Wet Benches

In the lab we have a total of 16 wet benches. They are divided into the following 8 types:

• 4 Solvent Cleaning Benches
• 3 Develop Benches
• 3 Spin Coat Benches
• 2 Toxic Corrosive Benches
• 1 SPECIAL PURPOSE Wafer Toxic Corrosive Bench
• 1 HF Processing Bench
• 1 HF/TMAH Processing Bench
• 1 Plating Bench

Develop Benches

Develop Benches Tool Type Wet Processing Location Bays 6 & 7 Supervisor Aidan Hopkins Supervisor Phone (805) 893-2343 Supervisor E-Mail hopkins@ece.ucsb.edu Description Custom Developer Bench Manufacturer Pure Aire Corporation

About

The facility contains 3 polypropylene Developing Benches for photolithographic development using TMAH / TEAH / KOH based developers. All is actively neutralized. The benches consist of two sinks with DI water hook ups and industrial water plenum flushes. Laminar flow fume hoods with hepa filtration. Nitrogen guns are also on both sides of the bench for drying samples. Digital hotplates are included for resist post exposure bakes or post develop hard bakes. POLOS spray puddle develop etch systems are included in the benches. All processes are done in user-supplied glassware. Two people may use the bench at a time and protective gear such as proper gloves must be used. Developers supplied by the laboratory include: AZ300MIF (0.26N TMAH developer), MF701 (0.24N TMAH developer), AZ400K (KOH based developer), pre-diluted AZ400K:DI 1:4. Other developers should be OK'd by laboratory staff prior to use in the laboratory.

Deatailed Specifications

• 2 Sinks, DI water
• 2 Nitrogen guns for sample drying
• NO SOLVENTS or STRIPPERS in bench
• Class 100
• Hot plates for post bakes
• POLOS Spray-Puddle-Develop-Rinse-Dry systems

Spin Coat Benches

Spin Coat Benches Tool Type Wet Processing Location Bays 6 & 7 Supervisor Aidan Hopkins Supervisor Phone (805) 893-2343 Supervisor E-Mail hopkins@ece.ucsb.edu Description Custom Photoresist Spin Coat Bench Manufacturer Pure Aire Corporation

About

The facility contains 3 stainless steel solvent benches for photoresist spin coating. The benches consist each of 2 integrated Headway PWM32 series photoresist spinners. Overhead and foot controls are provided. 8 preprogrammed recipes and 2 user-programmable recipes are offered. Automatic wafer lifting and centering stations are offered for spinning large wafers up to 8” in diameter. 6” or 8” Cee ultra-flat hotplates with 0.1°C temperature stability are preset for standard resist bake temperatures (90, 95, 100, 105, 110, 115°C). Other user-changeable hot plates are also provided. Nitrogen guns are also on both sides of the bench. Large resist bottles are stored in a refrigerator amd small user bottles are stored by group in a ventilated steel cabinet. Waste pipets and resist soaked wipes are collected for disposal. A list of stocked resists appears on the lithography processing web page. Other chemicals should be OK'd by laboratory staff prior to use in the laboratory.

Deatailed Specifications

• 2 Headway PWM32 spinners per bench, multi-step programming
• 8 preset spin programs, 2 user defineable
• Variety of wafer chucks for 5 mm x 5 mm pieces to 6” wafers
• Lifters for large wafer centering
• Preset 0.1°C stable, ultra-flat hotplates (90, 95, 1100, 105, 110, 115°C)
• NO WAX on hotplates
• Other hotplates for user defined temperatures
• Hepa filtered laminar flow for Class 100
• Manual dispense of resist; particle filtering available