File:SEM Image.png: Difference between revisions

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Wafer had UV6 or UVN30 as mask. 5min Si etch followed by PostBARC Etch/PR Strip (STD)_V2 with 2min over etch
Mask

Latest revision as of 18:50, 28 January 2025

Wafer had UV6 or UVN30 as mask. 5min Si etch followed by PostBARC Etch/PR Strip (STD)_V2 with 2min over etch

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current18:47, 28 January 2025Thumbnail for version as of 18:47, 28 January 20251,500 × 603 (706 KB)Gopimeena (talk | contribs)

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