Chemical-Mechanical Polisher (Logitech): Difference between revisions
Jump to navigation
Jump to search
(Created page with "{{tool|{{PAGENAME}} |picture=XeF2.jpg |type = Dry Etch |super= Wet Processing |phone=(805)839-3918x216 |location=Bay 5 |email=freeborn@ece.ucsb.edu |description = ORBIS Chemical …") |
No edit summary |
||
| Line 1: | Line 1: | ||
{{tool|{{PAGENAME}} |
{{tool|{{PAGENAME}} |
||
|picture= |
|picture=CMP.jpg |
||
|type = Dry Etch |
|type = Dry Etch |
||
|super= Wet Processing |
|super= Wet Processing |
||
Revision as of 14:22, 1 July 2012
| ||||||||||||||
About
The Logitech Orbis system is used in the facility for fine-scale polishing and planarization of a variety of materials including glass, silicon, GaAs, InP, GaN, etc. Wafers up to 6” diameter can be polished on the system. Several slurries and pads are available to provide a range of polishing options depending on the material being processed. Pieces can also be handled on the system. Each process is often unique in geometry and material combinations so that independent process development is required for most CMP applications. Logitech directly assists our users through expert consultation.