View source for Dicing Saw (ADT)

{{tool|{{PAGENAME}}
|picture=ADT.jpg
|type = Packaging
|super= Lee Sawyer
|location=Dicing Room: ESB 1147
|description = ADT Dicing Saw
|model = ADT 7100
|manufacturer = Advanced Dicing Technologies Ltd.
|materials = 
|toolid=49
}} 
== About  ==
The ADT 7100 Dicing Saw is optimized for multi-angle dicing of thin, tight tolerance products up to 200 mm x 200 mm.  It is currently setup for dicing up to 8” diameter wafers.  Check the [https://wiki.nanotech.ucsb.edu/wiki/index.php/Packaging_Recipes#Dicing_Saw_Recipes_.28ADT_7100.29 Dicing Saw Recipes page] for the blades we currently stock.

An ADT WM-966 tape applicator & Ultron Systems UH104-8 UV lamp system is used to apply UV-release tape for securing die during dicing.

Contact the tool supervisor for blades and dicing frames for your group.

== Detailed Specifications ==

== Operating Procedures ==
* [[ADT 7100 - Initial Setup Before Cutting|Setting up the Saw before Cutting]]
* [[ADT 7100 - Standard Dicing Procedure - Programmed Cut Map|Standard Dicing Procedure - Programmed Cut Map]]
* [[ADT 7100 - Standard Dicing Procedure - Single Cuts|Standard Dicing Procedure - Single Cuts]]
* [[ADT 7100 - Recovering an Old Recipe (2019)|Recovering an Old Recipe]]


== Recipes ==
* Recipes > Packaging > [https://wiki.nanotech.ucsb.edu/wiki/index.php/Packaging_Recipes?venotify=created#Dicing_Saw_Recipes_.28ADT_7100.29 '''Dicing Saw Recipes (ADT 7100)''']
Be sure to also see the recipes for protecting your sample from dicing dust, and mounting/unmounting.