Difference between revisions of "Oven 4 (Thermo-Fisher HeraTherm)"
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(Created page with "{{tool|{{PAGENAME}} |picture=Oven4.jpg |type = Lithography |super= Tony Bosch |location=Bay 6 |description = ? |manufacturer = Fisher Scientific }}") |
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|picture=Oven4.jpg |
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|type = Lithography |
|type = Lithography |
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| − | |super= |
+ | |super= Michael Barreraz |
| + | |super2= Aidan Hopkins |
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|location=Bay 6 |
|location=Bay 6 |
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| − | |description = |
+ | |description = Programmable Oven |
| − | |manufacturer = |
+ | |manufacturer = Thermo Scientific |
| + | |model = HeraTherm |
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| + | |toolid=68 |
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}} |
}} |
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| + | |||
| + | ==About== |
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| + | This oven is often used for long thermal cures and wafer bonding. It has programmable temperature ramps and hold times, but the ramp rate is only "low/med./high" (not an exact ramp rate). A manual needle valve for nitrogen purge has been installed on the back of the oven. |
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| + | |||
| + | ==Specifications== |
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| + | |||
| + | *Maximum Temperature = 330 C (no active cooling) |
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| + | *Gases: N2, manually set with needle valve (not programmable) |
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| + | *Multi-step programmable temperature ramps |
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| + | *Programmable atmospheric purge (for cooling) |
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| + | |||
| + | ==Documentation== |
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| + | |||
| + | * |
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| + | {{Instructions}} |
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| + | |||
| + | [https://wiki.nanotech.ucsb.edu/w/images/8/8e/Heratherm_instructions.pdf Instructions] |
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| + | <br /> |
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Latest revision as of 15:25, 13 September 2022
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About
This oven is often used for long thermal cures and wafer bonding. It has programmable temperature ramps and hold times, but the ramp rate is only "low/med./high" (not an exact ramp rate). A manual needle valve for nitrogen purge has been installed on the back of the oven.
Specifications
- Maximum Temperature = 330 C (no active cooling)
- Gases: N2, manually set with needle valve (not programmable)
- Multi-step programmable temperature ramps
- Programmable atmospheric purge (for cooling)
Documentation