Test Data of etching SiO2 with CHF3/CF4: Difference between revisions
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|Etch Selectivity (SiO2/PR) |
|Etch Selectivity (SiO2/PR) |
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|Averaged Sidewall Angle (<sup>o</sup>) |
|Averaged Sidewall Angle (<sup>o</sup>) |
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|10/5/2018 |
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|SiO2#02 |
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|160 |
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|1.2 |
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|82.1 |
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|1/28/2019 |
|1/28/2019 |
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|I11901 |
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|I21901 |
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Revision as of 18:13, 29 January 2019
ICP#2: 0.5Pa, 50/900W, CHF3/CF4=10/30 sccm, time=210 sec | ||||
Date | Sample# | Etch Rate (nm/min) | Etch Selectivity (SiO2/PR) | Averaged Sidewall Angle (o) |
1/28/2019 | I11901 |