Wet Etching Recipes: Difference between revisions

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=Compound Semiconductor Etching=
=Compound Semiconductor Etching=

{| class="wikitable sortable"
|-
! Material !! Etchant !! Rate (nm/min) !! Anisotropy !! Selective to !! Selectivity !! Ref. !! Notes !! Confirmed by !! Header text
|-
| InP|| Example || Example || Example || Example || Example || Example || Example || Example || Example
|-
| GaAs|| Example || Example || Example || Example || Example || Example || Example || Example || Example
|-
| GaN|| Example || Example || Example || Example || Example || Example || Example || Example || Example
|}


=Metal Etching=
=Metal Etching=

Revision as of 18:06, 6 November 2013

Compound Semiconductor Etching

Material Etchant Rate (nm/min) Anisotropy Selective to Selectivity Ref. Notes Confirmed by Header text
InP Example Example Example Example Example Example Example Example Example
GaAs Example Example Example Example Example Example Example Example Example
GaN Example Example Example Example Example Example Example Example Example

Metal Etching

Silicon etching

Dielectric etching

Organic removal

Gold Plating

Chemi-Mechanical Polishing (CMP)