Wafer Cleaver Recipes (LSD-155LT)
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The following table is a good starting point for several materials where users were able to successfully cleaved their samples. There are 3 modes of operations: Scribe and Break, Notch and Break and Notch and Drop. One will need to consider what is the best operating mode for their samples. Notch and Drop has the advantage of not having the wheel roll over the top of your sample. Although one can also insert a mylar film on the sample to protect from the rolling wheel.
| Materials | Material thickness (um) | Operating mode | Scribe Pressure (psi) | Wheel Pressure (psi) | Comments |
|---|---|---|---|---|---|
| GaAs | 125 to 675 | Scribe & Break and Notch & Cleave | 9 to 12 | 0.7 to 1.1 | Typically thicker materials will require higher wheel pressure to break |
| InP | 150 to 560 | Scribe & Break and Notch & Cleave | 6 to 8 | 0.5 to 0.8 | InP is more brittle and should require less break pressure than GaAs |
| Si | 130 to 500 | Scribe & Break and Notch & Cleave | 9 to 12 | 0.8 to 1.2 | Thicker Si will need higher scribe and wheel pressures |
| InGaAs | 250 to 500 | Scribe & Break and Notch & Cleave | 6 to 8 | 0.8 to 1.2 | |
| InSb | 500 | Scribe & Break and Notch & Cleave | 7 to 12 | 0.8 | There is less data on this material |