonex NX-1020
SUSS MJB-3 SUSS MA-6 Stepper 1
(GCA 6300)
Stepper 2
(AutoStep 200)
Stepper 3
(ASML DUV)
MLA150
(Heidelberg)