Test Data of etching SiO2 with CHF3/CF4: Difference between revisions

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add one more SEM pic
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|1.2
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|82.1
|82.1
|[https://www.nanotech.ucsb.edu/wiki/index.php/File:SiO2_Etch_using_ICP2-no_O2.pdf :File:SiO2 Etch using ICP2-no O2.pdf]
|[https://www.nanotech.ucsb.edu/wiki/index.php/File:SiO2_Etch_using_ICP2-no_O2.pdf]
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|1/28/2019
|1/28/2019

Revision as of 17:26, 31 January 2019

ICP#2: 0.5Pa, 50/900W, CHF3/CF4=10/30 sccm, time=210 sec
Date Sample# Etch Rate (nm/min) Etch Selectivity (SiO2/PR) Averaged Sidewall Angle (o) SEM Images
10/5/2018 SiO2#02 160 1.2 82.1 [1]
1/28/2019 I21901 146 1.23 [2]
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