Difference between revisions of "Oven 4 (Thermo-Fisher HeraTherm)"
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This oven is often used for long thermal cures and wafer bonding. It has programmable temperature ramps and hold times, but the ramp rate is only "low/med./high" (not an exact ramp rate). A manual needle valve for nitrogen purge has been installed on the back of the oven. |
This oven is often used for long thermal cures and wafer bonding. It has programmable temperature ramps and hold times, but the ramp rate is only "low/med./high" (not an exact ramp rate). A manual needle valve for nitrogen purge has been installed on the back of the oven. |
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+ | ==Specifications== |
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| − | * {{todo|User Manual}} |
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| + | {{Instructions}} |
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| + | [https://wiki.nanotech.ucsb.edu/w/images/8/8e/Heratherm_instructions.pdf Instructions] |
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Latest revision as of 15:25, 13 September 2022
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About
This oven is often used for long thermal cures and wafer bonding. It has programmable temperature ramps and hold times, but the ramp rate is only "low/med./high" (not an exact ramp rate). A manual needle valve for nitrogen purge has been installed on the back of the oven.
Specifications
- Maximum Temperature = 330 C (no active cooling)
- Gases: N2, manually set with needle valve (not programmable)
- Multi-step programmable temperature ramps
- Programmable atmospheric purge (for cooling)
Documentation