Test Data of etching SiO2 with CHF3/CF4/O2

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ICP#2: 0.5Pa, 50/500W, CHF3/CF4/O2=35/5/10sccm, time=210 sec
Date Sample# Etch Rate (nm/min) Etch Selectivity (SiO2/PR) Averaged Sidewall Angle (o)
10/5/2018 SiO2#01 95.2 0.74 77.9

File:SiO2 Etch using ICP2 with O2.pdf

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