Test Data of etching SiO2 with CHF3/CF4

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ICP#1: 0.5Pa, 50/900W, CHF3/CF4=10/30 sccm, time=210 sec
Date	Sample#	Etch Rate (nm/min)	Etch Selectivity (SiO2/PR)	Averaged Sidewall Angle (^o)
1/28/2019	I11901	110	1.35

File:SiO2 Etch using ICP2-no O2-a.pdf

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