Test Data of etching SiO2 with CHF3/CF4: Difference between revisions

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|caused by air leaking to CHF3 channel
|caused by air leaking to CHF3 channel
|[https://wiki.nanotech.ucsb.edu/w/images/d/d4/I2200203.pdf]
|[https://wiki.nanotech.ucsb.edu/w/images/d/d4/I2200203.pdf]
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|1/7/2021
|I22101
|144
|1.20
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Revision as of 00:45, 9 January 2021

ICP#2: 0.5Pa, 50/900W, CHF3/CF4=10/30 sccm, time=210 sec
Date Sample# Etch Rate (nm/min) Etch Selectivity (SiO2/PR) Averaged Sidewall Angle (o) SEM Images
10/5/2018 SiO2#02 160 1.2 82.1 [1]
1/28/2019 I21901 146 1.23 [2]
3/6/2019 I21904 151 1.23 85.6 [3]
7/18/2019 I21905 162 1.37 [4]
1/16/2020 I22001 149 1.21 [5]
8/9/2020 I22002 102 0.86 caused by air leaking to CHF3 channel [6]
1/7/2021 I22101 144 1.20
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