File:SEM Image.png: Difference between revisions
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Wafer had UV6 or UVN30 as mask. 5min Si etch followed by PostBARC Etch/PR Strip (STD)_V2 with 2min over etch |
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Mask |
Latest revision as of 18:50, 28 January 2025
Wafer had UV6 or UVN30 as mask. 5min Si etch followed by PostBARC Etch/PR Strip (STD)_V2 with 2min over etch
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current | 18:47, 28 January 2025 | 1,500 × 603 (706 KB) | Gopimeena (talk | contribs) |
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