Test Data of etching SiO2 with CHF3/CF4

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ICP#2: 0.5Pa, 50/900W, CHF3/CF4=10/30 sccm, time=210 sec
Date Sample# Etch Rate (nm/min) Etch Selectivity (SiO2/PR) Averaged Sidewall Angle (o)
10-8-2018 SiO2#02 160 1.23 82.1
1/28/2019 I21901 146 1.23

File:SiO2 Etch using ICP2-no O2-a.pdf