Test Data of etching SiO2 with CHF3/CF4: Difference between revisions
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Revision as of 01:29, 7 April 2020
ICP#2: 0.5Pa, 50/900W, CHF3/CF4=10/30 sccm, time=210 sec | |||||
Date | Sample# | Etch Rate (nm/min) | Etch Selectivity (SiO2/PR) | Averaged Sidewall Angle (o) | SEM Images |
10/5/2018 | SiO2#02 | 160 | 1.2 | 82.1 | [1] |
1/28/2019 | I21901 | 146 | 1.23 | [2] | |
3/6/2019 | I21904 | 151 | 1.23 | 85.6 | [3] |
7/18/2019 | I21905 | 162 | 1.37 | [4] | |
1/16/2020 | I22001 | 149 | 1.21 | [5] |