View source for Automated Wafer Cleaver (Loomis LSD-155LT)

{{tool2|{{PAGENAME}}
|picture=IMG_0554.jpg
|type = Packaging
|super= Aidan Hopkins
|super2= 
|location=Backend Lab: ESB 1111
|description = Loomis Automated Wafer Cleaver
|model = LSD-155LT
|manufacturer = Loomis Industries Inc.
|materials = III-V's, thin Silicon
|toolid=
}} 
==About==
The Loomis LSD-155Lt is a production scribe and break system that can be used for processing large grids, arrays of laser bars, cleaving high quality mirror facets, and dicing wafers.

==Detailed Specifications==

*Maximum Wafer Size: 4"
*Parts mounted to low tack tape and used in conjunction with 6" plastic rings.
*Automated cut maps at multiple angles (0° and 90° typical)
*~few micron alignment to on-wafer features.
*Multiple scribe and cleave options including 'scribe and break', 'notch and cleave', and 'peck and cleave'.
*Users should try and follow the 3 to 1 ratio (distance between cleaves should be 3X the thickness of the substrate) although some material like InP and GaAs can occasionally be cleaved closer to 2 to 1.

==Operating Procedures==

*[https://wiki.nanofab.ucsb.edu/w/images/d/d6/Loomis_Scriber_SOP.docx Loomis LSD-155LT Standard Operating Procedure]

==Recipes==

*Recipes > Packaging > '''[[Wafer Cleaver Recipes (LSD-155LT)]]'''
*Wafer thinning is critical, see the Wafer Lapping (Allied XYZ) tool as well.