NanoFab Process Group: Difference between revisions
Jump to navigation
Jump to search
(Text replacement - "www.nanotech.ucsb.edu/wiki/" to "wiki.nanotech.ucsb.edu/wiki/") |
(Text replacement - "/wiki/index.php/" to "/wiki/index.php?title=") |
||
| Line 1: | Line 1: | ||
''This page lists various processes used internally by the [https://wiki.nanotech.ucsb.edu/wiki/index.php |
''This page lists various processes used internally by the [https://wiki.nanotech.ucsb.edu/wiki/index.php?title=Staff_List#Process_Group NanoFab Process Group].'' |
||
== Dicing Procedures == |
== Dicing Procedures == |
||
Revision as of 19:49, 4 September 2021
This page lists various processes used internally by the NanoFab Process Group.
Dicing Procedures
Photoresist Application, Cleaning and Shipping
- PR Spin for Dicing Protect - ~800nm thick PR only (UV6)
- PR Clean of UV-6
- Shipping Samples on Dicing Tape+Frame
Dicing Alignment Mark Exposure
For providing alignment marks to use while dicing.
- ASML Stepper #3: Dicing Alignment Guides
- How to program the ASML to shoot some alignment markers for use during dicing.
Process Control Calibration Procedures
Etching Tools
- Unaxis PM1: Indium Phosphide Etch Verification Procedure
- ICP#1/2: SiO2 Etch Verification Procedure
- PlasmaTherm SLR: SiO2 Etch Verification Procedure
- PlasmaTherm DSEiii: Si Etch Verification Procedure
Deposition Tools
- PECVD#1: Process Verification Procedure
- PECVD#2: Process Verification Procedure
- Unaxis PM3: Process Verification Procedure
- Veeco IBD: Process Verification Procedure