Test Data of etching SiO2 with CHF3/CF4: Difference between revisions
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|0.86 |
|0.86 |
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|air leaking to CHF3 channel |
|caused by air leaking to CHF3 channel |
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|[https://wiki.nanotech.ucsb.edu/w/images/d/d4/I2200203.pdf] |
|[https://wiki.nanotech.ucsb.edu/w/images/d/d4/I2200203.pdf] |
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Revision as of 00:21, 11 August 2020
| ICP#2: 0.5Pa, 50/900W, CHF3/CF4=10/30 sccm, time=210 sec | |||||
| Date | Sample# | Etch Rate (nm/min) | Etch Selectivity (SiO2/PR) | Averaged Sidewall Angle (o) | SEM Images |
| 10/5/2018 | SiO2#02 | 160 | 1.2 | 82.1 | [1] |
| 1/28/2019 | I21901 | 146 | 1.23 | [2] | |
| 3/6/2019 | I21904 | 151 | 1.23 | 85.6 | [3] |
| 7/18/2019 | I21905 | 162 | 1.37 | [4] | |
| 1/16/2020 | I22001 | 149 | 1.21 | [5] | |
| 8/9/2020 | I22002 | 102 | 0.86 | caused by air leaking to CHF3 channel | [6] |