InP Etch Rate and Selectivity (InP/SiO2): Difference between revisions
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| colspan="4" |1.4 mT, 125/800W, Cl2/H2/Ar flow-rate=6.3/12.7/2 sccm, chuck temperature=200 C, and etch time=90s (Prior to the etch, do O2 plasma chamber clean for 15 minutes, then, chamber coating with the same recipe and a quarter dummy InP on carrier for 15 minutes. |
| colspan="4" |[https://wiki.nanotech.ucsb.edu/w/images/4/45/IP210201.pdf 1.4] mT, 125/800W, Cl2/H2/Ar flow-rate=6.3/12.7/2 sccm, chuck temperature=200 C, and etch time=90s (Prior to the etch, do O2 plasma chamber clean for 15 minutes, then, chamber coating with the same recipe and a quarter dummy InP on carrier for 15 minutes. |
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|8.9 |
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|[https://wiki.nanotech.ucsb.edu/wiki/images/9/9b/IP161332.pdf] |
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|12/1/2016 |
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|0.96 |
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|12.1 |
|12.1 |
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|[https://wiki.nanotech.ucsb.edu/wiki/images/e/ed/IP161421.pdf] |
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|12/15/2016 |
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|0.91 |
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|9.3 |
|9.3 |
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|[https://wiki.nanotech.ucsb.edu/wiki/images/6/64/IP161510.pdf] |
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|1/23/2017 |
|1/23/2017 |
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|0.93 |
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|9.4 |
|9.4 |
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|[https:// |
|[https://wiki.nanotech.ucsb.edu/wiki/images/7/7f/IP170106.pdf] |
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|2/7/2017 |
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|0.75 |
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|7.7 |
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|[https:// |
|[https://wiki.nanotech.ucsb.edu/wiki/images/2/2f/IP170208.pdf] |
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|2/21/2017 |
|2/21/2017 |
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|0.91 |
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|11.3 |
|11.3 |
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|[https:// |
|[https://wiki.nanotech.ucsb.edu/wiki/images/b/b8/IP170302.pdf] |
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|3/21/2017 |
|3/21/2017 |
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|1.01 |
|1.01 |
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|11.3 |
|11.3 |
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|[https://wiki.nanotech.ucsb.edu/wiki/images/f/fd/IP170404.pdf] |
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|4/20/2017 |
|4/20/2017 |
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|0.88 |
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|10.2 |
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|[https://wiki.nanotech.ucsb.edu/wiki/images/5/5b/IP170505.pdf] |
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|5/4/2017 |
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|0.84 |
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|[https://wiki.nanotech.ucsb.edu/wiki/images/d/d1/IP170603.pdf] |
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|5/19/2017 |
|5/19/2017 |
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|0.82 |
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|9.9 |
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|[https://wiki.nanotech.ucsb.edu/wiki/images/7/7f/IP170706.pdf] |
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|7/6/2017 |
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|0.98 |
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|12.1 |
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|[https://wiki.nanotech.ucsb.edu/wiki/images/a/ac/IP172520.pdf] |
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|8/16/2017 |
|8/16/2017 |
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|[https://wiki.nanotech.ucsb.edu/wiki/images/f/fa/IP172805.pdf] |
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|8/28/2017 |
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|11.7 |
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|[https://wiki.nanotech.ucsb.edu/wiki/images/a/aa/IP172905.pdf] |
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|10/11/2017 |
|10/11/2017 |
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|[https://wiki.nanotech.ucsb.edu/wiki/images/9/97/IP173009.pdf] |
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|10/23/2017 |
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|1.11 |
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|13.1 |
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|[https://wiki.nanotech.ucsb.edu/wiki/images/4/41/IP173107.pdf] |
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|11/21/2017 |
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|1.04 |
|1.04 |
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|12.1 |
|12.1 |
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|[https://wiki.nanotech.ucsb.edu/wiki/images/0/02/IP173203.pdf] |
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|12/7/2017 |
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|10.4 |
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|[https://wiki.nanotech.ucsb.edu/wiki/images/0/03/IP173306.pdf] |
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|1/2/2018 |
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|1.44 |
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|14.3 |
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|[https:// |
|[https://wiki.nanotech.ucsb.edu/wiki/images/0/0d/IP180104.pdf] |
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|3/1/2018 |
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|[https:// |
|[https://wiki.nanotech.ucsb.edu/wiki/images/6/65/IP180207.pdf] |
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|4/5/2018 |
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|1.05 |
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|11.9 |
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|[https:// |
|[https://wiki.nanotech.ucsb.edu/wiki/images/c/c7/IP180304.pdf] |
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|4/10/2018 |
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|1.12 |
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|12.8 |
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|[https:// |
|[https://wiki.nanotech.ucsb.edu/wiki/images/1/17/IP180406.pdf] |
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|4/26/2018 |
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|1.29 |
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|13.6 |
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|[https:// |
|[https://wiki.nanotech.ucsb.edu/wiki/images/c/c8/IP180508.pdf] |
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|5/22/2018 |
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|8.4 |
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|[https:// |
|[https://wiki.nanotech.ucsb.edu/wiki/images/e/e1/IP180606.pdf] |
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|8/7/2018 |
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|8.0 |
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|[https:// |
|[https://wiki.nanotech.ucsb.edu/wiki/images/f/fb/IP180705.pdf] |
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|10/3/2018 |
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|13.7 |
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|[https:// |
|[https://wiki.nanotech.ucsb.edu/wiki/images/e/e5/IP180805.pdf] |
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|12/10/2018 |
|12/10/2018 |
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|1.01 |
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|11.4 |
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|[https:// |
|[https://wiki.nanotech.ucsb.edu/wiki/images/8/84/IP180909.pdf] |
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|1/31/2019 |
|1/31/2019 |
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|9.7 |
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|[https:// |
|[https://wiki.nanotech.ucsb.edu/wiki/images/b/b7/IP190101.pdf][https://wiki.nanotech.ucsb.edu/wiki/images/0/06/IP190103.pdf] |
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|8/30/2020 |
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|InP#2001 |
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|1.11 |
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|10.4 |
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|[https://wiki.nanotech.ucsb.edu/w/images/8/8d/IP020104.pdf] |
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|2/3/2021 |
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|InP#2101 |
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|1.30 |
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|16 |
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|[https://wiki.nanotech.ucsb.edu/w/images/4/47/IP210117.pdf][https://wiki.nanotech.ucsb.edu/w/images/d/d4/IP210119.pdf] |
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|11/8/2021 |
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|InP#2102 |
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|1.24 |
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|13.8 |
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|[https://wiki.nanotech.ucsb.edu/w/images/4/45/IP210201.pdf][https://wiki.nanotech.ucsb.edu/w/images/4/49/IP210212.pdf] |
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Latest revision as of 01:00, 9 November 2021
1.4 mT, 125/800W, Cl2/H2/Ar flow-rate=6.3/12.7/2 sccm, chuck temperature=200 C, and etch time=90s (Prior to the etch, do O2 plasma chamber clean for 15 minutes, then, chamber coating with the same recipe and a quarter dummy InP on carrier for 15 minutes. | ||||
Date | Sample# | InP Etch Rate (um/min) | Selectivity (InP/SiO2) | Profile SEM Picture |
10/4/2016 | InP#1613 | 0.92 | 8.9 | [1] |
12/1/2016 | InP#1614 | 0.96 | 12.1 | [2] |
12/15/2016 | InP#1615 | 0.91 | 9.3 | [3] |
1/23/2017 | InP#1701 | 0.93 | 9.4 | [4] |
2/7/2017 | InP#1702 | 0.75 | 7.7 | [5] |
2/21/2017 | InP#1703 | 0.91 | 11.3 | [6] |
3/21/2017 | InP#1704 | 1.01 | 11.3 | [7] |
4/20/2017 | inP#1705 | 0.88 | 10.2 | [8] |
5/4/2017 | InP#1706 | 0.84 | 11 | [9] |
5/19/2017 | InP#1707 | 0.82 | 9.9 | [10] |
7/6/2017 | InP#1708 | 0.98 | 12.1 | [11] |
8/16/2017 | InP#1709 | 0.76 | 8 | [12] |
8/28/2017 | InP#1710 | 1 | 11.7 | [13] |
10/11/2017 | InP#1711 | 1 | 11 | [14] |
10/23/2017 | InP#1712 | 1.11 | 13.1 | [15] |
11/21/2017 | InP#1713 | 1.04 | 12.1 | [16] |
12/7/2017 | InP#1714 | 0.96 | 10.4 | [17] |
1/2/2018 | InP#1801 | 1.44 | 14.3 | [18] |
3/1/2018 | InP#1802 | 0.96 | 9 | [19] |
4/5/2018 | InP#1803 | 1.05 | 11.9 | [20] |
4/10/2018 | InP#1804 | 1.12 | 12.8 | [21] |
4/26/2018 | InP#1805 | 1.29 | 13.6 | [22] |
5/22/2018 | InP#1806 | 0.88 | 8.4 | [23] |
8/7/2018 | InP#1807 | 0.81 | 8.0 | [24] |
10/3/2018 | InP#1808 | 1.01 | 13.7 | [25] |
12/10/2018 | InP#1809 | 1.01 | 11.4 | [26] |
1/31/2019 | InP#1901 | 0.88 | 9.7 | [27][28] |
8/30/2020 | InP#2001 | 1.11 | 10.4 | [29] |
2/3/2021 | InP#2101 | 1.30 | 16 | [30][31] |
11/8/2021 | InP#2102 | 1.24 | 13.8 | [32][33] |